Chip high-temperature detection bearing device

Abstract

The utility model belongs to the field of detection, particularly relates to a chip high-temperature detection bearing device, and aims to solve the problems that placement detection is carried out in an embedded manner, the chip needs to be taken in a buckling manner during taking, the taking is inconvenient, and although a notch is formed in the edge of a placement groove for taking, the taking is still troublesome. According to the scheme, the device comprises a base, a plurality of mounting holes are formed in the surface of the base, a plurality of convex frames are fixedly arranged at the top of the base, and the convex frames communicate with the mounting holes correspondingly; and the limiting plate is located above the base, the chip can be fixed for detection operation by placing the chip in the placing hole, when the chip needs to be taken out, the limiting plate only needs to be pressed downwards to fix the limiting plate, then the chip is exposed out and taken down, and then the limiting plate can be reset by pressing the sliding plate.

Description

Technical Field

[0001] The utility model relates to the field of detection technology, in particular to a chip high temperature detection carrying device. Background Art

[0002] In the field of semiconductor manufacturing, high temperature detection of chips is a crucial link. The stability and reliability of chips when running in a high temperature environment directly determine their quality and performance.

[0003] However, in the existing high-temperature chip testing process, the design of the carrier device is often not ideal. The chip is usually placed in an embedded manner for testing, and it needs to be taken out by buckling, which is inconvenient. Although some will open notches on the edge of the placement slot for easy picking, the problem of troublesome picking still exists. Utility Model Content

[0004] The purpose of the utility model is to solve the problem in the prior art that chips are placed for detection in an embedded manner, and need to be taken out in a buckled manner, which is inconvenient. Although some chips have notches on the edge of the placement slot for easy removal, the disadvantage of being troublesome to take out still exists. A chip high-temperature detection carrier is proposed.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A chip high temperature detection carrying device comprises a base, a surface of the base is provided with a plurality of mounting holes, a top of the base is fixedly provided with a plurality of convex frames, and the plurality of convex frames are respectively connected with the plurality of mounting holes;

[0007] A limiting plate, the limiting plate is located above the base, a plurality of placement holes are opened on the surface of the limiting plate, and the plurality of placement holes are respectively slidably sleeved on the outside of the plurality of convex frames;

[0008] Connectors, used to connect multiple bases, the connectors are respectively arranged on both sides of the bases, and the connectors include a group of fixing blocks and a group of T-blocks;

[0009] The buckle assembly is used to fix the limiting plate and the base, and the buckle assembly is arranged at the bottom of the limiting plate.

[0010] In a possible design, limiting rods are fixedly provided at the four corners of the top of the base, and a limiting plate is slidably sleeved on the outer walls of the plurality of limiting rods, the outer walls of the limiting rods are sleeved with a No. 1 compression spring, and the two ends of the No. 1 compression spring are respectively fixedly provided at the bottom of the limiting plate and the top of the base.

[0011] In a possible design, the buckle assembly includes a bottom block fixedly arranged at the bottom of the limiting plate, a slot is provided at the top of the base, and the bottom block slides and extends into the slot, the same sliding hole is provided on both sides of the base, and the sliding hole is located below the slot, a slide plate is slidably arranged inside the slide hole, an inner cavity is provided on the top inner wall of the slide hole, a vertical plate is slidably arranged inside the inner cavity, and the vertical plate is fixedly arranged on the top of the slide plate, a triangular block is fixedly arranged on the side of the vertical plate close to the slot, the triangular block slides through the slot and cooperates with the bottom block, a slot is provided on the side of the bottom block close to the triangular block, and the slot cooperates with the triangular block.

[0012] In a possible design, a cross bar is fixedly installed inside the inner cavity, and a vertical plate is slidably sleeved on the outside of the cross bar. A No. 2 compression spring is sleeved on the outer wall of the cross bar, and the two ends of the No. 2 compression spring are respectively fixed on one side of the vertical plate and one inner wall of the inner cavity.

[0013] In a possible design, a group of the fixed blocks and a group of T-blocks are fixedly arranged on both sides of the base, respectively, each group of the fixed blocks and each group of T-blocks are provided with two, the slide plate is located between the two fixed blocks and the two T-blocks, a T-slot is provided on a side of the fixed block away from the base, and the T-slot cooperates with the T-block.

[0014] In a possible design, a T-shaped stop block is fixedly provided at one end of one of the T-blocks away from the other T-block, and a T-shaped stop groove is opened at one end of one of the fixed blocks away from the other fixed block, and the T-shaped stop groove is connected with the T-slot, and the T-shaped stop groove cooperates with the T-shaped stop block.

[0015] In the present application, when in use, the base is placed on the top of the PCB board, and the wiring terminal is located inside the mounting hole. Then, the chip is placed on the top of the convex frame and inside the placement hole, and the installation can be completed for testing. When the chip needs to be removed, just press the limit plate downward, and the limit plate drives the bottom block to move. The bottom block squeezes the triangular block so that the triangular block moves to one side. When the bottom block moves to the specified position, the triangular block will be reset by the force of the No. 2 compression spring, so that the triangular block is engaged with the card slot, thereby fixing the bottom block. At this time, the top surface of the limit plate will be flush with the top surface of the convex frame or lower than the top surface of the convex frame, and the chip can be taken out at this time. There is no need to buckle it out through the notch, which is convenient for actual use. When the limit plate needs to be reset, just press the slide plate, and the slide plate will drive the triangular block to move through the vertical plate, so that the triangular block is out of the inside of the card slot. At this time, the bottom block will release the fixing effect and reset through the No. 1 compression spring, thereby moving the limit plate back to its original position. When the number of chip detection needs to be increased, it is only necessary to connect the fixing block on one side of the other base with the T-block on one side of the base to achieve connection. When the limit plate needs to be pressed down to take the chip, just press it from left to right in sequence. When the limit plate needs to be moved back to its original position, just press the slide plate in the leftmost device. It is simple and convenient.

[0016] In the utility model, the chip high temperature detection carrying device can achieve the goal that when the chip needs to be removed, it is only necessary to press the limit plate downward to fix it, so that the chip can be leaked out and taken out, and when the limit plate needs to be reset to continue the detection work, it is only necessary to press the slide plate to reset it, which can facilitate the removal of the chip, and the operation and structure are simple, which is convenient for practical use;

[0017] In the utility model, the chip high temperature detection carrying device can achieve that when the number of detections needs to be increased, the fixing block on one side of one base is plugged into the T-block on the other side of the base through the connecting piece. While the number of detections can be increased, all the limit plates can be reset by pressing the slide plate in the leftmost base without extra steps.

[0018] In the utility model, when in use, by placing the chip inside the placement hole, it can be fixed for detection operation. When the chip needs to be taken out, the limit plate can be fixed by pressing it downward, and then the chip can be leaked out and taken out. Then, the limit plate can be reset by pressing the slide plate.

[0019] Multiple bases for placing chips can be connected together through connecting parts, and when the limit plate needs to be reset, all the limit plates can be reset by squeezing the slide plate in the leftmost base, thereby achieving the effect of simple operation and easy chip removal. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the main structure of a chip high temperature detection carrying device proposed by the utility model;

[0021] Figure 2 This is a schematic cross-sectional structure diagram of a limit rod of a chip high temperature detection carrier device proposed by the utility model;

[0022] Figure 3 This is a schematic cross-sectional structure diagram of a mounting hole of a chip high temperature detection carrier device proposed by the utility model;

[0023] Figure 4 This is a schematic cross-sectional structure diagram of a chip high temperature detection carrier slot proposed by the utility model;

[0024] Figure 5 For this utility model Figure 4 A magnified view of the structure of part A;

[0025] Figure 6 The utility model provides a three-dimensional structural schematic diagram of a fixed block and a T-block of a chip high temperature detection carrier device.

[0026] In the figure: 1. base; 2. fixing block; 3. limiting plate; 4. T-block; 5. limiting rod; 6. No. 1 compression spring; 7. placement hole; 8. convex frame; 9. mounting hole; 10. bottom block; 11. slot; 12. inner cavity; 13. cross bar; 14. slide plate; 15. No. 2 compression spring; 16. slot; 17. triangle block; 18. T-slot; 19. T-type abutment slot; 20. T-type abutment block; 21. vertical plate. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0028] Example 1

[0029] Reference Figure 1 , a bearing device, comprising: a base 1, a limiting plate 3, a connecting piece and a buckle assembly.

[0030] Reference Figure 3 , Base 1: A plurality of mounting holes 9 are provided on the surface of the base 1, a plurality of convex frames 8 are fixedly provided on the top of the base 1, and the plurality of convex frames 8 are respectively connected with the plurality of mounting holes 9. The design of the convex frames 8 enables the chip to be placed on the base 1 and facilitates the subsequent cooperation with the limiting plate 3. When the base 1 is placed on the PCB board, the wiring terminals can contact the chip through the mounting holes 9.

[0031] Reference Figure 3 , limit plate 3: The limit plate 3 is located above the base 1, and a plurality of placement holes 7 are opened on its surface. The plurality of placement holes 7 are respectively slidably sleeved on the outside of a plurality of convex frames 8, so that the limit plate 3 can slide up and down along the convex frames 8, so that when the chip is installed for testing, it can be embedded in the inside of the placement hole 7 to achieve limited fixation. When it needs to be taken, the limit plate 3 can be moved downward to expose the core for easy removal.

[0032] Reference Figure 4-5 , snap assembly: The snap assembly is arranged at the bottom of the limit plate 3, and is used to fix the limit plate 3 and the base 1. The snap assembly includes a bottom block 10, a slot 16, a slide plate 14, an inner cavity 12, a vertical plate 21, a triangular block 17 and a slot 11. The bottom block 10 is fixedly arranged at the bottom of the limit plate 3, and slides and extends into the slot 16 at the top of the base 1. When the chip needs to be taken out, just press the limit plate 3 downward, the limit plate 3 drives the bottom block 10 to move, and the bottom block 10 squeezes the triangular block 17 so that the triangular block 17 moves to one side. When the bottom block 10 moves to the bottom end of the slot 16, the triangular block 17 will be reset by the force of the second compression spring 15, so that the triangular block 17 is engaged with the slot 11, thereby fixing the bottom block 10. At this time, the top surface of the limit plate 3 will be flush with the top surface of the convex frame 8 or lower than the top surface of the convex frame 8. At this time, the chip can be taken out without buckling it out through the notch, which is convenient for practical use;

[0033] When the limit plate 3 needs to be reset, just press the slide plate 14. The slide plate 14 drives the triangular block 17 to move through the vertical plate 21, so that the triangular block 17 is separated from the inside of the slot 11. At this time, the bottom block 10 will release the fixing effect and reset through the No. 1 compression spring 6, thereby moving the limit plate 3 back to its original position.

[0034] The present application can be used in the field of chip detection, and can also be used in other fields applicable to the present application.

[0035] Example 2

[0036] refer to Figure 5-6 , improved on the basis of Example 1: a chip high-temperature detection carrier device, which is applied to the field of chip detection, a T-slot 18 is provided on the side of the fixed block 2 away from the base 1, and the T-slot 18 cooperates with the T-block 4. This design allows multiple devices to be connected together for detection. When the limit plate 3 needs to be pressed down to take the chip, it only needs to be pressed from left to right in sequence. When the limit plate 3 needs to be moved back to its original position, it only needs to press the slide plate 14 in the leftmost device. The slide plate 14 on the left will squeeze the slide plate 14 on the right in turn, and all the limit plates 3 will be reset. No extra steps are required, which is simple and convenient.

[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A chip high temperature detection carrying device, characterized in that: include: A base (1), wherein a plurality of mounting holes (9) are provided on a surface of the base (1), a plurality of convex frames (8) are fixedly provided on the top of the base (1), and the plurality of convex frames (8) are respectively connected to the plurality of mounting holes (9); A limiting plate (3), the limiting plate (3) being located above the base (1), a plurality of placement holes (7) being provided on a surface of the limiting plate (3), and the plurality of placement holes (7) being slidably sleeved on the outside of the plurality of convex frames (8) respectively; A connecting piece, used for connecting a plurality of bases (1), the connecting piece being arranged on both sides of the base (1) respectively, and comprising a group of fixing blocks (2) and a group of T-shaped blocks (4); A buckle assembly is used to fix the limiting plate (3) and the base (1), and the buckle assembly is arranged at the bottom of the limiting plate (3).

2. A chip high temperature detection carrying device according to claim 1, characterized in that: Limit rods (5) are fixedly arranged at the four corners of the top of the base (1), and the limit plates (3) are slidably sleeved on the outer walls of the plurality of limit rods (5). The outer walls of the limit rods (5) are sleeved with a No. 1 compression spring (6), and the two ends of the No. 1 compression spring (6) are respectively fixedly arranged at the bottom of the limit plate (3) and the top of the base (1).

3. A chip high temperature detection carrying device according to claim 2, characterized in that: The buckle assembly comprises a bottom block (10) fixedly arranged at the bottom of the limiting plate (3); a slot (16) is provided at the top of the base (1), and the bottom block (10) slides and extends into the inside of the slot (16); a same sliding hole is provided on both sides of the base (1), and the sliding hole is located below the slot (16); a slide plate (14) is slidably arranged inside the slide hole; an inner cavity (12) is provided on the top inner wall of the sliding hole; a vertical plate (21) is slidably arranged inside the inner cavity (12), and the vertical plate (21) is fixedly arranged on the top of the slide plate (14); a triangular block (17) is fixedly arranged on a side of the vertical plate (21) close to the slot (16); the triangular block (17) slides through the inside of the slot (16) and cooperates with the bottom block (10); a card slot (11) is provided on a side of the bottom block (10) close to the triangular block (17), and the card slot (11) cooperates with the triangular block (17).

4. A chip high temperature detection carrying device according to claim 3, characterized in that: A cross bar (13) is fixedly arranged inside the inner cavity (12), and a vertical plate (21) is slidably sleeved on the outside of the cross bar (13). A second compression spring (15) is sleeved on the outer wall of the cross bar (13), and two ends of the second compression spring (15) are respectively fixedly arranged on one side of the vertical plate (21) and on one inner wall of the inner cavity (12).

5. A chip high temperature detection carrying device according to claim 3, characterized in that: A group of the fixing blocks (2) and a group of T-blocks (4) are respectively fixedly arranged on both sides of the base (1), each group of the fixing blocks (2) and each group of the T-blocks (4) are provided with two, the slide plate (14) is located between the two fixing blocks (2) and the two T-blocks (4), a T-slot (18) is provided on a side of the fixing block (2) away from the base (1), and the T-slot (18) is matched with the T-block (4).

6. A chip high temperature detection carrying device according to claim 5, characterized in that: A T-shaped stop block (20) is fixedly arranged at one end of one of the T-shaped blocks (4) away from the other T-shaped block (4), and a T-shaped stop groove (19) is provided at one end of one of the fixed blocks (2) away from the other fixed block (2), the T-shaped stop groove (19) is connected to the T-shaped groove (18), and the T-shaped stop groove (19) and the T-shaped stop block (20) are matched.

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