Test fixture adaptive to leadless ceramic packaging product

Abstract

The utility model provides a test fixture adaptive to a leadless ceramic packaging product, belonging to the technical field of ceramic packaging test devices, the test fixture adaptive to the leadless ceramic packaging product comprises a base, a PCB, a positioning frame, a connecting piece and a gland assembly, the two opposite sides of the base are respectively provided with a test joint; the input end and the output end of the PCB are electrically connected with the two test connectors respectively; the positioning frame is arranged at the top of the PCB, a lower positioning groove and an upper positioning groove which are continuous are formed in the center of the positioning frame, the lower positioning groove is a rectangular groove, the upper positioning groove is a conical groove, the groove width of the upper positioning groove is gradually increased in the direction from bottom to top, the lower positioning groove is used for fixing a tube shell, and the upper positioning groove is used for containing a tube cap; the connecting piece respectively penetrates through the positioning frame and the PCB and is detachably connected with the base; and the gland assembly is provided with a pressing part extending into the upper positioning groove.

Description

Technical Field

[0001] The utility model belongs to the technical field of ceramic packaging test devices, and in particular relates to a test fixture adapted to leadless ceramic packaging products. Background Art

[0002] Leadless ceramic packaging products consist of three parts: tube shell, integrated chip, and tube cap. During the assembly process, the integrated chip is first sintered at high temperature and fixed on the tube shell, and then bonded to the tube shell pins through bonding wires. Finally, the tube cap and tube shell are sealed using a capping process. After production, it needs to be subjected to RF testing to ensure its product performance. During RF testing, a special fixture is required to fix the ceramic package product. Existing fixtures have the following defects:

[0003] Because the tube shell and tube cap in the ceramic packaging product are separate structures, the existing capping process cannot achieve 100% flush sealing of the tube shell and the tube cap. Therefore, the position of the tube shell after packaging will be offset in different directions compared to the tube cap. In order to ensure the normal placement of the product, the positioning frame of the traditional fixture needs to maintain a relatively large positioning space. After the product is placed in, due to the offset of the tube cap, the product tube shell pins cannot be accurately positioned with the PCB board pads at the bottom of the fixture through the test medium, resulting in problems such as abnormal power-on test or poor performance. If the pins need to be accurately positioned, the positioning space in the positioning frame needs to be reduced. In order to ensure the placement of the product, this puts forward higher packaging standards for the capping process, resulting in a low packaging process yield and a high product scrap rate. In addition, the existing test fixtures are usually only applicable to one type of packaged product, and the testing cost is relatively high. Utility Model Content

[0004] The embodiment of the utility model provides a test fixture adapted for leadless ceramic package products, aiming to solve the technical problems that, during radio frequency testing of existing ceramic package products, due to the offset of the tube cap, the precise positioning with the bottom PCB board pad cannot be guaranteed when installed on the test fixture, and the test fixture can only be applied to one type of packaged product, resulting in high testing costs.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a test fixture adapted to leadless ceramic packaging products, including:

[0006] A base, wherein two opposite sides of the base are respectively provided with test connectors;

[0007] A PCB board, covering the top surface of the base, wherein the input end and the output end of the PCB board are electrically connected to the two test connectors respectively;

[0008] A positioning frame is placed on the top of the PCB board, and a continuous lower positioning groove and an upper positioning groove are provided at the center of the positioning frame, wherein the lower positioning groove is a rectangular groove, and the upper positioning groove is a conical groove, and the top opening of the upper positioning groove is larger than the bottom opening, the lower positioning groove is used to fix the tube shell, and the upper positioning groove is used to accommodate the tube cap;

[0009] A connecting piece, which respectively passes through the positioning frame and the PCB board and is detachably connected to the base;

[0010] The gland assembly comprises a clamping portion extending into the upper positioning groove.

[0011] In a possible implementation, the bottom surface of the positioning frame is recessed upward to form a receiving groove.

[0012] In a possible implementation, the positioning frame includes a center block and a plurality of extension arms integrally formed on the periphery of the center block, the upper positioning groove and the lower positioning groove are both located in the center block, and each of the extension arms is equipped with a connecting piece.

[0013] In a possible implementation, at least two of the extension arms are further provided with positioning holes, and positioning pins are fitted in the positioning holes;

[0014] The positioning pin is plugged and matched with both the pressure cover assembly and the base, or the positioning pin is plugged and matched with one of the pressure cover assembly and the base.

[0015] In a possible implementation, the side wall of the upper positioning groove is further provided with an operating groove.

[0016] In one possible implementation, mounting plates are provided on opposite sides of the base, each mounting plate has a threaded hole and a through hole, the test connector has a bolt that cooperates with the threaded hole, and also has a terminal that passes through the through hole and is electrically connected to the PCB board.

[0017] In a possible implementation, a tin discharge hole is provided on the PCB board.

[0018] In a possible implementation, the gland assembly further includes:

[0019] A mounting seat, one side edge of which is rotatably connected to the positioning frame;

[0020] A pressing head is slidably connected to the mounting seat in an up-down direction, the pressing head protrudes from the bottom surface of the mounting seat and forms the pressing portion;

[0021] The adjusting module cooperates with the mounting seat and is used to drive the pressure head to move in the up and down directions.

[0022] In a possible implementation, the adjustment module includes:

[0023] A guide column, slidably connected to the mounting seat, one end of the guide column being fixedly connected to the pressure head;

[0024] A moving block, fixedly connected to the other end of the guide post, the moving block being located on the top of the mounting seat;

[0025] An adjusting knob, comprising an adjusting head and a threaded section, wherein the adjusting head abuts against a side of the moving block away from the mounting seat, and the threaded section penetrates the moving block and is threadedly matched with the mounting seat;

[0026] A spring is sleeved on the outer circumference of the guide column, two ends of the spring are respectively in contact with the mounting seat and the moving block, and the spring has a pre-tightening force to keep the moving block away from the base.

[0027] In a possible implementation, a buckle is provided on the mounting seat, and a buckle hole that cooperates with the buckle is provided on the positioning frame.

[0028] The scheme shown in the embodiment of the present application, compared with the prior art, the utility model is adapted to the positioning frame in the test fixture of the leadless ceramic packaging product, and is provided with a lower positioning groove and an upper positioning groove. The lower positioning groove can fix the position of the tube shell, and the upper positioning groove can accommodate the tube cap. Moreover, due to its conical setting, it provides a gap for the tube cap, so that only the tube shell is positioned but not the tube cap. It is compatible with packaging products with tube cap offset due to the tolerance of the capping process, ensures the precise alignment of the tube shell and the pad on the PCB board, avoids problems such as power-on abnormalities during testing, reduces the tolerance requirements of the capping process, and improves the yield of the early capping process. The base, PCB board and positioning frame are detachably connected through a connector, which is convenient for separate replacement. Different positioning frames can be replaced for testing different types of packaging products, thereby reducing the testing cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 An exploded structural diagram of a test fixture adapted for leadless ceramic package products provided in an embodiment of the utility model (with the gland assembly hidden);

[0030] Figure 2 This is a schematic diagram of the main structure of the positioning frame used in the embodiment of the utility model;

[0031] Figure 3 For along Figure 2 Schematic diagram of the cross-sectional structure along the AA line;

[0032] Figure 4 A schematic diagram of the three-dimensional structure of the positioning frame used in the embodiment of the utility model;

[0033] Figure 5This is a schematic diagram of the assembly structure of the positioning frame and the gland assembly used in the embodiment of the utility model;

[0034] Figure 6 This is a schematic diagram of the planar distribution of the PCB board used in the embodiment of the utility model.

[0035] Description of reference numerals:

[0036] 10-base; 11-test connector; 12-bolt; 13-terminal; 14-mounting plate;

[0037] 20-PCB board; 21-tin discharge hole; 22-grounding hole; 23-input terminal; 24-output terminal; 25-soldering pad;

[0038] 30-positioning frame; 31-lower positioning groove; 32-upper positioning groove; 33-accommodating groove; 34-center block; 35-extension arm; 36-positioning pin; 37-operating groove;

[0039] 40-connecting piece;

[0040] 50- gland assembly; 51- mounting seat; 52- press head; 53- guide column; 54- moving block; 55- adjusting knob; 56- spring; 57- buckle;

[0041] 60-tube shell; 61-tube cap. DETAILED DESCRIPTION

[0042] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] In the claims, specification and the above-mentioned drawings of the utility model, unless otherwise clearly defined, the use of terms such as "first", "second" or "third" etc. is to distinguish different objects rather than to describe a specific order.

[0044] Unless otherwise expressly defined, the directional words in the claims, specification and the above-mentioned drawings of the present utility model, such as the use of terms such as "upper", "lower", "top", "bottom", "front", "back", "inside", "outside", "center", "lateral", "longitudinal", "horizontal", "vertical", "left", "right", "clockwise", "counterclockwise", "high", "low", etc., indicating directions or positional relationships are based on the directions and positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the referred device or element must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the specific protection scope of the present utility model.

[0045] In the claims, specification and the above drawings of the utility model, unless otherwise clearly defined, if the term "fixed connection" or "fixed connection" is used, it should be understood in a broad sense, that is, any connection method without a displacement relationship and relative rotation relationship between the two, that is to say, including non-detachable fixed connection, detachable fixed connection, integrated connection and fixed connection through other devices or elements.

[0046] In the claims, specification and drawings of the present utility model, if the terms "include", "have" and their variations are used, they are intended to mean "including but not limited to".

[0047] Please also read Figures 1 to 6 , the test fixture for leadless ceramic package products provided by the utility model is now described. The test fixture for leadless ceramic package products includes a base 10, a PCB board 20, a positioning frame 30, a connector 40 and a gland assembly 50, and the base 10 is provided with test connectors 11 on opposite sides; the PCB board 20 covers the top surface of the base 10, and the input end 23 and the output end 24 of the PCB board 20 are electrically connected to the two test connectors 11 respectively; the positioning frame 30 is placed on the top of the PCB board 20, and the center of the positioning frame 30 is provided with a continuous lower positioning groove 31 and an upper positioning groove 32, the lower positioning groove 31 is a rectangular groove, the upper positioning groove 32 is a conical groove, the top opening of the upper positioning groove 32 is larger than the bottom opening, the lower positioning groove 31 is used to fix the tube shell 60, and the upper positioning groove 32 is used to accommodate the tube cap 61; the connector 40 passes through the positioning frame 30 and the PCB board 20 respectively and is detachably connected to the base 10; the gland assembly 50 has a pressing portion extending into the upper positioning groove 32.

[0048] It is easy to imagine that the upper positioning groove 32 is a tapered groove, and the top opening is larger than the bottom opening, so the distance between the inner side walls on the opposite sides (defined as the groove width) gradually increases from bottom to top.

[0049] The use process of the test fixture adapted to leadless ceramic packaged products provided in this embodiment is as follows: first, the PCB board 20, the base 10 and the test connector 11 are soldered by solder paste, and then the packaged product to be tested is placed in the lower positioning groove 31 of the positioning frame 30. After being placed in, the upper positioning groove 32 corresponds to the tube cap 61 on the packaged product, and the pins of the packaged product are accurately positioned and contacted through the conductive adhesive film and the pads 25 on the PCB board 20, and then the top of the tube cap 61 is pressed by the clamping assembly. After assembly, the test connector 11 is connected to the test equipment to test the packaged product.

[0050] Compared with the prior art, the utility model is adapted to the positioning frame 30 in the test fixture of the leadless ceramic packaging product, and is provided with a lower positioning groove 31 and an upper positioning groove 32. The lower positioning groove 31 can fix the position of the tube shell 60, and the upper positioning groove 32 can accommodate the tube cap 61. Moreover, due to its conical setting, it provides a space for the tube cap 61, so that only the tube shell 60 is positioned but not the tube cap 61. It is compatible with the packaging products in which the tube cap 61 is offset due to the tolerance of the sealing process, and ensures the precise alignment of the tube shell 60 with the pad 25 on the PCB board 20, avoiding problems such as power-on abnormality during the test, reducing the tolerance requirements of the sealing process, and improving the yield rate of the early sealing process. The base 10, the PCB board 20 and the positioning frame 30 are detachably connected through a connector 40, which is convenient for separate replacement. Different positioning frames 30 can be replaced for testing of packaging products of different models, thereby reducing the testing cost.

[0051] In some embodiments, an improved implementation of the positioning frame 30 may be as follows: Figure 3 to Figure 4 See the structure shown. Figure 3 to Figure 4 The bottom surface of the positioning frame 30 is recessed upward to form a receiving groove 33 .

[0052] In order to ensure good test electrical performance, the test medium is usually a colloid medium with small parasitic parameters and low loss. The medium is a film with a certain thickness and toughness, which is installed between the positioning frame 30 and the PCB board 20. Since the positioning frame 30, the PCB board 20 and the base 10 are clamped and fixed with a connector 40, the test medium may be squeezed during assembly, causing bulging, deformation, position displacement and other problems. By setting a receiving groove 33, the test medium can be embedded to prevent the above problems from occurring when the connector 40 is tightened.

[0053] In some embodiments, a specific implementation of the positioning frame 30 may be as follows: Figure 1 to Figure 2 and Figure 4 See the structure shown. Figure 1 to Figure 2 and Figure 4 The positioning frame 30 includes a center block 34 and a plurality of extension arms 35 integrally formed on the periphery of the center block 34. The upper positioning groove 32 and the lower positioning groove 31 are both located in the center block 34, and each extension arm 35 is matched with a connecting piece 40. Here, four extension arms 35 are provided for illustration. The center block 34 is a rectangular structure, and the extension arms 35 are provided at the four corners of the center block 34. The positioning frame 30 of this structure uses less material and has a lower cost. In addition, each extension arm 35 corresponds to a connecting piece 40, which can ensure that the center block 34 is in the center position, thereby ensuring that the force is uniform during the packaging product testing.

[0054] In some embodiments, an improved implementation of the positioning frame 30 may be as follows: Figures 1 to 5 See the structure shown. Figures 1 to 5, at least two extension arms 35 are also provided with positioning holes, and positioning pins 36 are matched in the positioning holes;

[0055] The positioning pin 36 is plug-fitted with both the pressure cover assembly 50 and the base 10 , or the positioning pin 36 is plug-fitted with one of the pressure cover assembly 50 and the base 10 .

[0056] A portion of the positioning pins 36 on the multiple extension arms 35 can be plugged into the pressure cover assembly 50, and the remaining portion can be plugged into the base 10; or the positioning pins 36 on all the extension arms 35 can be plugged into the base 10; or the positioning pins 36 on all the extension arms 35 can be plugged into the pressure cover assembly 50; a variety of positioning schemes can be selected according to specific test requirements.

[0057] By setting the positioning pins 36, the positioning frame 30 can be positioned, and then the packaged product placed in the positioning frame 30 can be positioned, ensuring that the packaged product and the pads 25 on the PCB board 20 are accurately positioned, and also ensuring that the clamping part accurately clamps the packaged product.

[0058] It is easy to imagine that the positioning pin 36 cooperates with the base 10 and must pass through the PCB board 20 , so the PCB board 20 also has a hole corresponding to the positioning pin 36 .

[0059] In some embodiments, an improved implementation of the positioning frame 30 may be as follows: Figures 1 to 3 See the structure shown. Figures 1 to 3 The side wall of the upper positioning groove 32 is also provided with an operating groove 37. When the packaged product is put into or taken out of the lower positioning groove 31, tweezers are required to be clamped. In order to prevent the tweezers from damaging the test medium at the bottom during the clamping process, the operating groove 37 is provided, and the tweezers can clamp the packaged product from the operating groove 37, thereby protecting the test medium from damage, extending its service life, and reducing the test cost.

[0060] In some embodiments, an improved implementation of the base 10 can be as follows: Figure 1 See the structure shown. Figure 1 , mounting plates 14 are provided on opposite sides of the base 10, each mounting plate 14 has a threaded hole and a through hole, and the test connector 11 has a bolt 12 that matches the threaded hole, and also has a terminal 13 that passes through the through hole and is electrically connected to the PCB board 20. The test connector 11 needs to be connected to the RF line knob. During the connection process, the input and output coplanar waveguide lines of the PCB board 20 may be bent and deformed due to the large force on the knob. By fixing the test connector 11 with bolts 12, the firmness and durability can be improved and the above-mentioned bending and deformation problems can be avoided.

[0061] In some embodiments, an improved implementation of the PCB board 20 can be implemented as follows: Figure 6 See the structure shown. Figure 6The PCB board 20 is provided with a tin discharge hole 21. When the PCB board 20 and the base 10 are soldered by solder paste, the tin discharge hole 21 can be provided to discharge excess bubbles and solder to ensure the flatness of the assembly.

[0062] Specifically, the PCB board 20 is further provided with a grounding hole 22, which is uniformly reduced to 0.2 mm, so that after the ground hole is plugged with copper paste, the surface is more horizontal, which is more conducive to the planar contact of the conductive medium and ensures good grounding.

[0063] In some embodiments, an improved embodiment of the above-mentioned gland assembly 50 can be adopted as follows Figure 5 See the structure shown. Figure 5 The pressure cover assembly 50 also includes a mounting seat 51, a pressure head 52 and an adjustment module. One side edge of the mounting seat 51 is rotatably connected to the positioning frame 30; the pressure head 52 is slidably connected to the mounting seat 51 in the up-down direction, and the pressure head 52 protrudes from the bottom surface of the mounting seat 51 to form a clamping part; the adjustment module cooperates with the mounting seat 51 to drive the pressure head 52 to move in the up-down direction. The mounting seat 51 is rotatably connected to the positioning frame 30, and the clamping part can be used to clamp and release the packaged product by the clamping part in a rotating opening and closing manner, which is easy to operate; after the pressure head 52 is clamped on the tube cap 61 of the packaged product, the pressure head 52 can be driven to move by the adjustment module to adjust the clamping force applied by the pressure head 52 on the packaged product, and the pressing height can also be adjusted according to different product thicknesses.

[0064] See also Figure 5 When the mounting seat 51 is rotatably connected to the positioning frame 30, a protruding structure is provided on the top of the two extension arms 35, and a rotating shaft is connected between the two protruding structures. The mounting seat 51 realizes rotational cooperation with the positioning frame 30 through the rotating shaft.

[0065] It should be noted that when a positioning pin 36 is provided on the top of the positioning frame 30, the mounting seat 51 is not directly rotatably connected to the positioning frame 30. The pressure cover assembly 50 also includes a fixed seat, which is fixed to the positioning frame 30 and cooperates with the positioning pin 36 on the top of the positioning frame 30. The mounting seat 51 is rotatably connected to the fixed seat.

[0066] In some embodiments, a specific implementation of the above-mentioned adjustment module can be as follows Figure 5 See the structure shown. Figure 5The adjustment module includes a guide column 53, a moving block 54, an adjusting knob 55 and a spring 56. The guide column 53 is slidably connected to the mounting seat 51, and one end of the guide column 53 is fixed to the pressure head 52; the moving block 54 is fixed to the other end of the guide column 53, and the moving block 54 is located at the top of the mounting seat 51; the adjusting knob 55 has an adjusting head and a threaded section, the adjusting head abuts against the side of the moving block 54 away from the mounting seat 51, and the threaded section passes through the moving block 54 and is threadedly engaged with the mounting seat 51; the spring 56 is sleeved on the outer periphery of the guide column 53, and the two ends of the spring 56 respectively abut against the mounting seat 51 and the moving block 54, and the spring 56 has a pre-tightening force that makes the moving block 54 away from the base 10.

[0067] When the adjusting knob 55 is turned, the adjusting knob 55 can abut against the moving block 54 to move closer to the mounting seat 51, so that the pressure head 52 moves downward; when the adjusting knob 55 is adjusted away from the mounting seat 51, the elastic force of the spring 56 can abut against the moving block 54 to move away from the mounting seat 51, and the pressure head 52 moves upward. This structure is convenient for adjustment, and the spring 56 always abuts between the mounting seat 51 and the moving block 54, which can ensure the stability of adjustment.

[0068] In some embodiments, an improved embodiment of the above-mentioned gland assembly 50 can be adopted as follows Figure 5 See the structure shown. Figure 5 The mounting seat 51 is provided with a buckle 57, and the positioning frame 30 is provided with a buckle hole that cooperates with the buckle 57. After the gland assembly 50 is rotated and closed, it can be connected to the positioning frame 30 through the buckle 57 to prevent the packaged product located in the lower positioning groove 31 from loosening during the test process, thereby ensuring the test effect.

[0069] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A test fixture adapted for leadless ceramic package products, characterized in that: include: A base, wherein two opposite sides of the base are respectively provided with test connectors; A PCB board, covering the top surface of the base, wherein the input end and the output end of the PCB board are electrically connected to the two test connectors respectively; A positioning frame is placed on the top of the PCB board, and a continuous lower positioning groove and an upper positioning groove are provided at the center of the positioning frame, wherein the lower positioning groove is a rectangular groove, and the upper positioning groove is a conical groove, and the top opening of the upper positioning groove is larger than the bottom opening, the lower positioning groove is used to fix the tube shell, and the upper positioning groove is used to accommodate the tube cap; A connecting piece, which respectively passes through the positioning frame and the PCB board and is detachably connected to the base; The gland assembly comprises a clamping portion extending into the upper positioning groove.

2. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: The bottom surface of the positioning frame is recessed upward to form a receiving groove.

3. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: The positioning frame includes a central block and a plurality of extension arms integrally formed on the periphery of the central block. The upper positioning groove and the lower positioning groove are both located in the central block, and each of the extension arms is matched with a connecting piece.

4. The test fixture adapted for leadless ceramic package products as claimed in claim 3, characterized in that: At least two of the extension arms are also provided with positioning holes, and positioning pins are matched in the positioning holes; The positioning pin is plugged and matched with both the pressure cover assembly and the base, or the positioning pin is plugged and matched with one of the pressure cover assembly and the base.

5. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: The side wall of the upper positioning groove is also provided with an operating groove.

6. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: Mounting plates are provided on opposite sides of the base, each of the mounting plates has a threaded hole and a through hole, the test connector has a bolt that matches the threaded hole, and also has a terminal that passes through the through hole and is electrically connected to the PCB board.

7. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: The PCB board is provided with tin discharge holes.

8. The test fixture adapted for leadless ceramic package products as claimed in claim 1, characterized in that: The gland assembly also includes: A mounting seat, one side edge of which is rotatably connected to the positioning frame; A pressing head is slidably connected to the mounting seat in an up-down direction, the pressing head protrudes from the bottom surface of the mounting seat and forms the pressing portion; The adjusting module cooperates with the mounting seat and is used to drive the pressure head to move in the up and down directions.

9. The test fixture adapted for leadless ceramic package products as claimed in claim 8, characterized in that: The adjustment module comprises: A guide column, slidably connected to the mounting seat, one end of the guide column being fixedly connected to the pressure head; A moving block, fixedly connected to the other end of the guide column, the moving block is located on the top of the mounting seat; An adjusting knob, comprising an adjusting head and a threaded section, wherein the adjusting head abuts against a side of the moving block away from the mounting seat, and the threaded section penetrates the moving block and is threadedly matched with the mounting seat; A spring is sleeved on the outer circumference of the guide column, two ends of the spring are respectively in contact with the mounting seat and the moving block, and the spring has a pre-tightening force to keep the moving block away from the base.

10. The test fixture adapted for leadless ceramic package products as claimed in claim 8, characterized in that: The mounting seat is provided with a buckle, and the positioning frame is provided with a buckle hole matched with the buckle.

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