Testing device of discrete semiconductor device

Abstract

The utility model discloses a testing device of a discrete semiconductor device, and belongs to the technical field of semiconductor testing. The device mainly comprises a body; the conveying assembly is mounted on the machine body; the placing assembly is mounted on the conveying assembly; the detection assembly is mounted on the machine body; the cleaning assembly is installed on the machine body, the cleaning assembly comprises a moving part, the moving part is installed on the machine body, and a fixed seat is installed on the moving part; the dust suction box is mounted on the fixed seat; the air cylinder is mounted on the fixed seat, and a base is mounted at the output end of the air cylinder; and the dust collection head is installed on the base, and the dust collection head is connected with the dust collection box through a hose. According to the testing device of the discrete semiconductor device, through the cleaning assembly, the probe can be cleaned before and after the discrete semiconductor device is detected each time, the influence of contaminated dust on the detection result is prevented, and the effect of cleaning the probe before and after testing is achieved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor testing technology, and in particular to a testing device for discrete semiconductor devices. Background Art

[0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor triodes (abbreviated as triodes) and semiconductor special devices. The manufacturing materials of these devices mainly include semiconductor elements such as silicon, germanium, and carbon;

[0003] During the production process of discrete semiconductor devices, their performance needs to be tested to ensure production quality;

[0004] At present, when testing semiconductor discrete devices, the semiconductor discrete devices are usually fixed on a tray, then transported to a testing position, and their pins are contacted by a probe to test their overall performance;

[0005] However, the probes are not cleaned before and after the test of semiconductor discrete devices. They can only be cleaned manually regularly after a period of use. During use, the probes may be contaminated with dust and other pollutants on the surface of the device to be tested. These pollutants will affect the contact resistance between the probes and the device to be tested, thereby causing inaccurate test results. If the probes are cleaned manually every time, frequent operations may cause fatigue to the staff, resulting in improper operation, negligence or other human factors, which may cause the probes to be damaged or not cleaned thoroughly, thereby affecting the test results.

[0006] Therefore, it is necessary to provide a testing device for discrete semiconductor devices to solve the above problems.

[0007] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0008] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a testing device for discrete semiconductor devices to achieve the effect of cleaning the probes before and after the test.

[0009] The technical solution adopted by the present application to solve its technical problems is: a testing device for semiconductor discrete devices, including a body; a conveying component, the conveying component is installed on the body; a placing component, the placing component is installed on the conveying component; a detection component, the detection component is installed on the body; a cleaning component, the cleaning component is installed on the body, and the cleaning component includes: a moving part, the moving part is installed on the body, and a fixed seat is installed on the moving part; a dust box, the dust box is installed on the fixed seat; a cylinder, the cylinder is installed on the fixed seat, and a base is installed on the output end of the cylinder; a dust head, the dust head is installed on the base, and the dust head and the dust box are connected by a hose.

[0010] Furthermore, the conveying assembly includes a first conveying portion arranged on the machine body, and a second conveying portion is arranged on the machine body, and the second conveying portion is located on a horizontal side of the first conveying portion.

[0011] Furthermore, the placement component includes a tray movably arranged on the conveying component, and at least two groups of sockets are provided on the tray.

[0012] Furthermore, a mounting frame is installed on the tray, a screw is rotatably installed on the mounting frame, a handle is installed on one end of the screw, two groups of threads with opposite rotation directions are arranged on the screw, splints are threadedly installed on both groups of threads, an elastic pad is arranged on one side of the splint, a limit rod is installed on the mounting frame, and the two groups of splints are slidably arranged on the limit rod.

[0013] Furthermore, the detection assembly includes a first detection part arranged on the body, the first detection part is provided with at least two groups of first probes, and a second detection part is arranged on the body, the second detection part is provided with at least two groups of second probes.

[0014] The beneficial effect of the present application is that a semiconductor discrete device testing device provided by the present application can clean the probes before and after each semiconductor discrete device test through a cleaning component to prevent contaminated dust from affecting the test results, thereby achieving the effect of cleaning the probes before and after the test.

[0015] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting part of the present application are used to provide a further understanding of the present application. The illustrative embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0017] Figure 1 It is an overall schematic diagram of a testing device for a semiconductor discrete device in the present application;

[0018] Figure 2 for Figure 1 The enlarged schematic diagram of point A in the middle;

[0019] Figure 3 for Figure 1 A partial schematic diagram of the whole;

[0020] Figure 4 for Figure 3 The enlarged schematic diagram of point B in the middle;

[0021] Among them, the reference numerals in the figure are:

[0022] 1. Machine body; 2. Conveying assembly; 21. First conveying part; 22. Second conveying part; 3. Placing assembly; 31. Tray; 32. Mounting frame; 33. Limit rod; 34. Screw rod; 35. Clamp; 36. Elastic pad; 4. Detection assembly; 41. First detection part; 42. First probe; 43. Second detection part; 44. Second probe; 5. Cleaning assembly; 51. Moving part; 52. Dust box; 53. Base; 54. Dust head; 55. Cylinder. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0025] like Figure 1 As shown, the present application provides a semiconductor discrete device testing device, comprising a body 1, and a conveying assembly 2 is arranged on the body 1, and the conveying assembly 2 is used to convey the semiconductor discrete device;

[0026] like Figure 1 As shown, the conveying assembly 2 includes a first conveying portion 21 disposed on the machine body 1, and a second conveying portion 22 is disposed on the machine body 1, and the second conveying portion 22 is located on a horizontal side of the first conveying portion 21. It should be noted that the first conveying portion 21 and the second conveying portion 22 are both existing belt conveyors, and the specific structure and principle are not described in detail here;

[0027] Meanwhile, a placement component 3 is arranged on the conveying component 2, and the placement component 3 is used to place semiconductor discrete devices;

[0028] like Figure 1-Figure 2 As shown, the placement component 3 includes a tray 31 movably arranged on the conveying component 2, and a plurality of jacks are provided on the tray 31 to facilitate the placement of pins of semiconductor discrete devices. A mounting frame 32 is fixedly installed on the tray 31, a screw rod 34 is rotatably installed on the mounting frame 32, and a handle (not shown in the figure) is fixedly installed on one end of the screw rod 34. It should be noted that two groups of threads with opposite rotation directions are arranged on the screw rod 34, and clamping plates 35 are threadedly installed on both groups of threads, and an elastic pad 36 is arranged on one side of the clamping plate 35. A limit rod 33 is fixedly installed on the mounting frame 32, and two groups of clamping plates 35 are slidably arranged on the limit rod 33.

[0029] The semiconductor discrete device to be tested is placed on the tray 31 through the jack, and the handle is turned to drive the two sets of clamping plates 35 to approach each other along the axis direction of the screw rod 34 through the screw rod 34, and the limit rod 33 fixes the moving direction to clamp the semiconductor discrete device, and the elastic pad 36 is designed to prevent it from being damaged due to excessive force;

[0030] like Figure 3-Figure 4 As shown, a detection component 4 is also provided on the body 1, and the detection component 4 is used for detecting semiconductor discrete devices;

[0031] The detection assembly 4 includes a first detection part 41 disposed on the machine body 1, and a plurality of first probes 42 are disposed on the first detection part 41. A second detection part 43 is disposed on the machine body 1, and a plurality of second probes 44 are disposed on the second detection part 43. It should be noted that the first detection part 41 and the second detection part 43 are driven by two groups of cylinders 55 respectively.

[0032] Driven by the two groups of cylinders 55, the first detection unit 41 and the second detection unit 43 respectively drive the first probe 42 and the second probe 44 to contact the pins on the semiconductor device and detect them;

[0033] At the same time, a cleaning component 5 is arranged on the machine body 1, and the cleaning component 5 is used to clean the detection component 4;

[0034] like Figure 3-Figure 4 As shown, the cleaning assembly 5 includes a moving part 51 fixedly mounted on the body 1, and the moving part 51 can move along the X-axis and the Y-axis, such as taking the moving direction of the first conveying part 21 as the X-axis, and the moving direction perpendicular to the first conveying part 21 as the Y-axis, and the moving part 51 is a prior art, such as the patent with publication number CN207807218U, and the specific structure and principle are not described in detail;

[0035] Meanwhile, a fixed seat (not shown in the figure) is fixedly mounted on the moving part 51, and a cylinder 55 and a dust collecting box 52 are fixedly mounted on the fixed seat respectively, and a base 53 is mounted on the output end of the cylinder 55, and a dust collecting head 54 is fixedly mounted on the base 53, and the dust collecting box 52 and the dust collecting head 54 are connected by a hose;

[0036] Before and after the detection of the detection component 4, driven by the cylinder 55, the base 53 drives the dust head 54 to move upward to the level with the second probe 44, and then the moving part 51 is started to drive the fixed seat to move along the X-axis direction, so as to synchronously drive the cylinder 55 and the dust box 52 to move, thereby synchronously driving the dust head 54 to move until the dust head 54 wraps the second probe 44, and then the dust box 52 can use the hose and the dust head 54 to vacuum and clean the surface of the second probe 44 and the inside of the pinhole. After the cleaning is completed, the cylinder 55 is reset, and when the moving part 51 drives it to move along the Y-axis direction to the first detection part 41, the cleaning operation can be repeated;

[0037] To summarize, before and after the inspection of semiconductor discrete devices, the inspection component 4 is cleaned by a cleaning component to prevent dust remaining on the inspection component 4 from affecting the inspection results. After cleaning, the semiconductor discrete device is placed and fixed by the placement component 3, and then placed on the conveying component 2 and transported to the inspection component 4 for inspection.

[0038] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A test device for discrete semiconductor devices, characterized in that: include: Body (1); A conveying assembly (2), wherein the conveying assembly (2) is mounted on the machine body (1); A placement component (3), the placement component (3) being mounted on the conveying component (2); A detection component (4), the detection component (4) being mounted on the machine body (1); A cleaning component (5), the cleaning component (5) being mounted on the machine body (1), the cleaning component (5) comprising: A moving part (51), the moving part (51) being mounted on the machine body (1), and a fixing seat being mounted on the moving part (51); A dust collection box (52), the dust collection box (52) being mounted on the fixing seat; A cylinder (55), the cylinder (55) being mounted on the fixing seat, and a base (53) being mounted on an output end of the cylinder (55); A dust collector head (54), the dust collector head (54) being mounted on the base (53), the dust collector head (54) and the dust collector box (52) being connected via a hose.

2. A semiconductor discrete device testing device according to claim 1, characterized in that: The conveying assembly (2) comprises a first conveying portion (21) arranged on the machine body (1), and a second conveying portion (22) is arranged on the machine body (1), wherein the second conveying portion (22) is located on a horizontal side of the first conveying portion (21).

3. The semiconductor discrete device testing device according to claim 1, characterized in that: The placement component (3) comprises a tray (31) movably arranged on the conveying component (2), and at least two groups of insertion holes are provided on the tray (31).

4. The semiconductor discrete device testing device according to claim 3, characterized in that: The tray (31) is mounted with a mounting frame (32), a screw rod (34) is rotatably mounted on the mounting frame (32), a handle is mounted on one end of the screw rod (34), two groups of threads with opposite rotation directions are arranged on the screw rod (34), a clamping plate (35) is threadedly mounted on both groups of threads, an elastic pad (36) is arranged on one side of the clamping plate (35), a limiting rod (33) is mounted on the mounting frame (32), and two groups of clamping plates (35) are slidably arranged on the limiting rod (33).

5. The semiconductor discrete device testing device according to claim 1, characterized in that: The detection assembly (4) comprises a first detection portion (41) arranged on the machine body (1), the first detection portion (41) being provided with at least two groups of first probes (42), and the machine body (1) being provided with a second detection portion (43), the second detection portion (43) being provided with at least two groups of second probes (44).

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