Novel computer CPU radiator

Abstract

The utility model relates to the technical field of CPU (central processing unit) radiators, and discloses a novel computer CPU radiator which comprises a CPU heat-conducting fin, four heat-conducting pipes are fixedly mounted at the top of the CPU heat-conducting fin, and a plurality of air guide sheets are fixedly mounted among the outer sides of the four heat-conducting pipes. A stabilizing sleeve is fixedly installed between the outer sides of the multiple air guide pieces, a storage box is fixedly installed at the top of the stabilizing sleeve, a mounting hole is formed in the top of the storage box, a heat conduction plate is fixedly installed on the inner side wall of the mounting hole, and a cooling plate located in the storage box is fixedly installed at the bottom of the heat conduction plate; a semiconductor chilling plate is fixedly mounted at the top of the heat conducting plate, a mounting sleeve is fixedly mounted at the top of the storage box, and a water pump communicating with the storage box is fixedly mounted at the top of the stabilizing sleeve. According to the novel computer CPU radiator, the air guide blades can be rapidly cooled through cold air, and therefore the radiating effect of the radiator on a CPU is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of CPU radiators, in particular to a novel computer CPU radiator. Background Art

[0002] CPU, or central processing unit, is the core and brain of the computer. It is responsible for executing instructions in computer programs, processing data, and controlling the operation of the computer. CPU is one of the most important components in computer hardware. Its performance directly affects the computer's operating speed and processing power. However, when the CPU is in use, it often generates a lot of heat, which will affect the CPU's performance. Therefore, when the CPU is in use, a radiator is often required to dissipate heat from the CPU.

[0003] The CPU radiator is one of the most important components in computer hardware. Its main function is to dissipate the heat generated by the CPU and ensure that the CPU can run stably within the appropriate temperature range. According to the different heat dissipation methods, CPU radiators can be divided into two categories: air-cooled radiators and liquid-cooled radiators. Air-cooled radiators generate airflow through fans to take away the heat from the CPU surface. Liquid-cooled radiators, also known as water-cooled radiators, absorb and take away the heat from the CPU through circulating liquid.

[0004] At present, the CPU heat dissipation device on the market has a single structure and a relatively single heat dissipation method. The CPU is simply cooled by a heat dissipation fan, and comprehensive heat dissipation treatment is not performed, resulting in poor heat dissipation effect and affecting the operating speed of the CPU. Therefore, this application proposes a new type of computer CPU heat sink to solve the above technical problems. Utility Model Content

[0005] 1. Technical issues to be solved

[0006] In view of the deficiencies in the prior art, the utility model provides a novel computer CPU radiator, which has the advantages of improving the heat dissipation effect, etc., and solves the problem that the existing CPU heat dissipation device has a single structure and heat dissipation method, resulting in poor heat dissipation effect.

[0007] (II) Technical solution

[0008] In order to achieve the above-mentioned purpose of improving the heat dissipation effect, the utility model provides the following technical solutions: a novel computer CPU radiator, comprising a CPU heat conducting sheet, four heat conducting pipes are fixedly installed on the top of the CPU heat conducting sheet, a number of air guide sheets are fixedly installed between the outer sides of the four heat conducting pipes, a stabilizing sleeve is fixedly installed between the outer sides of the plurality of air guide sheets, and a storage box is fixedly installed on the top of the stabilizing sleeve;

[0009] A mounting hole is provided on the top of the storage box, a heat conducting plate is fixedly mounted on the inner side wall of the mounting hole, a cooling plate located in the storage box is fixedly mounted on the bottom of the heat conducting plate, a semiconductor refrigeration plate is fixedly mounted on the top of the heat conducting plate, a mounting sleeve is fixedly mounted on the top of the storage box, and a water pump connected to the storage box is fixedly mounted on the top of the stabilizing sleeve;

[0010] Four connecting rods are fixedly installed on the inner wall of the installation sleeve, a coil is fixedly installed between the two connecting rods on one side close to the stabilizing sleeve, fixing holes are opened on both sides of the installation sleeve, a connecting sleeve is movably installed on the inner wall of the fixing hole, a cooling fan is fixedly installed on the inner wall of the connecting sleeve, and four limiting mechanisms are installed inside the installation sleeve.

[0011] Preferably, there are a plurality of cooling plates, and the plurality of cooling plates are evenly distributed and fixedly installed on the bottom of the heat conducting plate.

[0012] Preferably, a heat dissipation hole located above the semiconductor cooling fin is opened on the top of the mounting sleeve, and the size of the heat dissipation hole is larger than the size of the semiconductor cooling fin.

[0013] Preferably, the connecting rods form a group of two, and the coil is fixedly installed between one side of a group of connecting rods close to the stabilizing sleeve.

[0014] Preferably, the two coils are connected via a water pipe, and the output end of the right coil is connected to a storage tank.

[0015] Preferably, the limiting mechanism includes a mounting groove provided inside the mounting sleeve, a guide rod is fixedly installed on the inner side wall of the mounting groove, a sliding hole connected to the mounting groove is provided on the outer side of the mounting sleeve, an adjustment plate located on the inner side of the sliding hole is slidably connected to the outer side of the guide rod, a return spring sleeved on the outer side of the guide rod is fixedly installed on the side of the adjustment plate away from the connecting sleeve, a limiting groove is provided on the outer side of the connecting sleeve, and a limiting rod located in the limiting groove is fixedly installed on the side of the adjustment plate close to the connecting sleeve.

[0016] Preferably, the front and rear surfaces of the adjustment plate are tightly fitted with the inner wall of the sliding hole.

[0017] (III) Beneficial effects

[0018] Compared with the prior art, the utility model provides a new type of computer CPU radiator, which has the following beneficial effects:

[0019] The new computer CPU radiator places the CPU heat conducting sheet on the top of the CPU, and the CPU heat conducting sheet transfers the heat of the CPU to the heat conducting pipe, and the heat in the heat conducting pipe is transferred to the air guide sheet, and the semiconductor refrigeration sheet performs cooling, so that the semiconductor refrigeration sheet cools the heat conducting plate, and the heat conducting plate cools the cooling plate at the bottom, and the cooled cooling plate cools the coolant in the storage box, and the water pump extracts the coolant in the storage box, and the water pump sends the extracted coolant into the coil, and the coolant in the coil cools the coil and flows back into the storage box, so that the coolant can be continuously recycled, and the cooling fan blows air into the installation sleeve, and when the air blows through the coil, the coil cools the air blown by the cooling fan, and the cold air cools the air guide sheet in the stabilizing sleeve, so that the air guide sheet can be quickly cooled by the cold air, thereby improving the heat dissipation effect of the radiator on the CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the cross-sectional structure of the utility model;

[0021] Figure 2 For this utility model Figure 1 The enlarged structural diagram at A in the middle;

[0022] Figure 3 This is a schematic side view of the coil of the utility model;

[0023] Figure 4 It is a three-dimensional schematic diagram of the air guide piece and the stabilizing sleeve of the utility model.

[0024] In the figure: 1. CPU heat sink; 2. heat pipe; 3. air guide; 4. stabilizing sleeve; 5. storage box; 6. mounting hole; 7. heat conduction plate; 8. cooling plate; 9. semiconductor refrigeration plate; 10. mounting sleeve; 11. water pump; 12. connecting rod; 13. coil; 14. fixing hole; 15. connecting sleeve; 16. cooling fan; 17. limiting mechanism; 171. mounting slot; 172. guide rod; 173. sliding hole; 174. adjusting plate; 175. reset spring; 176. limiting slot; 177. limiting rod. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-4A novel computer CPU radiator comprises a CPU heat conducting sheet 1, four heat conducting pipes 2 are fixedly installed on the top of the CPU heat conducting sheet 1, a number of air guiding sheets 3 are fixedly installed between the outer sides of the four heat conducting pipes 2, a stabilizing sleeve 4 is fixedly installed between the outer sides of the plurality of air guiding sheets 3, and a storage box 5 is fixedly installed on the top of the stabilizing sleeve 4;

[0027] A mounting hole 6 is provided on the top of the storage box 5, a heat conducting plate 7 is fixedly installed on the inner side wall of the mounting hole 6, a cooling plate 8 located in the storage box 5 is fixedly installed on the bottom of the heat conducting plate 7, the number of cooling plates 8 is several, and several cooling plates 8 are evenly distributed and fixedly installed on the bottom of the heat conducting plate 7, so that the cooling plate 8 has a better cooling effect on the coolant in the storage box 5, a semiconductor cooling sheet 9 is fixedly installed on the top of the heat conducting plate 7, a mounting sleeve 10 is fixedly installed on the top of the storage box 5, a heat dissipation hole located above the semiconductor cooling sheet 9 is provided on the top of the mounting sleeve 10, and the size of the heat dissipation hole is larger than the size of the semiconductor cooling sheet, so that when the semiconductor cooling sheet 9 is in use, the heat dissipation effect of the semiconductor cooling sheet 9 is guaranteed, thereby avoiding the semiconductor heat sink 9 from being damaged due to excessive temperature during use, and a water pump 11 connected to the storage box 5 is fixedly installed on the top of the stabilizing sleeve 4;

[0028] Four connecting rods 12 are fixedly installed on the inner wall of the installation sleeve 10, and two connecting rods 12 form a group. A coil 13 is fixedly installed between the two connecting rods 12 on one side close to the stabilizing sleeve 4. The coil 13 is fixedly installed between the two sides of a group of connecting rods 12 close to the stabilizing sleeve 4. The two coils 13 are connected through a water pipe, and the output end of the right coil 13 is connected to the storage box 5, so that the coolant in the storage box 5 can be continuously circulated, thereby reducing the cost of using the CPU when cooling. Both sides of the installation sleeve 10 are provided with fixing holes 14, and the inner wall of the fixing hole 14 is movably installed with a connecting sleeve 15, and the inner wall of the connecting sleeve 15 is fixedly installed with a cooling fan 16. Four limiting mechanisms 17 are installed inside the installation sleeve 10;

[0029] The limiting mechanism 17 includes a mounting groove 171 provided inside the mounting sleeve 10, a guide rod 172 is fixedly installed on the inner side wall of the mounting groove 171, a sliding hole 173 connected to the mounting groove 171 is provided on the outer side of the mounting sleeve 10, an adjustment plate 174 located on the inner side of the sliding hole 173 is slidably connected to the outer side of the guide rod 172, the front and rear surfaces of the adjustment plate 174 are tightly fitted with the inner side wall of the sliding hole 173, so that the adjustment plate 174 has better stability when moving, a return spring 175 sleeved on the outer side of the guide rod 172 is fixedly installed on the side of the adjustment plate 174 away from the connecting sleeve 15, a limiting groove 176 is provided on the outer side of the connecting sleeve 15, and a limiting rod 177 located in the limiting groove 176 is fixedly installed on the side of the adjustment plate 174 close to the connecting sleeve 15.

[0030] In summary, the novel computer CPU radiator places the CPU heat conducting sheet 1 on the top of the CPU, and the CPU heat conducting sheet 1 transfers the heat of the CPU to the heat conducting pipe 2, and the heat in the heat conducting pipe 2 is transferred to the air guiding sheet 3, and the semiconductor refrigerating sheet 9 performs cooling, so that the semiconductor refrigerating sheet 9 cools the heat conducting plate 7, and the heat conducting plate 7 cools the cooling plate 8 at the bottom, and the cooling cooling plate 8 cools the coolant in the storage box 5, and the water pump 11 extracts the coolant in the storage box 5. The water pump 11 delivers the extracted coolant into the coil 13. The coolant in the coil 13 will cool the coil 13 and flow back into the storage box 5, so that the coolant can be continuously circulated. The cooling fan 16 blows air into the installation sleeve 10. When the air passes through the coil 13, the coil 13 will cool the air blown by the cooling fan 16. The cold air will cool the air guide plate 3 in the stabilizing sleeve 4. In this way, the air guide plate 3 can be quickly cooled by the cold air, thereby improving the heat dissipation effect of the radiator on the CPU.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A novel computer CPU radiator, comprising a CPU heat conducting sheet (1), characterized in that: Four heat conducting pipes (2) are fixedly mounted on the top of the CPU heat conducting sheet (1); a number of air guiding sheets (3) are fixedly mounted between the outer sides of the four heat conducting pipes (2); a stabilizing sleeve (4) is fixedly mounted between the outer sides of the air guiding sheets (3); and a storage box (5) is fixedly mounted on the top of the stabilizing sleeve (4); The top of the storage box (5) is provided with a mounting hole (6), the inner side wall of the mounting hole (6) is fixedly mounted with a heat conducting plate (7), the bottom of the heat conducting plate (7) is fixedly mounted with a cooling plate (8) located in the storage box (5), the top of the heat conducting plate (7) is fixedly mounted with a semiconductor cooling plate (9), the top of the storage box (5) is fixedly mounted with a mounting sleeve (10), and the top of the stabilizing sleeve (4) is fixedly mounted with a water pump (11) connected with the storage box (5); Four connecting rods (12) are fixedly mounted on the inner side wall of the installation sleeve (10); a coil (13) is fixedly mounted between the two connecting rods (12) on the side close to the stabilizing sleeve (4); fixing holes (14) are provided on both sides of the installation sleeve (10); a connecting sleeve (15) is movably mounted on the inner side wall of the fixing hole (14); a cooling fan (16) is fixedly mounted on the inner side wall of the connecting sleeve (15); and four limiting mechanisms (17) are mounted inside the installation sleeve (10).

2. A novel computer CPU radiator according to claim 1, characterized in that: The number of the cooling plates (8) is several, and the several cooling plates (8) are evenly distributed and fixedly installed on the bottom of the heat conducting plate (7).

3. A novel computer CPU radiator according to claim 1, characterized in that: A heat dissipation hole located above the semiconductor cooling sheet (9) is provided on the top of the installation sleeve (10), and the size of the heat dissipation hole is larger than the size of the semiconductor cooling sheet.

4. A novel computer CPU radiator according to claim 1, characterized in that: The connecting rods (12) are grouped in two, and the coil (13) is fixedly installed between one side of a group of connecting rods (12) close to the stabilizing sleeve (4).

5. A novel computer CPU radiator according to claim 1, characterized in that: The two coils (13) are connected via a water pipe, and the output end of the right coil (13) is connected to the storage box (5).

6. A novel computer CPU radiator according to claim 1, characterized in that: The limiting mechanism (17) comprises a mounting groove (171) provided inside the mounting sleeve (10); a guide rod (172) is fixedly installed on the inner side wall of the mounting groove (171); a sliding hole (173) communicating with the mounting groove (171) is provided on the outer side of the mounting sleeve (10); an adjusting plate (174) located inside the sliding hole (173) is slidably connected to the outer side of the guide rod (172); a return spring (175) sleeved on the outer side of the guide rod (172) is fixedly installed on the side of the adjusting plate (174) away from the connecting sleeve (15); a limiting groove (176) is provided on the outer side of the connecting sleeve (15); a limiting rod (177) located in the limiting groove (176) is fixedly installed on the side of the adjusting plate (174) close to the connecting sleeve (15).

7. A novel computer CPU radiator according to claim 6, characterized in that: The front and rear surfaces of the adjustment plate (174) are tightly fitted to the inner wall of the sliding hole (173).

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