Vacuum adsorption scribing machine structure suitable for warped wafer

Abstract

The utility model relates to the technical field of wafer vacuum adsorption machines, in particular to a vacuum adsorption scribing machine structure suitable for warped wafers, which comprises a machine table, a sealing rubber ring is arranged on the outer side edge of the machine table, a fixing claw used for clamping a wafer ring is arranged on the outer side of the machine table, the fixing claw abuts against the upper side of the wafer ring, and the wafer ring is arranged on the upper side of the machine table. The middle of the fixing claw is rotationally connected to the machine table, one end of the fixing claw is used for abutting against the upper side of the sheet ring after rotating towards the inner side, and a driving piece used for driving the other end of the fixing claw to rotate outwards is arranged on the machine table. The device has the following effects that the sealing rubber ring is additionally arranged between the sheet ring and the machine table, a gap part caused by warping can be filled, and before operation, the fixing claw rotates and abuts against the sheet ring, acting force is applied to the sealing rubber ring, sealing is formed, in this way, during adsorption, the adsorption force of a middle area can be guaranteed, and follow-up operation is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of wafer vacuum adsorption machines, and in particular to a vacuum adsorption dicing machine structure suitable for warped wafers. Background Art

[0002] Before the wafer is processed, it needs to be fixed by a carrier. Before the dicing operation, the wafer is directly attached to the wafer ring through the dicing film, and the dicing film is stretched and fixed by the vacuum adsorption machine, and then the cutting and cleaning operations are completed on the machine.

[0003] However, when thicker wafers need to be operated, the warping is too large, with the middle being low and the edges being high, resulting in the edges being unable to be adsorbed, causing vacuum leakage and reduced adsorption firmness. Utility Model Content

[0004] In order to improve the adsorption capacity for larger warped wafers, the present application provides a vacuum adsorption dicing machine structure suitable for warped wafers.

[0005] The present application provides a vacuum adsorption dicing machine structure suitable for warped wafers, which adopts the following technical solution: a vacuum adsorption dicing machine structure suitable for warped wafers, comprising a machine platform, a sealing rubber ring is arranged on the outer side of the machine platform, a fixed claw for clamping a wafer ring is arranged on the outer side of the machine platform, the fixed claw is pressed against the upper side of the wafer ring to press the sealing rubber ring, the middle part of the fixed claw is rotatably connected to the machine platform, one end of the fixed claw is used to rotate inward and then press against the upper side of the wafer ring, and a driving member is arranged on the machine platform to drive the other end of the fixed claw to rotate outward.

[0006] By adopting the above technical solution, a sealing rubber ring is added between the sheet ring and the machine table in the part with a large degree of warping, which can fill the gap caused by the warping, and before operation, the fixed claw is rotated and pressed against the sheet ring to apply force to the sealing rubber ring to form a seal. In this way, during adsorption, the adsorption force of the middle area can be guaranteed, which is convenient for subsequent operations.

[0007] Preferably, the machine platform is provided with an annular groove for embedding the sealing rubber ring, and the depth of the annular groove is not greater than half of the thickness of the sealing rubber ring.

[0008] Preferably, the inner wall of the annular groove is circumferentially provided with a plurality of protrusions embedded in the sealing rubber ring, a gap is provided between the protrusions and the bottom of the annular groove, and the side wall of the sealing rubber ring has a groove for the protrusions to be embedded.

[0009] Preferably, the thickness of the sealing rubber ring decreases gradually from the outside to the inside along the radial direction.

[0010] Preferably, the peripheral side of the machine platform has an external platform arranged in the radial direction, and the end of the external platform has an accommodating groove for the middle part of the fixed claw to rotate.

[0011] Preferably, the driving member comprises a driving rod slidably arranged along the inner length direction of the external platform, and an elastic member is arranged between the end of the fixing claw and the inner wall of the accommodating groove.

[0012] Preferably, the end of the fixing claw has a guide groove for the driving rod to be embedded in, and the guide groove extends along the length direction of the fixing claw.

[0013] Preferably, a driving ring is coaxially rotated on the machine platform, and the driving ring has an arc-shaped protrusion for abutting against the end of the driving rod away from the fixed claw.

[0014] Preferably, a telescopic pressing section is extended inwardly from one end of the fixing claw away from the driving rod.

[0015] Preferably, the end of the fixing claw has a mounting groove for the pressing section to be embedded in, and the fixing claw is threadedly connected with a stud extending into the mounting groove, and the stud is rotatably connected to the pressing section.

[0016] In summary, the present application includes at least one of the following beneficial technical effects:

[0017] 1. In the part with large warping, add a sealing rubber ring between the sheet ring and the machine table to fill the gap caused by the warping. Before operation, the fixed claw is rotated and pressed against the sheet ring to apply force to the sealing rubber ring to form a seal. In this way, the adsorption force in the middle area can be guaranteed during adsorption, which is convenient for subsequent operations.

[0018] 2. The synchronously rotating drive ring can make multiple drive rods move synchronously, thereby synchronously clamping the sheet ring to form a fixed shape;

[0019] 3. The pressing section can be adapted to sheet rings of different sizes, thereby clamping and improving adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the structure of this application;

[0021] Figure 2 It is a partial exploded schematic diagram of the present application;

[0022] Figure 3 is a schematic cross-sectional view of the sealing rubber ring;

[0023] Figure 4 Schematic diagram of the connection between the driving rod and the fixed claw;

[0024] Figure 5It is a schematic diagram of the internal structure of the machine;

[0025] Figure 6 It is a cross-sectional view of the fixing claw.

[0026] Explanation of reference numerals: 100, machine platform; 110, sealing rubber ring; 111, fixing claw; 112, ring groove; 113, protrusion; 114, groove; 120, external platform; 121, accommodating groove; 122, driving rod; 123, spring; 124, guide groove; 130, driving ring; 131, arc-shaped protrusion; 140, pressing section; 141, mounting groove; 142, stud. DETAILED DESCRIPTION

[0027] The present application is further described in detail below in conjunction with the accompanying drawings.

[0028] The embodiment of the present application discloses a vacuum adsorption dicing machine structure suitable for warped wafers, referring to Figure 1 , including a machine platform 100 , a sealing rubber ring 110 is arranged on the outer side of the machine platform 100 , a fixing claw 111 for clamping a sheet ring is arranged on the outer side of the machine platform 100 , and the sheet ring is placed in the middle part of the machine platform 100 .

[0029] Reference Figure 1 , Figure 2 , the machine 100 is provided with an annular groove 112 for embedding the sealing rubber ring 110, and the depth of the annular groove 112 is not greater than half of the thickness of the sealing rubber ring 110. In this embodiment, the depth is one-third of the thickness of the sealing rubber ring 110. In order to limit the sealing rubber ring 110 inside, the inner wall is provided with a plurality of protrusions 113 embedded in the sealing rubber ring 110 along the circumferential direction, and there is a gap between the protrusions 113 and the bottom of the annular groove 112, and the side wall of the sealing rubber ring 110 has a groove 114 for embedding the protrusions 113. During installation, the sealing rubber ring 110 needs to be pressed downward to make it fully embedded. When embedded, the lower part of the sealing rubber ring 110 is limited by the protrusions 113, and when the sheet ring is opened, it will not affect the installation, and the annular groove 112 can be limited in the radial direction.

[0030] Reference Figure 3 Since the warping is generally low in the middle and high at the edge, the thickness of the sealing rubber ring 110 in this embodiment decreases gradually from the outside to the inside in the radial direction, so as to adapt to the pressing effect of the fixed claw 111 on the sheet ring during clamping.

[0031] Reference Figure 1 , Figure 4The fixed claw 111 is pressed against the upper side of the film ring so that the sealing rubber ring 110 is compressed. The peripheral side of the machine 100 has an external platform 120 arranged in the radial direction. The middle part of the fixed claw 111 is rotatably connected to the external platform 120. The end of the external platform 120 has a receiving groove 121 for the middle part of the fixed claw 111 to rotate. One end of the fixed claw 111 is used to rotate inward and then press against the upper side of the film ring. The machine 100 is provided with a driving member for driving the other end of the fixed claw 111 to rotate outward.

[0032] The driving member includes a driving rod 122 that is slidably arranged along the length direction of the external connection platform 120, and an elastic member is arranged between the end of the fixed claw 111 and the inner wall of the accommodating groove 121. The end of the fixed claw 111 has a guide groove 124 for the driving rod 122 to be embedded, and the guide groove 124 extends along the length direction of the fixed claw 111. In this embodiment, the elastic member is a spring 123. When the driving rod 122 is pushed outward, its end will slide in the guide groove 124, and the spring 123 will extend, and the upper end of the fixed claw 111 will press against the upper side of the sheet ring. When resetting, the spring 123 can press the fixed claw 111 back, so that the driving rod 122 is reset.

[0033] Reference Figure 5 A driving ring 130 is coaxially rotated inside the machine 100, and an arc-shaped protrusion 131 is provided on the driving ring 130. The arc-shaped protrusion 131 is used to abut against the end of the driving rod 122 away from the fixed claw 111. When the driving ring 130 rotates, the arc-shaped protrusion 131 abuts against the end of the driving rod 122, increasing the radial distance, so that the driving rod 122 extends outward, and when the driving ring 130 rotates in the opposite direction, the spring 123 cooperates with the driving rod 122 to reset. In this embodiment, a driving motor is installed inside the machine 100, and a driving wheel is installed on the driving motor. The outer wall of the driving wheel has a tooth groove, and the outer wall of the corresponding driving ring 130 also has a tooth groove, thereby driving the driving ring 130 to rotate.

[0034] Reference Figure 4 , Figure 6 In order to adapt to sheet rings of different diameters, the end of the fixed claw 111 away from the driving rod 122 extends inwardly with a telescopic pressing section 140. The end of the fixed claw 111 has a mounting groove 141 for the pressing section 140 to be embedded. The fixed claw 111 is threaded with a stud 142 that extends into the mounting groove 141, and the stud 142 is rotatably connected to the pressing section 140. When the stud 142 rotates, the pressing section 140 can move inward or outward. In order to protect the sheet ring, the downward edge of the pressing section 140 is arc-shaped to reduce damage during pressing. At the same time, after changing the position of the pressing section 140, the rotation stroke of the drive ring 130 is also changed accordingly by adjusting the drive motor.

[0035] The implementation principle of the embodiment of the present application is as follows: the sheet ring and the wafer are placed in the middle, and the arc-shaped protrusion 131 will abut against the end of the driving rod 122 through the rotation of the driving ring 130. It is worth noting that, in order to facilitate the abutment, the end of the driving rod 122 is set to be inclined. After the driving rod 122 protrudes outward, its end slides in the guide groove 124, so that the lower end of the fixed claw 111 moves outward, and the synchronous spring 123 is stretched. Then the pressing section 140 moves downward and presses on the sheet ring. The downward force on the sheet ring can deform the sealing rubber ring 110, so that the middle part can maintain good sealing. When the adsorption machine is adsorbed, the inconvenience caused by the large warped sheet is reduced, thereby facilitating subsequent operations.

[0036] The embodiments of this specific implementation method are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, all equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A vacuum adsorption dicing machine structure suitable for warping wafers, comprising a machine platform (100), characterized in that: A sealing rubber ring (110) is arranged on the outer side of the machine (100), and a fixing claw (111) for clamping a sheet ring is arranged on the outer side of the machine (100); the fixing claw (111) is pressed against the upper side of the sheet ring so that the sealing rubber ring (110) is pressed; a middle part of the fixing claw (111) is rotatably connected to the machine (100); one end of the fixing claw (111) is used to rotate inwardly and press against the upper side of the sheet ring; and a driving member for driving the other end of the fixing claw (111) to rotate outwardly is arranged on the machine (100).

2. A vacuum adsorption dicing machine structure suitable for warped wafers according to claim 1, characterized in that: The machine platform (100) is provided with an annular groove (112) for the sealing rubber ring (110) to be embedded, and the depth of the annular groove (112) is not greater than half the thickness of the sealing rubber ring (110).

3. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 2, characterized in that: The inner wall of the annular groove (112) is provided with a plurality of protrusions (113) embedded in the sealing rubber ring (110) along the circumferential direction, and there is a gap between the protrusions (113) and the bottom of the annular groove (112), and the side wall of the sealing rubber ring (110) has a groove (114) for the protrusions (113) to be embedded.

4. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 3, characterized in that: The thickness of the sealing rubber ring (110) gradually decreases from the outside to the inside in the radial direction.

5. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 3, characterized in that: The peripheral side of the machine platform (100) is provided with an external platform (120) arranged in a radial direction, and the end of the external platform (120) is provided with a receiving groove (121) for the middle part of the fixed claw (111) to rotate.

6. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 5, characterized in that: The driving member comprises a driving rod (122) slidably arranged along the length direction inside the external connection platform (120), and an elastic member is arranged between the end of the fixing claw (111) and the inner wall of the accommodating groove (121).

7. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 6, characterized in that: The end of the fixing claw (111) has a guide groove (124) for the driving rod (122) to be embedded in, and the guide groove (124) extends along the length direction of the fixing claw (111).

8. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 7, characterized in that: A driving ring (130) is coaxially rotated on the machine platform (100), and the driving ring (130) has an arc-shaped protrusion (131) for contacting the end of the driving rod (122) away from the fixed claw (111).

9. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 8, characterized in that: An end of the fixing claw (111) away from the driving rod (122) is provided with a telescopic pressing section (140) extending inward.

10. The vacuum adsorption dicing machine structure suitable for warped wafers according to claim 9, characterized in that: The end of the fixing claw (111) has a mounting groove (141) for the pressing section (140) to be embedded in, and the fixing claw (111) is threadedly connected with a stud (142) extending into the mounting groove (141), and the stud (142) is rotatably connected to the pressing section (140).

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