Pressing plate stacking structure for improving gummosis

Abstract

The utility model provides a pressing plate stacking structure for improving gummosis, and relates to the technical field of electronic products. Comprising a soft board body, a first buffer layer, a second buffer layer, a first Cu layer, a second Cu layer, a first PP layer and a second PP layer, the first buffer layer, the second buffer layer, the first Cu layer, the second Cu layer, the first PP layer and the second PP layer are sequentially and symmetrically arranged on the two sides of the soft board body from outside to inside, a third Cu layer and a fourth Cu layer are arranged on the two sides of the soft board body respectively, the first buffer layer and the first Cu layer are provided with a first open cover, and the first buffer layer extends into the first open cover. The first buffer layer extends into the first Cu layer, the second Cu layer extends into the second Cu layer, the first Cu layer is in contact with the first PP layer for glue resistance, the second buffer layer and the second Cu layer are provided with a second open cover, and the second buffer layer extends into the second open cover so as to be in contact with the second PP layer for glue resistance, the structure is simple, the design is reasonable, and compared with a traditional structure in which a copper sheet is arranged between a buffer material and PP, the glue resistance effect is poor; according to the utility model, the pressing plate stacking structure is optimized, and the buffer layer is used for directly blocking the PP glue of the RF wire, so that the glue of the RF wire flows out; and the thickness is 0.3 mm, so that the product requirements can be better met.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to a pressure plate stacking structure for improving glue flow. Background Art

[0002] CCM (Contraction / CMOS Camera Moudule) camera module is the core component used in various new generation portable camera devices due to its high image quality and fast photo sensing speed. Compared with traditional camera systems, it has the advantages of miniaturization, low power consumption, low cost and high camera quality.

[0003] The conventional CCM strip CVL (cover film) design has an inner soft board copper thickness of 18um, and the product uses Low flow PP (low flow polypropylene) + etching to open the cover. Due to the use of Low flow PP for pressing, in order to ensure the copper filling requirement, the pressing plate pressure needs to be 36kg, and there is a whole copper foil between the buffer layer and the PP, the glue resistance effect is poor, resulting in excessive PP glue flow, and its RF (radio frequency) line glue flow> 0.3mm, which does not meet the CCM product glue flow requirements.

[0004] In view of this, the present application aims to provide a pressure plate stacking structure that improves glue flow, so as to better solve the above-mentioned technical problems. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a pressure plate stacking structure for improving glue flow, which can solve the technical problem of excessive glue flow at the RF line position of electronic products.

[0006] An embodiment of the present application provides a press plate stack structure for improving glue flow, including a soft board body and a first buffer layer and a second buffer layer, a first Cu layer and a second Cu layer, and a first PP layer and a second PP layer, which are symmetrically arranged on both sides of the soft board body from the outside to the inside, and a third Cu layer and a fourth Cu layer are respectively arranged on both sides of the soft board body, a first opening cover is opened on the first buffer layer and the first Cu layer, the first buffer layer extends into the first opening cover to contact the first PP layer to block glue, and a second opening cover is opened on the second buffer layer and the second Cu layer, the second buffer layer extends into the second opening cover to contact the second PP layer to block glue.

[0007] Furthermore, the third Cu layer and the fourth Cu layer are respectively provided with a coating area, and the first open cover and the second open cover are provided corresponding to the coating area.

[0008] Furthermore, the thickness of the third Cu layer and the fourth Cu layer are respectively set to 17-19 um.

[0009] Furthermore, the first buffer layer is set to be any one of a polyester film, a silicone pad and a Teflon film.

[0010] Furthermore, the second buffer layer is set to be any one of a polyester film, a silicone pad and a Teflon film.

[0011] Furthermore, the materials of the first buffer layer and the second buffer layer are set to be consistent.

[0012] Furthermore, a first release film is provided on a side of the first buffer layer away from the first Cu layer; and a second release film is provided on a side of the second buffer layer away from the second Cu layer.

[0013] Beneficial effects of the utility model:

[0014] The utility model provides a press plate stacking structure for improving glue flow, comprising a soft board body and a first buffer layer and a second buffer layer, a first Cu layer and a second Cu layer, and a first PP layer and a second PP layer, which are symmetrically arranged on both sides of the soft board body from outside to inside, respectively. A third Cu layer and a fourth Cu layer are arranged on both sides of the soft board body, respectively. A first opening cover is provided on the first buffer layer and the first Cu layer, the first buffer layer extends into the first opening cover, contacts with the first PP layer, and performs glue blocking. A second opening cover is provided on the second buffer layer and the second Cu layer, the second buffer layer extends into the second opening cover, contacts with the second PP layer, and performs glue blocking. The utility model has a simple structure and a reasonable design. Compared with the traditional structure in which a copper sheet is provided between the buffer material and the PP, the glue blocking effect is poor. The utility model optimizes the press plate stacking structure and uses the buffer layer to directly block the RF line PP glue, so that the RF line glue flow is less than 0.3mm, which can better meet product requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the structure of some embodiments of the utility model;

[0017] Figure 2 It is a schematic diagram of the structure of the pressed state in some embodiments of the utility model;

[0018] Figure 3 The invention relates to a pressure plate design structure in the prior art.

[0019] The reference numerals are:

[0020] Soft board body 1, third Cu layer 11, fourth Cu layer 12, coating area 13, first buffer layer 2, second buffer layer 3, first Cu layer 4, second Cu layer 5, first PP layer 6, second PP layer 7, first opening cover 8, second opening cover 9, first release film 10, second release film 101, A-cover plate, B-kraft paper. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0023] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0024] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0025] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0026] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] See also Figure 1-Figure 2 As shown, a press plate stacking structure for improving glue flow described in this embodiment includes a soft board body 1 and a first buffer layer 2 and a second buffer layer 3, a first Cu layer 4 and a second Cu layer 5, and a first PP layer 6 and a second PP layer 7 symmetrically arranged on both sides of the soft board body 1 from the outside to the inside, a third Cu layer 11 and a fourth Cu layer 12 are respectively provided on both sides of the soft board body 1, a first open cover 8 is opened on the first buffer layer 2 and the first Cu layer 4, the first buffer layer 2 extends into the first open cover 8, contacts with the first PP layer 6, and performs glue blocking, a second open cover 9 is opened on the second buffer layer 3 and the second Cu layer 5, the second buffer layer 4 extends into the second open cover 9 to contact with the second PP layer 7, and performs glue blocking.

[0028] This embodiment has a simple structure and reasonable design. Compared with the traditional structure, there is a copper sheet between the buffer material and the PP (see Figure 3 As shown), the blocking effect is poor. This embodiment optimizes the laminated structure of the pressure plate and uses a buffer layer to directly block the RF line PP glue, so that the RF line flow glue is less than 0.3mm, which can better meet product requirements.

[0029] In some embodiments, the third Cu layer 11 and the fourth Cu layer 12 are respectively provided with a coating region 13 , and the first open cover 8 and the second open cover 9 are provided corresponding to the coating region 13 .

[0030] In this embodiment, by arranging the first opening cover 8 and the second opening cover 9 corresponding to the film coating area 13, the first buffer layer and the second buffer layer can directly extend into the film coating area 13 to directly block the PP glue flow, so that the product glue flow meets the production requirements.

[0031] In some embodiments, the thickness of the third Cu layer 11 and the fourth Cu layer 12 are respectively set to 17-19 um.

[0032] The thickness of the third Cu layer 11 and the fourth Cu layer 12 in this embodiment are conventionally set to meet conventional production requirements.

[0033] In some embodiments, the first buffer layer 2 is configured to be any one of a polyester film, a silicone pad and a Teflon film.

[0034] Specifically, the second buffer layer 3 is set to be any one of a polyester film, a silicone pad and a Teflon film.

[0035] More specifically, the materials of the first buffer layer 2 and the second buffer layer 3 are set to be consistent.

[0036] This embodiment specifically shows several material selections for the buffer layer, which is a preferred embodiment. At the same time, as a preferred embodiment, the first buffer layer 2 and the second buffer layer 3 can be made of the same material to achieve the same glue-blocking effect and ensure product quality.

[0037] In some embodiments, a first release film 10 is provided on a side of the first buffer layer 2 facing away from the first Cu layer 4 ; a second release film 101 is provided on a side of the second buffer layer 3 facing away from the second Cu layer 5 .

[0038] The release film in this embodiment can be specifically set as a PET film. After the lamination is completed, it can be easily peeled off when it is needed. Its structure is simple and easy to use.

[0039] The above are only preferred embodiments of the present application and are not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A plate stacking structure for improving glue flow, characterized in that: The invention comprises a soft board body and a first buffer layer and a second buffer layer, a first Cu layer and a second Cu layer, and a first PP layer and a second PP layer, which are symmetrically arranged on both sides of the soft board body from the outside to the inside. A third Cu layer and a fourth Cu layer are respectively arranged on both sides of the soft board body. A first opening cover is opened on the first buffer layer and the first Cu layer. The first buffer layer extends into the first opening cover to contact the first PP layer for glue blocking. A second opening cover is opened on the second buffer layer and the second Cu layer. The second buffer layer extends into the second opening cover to contact the second PP layer for glue blocking.

2. The plate stacking structure for improving glue flow according to claim 1, characterized in that: The third Cu layer and the fourth Cu layer are respectively provided with film regions, and the first open cover and the second open cover are provided corresponding to the film regions.

3. The plate stacking structure for improving glue flow according to claim 1, characterized in that: The thickness of the third Cu layer and the fourth Cu layer are set to 17-19 um respectively.

4. The plate stacking structure for improving glue flow according to claim 1, characterized in that: The first buffer layer is set to be any one of a polyester film, a silicone pad and a Teflon film.

5. The plate stacking structure for improving glue flow according to claim 4, characterized in that: The second buffer layer is configured to be any one of a polyester film, a silicone pad and a Teflon film.

6. The plate stacking structure for improving glue flow according to claim 5, characterized in that: The materials of the first buffer layer and the second buffer layer are set to be consistent.

7. The plate stacking structure for improving glue flow according to claim 1, characterized in that: A first release film is disposed on a side of the first buffer layer away from the first Cu layer; and a second release film is disposed on a side of the second buffer layer away from the second Cu layer.

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