Multi-layer circuit board capable of preventing circuit board displacement

Abstract

The utility model relates to the technical field of multi-layer circuit boards, in particular to a multi-layer circuit board capable of preventing circuit board displacement, which comprises a frame main body, a plurality of groups of single-layer circuit boards are arranged on the inner side of the frame main body through a clamping mechanism, placing grooves are arranged on two sides of the frame main body, cooling fans are arranged on the inner sides of the placing grooves, and the single-layer circuit boards are arranged in the placing grooves. A placement groove is formed in one side of the frame main body, a dustproof net is installed on one side of the placement groove, an attaching heat dissipation mechanism is installed on one side of the frame main body, the clamping mechanism comprises a positioning assembly and a pulling and hanging assembly, the positioning assembly is used for making the single-layer circuit board abut against the frame main body, and the pulling and hanging assembly is used for unlocking positioning of the single-layer circuit board; the laminating heat dissipation mechanism is used for carrying out heat dissipation treatment on the single-layer circuit board; according to the utility model, the structure is simple, the operation is convenient, a worker can conveniently overhaul or replace the faulted single-layer circuit board in time, and the clamping mode can ensure that the single-layer circuit board does not displace after being assembled.

Description

Technical Field

[0001] The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board capable of preventing the circuit board from shifting. Background Art

[0002] A conductive pattern made of printed circuits, printed components or a combination of the two on an insulating material according to a predetermined design is called a circuit board. A conductive pattern that provides electrical connections between components on an insulating substrate is called a printed circuit. Therefore, the finished board of a printed circuit or printed circuit can be called a printed circuit board, also known as a printed board or printed circuit board. Circuit boards can be divided into: single-sided circuit boards, double-sided circuit boards, multi-layer circuit boards, aluminum-based circuit boards, impedance circuit boards and FPC flexible circuit boards according to their functions. In the prior art, as the technology of the supply chain becomes more and more mature, a multi-layer circuit board superposition design has gradually emerged to make the circuit board performance more powerful. However, due to the superimposed design of this type of multi-layer circuit board, the internal heat cannot be quickly transferred to the outside world, resulting in general heat dissipation capacity, and the performance release under long-term high load is limited: the existing multi-layer circuit board has a fixed structure and is not easy to disassemble and adjust, resulting in a small scope of application.

[0003] In order to solve the above technical problems, a Chinese patent with announcement number CN213880395U in the prior art discloses a multilayer circuit board, comprising two parallel side frames, a plurality of parallel PCB boards arranged on the inner sides of the two side frames, a top cover body and a bottom cover body respectively arranged on the top and bottom of the two side frames and welded and fixed thereto, the two side frames are provided with a first protective plate fitted with their outer walls, and a second protective plate is fixedly nested on the top and bottom of the two first protective plates.

[0004] Although the above-mentioned prior art solution enhances the heat dissipation capacity of the circuit board and ensures the performance release under long-term high load, the two sides of each PCB board are respectively inserted and bonded to the inner sides of the two side strips. Although the position of the PCB board will not be shifted, it is difficult for the staff to take it out for inspection or replacement when it fails, which in turn affects the subsequent use effect. Utility Model Content

[0005] The purpose of the utility model is to provide a multilayer circuit board which can prevent the circuit board from shifting, so as to solve the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A multi-layer circuit board capable of preventing the circuit board from shifting comprises a frame body, a plurality of groups of single-layer circuit boards are installed on the inner side of the frame body through a clamping mechanism, placement grooves are provided on both sides of the frame body, a cooling fan is installed on the inner side of the placement groove, a dustproof net is installed on one side of the placement groove, a fitting heat dissipation mechanism is installed on one side of the frame body, the clamping mechanism comprises a positioning component and a hanging component, the positioning component is used to abut the single-layer circuit board on the frame body, and the hanging component is used to release the positioning of the single-layer circuit board;

[0008] The laminating heat dissipation mechanism is used for heat dissipation treatment of a single-layer circuit board.

[0009] As a preferred solution of the utility model, the positioning assembly includes a placement block installed at one end of the top of the single-layer circuit board, a pressure block is installed at one end of the bottom of the placement block, a plurality of groups of pressure grooves that are engaged with the pressure block are arranged at one end of the top of the frame body, a positioning groove is provided on one side of the pressure groove inside the frame body, a positioning block is slidably connected to the inside of the positioning groove, springs are installed between both ends of one side of the positioning block and the positioning groove, and the positioning groove and the inside of the pressure groove are connected.

[0010] As a preferred solution of the utility model, the side cross-section of the positioning block is T-shaped, the cross-section of the pressing block is L-shaped, and the contacting ends of the positioning block and the pressing block are both provided with slopes that fit each other.

[0011] As a preferred solution of the utility model, an extension groove is provided on one side of the positioning groove of the frame body, a pull rod is installed on one side of the positioning block between two groups of springs, the pull rod is slidingly connected to the frame body, one end of the pull rod extending to the inner side of the extension groove is rotatably connected to a pull ring, and a hanging column is installed on the inner wall of the extension groove.

[0012] As a preferred solution of the utility model, the fitting heat dissipation mechanism includes an adjustment groove opened on the inner wall of one side of the frame body, a threaded rod is rotatably connected to the inner side of the adjustment groove, a rotating rod is installed between two adjacent groups of the threaded rods, the rotating rod is rotatably connected to the inside of the frame body, and a knob is installed on one side of the frame body, and one end of one group of the rotating rods is fixedly connected to one end of the knob.

[0013] As a preferred solution of the utility model, the thread on the left side of the center of the threaded rod is opposite to the thread on the right side, and both ends of the threaded rod are threadedly connected with adjustment blocks, the adjustment block is slidingly connected to the inner side of the adjustment groove, a metal heat sink is installed at one end of the adjustment block, and the opposite surfaces of the two groups of metal heat sinks are installed with thermal conductive adhesive stickers.

[0014] As a preferred solution of the utility model, a plurality of groups of closed grooves are arranged on one side of the frame body, the inner side of the closed groove is connected to the inner side of the extension groove, limiting grooves are provided on both sides of the inner wall of the closed groove, a closing plate is slidably connected to the inner side of the closed groove, and limiting blocks slidably connected to the limiting grooves are installed on both sides of the closing plate.

[0015] As a preferred solution of the utility model, a magnetic block is embedded and installed at one end of the closing plate, an iron block adsorbed by the magnetic block is embedded and installed on the inner wall of the closing groove, and a buckle groove is opened on one side of the closing plate.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] 1. In the utility model, the single-layer circuit board can be clamped on the frame body or separated and disassembled by pressing and pulling the crimping mechanism. The structure is simple and the operation is convenient, which is convenient for the staff to repair or replace the faulty single-layer circuit board in time, and the clamping method can ensure that the single-layer circuit board will not be displaced after assembly.

[0018] 2. In the utility model, by rotating the knob and cooperating with the multiple sets of rotating rods, the multiple sets of threaded rods can be linked to rotate, which can drive all the thermal conductive adhesives and metal heat sinks to fit close to the single-layer circuit board at one time, accelerate the absorption of its heat, and play a certain heat dissipation role. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0020] Figure 2 For this utility model Figure 1 A schematic diagram of the enlarged structure of part A;

[0021] Figure 3 It is a partial cross-sectional structural schematic diagram of the clamping mechanism of the utility model;

[0022] Figure 4 It is a partial cross-sectional structural schematic diagram of the laminating heat dissipation mechanism of the utility model.

[0023] In the figure: 1. Frame body; 2. Single-layer circuit board; 3. Placement block; 4. Pressure block; 5. Positioning block; 6. Spring; 7. Slope; 8. Pull rod; 9. Pull ring; 10. Hanging column; 11. Threaded rod; 12. Rotating rod; 13. Knob; 14. Adjustment block; 15. Metal heat sink; 16. Thermal conductive adhesive; 17. Closing groove; 18. Closing plate; 19. Limit block; 20. Magnetic block; 21. Buckle and pull groove. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Example

[0025] See also Figure 1-Figure 4 , the utility model provides a technical solution:

[0026] A multi-layer circuit board capable of preventing the circuit board from shifting comprises a frame body 1, a plurality of groups of single-layer circuit boards 2 are installed on the inner side of the frame body 1 through a clamping mechanism, placement grooves are provided on both sides of the frame body 1, a cooling fan is installed on the inner side of the placement groove, a dustproof net is installed on one side of the placement groove, a fitting cooling mechanism is installed on one side of the frame body 1, the clamping mechanism comprises a positioning component and a hanging component, the positioning component is used to abut the single-layer circuit board 2 on the frame body 1, and the hanging component is used to release the positioning of the single-layer circuit board 2;

[0027] The laminating heat dissipation mechanism is used to perform heat dissipation treatment on the single-layer circuit board 2. When in use, the single-layer circuit board 2 can be clamped on the frame body 1 or separated and disassembled by pressing and pulling the crimping mechanism. It has a simple structure and is easy to operate, which is convenient for the staff to promptly repair or replace the faulty single-layer circuit board 2. The rotating knob 13 cooperates with the multiple groups of rotating rods 12 to link the multiple groups of threaded rods 11 to rotate, which can drive all the thermal conductive adhesive stickers 16 and the metal heat sink 15 to fit close to the single-layer circuit board 2 at one time, accelerate the absorption of its heat, and play a certain heat dissipation role.

[0028] In this embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, the positioning assembly includes a placement block 3 installed on one end of the top of the single-layer circuit board 2, a pressure block 4 is installed on one end of the bottom of the placement block 3, a plurality of groups of pressure grooves that are engaged with the pressure block 4 are arranged at one end of the top of the frame body 1, a positioning groove is opened on one side of the pressure groove inside the frame body 1, a positioning block 5 is slidably connected to the inner side of the positioning groove, springs 6 are installed between the two ends of one side of the positioning block 5 and the positioning groove, and the positioning groove and the inner side of the pressure groove are connected. First, the placement block 3 on the single-layer circuit board 2 is placed on the top of the frame body 1, so that the pressure block 4 enters the inner side of the pressure groove, and the single-layer circuit board 2 is initially docked on the frame body 1.

[0029] In this embodiment, if Figure 1 , Figure 2 and Figure 3As shown, the side section of the positioning block 5 is T-shaped, and the section of the pressing block 4 is L-shaped. The contacting ends of the positioning block 5 and the pressing block 4 are provided with slopes 7 that fit each other. Then, the placement block 3 is pressed downward, so that the slope 7 of the pressing block 4 at the bottom of the placement block 3 squeezes the slope 7 at one end of the positioning block 5, squeezing the positioning block 5 and the spring 6 to move toward the inside of the positioning groove. After the pressing block 4 is completely inserted into the inside of the pressing groove, the slope 7 of the positioning block 5 loses resistance, and the spring 6 drives the positioning block 5 to pop out and abut against one end of the pressing block 4, thereby achieving the effect of abutting and fixing the single-layer circuit board 2.

[0030] In this embodiment, if Figure 1 , Figure 2 and Figure 3 As shown, an extension groove is provided on one side of the positioning groove of the frame body 1, and a pull rod 8 is installed between two groups of springs 6 on one side of the positioning block 5. The pull rod 8 is slidably connected to the frame body 1, and one end of the pull rod 8 extending to the inner side of the extension groove is rotatably connected to a pull ring 9, and a hanging column 10 is installed on the inner wall of the extension groove. Further, the pull ring 9 is pulled toward the end away from the positioning block 5, so that the positioning block 5 squeezes the spring 6 again, forcing it to retract again, and the positioning block 5 no longer abuts against one end of the pressing block 4. At this time, the faulty single-layer circuit board 2 can be pulled out for inspection or replacement to ensure subsequent use, and the clamping method can ensure that the single-layer circuit board will not be displaced after assembly.

[0031] In this embodiment, if Figure 1 and Figure 4 As shown, the laminating heat dissipation mechanism includes an adjustment groove opened on the inner wall of one side of the frame body 1, a threaded rod 11 is rotatably connected to the inner side of the adjustment groove, a rotating rod 12 is installed between two adjacent groups of threaded rods 11, the rotating rod 12 is rotatably connected to the inside of the frame body 1, and a knob 13 is installed on one side of the frame body 1, one end of one group of rotating rods 12 is fixedly connected to one end of the knob 13, the thread on the left side of the center of the threaded rod 11 is opposite to the thread on the right side, and both ends of the threaded rod 11 are threadedly connected to an adjustment block 14, the adjustment block 14 is slidably connected to the inner side of the adjustment groove, one end of the adjustment block 14 is installed with a metal heat sink 15, and the opposite surfaces of the two groups of metal heat sinks 15 are installed with thermal conductive adhesive 16. Further, the rotating knob 13 can cooperate with multiple groups of rotating rods 12, so that the multiple groups of threaded rods 11 rotate in conjunction, and the two groups of adjustment blocks 14 move on the inner side of the adjustment groove, driving all the thermal conductive adhesive 16 and the metal heat sink 15 to fit close to the single-layer circuit board 2 at one time, so as to accelerate the absorption of its heat when it is heated.

[0032] In this embodiment, if Figure 1 , Figure 2 and Figure 3As shown, a plurality of groups of closed grooves 17 are arranged on one side of the frame body 1, the inner side of the closed groove 17 is connected with the inner side of the extension groove, and limiting grooves are provided on both sides of the inner wall of the closed groove 17, and a closing plate 18 is slidably connected to the inner side of the closed groove 17, and limiting blocks 19 slidably connected to the limiting grooves are installed on both sides of the closed plate 18, a magnetic block 20 is embedded and installed at one end of the closed plate 18, and an iron block adsorbed by the magnetic block 20 is embedded and installed on the inner wall of the closed groove 17, and a buckling groove 21 is provided on one side of the closed plate 18, and further, buckling the buckling groove 21 on the closed plate 18 and cooperating with the limiting block 19 can drive it to move along the direction of the limiting groove, so that the magnetic block 20 on the closed plate 18 and the iron block inside the closed groove 17 are adsorbed, so as to achieve the effect of covering the pull ring 9 and prevent the staff from accidentally touching it after the installation is completed.

[0033] The implementation principle of a multi-layer circuit board that can prevent the circuit board from shifting in the embodiment of the present application is as follows: the placement block 3 on the single-layer circuit board 2 is placed on the top of the frame body 1, so that the pressure block 4 enters the inner side of the pressure groove, and the single-layer circuit board 2 is initially docked on the frame body 1, and the placement block 3 is pressed downward so that the slope 7 of the pressure block 4 at the bottom end of the placement block 3 squeezes the slope 7 at one end of the positioning block 5, and the positioning block 5 and the spring 6 are squeezed to move toward the inner side of the positioning groove. After the pressure block 4 is completely stuck in the inner side of the pressure groove, the slope 7 of the positioning block 5 loses resistance, and the spring 6 drives the positioning block 5 to pop out and abut against one end of the pressure block 4, so as to achieve the effect of abutting and fixing the single-layer circuit board 2, and the pull ring 9 is pulled toward the end away from the positioning block 5, so that the positioning block 5 squeezes the spring 6 again, forcing it to retract again, and the positioning block 5 no longer abuts against At one end of the pressing block 4, the faulty single-layer circuit board 2 can be pulled out for inspection or replacement to ensure the use of subsequent personnel, and the clamping method can ensure that the single-layer circuit board will not be displaced after assembly. The rotating knob 13 can cooperate with multiple sets of rotating rods 12 to make multiple sets of threaded rods 11 rotate in conjunction, and the two sets of adjusting blocks 14 move on the inner side of the adjusting groove, driving all the thermal conductive adhesive stickers 16 and the metal heat sink 15 to fit close to the single-layer circuit board 2 at one time, and accelerating the absorption of its heat when it is hot. The buckle groove 21 on the closing plate 18 is buckled and cooperated with the limit block 19 to drive it to move along the direction of the limit groove, so that the magnetic block 20 on the closing plate 18 and the iron block inside the closing groove 17 are adsorbed, so as to achieve the effect of covering the pull ring 9 and prevent the staff from accidentally touching it after the installation is completed.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board capable of preventing the circuit board from shifting, comprising a frame body (1), characterized in that: A plurality of groups of single-layer circuit boards (2) are installed on the inner side of the frame body (1) via a clamping mechanism, placement grooves are provided on both sides of the frame body (1), a cooling fan is installed on the inner side of the placement groove, a dust screen is installed on one side of the placement groove, a fitting cooling mechanism is installed on one side of the frame body (1), the clamping mechanism comprises a positioning component and a hanging component, the positioning component is used to abut the single-layer circuit board (2) against the frame body (1), and the hanging component is used to release the positioning of the single-layer circuit board (2); The laminating heat dissipation mechanism is used to perform heat dissipation treatment on a single-layer circuit board (2).

2. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 1, characterized in that: The positioning assembly comprises a placement block (3) mounted on one end of the top of the single-layer circuit board (2), a pressure block (4) being mounted on one end of the bottom of the placement block (3), a plurality of groups of pressure grooves arranged at one end of the top of the frame body (1) being snap-fitted and connected to the pressure block (4), a positioning groove being arranged inside the frame body (1) on one side of the pressure groove, a positioning block (5) being slidably connected inside the positioning groove, springs (6) being mounted between both ends of one side of the positioning block (5) and the positioning groove, and the positioning groove is connected to the inside of the pressure groove.

3. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 2, characterized in that: The side cross-section of the positioning block (5) is T-shaped, the cross-section of the pressing block (4) is L-shaped, and the ends of the positioning block (5) and the pressing block (4) that contact each other are both provided with slope surfaces (7) that fit each other.

4. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 3, characterized in that: An extension groove is provided on one side of the positioning groove of the frame body (1); a pull rod (8) is installed on one side of the positioning block (5) between two groups of springs (6); the pull rod (8) is slidably connected to the frame body (1); one end of the pull rod (8) extending to the inner side of the extension groove is rotatably connected to a pull ring (9); and a hanging column (10) is installed on the inner wall of the extension groove.

5. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 4, characterized in that: The fitting heat dissipation mechanism comprises an adjustment groove formed on an inner wall of one side of a frame body (1); a threaded rod (11) is rotatably connected to the inner side of the adjustment groove; a rotating rod (12) is installed between two adjacent groups of the threaded rods (11); the rotating rod (12) is rotatably connected to the inside of the frame body (1); a knob (13) is installed on one side of the frame body (1); one end of one group of the rotating rods (12) is fixedly connected to one end of the knob (13).

6. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 5, characterized in that: The threads on the left side and the threads on the right side of the center of the threaded rod (11) are opposite to each other, and both ends of the threaded rod (11) are threadedly connected to adjustment blocks (14), and the adjustment block (14) is slidably connected to the inner side of the adjustment groove. A metal heat sink (15) is installed at one end of the adjustment block (14), and the opposite surfaces of the two groups of metal heat sinks (15) are installed with thermal conductive adhesive patches (16).

7. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 6, characterized in that: A plurality of groups of closed grooves (17) are arranged on one side of the frame body (1), the inner side of the closed groove (17) is connected to the inner side of the extension groove, both sides of the inner wall of the closed groove (17) are provided with limit grooves, the inner side of the closed groove (17) is slidably connected to a closing plate (18), and both sides of the closed plate (18) are provided with limit blocks (19) slidably connected to the limit grooves.

8. A multilayer circuit board capable of preventing the circuit board from shifting according to claim 7, characterized in that: A magnetic block (20) is embedded and installed at one end of the closing plate (18), an iron block adsorbed by the magnetic block (20) is embedded and installed on the inner wall of the closing groove (17), and a buckling groove (21) is opened on one side of the closing plate (18).

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