Reinforced electromagnetic wave-absorbing plate
By designing a "wave-shaped" structure and bumps on the wave inlet hole of the wave absorber plate, and combining the design of the wave absorber plate and the heat dissipation plate, the problem of reducing the wave absorbing effect caused by the wave inlet hole when the thickness of the wave absorber plate is the same, and a more efficient electromagnetic wave absorption and heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202420776018.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-15
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-04-15
AI Technical Summary
The cylindrical inlet holes on the wave absorbing plate of the same thickness lead to a short trajectory of electromagnetic wave reflection, which easily makes the wave absorbing plate saturated and reduces the wave absorbing effect.
The wave inlet hole of the wave absorbing motherboard is designed as a "wavy shape", and multiple bumps are fixedly connected on the inside to form an irregular and rough surface structure. At the same time, the wave absorbing secondary plate and the heat dissipation plate are fixedly connected on the side of the wave absorbing motherboard, and a heat conduction hole and a heat conduction rod are provided on the side of the heat dissipation plate to improve the heat dissipation effect.
Through the design of "wave-shaped" wave inlet holes and bumps, the reflection path of electromagnetic waves is extended, energy loss is increased, the absorption effect is improved, and the upper saturation limit of the absorber motherboard is increased through the heat dissipation structure, solving the problem that the absorber plate is easily in a saturated state.
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Figure CN222692177U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of plates, in particular to a reinforced electromagnetic wave absorbing plate. Background Art
[0002] Absorbing materials refer to a type of material that can absorb or significantly reduce the electromagnetic wave energy received on its surface, thereby reducing the interference of electromagnetic waves. Studies have confirmed that ferrite absorbing materials have the best performance.
[0003] At present, the absorbing materials are made into more solid and stable electromagnetic absorbing plates after composite processing. In order to better reflect electromagnetic waves, a plurality of cylindrical wave inlet holes are usually opened on the electromagnetic absorbing plates.
[0004] However, when the electromagnetic absorbing plate has the same thickness, the cylindrical wave inlet hole makes the trajectory of electromagnetic wave reflection shorter and it is easy to put the absorbing plate into a saturated state, resulting in reduced absorbing effect. Therefore, the utility model proposes a reinforced electromagnetic absorbing plate to solve the above problems. Utility Model Content
[0005] The purpose of the utility model is to provide a reinforced electromagnetic absorbing plate to solve the problem in the above-mentioned background technology that the cylindrical wave inlet holes on the absorbing plates of the same thickness make the trajectory of electromagnetic wave reflection shorter, resulting in the absorbing plates being easily in a saturated state and reducing the absorbing effect.
[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a reinforced electromagnetic wave absorbing plate, the reinforced electromagnetic wave absorbing plate comprising:
[0007] A wave-absorbing main board, wherein a plurality of wave-entry holes are provided through one side of the wave-absorbing main board, wherein the plurality of wave-entry holes are arranged in a "wave shape" and are distributed in a linear array, and a plurality of protrusions are fixedly connected to the inner side of the wave-entry holes, wherein the plurality of protrusions are arranged irregularly and have rough surfaces.
[0008] Preferably, a wave absorbing secondary plate is fixedly connected to one side of the wave absorbing main plate, and a heat dissipation plate is fixedly connected to one side of the wave inlet hole.
[0009] Preferably, a plurality of heat-conducting holes distributed in a linear array are formed through one side of the heat dissipation plate, and the heat-conducting holes penetrate the wave-absorbing secondary plate and extend to the wave-absorbing main plate.
[0010] Preferably, a plurality of heat-conducting rods distributed in a linear array are fixedly connected to one side of the wave-absorbing main board, and the plurality of heat-conducting rods are correspondingly plugged into the plurality of heat-conducting holes.
[0011] Preferably, one side of the heat sink is penetrated with a plurality of No. 1 heat dissipation holes distributed in a linear array, and the other side of the heat sink is penetrated with a plurality of No. 2 heat dissipation holes distributed in a linear array, and the No. 1 heat dissipation holes and the No. 2 heat dissipation holes correspond to the positions of the thermal conductive holes.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] The utility model sets the cylindrical wave-entry hole into a "wave shape", which can allow the electromagnetic wave to have a longer reflection path when the thickness of the wave-absorbing main board is the same, so that the heat energy lost by the electromagnetic wave reflection is greater, which can not only improve the wave-absorbing effect, but also increase the saturation upper limit of the wave-absorbing main board. This solves the problem that the cylindrical wave-entry hole on the wave-absorbing board of the same thickness makes the trajectory of the electromagnetic wave reflection shorter, causing the wave-absorbing board to be easily in a saturated state, resulting in reduced wave-absorbing effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the utility model;
[0015] Figure 2 It is a side schematic diagram of the overall structure of the utility model;
[0016] Figure 3 It is a side cross-sectional schematic diagram of one side of the overall structure of the utility model;
[0017] Figure 4 It is a side sectional schematic diagram of the other side of the overall structure of the utility model.
[0018] In the figure: 1. Wave-absorbing main board; 2. Wave-entry hole; 3. Bump; 4. Wave-absorbing secondary board; 5. Heat dissipation plate; 6. Heat-conducting hole; 7. Heat-conducting rod; 8. Heat dissipation hole No. 1; 9. Heat dissipation hole No. 2. DETAILED DESCRIPTION
[0019] In order to make the purpose and technical solution of the present invention clearly and completely described, and the advantages more clearly understood, the embodiments of the present invention are further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are part of the embodiments of the present invention, rather than all of the embodiments, and are only used to explain the embodiments of the present invention, and are not used to limit the embodiments of the present invention. All other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0020] In the description of the present invention, it should be noted that the terms "center", "middle", "upper", "lower", "left", "right", "inner", "outer", "top", "bottom", "side", "vertical", "horizontal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "one", "first", "second", "third", "fourth", "fifth", "sixth" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0021] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0022] For the purpose of simplicity and illustration, the principles of the embodiments are mainly described by reference to examples. In the following description, many specific details are proposed to provide a thorough understanding of the embodiments. However, it is obvious that for those of ordinary skill in the art, these embodiments may not be limited to these specific details in practice. In some instances, known methods and structures are not described in detail to avoid making these embodiments unnecessarily difficult to understand. In addition, all embodiments can be used in combination with each other.
[0023] See also Figures 1 to 4 , the utility model provides a technical solution:
[0024] Embodiment 1, a reinforced electromagnetic wave absorbing plate, the reinforced electromagnetic wave absorbing plate comprises: a wave absorbing main board 1.
[0025] Specifically, a plurality of wave-entry holes 2 are provided through one side of the wave-absorbing mainboard 1, and the plurality of wave-entry holes 2 are all arranged in a "wave shape" and distributed in a linear array. A plurality of protrusions 3 are fixedly connected to the inner side of the wave-entry holes 2, and the plurality of protrusions 3 are irregularly arranged and have a rough surface. In specific implementation, external electromagnetic waves will enter the wave-entry holes 2 provided on the wave-absorbing mainboard 1, and then be ejected in the wave-entry holes 2. Compared with the cylindrical wave-entry holes 2, the "wave-shaped" wave-entry holes 2 can allow electromagnetic waves to use a longer ejection path, and can allow electromagnetic waves to collide with the wave-entry holes 2 multiple times, thereby greatly wasting the energy of the electromagnetic waves and causing them to release more heat energy, thereby improving the wave-absorbing effect of the wave-absorbing mainboard 1, and the protrusions 3 can further make the trajectory of the electromagnetic wave ejection more chaotic, increase the collision rate of the electromagnetic waves, thereby further enhancing the role of the wave-entry holes 2.
[0026] In order to improve the wave absorbing performance of the wave absorbing main board 1, a wave absorbing sub-board 4 is fixedly connected to one side of the wave absorbing main board 1 of the present application, and a heat sink 5 is fixedly connected to one side of the wave inlet hole 2. The wave absorbing sub-board 4 can absorb the electromagnetic waves rebounding and overflowing from the wave inlet hole 2, and the heat sink 5 can absorb the heat energy contained in the wave absorbing main board 1 and the wave absorbing sub-board 4, thereby improving the saturation upper limit of the wave absorbing main board 1 and the wave absorbing sub-board 4.
[0027] In order to improve the heat dissipation capacity of the absorbing main board 1, a plurality of heat conducting holes 6 distributed in a linear array are opened on one side of the heat dissipation plate 5 of the present application. The heat conducting holes 6 penetrate the absorbing sub-plate 4 and extend to the absorbing main board 1. The heat conducting holes 6 can increase the direct contact area between the air and the absorbing main board 1, the absorbing sub-plate 4, and the heat dissipation plate 5, thereby improving the heat dissipation effect.
[0028] In order to further improve the effect of the heat-conducting holes 6, a plurality of heat-conducting rods 7 distributed in a linear array are fixedly connected to one side of the wave-absorbing main board 1 of the present application. The plurality of heat-conducting rods 7 are correspondingly plugged into the plurality of heat-conducting holes 6. The heat-conducting rods 7 can guide the heat energy and improve the heat absorption effect of the air in the heat-conducting holes 6.
[0029] In order to improve the heat dissipation effect of the heat sink 5, a plurality of No. 1 heat dissipation holes 8 distributed in a linear array are penetrated on one side of the heat sink 5 of the present application, and a plurality of No. 2 heat dissipation holes 9 distributed in a linear array are penetrated on the other side of the heat sink 5. The No. 1 heat dissipation holes 8 and the No. 2 heat dissipation holes 9 correspond to the positions of the thermal conductive holes 6, so that a heat dissipation hole network can be formed, thereby facilitating the transmission of air and achieving a better heat dissipation effect.
[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A reinforced electromagnetic absorbing plate, characterized in that: The reinforced electromagnetic absorbing plate comprises: A wave absorbing main board (1), wherein a plurality of wave inlet holes (2) are provided through one side of the wave absorbing main board (1), the plurality of wave inlet holes (2) are all arranged in a "wave shape" and are distributed in a linear array, a plurality of protrusions (3) are fixedly connected to the inner side of the wave inlet holes (2), and the plurality of protrusions (3) are arranged irregularly and have rough surfaces.
2. The reinforced electromagnetic absorbing plate according to claim 1, characterized in that: A wave absorbing secondary plate (4) is fixedly connected to one side of the wave absorbing main plate (1), and a heat dissipation plate (5) is fixedly connected to one side of the wave inlet hole (2).
3. The reinforced electromagnetic absorbing plate according to claim 2, characterized in that: A plurality of heat-conducting holes (6) distributed in a linear array are formed through one side of the heat-dissipating plate (5); the heat-conducting holes (6) penetrate the wave-absorbing secondary plate (4) and extend to the wave-absorbing main plate (1).
4. The reinforced electromagnetic absorbing plate according to claim 3, characterized in that: A plurality of heat-conducting rods (7) distributed in a linear array are fixedly connected to one side of the wave-absorbing main board (1), and the plurality of heat-conducting rods (7) and the plurality of heat-conducting holes (6) are correspondingly plugged in.
5. The reinforced electromagnetic absorbing plate according to claim 2, characterized in that: A plurality of No. 1 heat dissipation holes (8) distributed in a linear array are formed through one side of the heat dissipation plate (5), and a plurality of No. 2 heat dissipation holes (9) distributed in a linear array are formed through the other side of the heat dissipation plate (5), wherein the No. 1 heat dissipation holes (8) and the No. 2 heat dissipation holes (9) both correspond to the positions of the heat conduction holes (6).