Miniature LED packaging structure and display device

Abstract

The utility model provides a miniature LED packaging structure and a display device, and relates to the field of semiconductor display manufacturing. The miniature LED packaging structure comprises a driving chip, a first groove and a second groove are formed in the surface of the driving chip, a light-emitting area is arranged in the first groove, and a bonding wire area is arranged in the second groove; wherein the first groove is used for accommodating the micro LED optical chip, and the second groove is used for accommodating one end of the bonding wire. The miniature LED packaging structure has the advantages of small overall packaging thickness, light weight and high flatness, and is low in production cost, high in production efficiency and high in production yield.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor display manufacturing, and in particular to a micro LED packaging structure and a display device. Background Art

[0002] Micro-LED (Micro Light Emitting Diode, Micro-LED) technology, that is, LED miniaturization and matrix technology, refers to the integration of high-density and tiny-sized LEDs on a chip, so that each pixel of the LED display can be addressed and driven individually to light up, reducing the pixel level from millimeter level to micron level.

[0003] The existing Micro-LED packaging process is still immature, and the packaged product is thick. Utility Model Content

[0004] In order to solve the problems in the prior art of immature packaging technology, large thickness of packaged products, low brightness and poor heat dissipation, one of the purposes of the utility model is to provide a micro LED packaging structure.

[0005] The utility model provides the following technical solutions:

[0006] A micro LED packaging structure includes a driving chip, wherein a first groove and a second groove are provided on the surface of the driving chip, a light emitting area is provided in the first groove, and a wire bonding area is provided in the second groove;

[0007] The first groove is used to accommodate the micro LED optical chip, and the second groove is used to accommodate one end of the welding wire.

[0008] As a further optional solution for the micro LED packaging structure, a packaging layer is arranged in the first groove, and the packaging layer covers the micro LED optical chip.

[0009] As a further optional solution for the micro LED packaging structure, the depth of the first groove is not less than the sum of the thickness of the micro LED optical chip and the thickness of the packaging layer.

[0010] As a further optional solution to the micro LED packaging structure, a side of the packaging layer facing away from the micro LED optical chip is flush with a notch of the first groove.

[0011] As a further optional solution for the micro LED packaging structure, a light shielding layer is further arranged in the first groove, and the light shielding layer is arranged around the micro LED optical chip.

[0012] As a further optional solution for the micro LED packaging structure, the notch width of the first groove is greater than the groove bottom width, the micro LED optical chip contacts the bottom end of the side wall of the first groove, and the shading layer is located between the micro LED optical chip and the side wall of the first groove.

[0013] As a further optional solution for the micro LED packaging structure, the side wall of the first groove is perpendicular to the bottom surface, and the micro LED optical chip and the light shielding layer are both arranged on the bottom surface of the first groove.

[0014] As a further optional solution for the micro LED packaging structure, the second groove passes through the side wall of the driving chip.

[0015] As a further optional solution for the micro LED packaging structure, the micro LED packaging structure also includes a protective layer, which wraps the welding wires and at least part of the welding wire area of ​​the driver chip, and the thickness of the protective layer is not greater than the thickness of the driver chip.

[0016] Another object of the present invention is to provide a display device.

[0017] The utility model provides the following technical solutions:

[0018] A display device comprises the above-mentioned micro LED packaging structure.

[0019] The embodiments of the present invention have the following beneficial effects:

[0020] In the above-mentioned micro LED packaging structure, a first groove and a second groove are provided on the surface of the driver chip. Among them, a light-emitting area is provided in the first groove, and the lower part of the micro LED optical chip or the entire micro LED optical chip is accommodated, so that the overall height of the driver chip and the micro LED optical chip can be reduced, thereby reducing the thickness of the packaged product. A welding wire area is provided in the second groove, and one end of the welding wire is accommodated, so that the welding height of the welding wire can be reduced, which can also reduce the thickness of the packaged product. The above-mentioned micro LED packaging structure has the advantages of small overall packaging thickness, light weight, and high flatness of the product, and has low production cost, high production efficiency, and high production yield.

[0021] In order to make the above-mentioned objectives, features and advantages of the present invention more obvious and understandable, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A schematic structural diagram of a micro LED packaging structure is shown;

[0024] Figure 2 Shows Figure 1 The enlarged schematic diagram at A in the middle;

[0025] Figure 3 A schematic structural diagram of a micro LED packaging structure provided by an embodiment of the utility model is shown;

[0026] Figure 4 Shows Figure 3 The enlarged schematic diagram of point B in the middle;

[0027] Figure 5 A schematic diagram of the partial structure of a micro LED packaging structure provided by an embodiment of the utility model in another specific implementation manner is shown.

[0028] Description of main component symbols:

[0029] 100 - micro LED optical chip; 200 - driver chip; 210 - light-emitting area; 220 - first groove; 221 - packaging layer; 222 - light-shielding layer; 230 - welding wire area; 240 - second groove; 300 - welding wire; 400 - protective layer; 500 - dam glue. DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. On the contrary, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical" - "horizontal" - "left" - "right" and similar expressions used herein are for illustrative purposes only.

[0032] In the present invention, unless otherwise clearly specified and limited, the terms "installation" - "connection" - "connection" - "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] In addition, the terms "first"-"second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first"-"second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of the template herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0035] A micro LED packaging structure such as Figure 1 and Figure 2 As shown, the micro LED light chip 100 is bonded to the surface of the driver chip 200, and is surrounded by black light-shielding glue to form a light-shielding layer 222. A dam glue 500 is provided on the black light-shielding glue to fill the micro LED light chip 100 with a packaging protective glue to form a packaging layer 221. A welding wire 300 is welded to one side of the driver chip 200, and a protective layer 400 is provided to wrap the welding wire 300 and one side of the driver chip 200.

[0036] During the packaging process, the filling glue is often uneven, and the flatness cannot be guaranteed. At the same time, there are compatibility issues between different glues. The packaged product is thick and heavy.

[0037] In addition, the welding height of the welding wire 300 is too high, and it is easy to exceed the highest point of the micro LED optical chip 100. This not only increases the thickness of the packaged product, but also may cause the welding wire 300 to collapse during dispensing, and the protective layer 400 is too much and overflows to the area where the micro LED optical chip 100 is located, resulting in low production yield.

[0038] Example

[0039] Please also read Figure 3 and Figure 4 This embodiment provides a micro-LED packaging structure, specifically a high-efficiency and low-cost Micro-LED packaging structure, and the micro-LED packaging structure includes a driving chip 200.

[0040] The surface of the driver chip 200 is provided with a first groove 220 and a second groove 240 . The first groove 220 is provided with a light emitting area 210 , and the second groove 240 is provided with a wire bonding area 230 .

[0041] During packaging, the first groove 220 is used to accommodate the micro LED optical chip 100, and the micro LED optical chip 100 accommodated in the first groove 220 is electrically connected to the driver chip 200. The second groove 240 is used to accommodate one end of the bonding wire 300, and one end of the bonding wire 300 located in the second groove 240 is electrically connected to the driver chip 200.

[0042] In the above-mentioned micro LED packaging structure, the surface of the driver chip 200 is provided with a first groove 220 and a second groove 240. Among them, the first groove 220 is provided with a light-emitting area 210, and accommodates the lower part of the micro LED optical chip 100 or accommodates the entire micro LED optical chip 100, so that the overall height of the driver chip 200 and the micro LED optical chip 100 can be reduced, thereby reducing the thickness of the packaged product. The second groove 240 is provided with a welding wire area 230, and accommodates one end of the welding wire 300, so that the welding height of the welding wire 300 can be reduced, which can also reduce the thickness of the packaged product, and it is not easy to collapse the welding wire 300 during dispensing, thereby improving the production yield.

[0043] Specifically, during the packaging operation, firstly, according to the product design requirements, a first groove 220 and a second groove 240 of corresponding sizes are etched on the surface of the driver chip 200, and then a corresponding circuit design is made, and then a solder pad is formed on the bottom surface of the first groove 220, thereby producing an IC groove circuit that matches the size of the micro LED optical chip 100, and at the same time, a solder pad is formed on the bottom surface of the second groove 240.

[0044] Subsequently, the micro LED optical chip 100 is bonded into the first groove 220 by an automated binding device, so that the pad of the micro LED optical chip 100 is connected to the pad on the bottom of the first groove 220. The substrate on the micro LED optical chip 100 is then removed by a laser stripping device to reduce the product height, improve the brightness and picture quality, and improve the heat dissipation effect.

[0045] Finally, the welding wire 300 is welded to the welding pad at the bottom of the second groove 240 by an automatic welding wire device, and the welding method can be positive welding or reverse welding.

[0046] In some embodiments, a packaging layer 221 is disposed in the first groove 220 , and the packaging layer 221 covers the micro LED optical chip 100 .

[0047] When in use, the encapsulation layer 221 can protect the micro LED optical chip 100, prevent the micro LED optical chip 100 from contacting with water vapor, air, etc., and ensure the water and oxygen resistance reliability of the encapsulated product.

[0048] In some specific implementations, the encapsulation layer 221 is a packaging glue layer.

[0049] Specifically, after removing the substrate on the micro LED optical chip 100 , white transparent glue is applied on the micro LED optical chip 100 , and a packaging glue layer is formed after the white transparent glue is cured.

[0050] Optionally, the white transparent glue may be silicone or epoxy resin or the like.

[0051] Furthermore, the depth of the first groove 220 is not less than the sum of the thickness of the micro LED optical chip 100 and the thickness of the packaging layer 221 .

[0052] At this time, the first groove 220 can accommodate the entire micro LED optical chip 100 and the packaging layer 221 covering the micro LED optical chip 100, thereby minimizing the thickness of the packaged product.

[0053] In addition, the inner wall of the first groove 220 can replace the dam glue 500 in other packaging structures to limit the packaging glue layer, thereby saving the cost of the dam glue 500, reducing the amount of glue used, reducing the weight of the packaged product, and to a certain extent solving the compatibility problem between different glues. At the same time, it can also reduce the dam process and improve production efficiency.

[0054] In some specific implementations, the side of the packaging layer 221 facing away from the micro LED optical chip 100 is flush with the notch of the first groove 220 .

[0055] At this time, the driving chip 200 and the micro LED optical chip 100 have high overall flatness, and the appearance is simple, elegant and beautiful.

[0056] In some embodiments, a light shielding layer 222 is disposed in the first groove 220 .

[0057] The light shielding layer 222 is disposed around the micro LED optical chip 100 to block the periphery of the micro LED optical chip 100 to prevent light leakage.

[0058] In some specific implementations, the light shielding layer 222 is a light shielding adhesive layer.

[0059] Specifically, after removing the substrate on the micro LED optical chip 100 , black light shielding glue is applied around the micro LED optical chip 100 , and a light shielding glue layer is formed after the black light shielding glue is cured.

[0060] Optionally, the black light-shielding glue may be silicone or epoxy resin.

[0061] Furthermore, the width of the first groove 220 is greater than the width of the groove bottom, forming a trumpet-shaped groove body that is wider at the top and narrower at the bottom.

[0062] Accordingly, the width of the micro LED optical chip 100 is equal to the bottom width of the first groove 220. When the micro LED optical chip 100 is bonded in the first groove 220, the micro LED optical chip 100 contacts the bottom end of the side wall of the first groove 220.

[0063] In addition, the light shielding layer 222 is located between the micro LED optical chip 100 and the sidewall of the first groove 220 .

[0064] During the packaging process, the bottom end of the sidewall of the first groove 220 can position the micro LED optical chip 100. At the same time, since the first groove 220 is wide at the top and narrow at the bottom, there is still a gap between the sidewall of the first groove 220 and the micro LED optical chip 100 to accommodate the light shielding layer 222.

[0065] Optionally, the side wall of the first groove 220 is inclined to form a trumpet-shaped groove body that is wider at the top and narrower at the bottom.

[0066] See also Figure 5 In some other specific embodiments, the sidewall of the first groove 220 is perpendicular to the bottom surface. Along the depth direction of the first groove 220, the groove width of the first groove 220 remains unchanged. At this time, the micro LED light chip 100 and the light shielding layer 222 are both arranged on the bottom surface of the first groove 220, and the light shielding layer 222 fills the gap between the micro LED light chip 100 and the sidewall of the first groove 220.

[0067] In some embodiments, the second groove 240 passes through the side wall of the driving chip 200 .

[0068] At this time, the bonding wire 300 can pass through the side wall of the driver chip 200 without having to go around the top of the driver chip 200. The bonding wire 300 is completely below the surface of the driver chip 200, which minimizes the thickness of the packaged product and makes it less likely that the bonding wire 300 will collapse during dispensing.

[0069] Furthermore, the micro LED package structure further includes a protective layer 400 . The protective layer 400 wraps the bonding wire 300 and at least a portion of the bonding wire region 230 of the driver chip 200 , and the thickness of the protective layer 400 is not greater than the thickness of the driver chip 200 .

[0070] On the one hand, the protection layer 400 wraps the welding wire 300, which can protect the internal structure of the welding wire 300 and prevent other components from touching the welding wire 300 to cause electrical defects such as short circuits or open circuits.

[0071] On the other hand, since the thickness of the protection layer 400 is not greater than the thickness of the driver chip 200 , the overall thickness of the micro LED packaging structure is the thickness of the driver chip 200 , which is minimized, and the thickness of the packaged product is also minimized.

[0072] In some specific implementations, the protective layer 400 is a protective adhesive layer.

[0073] Specifically, after welding the welding wire 300 to the welding pad at the bottom of the second groove 240, a welding wire protection glue is applied to the area where the welding wire 300 is located and at least a portion of the welding wire area 230 of the driver chip 200. After the welding wire protection glue is cured, a protective glue layer is formed, and the welding wire 300 and at least a portion of the welding wire area 230 of the driver chip 200 are wrapped therein.

[0074] During this process, the side wall of the second groove 240 can limit the protective glue layer to prevent the wire protection glue from overflowing to the light-emitting area 210, thereby also improving the production yield.

[0075] Optionally, the wire protection glue may be silicone or epoxy resin, and opaque glue is preferably used.

[0076] In some specific embodiments, the thickness of the protective layer 400 is equal to the thickness of the driver chip 200, that is, the surface of the protective layer 400 is flush with the surface of the driver chip 200. At this time, the packaging height of the entire micro LED packaging structure is in the same plane, and the appearance is simple, elegant and beautiful.

[0077] In summary, the above-mentioned micro LED packaging structure has the advantages of small overall packaging thickness, light weight, and high flatness of the product, and has low production cost, high production efficiency, and high production yield.

[0078] This embodiment further provides a display device, including the above-mentioned micro LED packaging structure.

[0079] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not as limiting, and thus other examples of the exemplary embodiments may have different values.

[0080] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0081] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A micro LED packaging structure, characterized in that: A driving chip is included, wherein a first groove and a second groove are provided on the surface of the driving chip, a light emitting area is provided in the first groove, and a wire bonding area is provided in the second groove; The first groove is used to accommodate the micro LED optical chip, and the second groove is used to accommodate one end of the welding wire.

2. The micro LED packaging structure according to claim 1, characterized in that: A packaging layer is disposed in the first groove, and the packaging layer covers the micro LED optical chip.

3. The micro LED packaging structure according to claim 2, characterized in that: The depth of the first groove is not less than the sum of the thickness of the micro LED optical chip and the thickness of the packaging layer.

4. The micro LED packaging structure according to claim 3, characterized in that: A side of the packaging layer facing away from the micro LED optical chip is flush with the notch of the first groove.

5. The micro LED packaging structure according to claim 1, characterized in that: A light shielding layer is also arranged in the first groove, and the light shielding layer is arranged around the micro LED optical chip.

6. The micro LED packaging structure according to claim 5, characterized in that: The notch width of the first groove is greater than the groove bottom width, the micro LED optical chip contacts the bottom end of the side wall of the first groove, and the light shielding layer is located between the micro LED optical chip and the side wall of the first groove.

7. The micro LED packaging structure according to claim 5, characterized in that: The side wall of the first groove is perpendicular to the bottom surface, and the micro LED optical chip and the light shielding layer are both arranged on the bottom surface of the first groove.

8. The micro LED packaging structure according to claim 1, characterized in that: The second groove passes through the side wall of the driving chip.

9. The micro LED packaging structure according to claim 8, characterized in that: The micro LED packaging structure further includes a protective layer, which wraps the bonding wires and at least a portion of the bonding wire region of the driver chip, and the thickness of the protective layer is no greater than the thickness of the driver chip.

10. A display device, characterized in that: A micro LED packaging structure comprising any one of claims 1-9.

Images