Double-cavity surface-mounted LED support, support module and double-cavity integrated LED

Abstract

The utility model discloses a double-cavity surface mount type LED support, support module and double-cavity integrated LED wherein the LED support comprises a base and a plurality of pins, the base is a plastic injection molding part, the top surface of the base is provided with a first packaging cavity and a second packaging cavity which are mutually independent, the first packaging cavity is used for installing a first functional chip, and the second packaging cavity is used for installing a second functional chip. The second packaging cavity is used for installing a light-emitting chip and / or a second functional chip; the plurality of pins are formed by stamping and segmenting conductive sheets and are fixed on the base through injection molding, each pin is provided with a connecting end and a functional end, the connecting end is located outside the base, and the functional end extends into the first packaging cavity and / or the second packaging cavity and is used for carrying and connecting the first functional chip, the light-emitting chip and / or the second functional chip. According to the utility model, the integration of multiple functions of light emitting, signal transmission and the like is realized, in addition, the circuit layout in specific application is simplified, the manufacturing cost is reduced, and the reliability and the maintenance efficiency are improved.

Description

Technical Field

[0001] The utility model relates to an LED bracket, in particular to a double-cavity patch type LED bracket, a bracket module and a double-cavity integrated LED. Background Art

[0002] With the continuous advancement of science and technology, photodiodes have become a new generation of light sources with their unique advantages and have been widely used in various fields. Photodiodes are usually single-function, such as light-emitting diodes and infrared photodiodes.

[0003] However, in some specific applications, light-emitting diodes are needed, and electronic components with different functions such as infrared photodiodes are also needed. For example, in the application of optomechanical keyboards, light-emitting diodes and infrared photodiodes play different roles. Light-emitting diodes are mainly used for keyboard decoration and lighting effects to provide users with a good visual experience. Infrared photodiodes are used as transmitters and receivers of functional signals to realize the input detection and signal transmission functions of the keyboard.

[0004] Since traditional light-emitting diodes and infrared photodiodes use separate packaging processes, they only have a single photoelectric characteristic. In applications such as optoelectronic mechanical keyboards, it is necessary to use these two different optoelectronic components separately, or assist with switching components to achieve multiple functions such as decoration, lighting, and signal transmission.

[0005] This design approach brings some problems and challenges. First, it is necessary to arrange multiple components in a limited circuit board space, which increases the difficulty and complexity of design for small-sized circuit boards. Second, the use of multiple components will directly increase the application cost of the product and affect the competitiveness of the product. In addition, the coexistence of multiple components also makes the design and wiring of the circuit more cumbersome, and the maintenance and repair work is also more difficult. Utility Model Content

[0006] The utility model aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the purpose of the utility model is to provide a dual-cavity SMD LED bracket, a bracket module and a dual-cavity integrated LED.

[0007] To achieve the above objectives, on the one hand, a dual-cavity SMD LED bracket according to an embodiment of the utility model includes:

[0008] A base, the base is a plastic injection molded part, and the top surface of the base has a first packaging cavity and a second packaging cavity that are independent of each other, the first packaging cavity is used to install a first functional chip, and the second packaging cavity is used to install a light-emitting chip and / or a second functional chip;

[0009] Multiple pins, multiple pins are formed by stamping and splitting of conductive sheets and are injection-molded and fixed on the base, each of the pins has a connection end and a functional end, the connection end is located outside the base, and the functional end extends into the first packaging cavity and / or the second packaging cavity, for carrying and connecting the first functional chip, the light-emitting chip and / or the second functional chip.

[0010] According to the dual-cavity SMD LED bracket provided by the embodiment of the utility model, by setting a first packaging cavity and a second packaging cavity independent of each other on the top surface of the base, the first packaging cavity is used to install the first functional chip, and the second packaging cavity is used to install the light-emitting chip and / or the second functional chip, and the functional ends of multiple pins are respectively extended to the first packaging cavity and the second packaging cavity to be electrically connected to the corresponding chips, so as to realize the integrated integration of multiple functions such as light emission and signal transmission. This design not only simplifies the circuit layout in specific applications, reduces manufacturing costs, but also improves reliability and maintenance efficiency.

[0011] In addition, the dual-cavity SMD LED bracket according to the above embodiment of the utility model may also have the following additional technical features:

[0012] According to an embodiment of the utility model, the pins include a positive power pin and a negative power pin;

[0013] The functional ends of the positive power pin and the negative power pin extend to the first packaging cavity and the second packaging cavity to connect the first functional chip in the first packaging cavity and the light-emitting chip and / or the second functional chip in the second packaging cavity.

[0014] According to an embodiment of the utility model, the pins further include a first function input pin and a first function output pin;

[0015] The connection end of the first function input pin and the first function output pin extend at least to the first packaging cavity, so as to be connected to the first function chip in the first packaging cavity.

[0016] According to an embodiment of the utility model, the pin further includes a second function input pin and a second function output pin;

[0017] The connection end of the second function input pin and the second function output pin extend at least to the second packaging cavity to connect to the second function chip in the second packaging cavity, and the second function chip is used to control the light effect of the light-emitting chip in the second packaging cavity.

[0018] According to an embodiment of the present invention, the first functional chip is an infrared light chip or a Hall sensor chip, and the second functional chip is a light emitting control chip.

[0019] According to an embodiment of the present invention, the pin is made of copper, and the surface of the pin has a silver-plated layer.

[0020] On the other hand, the dual-cavity SMD LED bracket module according to the embodiment of the utility model includes:

[0021] Sheet rack;

[0022] A plurality of the above-mentioned dual-cavity SMD LED brackets are arranged in a matrix on the sheet material rack, and the sheet material rack is connected to the pins as a whole.

[0023] The dual-cavity SMD LED bracket module provided by the embodiment of the utility model has the above dual-cavity SMD LED bracket, which realizes the integrated integration of multiple functions such as light emission and control, simplifies the circuit layout in specific applications, reduces manufacturing costs, and improves reliability and maintenance efficiency. In addition, the bracket module is suitable for batch manufacturing to facilitate industrial applications.

[0024] On the other hand, the dual-cavity integrated LED according to the embodiment of the present invention includes:

[0025] As described above, the double cavity SMD LED bracket;

[0026] A first functional chip, wherein the first functional chip is packaged in the first packaging cavity;

[0027] A light emitting chip and a second functional chip are packaged in the second packaging cavity.

[0028] The dual-cavity integrated LED provided in the embodiment of the utility model has the above-mentioned dual-cavity SMD LED bracket, which realizes the integrated integration of multiple functions such as light emission and signal transmission, simplifies the circuit layout in specific applications, reduces manufacturing costs, and improves reliability and maintenance efficiency.

[0029] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0031] Figure 1This is a schematic diagram of the structure of a double-cavity SMD LED bracket according to an embodiment of the utility model;

[0032] Figure 2 This is a schematic diagram of the structure of the pins in the double-cavity SMD LED bracket of the utility model embodiment;

[0033] Figure 3 This is a schematic diagram of the structure of a dual-cavity SMD LED bracket module according to an embodiment of the utility model;

[0034] Figure 4 It is a structural schematic diagram of a dual-cavity integrated LED according to an embodiment of the utility model.

[0035] Reference numerals:

[0036] 10. Double cavity SMD LED bracket;

[0037] 101. Base;

[0038] P10, first packaging cavity;

[0039] P11, second packaging cavity;

[0040] 102, pin;

[0041] P1, power negative pin;

[0042] P2, first function input pin;

[0043] P3, second function input pin;

[0044] P4, first function output pin;

[0045] P5, second function output pin;

[0046] P6, power positive pin;

[0047] 20. Second function chip;

[0048] 21a, red light emitting chip;

[0049] 21b, blue light emitting chip;

[0050] 21c, green light emitting chip;

[0051] 22. The first functional chip;

[0052] 30. Sheet rack.

[0053] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0054] The embodiments of the utility model are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the utility model.

[0055] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0059] The dual-cavity SMD LED bracket 10, bracket module and dual-cavity integrated LED of the embodiment of the utility model are described in detail below with reference to the accompanying drawings.

[0060] Reference Figures 1 to 4 As shown, a dual-cavity SMD LED bracket 10 provided according to an embodiment of the utility model includes a base 101 and a plurality of pins 102 .

[0061] Specifically, the base 101 is a plastic injection molded part, and the top surface of the base 101 has a first packaging cavity P10 and a second packaging cavity P11 that are independent of each other. The first packaging cavity P10 is used to install the first functional chip 22, and the second packaging cavity P11 is used to install the light-emitting chip and / or the second functional chip 20.

[0062] That is to say, the base 101, as the core component of the bracket, is manufactured using a plastic injection molding process. Its top surface is divided into two independent packaging cavities, namely the first packaging cavity P10 and the second packaging cavity P11. The first packaging cavity P10 is specifically used to install a first functional chip 22, such as a Hall sensor chip, an infrared light chip, etc. The second packaging cavity P11 is used to install a light-emitting chip, namely an LED chip. According to actual needs, the second packaging cavity P11 can also simultaneously install a second functional chip 20, such as an LED driver chip, a light-emitting control chip, etc. This design makes the two core functions of light emission and signal transmission highly integrated in a compact bracket, greatly simplifying the circuit layout.

[0063] The plurality of pins 102 are formed by stamping and splitting conductive sheets and are fixed on the base 101 by injection molding. Each of the pins 102 has a connection end and a functional end. The connection end is located outside the base 101, and the functional end extends into the first packaging cavity P10 and / or the second packaging cavity P11, so as to carry and connect the first functional chip 22, the light-emitting chip and / or the second functional chip 20.

[0064] These pins 102 are usually made of metal conductive material and are made by stamping and segmentation. The pins 102 serve as an electrical connection path between the bracket and the external application circuit. Each pin 102 includes a connection end located outside the base 101 and a functional end extending into the first packaging cavity P10 and / or the second packaging cavity P11. The functional end extends into the corresponding packaging cavity for reliable electrical connection with the chip installed in the cavity.

[0065] In the specific manufacturing process. First, a conductive metal foil is used as the raw material. Under the stamping action of a high-precision mold, the metal foil is cut and separated into the required pin shape. After the stamping is completed, these pins 102 need to be firmly fixed on the base 101. To this end, an injection molding process is used to integrate the pins 102 with the base 101. Specifically, the conductive metal foil with the pins 102 pre-stamped is first installed into the injection mold so that the pins 102 maintain the appropriate position and angle. Then the molten plastic is injected into the mold cavity, and while the plastic cools and solidifies, the pins 102 will be firmly wrapped and anchored in the base 101. This integrated injection molding process not only ensures the high-precision assembly of the pins 102 and the base 101, but also greatly improves the production efficiency, which is conducive to the realization of automated large-scale production.

[0066] According to the dual-cavity SMD LED bracket 10 provided by the embodiment of the utility model, by setting a first packaging cavity P10 and a second packaging cavity P11 independently of each other on the top surface of the base 101, the first packaging cavity P10 is used to install the first functional chip 22, and the second packaging cavity P11 is used to install the light-emitting chip and / or the second functional chip 20, and the functional ends of the plurality of pins 102 are respectively extended to the first packaging cavity P10 and the second packaging cavity P11 to be electrically connected to the corresponding chips, thereby realizing the integrated integration of multiple functions such as light emission and control. This design not only simplifies the circuit layout in specific applications, reduces manufacturing costs, but also improves reliability and maintenance efficiency.

[0067] In one embodiment of the present invention, the pin 102 includes a positive power pin P6 and a negative power pin P1. The functional end of the positive power pin P6 and the functional end of the negative power pin P1 both extend to the first packaging cavity P10 and the second packaging cavity P11, so as to connect the first functional chip 22 in the first packaging cavity P10, and connect the light-emitting chip and / or the second functional chip 20 in the second packaging cavity P11.

[0068] In this embodiment, the positive power pin P6 and the negative power pin P1 are responsible for providing working power and are the basis for realizing multi-functional integration. The functional ends of the positive power pin P6 and the negative power pin P1 extend to the internal space of the first packaging cavity P10 and the second packaging cavity P11.

[0069] In the first packaging cavity P10, the functional end of the positive power pin P6 is reliably electrically connected to the positive end of the first functional chip 22, and the functional end of the negative power pin P1 is electrically connected to the negative end of the first functional chip 22. In this way, the external power supply can supply power to the first functional chip 22 through the positive power pin P6 and the negative power pin P1 to ensure its normal operation.

[0070] In the second packaging cavity P11, the situation is slightly different. Since the second packaging cavity P11 is used to install the light-emitting chip and the optional second functional chip 20, when only the light-emitting chip is installed in the second packaging cavity P11, the functional end of the positive power pin P6 and the functional end of the negative power pin P1 are electrically connected to the positive terminal and the negative terminal of the light-emitting chip, respectively. When the light-emitting chip and the second functional chip 20 are installed in the second packaging cavity P11, the second functional chip 20 takes the fantasy color control chip as an example, and the light-emitting chip includes visible light-emitting chips of various colors, such as red light-emitting chip 21a, blue light-emitting chip 21b, and green light-emitting chip 21c. The fantasy color control chip is usually a multi-channel switch chip; when connected, the functional end of the positive power pin P6 and the functional end of the negative power pin P1 are electrically connected to the positive terminal and negative terminal of the fantasy color control chip respectively, and the negative terminals of the red light-emitting chip 21a, blue light-emitting chip 21b, and green light-emitting chip 21c are respectively connected to the respective control terminals of the fantasy color control chip, and the positive terminals of the red light-emitting chip 21a, blue light-emitting chip 21b, and green light-emitting chip 21c are all connected to the positive power pin P6. In this way, the switch control of each channel in the fantasy color control chip is used to control the red light-emitting chip 21a, blue light-emitting chip 21b, and green light-emitting chip 21c, thereby realizing the control of the light effect.

[0071] By adopting the above structure of the positive power pin P6 and the negative power pin P1, the external power supply can simultaneously power the chips in the first packaging cavity P10 and the second packaging cavity P11, thus realizing multifunctional integration. Compared with the discrete design using independent power supplies, the shared power input not only saves space, but also reduces costs and improves reliability.

[0072] In one embodiment of the present invention, the pins 102 further include a first function input pin P2 and a first function output pin P4. The connection end of the first function input pin and the first function output pin P4 at least extend to the first packaging cavity P10 to connect to the first function chip 22 in the first packaging cavity P10.

[0073] In this embodiment, in addition to the positive power pin P6 and the negative power pin P1, the pin 102 also includes a first function input pin P2 and a first function output pin P4, which are used to provide input and output interfaces for the first function chip 22 in the first packaging cavity P10.

[0074] The connection end of the first function input pin P2 is located outside the base 101, and is used to electrically connect to the input signal of the external circuit. Its functional end extends to the internal space of the first packaging cavity P10 and is electrically connected to the input end of the first function chip 22. Through this design, external control signals and the like can be transmitted to the first function chip 22 to drive it to work. Similarly, the connection end of the first function output pin P4 is also located outside the base 101, and its functional end extends into the first packaging cavity P10 and is connected to the output end of the first function chip 22. This enables the first function chip 22 to output signals to an external circuit or system through the output pin.

[0075] Through a reasonable design of the pins 102, the first functional chip 22 can achieve reliable connection with external circuits, meet the requirements of various complex applications, and improve overall performance and reliability.

[0076] In one embodiment of the present invention, the pin 102 further includes a second function input pin P3 and a second function output pin P5. The connection end of the second function input pin and the second function output pin P5 at least extend to the second packaging cavity P11 to connect to the second function chip 20 in the second packaging cavity P11, and the second function chip 20 is used to control the light effect of the light-emitting chip in the second packaging cavity P11.

[0077] In this embodiment, in addition to the first function input pin P2 and the first function output pin P4 for the first packaging cavity P10, the pin 102 also includes a second function input pin P3 and a second function output pin P5 for connecting to the second function chip 20 in the second packaging cavity P11.

[0078] The second function chip 20 is mainly used to control and adjust the light performance of the light-emitting chip in the second packaging cavity P11. The connection end of the second function input pin P3 is located outside the base 101 and is used to connect to the control command signal of the host computer or control system. Its functional end extends to the inside of the second packaging cavity P11 and is electrically connected to the input end of the second function chip 20. Once the external command signal is transmitted to the inside of the second function chip 20 through the second function input pin P3, the second function chip 20 will control the light-emitting chip according to the corresponding command. For example, if the second function chip 20 is a magic color control chip, it can control the selective closing or opening of each channel, thereby controlling the corresponding visible light emitting chip to work.

[0079] Through a reasonable design of the pin 102, the second function input pin P3 and the second function output pin P5 can be reliably connected to an external circuit, so as to exert the control function of the second function chip 20 and realize various light effect controls of the light-emitting chip.

[0080] In one embodiment of the present invention, the first functional chip 22 is an infrared chip or a Hall sensor chip, and the second functional chip 20 is a light emitting control chip.

[0081] Infrared light chips are usually used as signal transmitters and receivers. For example, when the photodiode is used in an optoelectronic keyboard, it is mainly used to transmit and receive infrared rays to detect finger keystrokes. The Hall sensor chip can detect changes in the magnetic field and is often used as a sensor for position, speed, etc. When the photodiode is used in an optoelectronic keyboard, there is a small permanent magnet under each key. When the key is not pressed, the magnet maintains a certain distance from the Hall sensor chip mounted on the keyboard base, and the Hall sensor chip cannot detect the magnetic field. But when the key is pressed, the magnet will approach the Hall sensor chip, which detects changes in the magnetic field and outputs a voltage signal. The light-emitting control chip is used to control the operation of each visible light-emitting chip to achieve different light effect adjustments.

[0082] Preferably, the pin 102 is made of copper, and the surface of the pin 102 has a silver coating. The copper pin 102 has good electrical conductivity, can reduce the resistance value of the circuit, and improve the transmission efficiency of the circuit. At the same time, the copper material has high mechanical strength, can ensure the structural stability of the pin 102, and avoid deformation or breakage of the pin 102 due to external forces. Processing a layer of silver coating on the surface of the pin 102 can further improve the electrical conductivity of the pin 102. The silver coating has good anti-oxidation and anti-corrosion properties, can protect the surface of the pin 102, and avoid circuit failures due to oxidation or corrosion. In addition, the surface of the silver coating is smooth and clean, can provide good welding performance, and make the welding of the pin 102 with other components more stable and reliable. At the same time, the surface of the silver coating also has good reflectivity, which can improve the optical performance of the photodiode.

[0083] The embodiment of the utility model also provides a dual-cavity SMD LED bracket 10 module, including a sheet rack 30 and multiple dual-cavity SMD LED brackets as described above, and multiple dual-cavity SMD LED brackets are arranged in a matrix on the sheet rack 30, and the sheet rack 30 is connected to the pin 102 as a whole.

[0084] As described above, in the manufacturing process, conductive metal foil is used as raw material, and under the stamping action of a high-precision mold, the metal foil is cut and separated into the required pin 102 shape, and the conductive metal foil at this time is the sheet frame 30. The sheet frame 30 is then installed in an injection mold, and a plurality of bases 101 are formed by injection molding using an injection molding process, and the pins 102 can be firmly wrapped and anchored in the base 101 to form an LED bracket module.

[0085] This kind of LED bracket module can also be directly placed in the packaging equipment for chip packaging during the subsequent photodiode processing and manufacturing. After the packaging is completed, it can be cut into individual photodiodes. In this way, mass production can be achieved, greatly improving production efficiency.

[0086] The dual-cavity SMD LED bracket 10 module provided by the embodiment of the utility model has the above-mentioned dual-cavity SMD LED bracket 10, realizes the integrated integration of multiple functions such as light emission and control, simplifies the circuit layout in specific applications, reduces manufacturing costs, and improves reliability and maintenance efficiency. In addition, the bracket module is suitable for batch manufacturing to facilitate industrial applications.

[0087] The embodiment of the utility model also provides a dual-cavity integrated LED, comprising the dual-cavity SMD LED bracket 10 as described above, a first functional chip 22, a light-emitting chip and a second functional chip 20, wherein the first functional chip 22 is packaged in the first packaging cavity P10, and the light-emitting chip and the second functional chip 20 are packaged in the second packaging cavity P11.

[0088] Exemplarily, the first functional chip 22 is an infrared chip or a Hall sensor chip, and the second functional chip 20 is a light emitting control chip.

[0089] The dual-cavity integrated LED provided in the embodiment of the utility model has the above-mentioned dual-cavity SMD LED bracket 10, which realizes the integrated integration of multiple functions such as lighting and control, simplifies the circuit layout in specific applications, reduces manufacturing costs, and improves reliability and maintenance efficiency.

[0090] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0091] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A dual-cavity SMD LED bracket, characterized in that: include: A base, the base is a plastic injection molded part, and the top surface of the base has a first packaging cavity and a second packaging cavity that are independent of each other, the first packaging cavity is used to install a first functional chip, and the second packaging cavity is used to install a light-emitting chip and / or a second functional chip; Multiple pins, multiple pins are formed by stamping and splitting of conductive sheets and are injection-molded and fixed on the base, each of the pins has a connection end and a functional end, the connection end is located outside the base, and the functional end extends into the first packaging cavity and / or the second packaging cavity, for carrying and connecting the first functional chip, the light-emitting chip and / or the second functional chip.

2. The dual-cavity SMD LED bracket according to claim 1, characterized in that: The pins include a positive power pin and a negative power pin; The functional ends of the positive power pin and the negative power pin extend to the first packaging cavity and the second packaging cavity to connect the first functional chip in the first packaging cavity and the light-emitting chip and / or the second functional chip in the second packaging cavity.

3. The dual-cavity SMD LED bracket according to claim 2, characterized in that: The pins also include a first function input pin and a first function output pin; The connection end of the first function input pin and the first function output pin extend at least to the first packaging cavity, so as to be connected to the first function chip in the first packaging cavity.

4. The dual-cavity SMD LED bracket according to claim 2, characterized in that: The pins also include a second function input pin and a second function output pin; The connection end of the second function input pin and the second function output pin extend at least to the second packaging cavity to connect to the second function chip in the second packaging cavity, and the second function chip is used to control the light effect of the light-emitting chip in the second packaging cavity.

5. The dual-cavity SMD LED bracket according to claim 1, characterized in that: The first functional chip is an infrared light chip or a Hall sensor chip, and the second functional chip is a light emitting control chip.

6. The dual-cavity SMD LED bracket according to claim 1, characterized in that: The pin is made of copper, and the surface of the pin has a silver-plated layer.

7. A dual-cavity SMD LED bracket module, characterized in that: include: Sheet rack; A plurality of dual-cavity SMD LED brackets as described in any one of claims 1 to 6, wherein a matrix of the plurality of dual-cavity SMD LED brackets is arranged on the sheet material rack, and the sheet material rack is connected to the pins as a whole.

8. A dual-cavity integrated LED, characterized in that: include: A dual-cavity SMD LED bracket as described in any one of claims 1 to 6; A first functional chip, wherein the first functional chip is packaged in the first packaging cavity; A light emitting chip and a second functional chip are packaged in the second packaging cavity.

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