COB light source

Abstract

The utility model relates to the field of light sources, in particular to a COB light source which comprises a substrate, a light-emitting module and an electric connection module, the substrate is provided with a light-emitting area and a circuit area, the light-emitting module is arranged on the light-emitting area, the electric connection module is arranged on the circuit area, and the light-emitting module is electrically connected with the electric connection module. The electric connection module comprises a circuit layer and a bonding pad, a welding layer is arranged on the upper surface of the bonding pad, the substrate, the circuit layer, the bonding pad and the welding layer are sequentially connected, the thickness of the welding layer is 0.3-3 mm, and the upper surface area of the bonding pad is 1-30 mm < 2 >. According to the utility model, the production efficiency is improved for subsequent production, and the labor cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of light sources, in particular to a COB light source. Background Art

[0002] The COB light source needs to be welded with wires, connected to the driver, and then installed on the lamp housing to form a lighting device available on the market. The manufacturer of lighting equipment welds the wires on the purchased COB light source, connects it to the driver, and then installs it on the lamp housing to form a lighting device. Among them, the automatic wire welding machine can automatically weld wires on the positive and negative pads of COB. However, since COB has many specifications and many of them are not universal, lighting equipment manufacturers often still use manual wire welding. The traditional manual wire welding operation is to hold the wire and solder wire in one hand and the soldering iron in the other hand to melt the solder wire so that the wire is welded on the pad. This operation is inconvenient and the welding speed is very slow. In order to increase the welding speed, two workers are usually arranged to operate, one worker is responsible for operating the solder wire and adding tin, and the other worker holds the wire and soldering iron to weld the wire. Although this is faster than traditional manual wire welding, it requires two workers to operate, which increases labor costs. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a COB light source, which improves the production efficiency and reduces the labor cost for subsequent production.

[0004] In order to solve the above technical problems, the utility model provides a COB light source, including a substrate, a light-emitting module and an electrical connection module, wherein the substrate is provided with a light-emitting area and a circuit area, the light-emitting module is provided on the light-emitting area, the electrical connection module is provided on the circuit area, and the light-emitting module and the electrical connection module are electrically connected;

[0005] The electrical connection module comprises a circuit layer and a pad, the upper surface of the pad is covered with a solder layer, the substrate, circuit layer, pad and solder layer are connected in sequence; the thickness of the solder layer is 0.3-3 mm, and the upper surface area of ​​the pad is 1-30 mm 2 .

[0006] As an improvement of the above solution, the thickness ratio of the solder layer and the solder pad is (3-200):1.

[0007] As an improvement of the above solution, the cross-sectional area of ​​the solder layer is the same as the upper surface area of ​​the solder pad.

[0008] As an improvement of the above solution, the solder layer is solder paste.

[0009] As an improvement of the above solution, the solder paste is tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, pure tin, tin-bismuth alloy or tin-silver-bismuth alloy.

[0010] As an improvement of the above solution, the cross-sectional shape of the pad is triangular, circular, semicircular, elliptical, rectangular, trapezoidal or rhombus.

[0011] As an improvement of the above solution, the corner of the pad is an arc angle.

[0012] As an improvement of the above solution, the solder layer is surrounded by a solder resist layer, and the thickness of the solder resist layer is 20-200 μm.

[0013] As an improvement of the above solution, the solder resist layer is a white oil layer.

[0014] As an improvement of the above solution, the substrate is an aluminum substrate or a ceramic; and the circuit layer is a copper foil circuit layer or a silver circuit layer.

[0015] The implementation of this utility model has the following beneficial effects:

[0016] The COB light source of the utility model is provided with a solder layer on the pad, so that the COB light source can directly solder the wire to the pad provided with the solder layer during subsequent production without additional soldering, which not only saves welding time, but also eliminates the need for manual tinning, thereby improving production efficiency and reducing labor costs for subsequent production. At the same time, the utility model limits the thickness of the solder layer and the surface area of ​​the pad to limit the setting volume of the solder layer, that is, the amount of the solder layer, to ensure the amount of solder required for the wire welding, and to ensure that no additional soldering is required during the wire welding process, which not only saves welding time, but also eliminates the need for manual tinning, thereby improving production efficiency and reducing labor costs for subsequent production. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is the front view of the COB light source of the utility model;

[0018] Figure 2 yes Figure 1 Section view along line AA. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model will be further described in detail with reference to the accompanying drawings. It is hereby stated that the directional words such as up, down, left, right, front, back, inside, outside, etc. that appear or will appear in the text of the utility model are only based on the accompanying drawings of the utility model, and are not specific limitations of the utility model.

[0020] See also Figure 1-2 The utility model discloses a COB light source, including a substrate 1, a light-emitting module and an electrical connection module. The substrate 1 is provided with a light-emitting area 2 and a circuit area. The light-emitting module is arranged on the light-emitting area 2, the electrical connection module is arranged on the circuit area, and the light-emitting module and the electrical connection module are electrically connected.

[0021] The electrical connection module comprises a circuit layer 5 and a pad 3, the upper surface of the pad 3 is covered with a solder layer 4, the substrate 1, the circuit layer 5, the pad 3 and the solder layer 4 are connected in sequence; the thickness d of the solder layer 4 is 0.3-3 mm, and the upper surface area of ​​the pad 3 is 1-30 mm 2 .

[0022] The COB light source of the utility model is provided with a solder layer on the pad, so that the COB light source can directly solder the wire to the pad provided with the solder layer during subsequent production without additional soldering, which not only saves welding time, but also eliminates the need for manual tinning, thereby improving production efficiency and reducing labor costs for subsequent production. At the same time, the utility model limits the thickness of the solder layer and the surface area of ​​the pad to limit the setting volume of the solder layer, that is, the amount of the solder layer, to ensure the amount of solder required for the wire welding, and to ensure that no additional soldering is required during the wire welding process, which not only saves welding time, but also eliminates the need for manual tinning, thereby improving production efficiency and reducing labor costs for subsequent production.

[0023] Preferably, the thickness d of the welding layer 4 is 0.5-2.5 mm. More preferably, the thickness d of the welding layer 4 is 1-2 mm. More preferably, the thickness d of the welding layer 4 is 1.3-1.8 mm.

[0024] Preferably, the thickness ratio of the solder layer and the pad is (3-200):1, ensuring sufficient solder, and no additional soldering is required during the wire welding process, which not only saves welding time, but also eliminates the need for manual tinning, thereby improving production efficiency and reducing labor costs for subsequent production. More preferably, the thickness ratio of the solder layer and the pad is (10-100):1.

[0025] Preferably, the cross-sectional area of ​​the solder layer is the same as the upper surface area of ​​the solder pad, ensuring that the solder layer completely covers the solder pad.

[0026] Preferably, the solder layer 4 is solder paste. More preferably, the solder paste is tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, pure tin, tin-bismuth alloy or tin-silver-bismuth alloy. The solder paste is made by heating and melting tin powder with a flux component, and the tin powder uses 2-4 powder particles with a diameter of 20-72 μm.

[0027] Preferably, the cross-sectional shape of the pad 3 is triangular, circular, semicircular, elliptical, rectangular, trapezoidal or rhombic. More preferably, the corner of the pad 3 is an arc angle. The definition of this shape facilitates the melting and reflow of the solder paste to cover the entire pad.

[0028] Preferably, the solder layer 4 is surrounded by a solder resist layer 6, and the thickness of the solder resist layer 6 is 20-200 μm. More preferably, the thickness of the solder resist layer is 30-100 μm.

[0029] The solder mask has the functions of anti-corrosion, insulation and decoration, which is beneficial to prolong the service life of COB light source, improve the reflectivity of light, and thus improve the light effect. After the solder paste melts, it is only connected to the pad, not to the solder mask. Therefore, the width of the solder layer is the same as the width of the upper surface of the pad.

[0030] More preferably, the solder resist layer 6 is a white oil layer.

[0031] Preferably, the substrate 1 is an aluminum substrate or a ceramic substrate, but not limited thereto.

[0032] Preferably, the circuit layer 5 is a copper foil circuit layer or a silver circuit layer. The provision of the tin layer is conducive to welding and also protects the circuit layer to prevent oxidation of the circuit layer.

[0033] Among them, Figure 2 As shown, the light-emitting module includes a chip 21 and a fluorescent glue layer 22, wherein the fluorescent glue layer 22 is filled in the light-emitting area 2 and covers the chip 21; the chip 21 is electrically connected to the circuit layer 5. The chip is an LED chip. The fluorescent glue layer is provided to protect the chip.

[0034] In the production process of COB light sources, a dispensing machine can be used to quickly add a sufficient amount of solder paste to the pad position in batches using a syringe solder paste. After melting, the effect is similar to that of adding solder manually with tin wire, eliminating the need for manual tinning in subsequent production, which not only improves production efficiency but also reduces labor costs.

[0035] In summary, the utility model provides a COB light source, which improves production efficiency and reduces labor costs for subsequent production.

[0036] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. A COB light source, characterized in that: It comprises a substrate, a light-emitting module and an electrical connection module, wherein the substrate is provided with a light-emitting area and a circuit area, the light-emitting module is arranged on the light-emitting area, the electrical connection module is arranged on the circuit area, and the light-emitting module and the electrical connection module are electrically connected; The electrical connection module comprises a circuit layer and a pad, the upper surface of the pad is covered with a solder layer, the substrate, circuit layer, pad and solder layer are connected in sequence; the thickness of the solder layer is 0.3-3 mm, and the upper surface area of ​​the pad is 1-30 mm 2 .

2. The COB light source according to claim 1, characterized in that: The thickness ratio of the solder layer and the solder pad is (3-200):

1.

3. The COB light source according to claim 1, characterized in that: The cross-sectional area of ​​the solder layer is the same as the upper surface area of ​​the solder pad.

4. The COB light source according to claim 1, characterized in that: The solder layer is solder paste.

5. The COB light source according to claim 4, characterized in that: The solder paste is tin-copper alloy, tin-silver-copper alloy, tin-lead alloy, pure tin, tin-bismuth alloy or tin-silver-bismuth alloy.

6. The COB light source according to claim 1, characterized in that: The cross-sectional shape of the pad is triangular, circular, semicircular, elliptical, rectangular, trapezoidal or rhombus.

7. The COB light source according to claim 6, characterized in that: The corner of the pad is an arc angle.

8. The COB light source according to claim 1, characterized in that: The solder layer is surrounded by a solder resist layer, and the thickness of the solder resist layer is 20-200 μm.

9. The COB light source according to claim 8, characterized in that: The solder resist layer is a white oil layer.

10. The COB light source according to any one of claims 1 to 9, characterized in that: The substrate is an aluminum substrate or a ceramic substrate; the circuit layer is a copper foil circuit layer or a silver circuit layer.

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