Glue injection device

Abstract

The utility model relates to a glue injection device. The glue injection device includes: a control valve, including a valve seat, a striker penetrating the valve seat along a first direction, and a driver located above the striker along the first direction, the driver is used to drive the striker to move along the first direction, the valve seat has a flow channel and a glue injection port connected to the flow channel, the glue injection port is used to inject glue; a nozzle, located below the striker along the first direction, the nozzle is connected to the flow channel, and the striker can hit the nozzle along the first direction; a heat dissipation structure, at least distributed around a portion of the periphery of the striker. The utility model reduces the accumulation of heat inside the glue injection device, and avoids glue solidifying inside the glue injection device and clogging the pipeline.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a glue injection device. Background Art

[0002] In the packaging process, glue is injected into the positions between the chip and the substrate, between the functional device and the substrate, etc. through the glue injection device, so as to fix the chip, the functional device, etc. The working principle of the glue injection device is to control whether the glue is sprayed out from the nozzle by the impact of the striker. However, a large amount of heat is generated during the impact of the striker. The heat that is not dissipated in time can easily cause the glue inside the glue injection device to solidify and clog. For example, overheating in the flow channel will cause the glue to solidify in the flow channel, so that the glue cannot be smoothly sprayed out from the nozzle, affecting the smooth progress of the glue injection process.

[0003] Therefore, how to reduce the probability of glue solidification and clogging in the glue injection device, so as to ensure that the glue injection device can smoothly and stably implement the glue injection process, is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a glue injection device, which is used for reducing the probability of glue solidification and clogging in the glue injection device, thereby ensuring that the glue injection device can smoothly and stably implement the glue injection process.

[0005] According to some embodiments, the utility model provides a glue injection device, comprising:

[0006] A control valve, comprising a valve seat, a striker penetrating the valve seat in a first direction, and a driver located above the striker in the first direction, the driver being used to drive the striker to move in the first direction, the valve seat having a flow channel and a glue injection port communicating with the flow channel, the glue injection port being used to inject glue;

[0007] a nozzle, located below the striker along the first direction, the nozzle being in communication with the flow channel, and the striker being capable of striking the nozzle along the first direction;

[0008] The heat dissipation structure is distributed around at least a portion of the periphery of the striker.

[0009] In some embodiments, it also includes:

[0010] A heating block is located below the valve seat along the first direction, and the heating block is distributed around a portion of the periphery of the heat dissipation structure.

[0011] In some embodiments, the heat dissipation structure includes:

[0012] The heat dissipation screw sleeve is distributed around at least a portion of the periphery of the striker, and at least a portion of the heat dissipation screw sleeve is embedded in the heating block.

[0013] In some embodiments, the heat dissipation screw sleeve includes a first end and a second end that are opposite to each other along the first direction, the first end is connected to the heating block, and the second end is connected to the nozzle.

[0014] In some embodiments, the heat dissipation screw sleeve includes:

[0015] A first screw sleeve is distributed around at least a portion of the outer circumference of the striker, and at least a portion of the first screw sleeve is embedded in the heating block;

[0016] The second screw sleeve is protruding along the first direction and is arranged at the bottom end of the first screw sleeve. The second screw sleeve surrounds a portion of the outer circumference of the striker, and the outer diameter of the first screw sleeve is greater than the outer diameter of the second screw sleeve.

[0017] In some embodiments, the bottom surface of the first screw sleeve protrudes from the heating block along the first direction; or,

[0018] The bottom surface of the first screw sleeve is flush with the bottom surface of the heating block.

[0019] In some embodiments, the heat dissipation structure further includes:

[0020] The heat dissipation seal is located in the heat dissipation screw sleeve, and the heat dissipation seal is at least distributed around the outer circumference of the striker.

[0021] In some embodiments, it also includes:

[0022] A striker channel penetrates the valve seat along the first direction, the striker is located in the striker channel, and the striker channel is communicated with the flow channel, and the heat dissipation seal is distributed around the periphery of the striker channel.

[0023] In some embodiments, the heat dissipating seal is a flexible thermally conductive seal.

[0024] In some embodiments, the heat dissipation seal is only located in the second screw sleeve; or,

[0025] The heat dissipation seal is continuously distributed in the second screw sleeve and the first screw sleeve.

[0026] The glue injection device provided by the utility model is provided with a heat dissipation structure so that the heat dissipation structure is distributed around at least part of the outer circumference of the striker, so that during the glue injection process of the glue injection device, the heat generated in the process of the striker hitting the nozzle can be dissipated outwardly through the heat dissipation structure, reducing the accumulation of heat inside the glue injection device, thereby preventing the glue from solidifying inside the glue injection device and clogging the pipeline (such as the flow channel), thereby ensuring the smooth and stable implementation of the glue injection process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Attached Figure 1 It is a structural schematic diagram of the glue injection device in a specific embodiment of the utility model when it is in the first state;

[0028] Attached Figure 2 It is a structural schematic diagram of the glue injection device in a specific embodiment of the utility model when it is in the second state;

[0029] Attached Figure 3 It is a structural schematic diagram of the heat dissipation screw sleeve in a specific implementation manner of the utility model. DETAILED DESCRIPTION

[0030] The specific implementation of the glue injection device provided by the utility model is described in detail below with reference to the accompanying drawings.

[0031] This specific embodiment provides a glue injection device, Figure 1 Schematic diagram of the structure of the glue injection device in the first state in the specific implementation mode of the utility model, Figure 2 Schematic diagram of the structure of the glue injection device in the second state in the specific embodiment of the utility model. Figure 1 and Figure 2 As shown, the glue injection device comprises:

[0032] A control valve, comprising a valve seat 12, a striker 10 penetrating the valve seat 12 along a first direction D1, and a driver 11 located above the striker 10 along the first direction D1, wherein the driver 11 is used to drive the striker 10 to move along the first direction D1, wherein the valve seat has a flow channel and a glue injection port 13 connected to the flow channel, wherein the glue injection port 13 is used to inject glue;

[0033] a nozzle 18, located below the striker 10 along the first direction D1, the nozzle 18 is in communication with the flow channel, and the striker 10 can strike the nozzle 18 along the first direction D1;

[0034] The heat dissipation structure is distributed around at least a portion of the periphery of the striker 10 .

[0035] Specifically, the glue injection port 13 is connected to the flow channel, and the glue is injected into the flow channel through the glue injection port 13, and then flows into the nozzle 18 through the flow channel. The driver 11 can drive the striker 10 to reciprocate along the first direction D1. The glue injection port 13 and the driver 11 are distributed on opposite sides of the valve seat 12 along the second direction D2, wherein the second direction D2 intersects with the first direction D1 (for example, intersects vertically). In one example, in the first state, the driver 11 drives the striker 10 to move downward along the first direction D1, and the striker 10 hits the nozzle 18, so that the glue in the nozzle 18 is sprayed out, thereby realizing the opening of the glue injection device, such as Figure 1 In the second state, the driver drives the striker 10 to move upward along the first direction D1, the striker 10 is separated from the nozzle 18, and the glue cannot be sprayed out from the nozzle 18, so that the glue injection device is closed. Figure 2 In one example, the driver 11 may be a piezoelectric ceramic driver to improve the accuracy of the glue injection device. The glue may be, but is not limited to, epoxy resin glue.

[0036] In this specific embodiment, the heat dissipation structure is arranged on the outer periphery of at least a portion of the impact pin 10, so that during the glue injection process of the glue injection device, the heat generated when the impact pin 10 hits the nozzle 18 can be dissipated outwardly through the heat dissipation structure, reducing the accumulation of heat inside the glue injection device, thereby preventing the glue from solidifying inside the glue injection device and clogging the pipeline (such as the flow channel), thereby ensuring the smooth and stable implementation of the glue injection process.

[0037] In some embodiments, the glue injection device further comprises:

[0038] The heating block 14 is located below the valve seat 12 along the first direction D1, and the heating block 14 is distributed around a portion of the periphery of the heat dissipation structure.

[0039] Specifically, the heating block 14 is located below the valve seat 12 along the first direction D1 and is used to heat the glue in the flow channel so that the glue can be kept in a molten state and can flow smoothly in the flow channel.

[0040] In some embodiments, the heat dissipation structure includes:

[0041] The heat dissipation screw sleeve is distributed around at least a portion of the outer circumference of the striker 10 , and at least a portion of the heat dissipation screw sleeve is embedded in the heating block 14 .

[0042] In some embodiments, the heat dissipation screw sleeve includes a first end and a second end at opposite portions along the first direction D1 , the first end is connected to the heating block 14 , and the second end is connected to the nozzle 18 .

[0043] Specifically, the heating block 14 and the nozzle 18 are connected by the heat dissipation screw sleeve, so that the heat dissipation performance of the glue injection device can be improved while also helping to improve the stability of the overall structure of the glue injection device. In one example, the heat dissipation screw sleeve and the nozzle 18 can be detachably connected to facilitate cleaning or replacement of the nozzle 18. Moreover, the second end of the heat dissipation screw sleeve is connected to the nozzle 18, which also helps to dissipate heat from the nozzle 18 and prevent the nozzle 18 from being deformed due to excessive temperature.

[0044] Attached Figure 3 Schematic diagram of the structure of the heat dissipation screw sleeve in a specific embodiment of the utility model. Figure 1-Figure 3 As shown, the heat dissipation screw sleeve includes:

[0045] A first screw sleeve 15 is distributed around at least a portion of the outer circumference of the striker 10 , and at least a portion of the first screw sleeve 15 is embedded in the heating block 14 ;

[0046] The second screw sleeve 16 is protruding from the bottom end of the first screw sleeve 15 along the first direction D1. The second screw sleeve 16 surrounds a portion of the outer circumference of the striker 10 , and an outer diameter R1 of the first screw sleeve 15 is greater than an outer diameter R2 of the second screw sleeve 16 .

[0047] Specifically, if Figure 1-Figure 3As shown, the heat dissipation screw sleeve includes the first screw sleeve 15 and the second screw sleeve 16 protruding along the first direction D1 and arranged on the bottom surface of the first screw sleeve 15 (i.e., the surface of the first screw sleeve 15 facing the nozzle 18). The heat dissipation screw sleeve has a through hole 30, and the through hole 30 passes through the first screw sleeve 15 and the second screw sleeve 16 along the first direction D1. The first screw sleeve 15 is embedded in the heating block 14. Since the first screw sleeve 15 has good thermal conductivity, it can better conduct the heat generated by the heating block 14, so that the glue in the flow channel and other pipes in the glue injection device remains in a molten state. The second screw sleeve 16 is arranged outside the heating block 14, and the second screw sleeve 16 is distributed around the outer periphery of part of the striker 10, so that the heat generated by the striker 10 hitting the nozzle 18 can be dissipated to the external environment in time by using the good thermal conductivity of the second screw sleeve 16, so as to avoid the glue solidification caused by the excessive temperature inside the glue injection device. The outer diameter R1 of the first screw sleeve 15 is greater than the outer diameter R2 of the second screw sleeve 16 . On the one hand, this helps to reduce the thickness of the second screw sleeve 16 , thereby further improving the heat dissipation efficiency of the second screw sleeve 16 ; on the other hand, it also helps to reduce the manufacturing cost of the glue injection device.

[0048] In some embodiments, the bottom surface of the first screw sleeve 15 protrudes from the heating block 14 along the first direction D1; or

[0049] The bottom surface of the first screw sleeve 15 is flush with the bottom surface of the heating block 14 .

[0050] In one example, if Figure 1 and Figure 2 As shown, the bottom surface of the first screw sleeve 15 protrudes from the heating block 14 along the first direction D1, which can enhance the heat dissipation effect of the heat dissipation screw sleeve as a whole and simplify the disassembly and assembly operation of the heat dissipation screw sleeve. In another example, the bottom surface of the first screw sleeve 15 is flush with the bottom surface of the heating block 14, thereby reducing the heat loss in the heating block 14.

[0051] In some embodiments, the heat dissipation structure further includes:

[0052] The heat dissipation seal 17 is located in the heat dissipation screw sleeve, and the heat dissipation seal 17 is distributed at least around the outer circumference of the striker 10 .

[0053] Specifically, the heat dissipation seal 17 is located in the through hole 30 of the heat dissipation screw sleeve, and the heat dissipation seal 17 is located between the inner wall of the through hole 30 and the striker 10. By providing the heat dissipation seal 17, on the one hand, the heat dissipation performance of the glue injection device can be further enhanced by utilizing the good heat conduction performance of the heat dissipation seal 17, and the probability of glue solidification and blockage inside the glue injection device can be further reduced; on the other hand, the sealing performance of the glue injection device can be enhanced, and the leakage of the glue can be reduced or even avoided.

[0054] In order to further ensure the smooth flow of the glue, in some embodiments, the glue injection device further includes:

[0055] The striker channel penetrates the valve seat 12 along the first direction D1. The striker 10 is located in the striker channel, and the striker channel is communicated with the flow channel. The heat dissipation seal 17 is distributed around the periphery of the striker channel.

[0056] In some embodiments, the heat dissipation seal 17 is a flexible heat conductive seal.

[0057] Specifically, by setting the heat dissipation seal 17 as a flexible heat-conductive seal, it can ensure good contact between the heat dissipation structure and the striker channel or glue channel (such as a pipe connecting the flow channel and the nozzle 18), and achieve efficient heat conduction.

[0058] In some embodiments, the heat dissipation seal 17 is only located in the second screw sleeve 16; or,

[0059] The heat dissipation seal 17 is continuously distributed in the second screw sleeve 16 and the first screw sleeve 15 .

[0060] In one example, the heat dissipation seal 17 is only located in the second screw sleeve 16, thereby helping to further improve the heat dissipation performance of the heat dissipation structure and reduce the manufacturing cost of the glue injection device. In another example, the heat dissipation seal 17 is continuously distributed in the second screw sleeve 16 and the first screw sleeve 15, thereby improving the heat dissipation performance of the second screw sleeve 16 and helping to improve the performance of the first screw sleeve 15 in conducting the heat generated by the heating block 14.

[0061] The glue injection device provided in this specific embodiment is provided with a heat dissipation structure so that the heat dissipation structure is distributed around at least part of the outer circumference of the striker, so that during the glue injection process of the glue injection device, the heat generated when the striker hits the nozzle can be dissipated outwardly through the heat dissipation structure, reducing the accumulation of heat inside the glue injection device, thereby preventing the glue from solidifying inside the glue injection device and clogging the pipeline (such as the flow channel), thereby ensuring the smooth and stable implementation of the glue injection process.

[0062] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A glue injection device, characterized in that: include: A control valve, comprising a valve seat, a striker penetrating the valve seat in a first direction, and a driver located above the striker in the first direction, the driver being used to drive the striker to move in the first direction, the valve seat having a flow channel and a glue injection port communicating with the flow channel, the glue injection port being used to inject glue; a nozzle, located below the striker along the first direction, the nozzle being in communication with the flow channel, and the striker being capable of striking the nozzle along the first direction; The heat dissipation structure is distributed around at least a portion of the periphery of the striker.

2. The glue injection device according to claim 1, characterized in that: Also includes: A heating block is located below the valve seat along the first direction, and the heating block is distributed around a portion of the periphery of the heat dissipation structure.

3. The glue injection device according to claim 2, characterized in that: The heat dissipation structure comprises: The heat dissipation screw sleeve is distributed around at least a portion of the periphery of the striker, and at least a portion of the heat dissipation screw sleeve is embedded in the heating block.

4. The glue injection device according to claim 3, characterized in that: The heat dissipation screw sleeve comprises a first end and a second end which are opposite to each other along the first direction, the first end is connected to the heating block, and the second end is connected to the nozzle.

5. The glue injection device according to claim 3, characterized in that: The heat dissipation screw sleeve comprises: A first screw sleeve is distributed around at least a portion of the outer circumference of the striker, and at least a portion of the first screw sleeve is embedded in the heating block; The second screw sleeve is protruding along the first direction and is arranged at the bottom end of the first screw sleeve. The second screw sleeve surrounds a portion of the outer circumference of the striker, and the outer diameter of the first screw sleeve is greater than the outer diameter of the second screw sleeve.

6. The glue injection device according to claim 5, characterized in that: The bottom surface of the first screw sleeve protrudes from the heating block along the first direction; or, The bottom surface of the first screw sleeve is flush with the bottom surface of the heating block.

7. The glue injection device according to claim 5, characterized in that: The heat dissipation structure further includes: The heat dissipation seal is located in the heat dissipation screw sleeve, and the heat dissipation seal is at least distributed around the outer circumference of the striker.

8. The glue injection device according to claim 7, characterized in that: Also includes: A striker channel penetrates the valve seat along the first direction, the striker is located in the striker channel, and the striker channel is communicated with the flow channel, and the heat dissipation seal is distributed around the periphery of the striker channel.

9. The glue injection device according to claim 7, characterized in that: The heat dissipation seal is a flexible heat conductive seal.

10. The glue injection device according to claim 7, characterized in that: The heat dissipation seal is only located in the second screw sleeve; or, The heat dissipation seal is continuously distributed in the second screw sleeve and the first screw sleeve.

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