Wafer centering mechanism for gluing machine

Abstract

The utility model discloses a wafer centering mechanism for a gluing machine, which relates to the field of wafer processing and comprises a base, a first ring body is mounted at the upper end of the base, a top plate is mounted at the upper end of the first ring body, four first sliding grooves distributed in an annular array are formed in the upper end of the first ring body, and a second ring body is mounted at the lower end of the top plate. A centering component is jointly arranged in the four first sliding grooves, four rectangular through grooves distributed in an annular array mode are formed in the upper end of the top plate, a hollow column is installed in the middle of the upper end of the top plate, and an auxiliary component is arranged in the hollow column. According to the utility model, wafers of different sizes can be centered conveniently by arranging the centering part, so that the wafer clamping device is suitable for wafers of different sizes, fixing clamps of different sizes do not need to be replaced, the flexibility and universality of the device are improved, and abrasion to the bottoms of the wafers can be reduced by arranging the auxiliary part; the influence of surface damage on the product quality is avoided, and the machining quality is improved.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a wafer centering mechanism for a glue coating machine. Background Art

[0002] The processing of semiconductor devices includes many steps, and each step uses different processing equipment. To ensure that the processing of semiconductor devices can proceed smoothly, the wafer needs a fixed position and posture when entering many steps so that the subsequent steps can accurately process the wafer. In this way, it is necessary to use a centering mechanism to position and calibrate the wafer in advance.

[0003] The prior art (publication number: CN 220189602 U) discloses a wafer centering device, including a wafer configurator for carrying wafers and a centering assembly relatively arranged on both sides of the wafer configurator for pushing the wafer to the center of the wafer configurator, wherein the centering assembly includes a support assembly, a cylinder installed on the top of the support assembly, a connecting piece arranged at the output end of the cylinder, and a centering clamp arranged on the top of the connecting piece, wherein the connecting piece and the centering clamp are driven by the cylinder to move toward and away from the wafer on the wafer configurator.

[0004] Although the above patent improves the subsequent gluing quality of wafers during the gluing process and solves the problem that the COT of the current model is not equipped with a centering device, which will cause the wafer to be centrifugally unstable during the rotation process driven by the CTO, it has the following disadvantages: when in use, the size of the fixing clamp cannot be adjusted. When the fixing clamp is centered on a larger wafer, the wafer cannot be centered, and thus cannot adapt to wafers of different sizes. It is necessary to replace fixing clamps of different sizes, which affects the flexibility and versatility of the equipment and requires further improvement. For this reason, we propose a wafer centering mechanism for a glue coating machine. Utility Model Content

[0005] The main purpose of the utility model is to provide a wafer centering mechanism for a glue coating machine, which can effectively solve the problems in the background technology.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A wafer centering mechanism for a glue coating machine comprises a base, a first ring body is installed on the upper end of the base, a top plate is installed on the upper end of the first ring body, four first slide grooves distributed in a circular array are opened on the upper end of the first ring body, a centering component is commonly arranged in the four first slide grooves, four rectangular through grooves distributed in a circular array are opened on the upper end of the top plate, a hollow column is installed in the middle of the upper end of the top plate, and auxiliary components are arranged in the hollow column.

[0008] Preferably, the centering component includes a rack, four of which are provided and distributed in a ring array, the four racks are respectively slidably connected in four first sliding grooves, the four racks are all meshed with gears, push rods are installed on the upper ends of the four racks, the four gears are commonly meshed with annular teeth, and the outer surface of the annular teeth is fixedly sleeved with an annular worm gear.

[0009] Preferably, the auxiliary component includes an electric cylinder, two of which are provided and distributed on the left and right, the two electric cylinders are both arranged in a hollow column, a support ring is commonly installed at the output ends of the two electric cylinders, the upper end of the support ring is movably inserted into the upper side of the hollow column, and a plurality of universal ball bearings distributed in a ring array are installed at the upper end of the support ring.

[0010] Preferably, a circular through groove is provided on the first ring body, a rotatable worm is arranged in the circular through groove, the left end of the worm is movably connected to a bearing seat, the right end of the worm is fixedly connected to a motor, the worm is meshed with an annular worm wheel, and the motor and the bearing seat are both installed at the rear of the upper end of the base.

[0011] Preferably, a second ring body is installed in the middle of the upper end of the base, and four second slide grooves distributed in a ring array are opened at the upper end of the second ring body, and the four racks all extend into the second slide grooves.

[0012] Preferably, the lower end of the annular tooth is rotatably connected to the upper end of the base, the lower ends of the four gears are rotatably connected to the upper end of the base via a rotating shaft, and the four push rods all extend into the rectangular through groove.

[0013] Preferably, a suction cup is installed at the upper end of the hollow column.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. By setting the centering component, wafers of different sizes can be easily centered. When in use, the wafer is placed on the universal ball to drive the annular worm gear and the annular gear to rotate. The annular gear drives four gears at the same time. The four gears drive four racks to approach each other at the same time. The four racks drive four push rods to approach each other at the same time, and push the wafer to the center position at the same time. When fixing wafers of other sizes, it is only necessary to adjust the distance between the four push rods through the annular worm gear to center wafers of different sizes, thereby adapting to wafers of different sizes without replacing fixing clips of different sizes, thereby improving the flexibility and versatility of the equipment;

[0016] 2. By setting auxiliary components, the wear on the bottom of the wafer can be reduced. When in use, the output end of the electric cylinder is controlled to extend, driving the support ring and the universal ball to move downward, and then the wafer is placed on top of the universal ball. During centering, since the wafer can roll freely on the universal ball, the universal ball support can reduce friction and scratches when in contact with the wafer, avoiding the impact of surface damage on product quality and improving processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the entire structure proposed in this embodiment;

[0018] Figure 2 Schematic diagram of the structure of the centering component in this embodiment;

[0019] Figure 3 Schematic diagram of the structure of the base in this embodiment;

[0020] Figure 4 Schematic diagram of the structure of the auxiliary components in this embodiment.

[0021] In the figure: 1. base; 2. first ring body; 3. top plate; 4. rectangular through groove; 5. centering component; 6. hollow column; 7. auxiliary component; 8. suction cup; 9. first slide groove; 10. second ring body; 11. second slide groove; 12. motor; 13. worm; 14. bearing seat; 21. circular through groove; 51. rack; 52. push rod; 53. annular gear; 54. gear; 55. annular worm wheel; 71. electric cylinder; 72. support ring; 73. universal ball. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0023] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] like Figure 1-Figure 4 As shown, a wafer centering mechanism for a glue coating machine comprises a base 1, a first ring body 2 is installed on the upper end of the base 1, the first ring body 2 is connected to the base 1 by screws, a top plate 3 is installed on the upper end of the first ring body 2, the top plate 3 is connected to the first ring body 2 by screws, four first slide grooves 9 distributed in a circular array are opened on the upper end of the first ring body 2, a centering component 5 is commonly arranged in the four first slide grooves 9, four rectangular through grooves 4 distributed in a circular array are opened on the upper end of the top plate 3, a hollow column 6 is installed in the middle of the upper end of the top plate 3, the hollow column 6 is welded to the top plate 3, and an auxiliary component 7 is arranged in the hollow column 6.

[0026] The centering component 5 can be used to conveniently center wafers of different sizes. The specific structure is as follows: the centering component 5 includes a rack 51, four racks 51 are provided and are distributed in a ring array, the four racks 51 are slidably connected in four first slide grooves 9, respectively, the four racks 51 are slidably connected in the first slide grooves 9 through slide rails, the four racks 51 are all meshed with gears 54, push rods 52 are installed on the upper ends of the four racks 51, the push rods 52 are detachably connected to the racks 51 through screws, the four gears 54 are commonly meshed with annular teeth 53, the outer surface of the annular teeth 53 is fixedly sleeved with an annular worm gear 55, and the annular worm gear 55 is welded to the outer surface of the annular teeth 53, a circular through groove 21 is provided on the first ring body 2, a rotatable worm 13 is provided in the circular through groove 21, the left end of the worm 13 is movably connected to a bearing seat 14, and the right end of the worm 13 is fixedly connected to Motor 12, in order to improve accuracy, motor 12 is a servo motor, worm 13 is meshed with annular worm gear 55, worm 13 and annular worm gear 55 are self-locking, motor 12 and bearing seat 14 are both installed at the upper rear of base 1, motor 12 and bearing seat 14 are both disassembled and connected to base 1 by bolts, when in use, the wafer is placed above universal ball 73, the motor 12 is controlled to drive the worm 13 to rotate, the worm 13 drives the annular worm gear 55 and the annular gear 53 to rotate, the annular gear 53 drives four gears 54 at the same time, the four gears 54 drive four racks 51 to approach each other at the same time, the four racks 51 drive four push rods 52 to approach each other at the same time, and push the wafer to the center position at the same time, when fixing wafers of other sizes, it is only necessary to adjust the number of revolutions of motor 12, thereby adjusting the distance between the four push rods 52 through the annular worm gear 55.

[0027] The auxiliary component 7 can reduce the wear on the bottom of the wafer. The auxiliary component 7 includes an electric cylinder 71. Two electric cylinders 71 are provided and distributed on the left and right. The two electric cylinders 71 are both arranged in the hollow column 6. The output ends of the two electric cylinders 71 are commonly equipped with a support ring 72. The support ring 72 is detachably connected to the output end of the electric cylinder 71 through a screw. The upper end of the support ring 72 is movably inserted into the upper side of the hollow column 6. A plurality of universal ball bearings 73 distributed in a ring array are installed on the upper end of the support ring 72. The universal ball bearings 73 can rotate freely. The universal ball bearing support can reduce friction and scratches when in contact with the wafer, avoid the influence of surface damage on product quality, and improve processing quality.

[0028] A second ring body 10 is installed in the middle of the upper end of the base 1. Four second slide grooves 11 distributed in a ring array are opened at the upper end of the second ring body 10. The four racks 51 all extend into the second slide grooves 11. The second slide grooves 11 are used to support the racks 51. The racks 51 are slidably connected to the second slide grooves 11 through slide rails.

[0029] The lower end of the annular tooth 53 is rotatably connected to the upper end of the base 1 , and the annular tooth 53 is rotatably connected to the base 1 through an annular slide rail. The lower ends of the four gears 54 are rotatably connected to the upper end of the base 1 through a rotating shaft, and the four push rods 52 all extend into the rectangular through groove 4 .

[0030] A suction cup 8 is installed at the upper end of the hollow column 6, and the suction cup 8 is used to fix the wafer. A servo motor is arranged under the base 1 to drive the suction cup 8 to rotate.

[0031] The wafer centering mechanism for the glue coating machine proposed by the utility model, when in use, controls the output end of the electric cylinder 71 to extend, drives the support ring 72 and the universal ball 73 to move downward, so that the highest point of the universal ball 73 is located above the suction cup 8, and then places the wafer above the universal ball 73, controls the motor 12 to drive the worm 13 to rotate, and the worm 13 drives the annular worm gear 55 and the annular gear 53 to rotate, and the annular gear 53 drives the four gears 54 at the same time, and the four gears 54 drive the four racks 51 to approach each other at the same time, and the four racks 51 drive the four push rods 52 to approach each other at the same time, and push the wafer to the center position at the same time. When fixing wafers of other sizes, it is only necessary to adjust the distance between the four push rods 52 by the annular worm gear 55 to center wafers of different sizes, and then controls the output end of the electric cylinder 71 to shorten, so that the wafer is placed above the suction cup 8, and finally fixes the wafer by the suction cup 8, so that the glue coating machine can coat the glue conveniently.

[0032] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A wafer centering mechanism for a glue coating machine, comprising a base (1), characterized in that: A first ring body (2) is mounted on the upper end of the base (1), a top plate (3) is mounted on the upper end of the first ring body (2), four first slide grooves (9) distributed in a ring array are provided on the upper end of the first ring body (2), a centering component (5) is commonly provided in the four first slide grooves (9), four rectangular through grooves (4) distributed in a ring array are provided on the upper end of the top plate (3), a hollow column (6) is mounted in the middle of the upper end of the top plate (3), and an auxiliary component (7) is provided in the hollow column (6).

2. The wafer centering mechanism for a glue coating machine according to claim 1, characterized in that: The centering component (5) comprises a rack (51), wherein four racks (51) are provided and distributed in an annular array, wherein the four racks (51) are respectively slidably connected in four first sliding grooves (9), wherein the four racks (51) are all meshedly connected with a gear (54), wherein a push rod (52) is installed at the upper end of the four racks (51), wherein the four gears (54) are commonly meshedly connected with an annular gear (53), and an annular worm gear (55) is fixedly sleeved on the outer surface of the annular gear (53).

3. The wafer centering mechanism for a glue coating machine according to claim 1, characterized in that: The auxiliary component (7) comprises an electric cylinder (71), two of which are arranged and distributed on the left and right, the two electric cylinders (71) are arranged in the hollow column (6), a support ring (72) is installed on the output ends of the two electric cylinders (71), the upper end of the support ring (72) is movably inserted into the upper side of the hollow column (6), and a plurality of universal balls (73) distributed in a ring array are installed on the upper end of the support ring (72).

4. The wafer centering mechanism for a glue coating machine according to claim 2, characterized in that: A circular through groove (21) is provided on the first ring body (2), a rotatable worm (13) is arranged in the circular through groove (21), the left end of the worm (13) is movably connected to a bearing seat (14), the right end of the worm (13) is fixedly connected to a motor (12), the worm (13) is meshed with an annular worm wheel (55), and the motor (12) and the bearing seat (14) are both mounted on the upper rear part of the base (1).

5. The wafer centering mechanism for a glue coating machine according to claim 2, characterized in that: A second ring body (10) is installed in the middle of the upper end of the base (1), and four second slide grooves (11) distributed in a ring array are opened at the upper end of the second ring body (10), and the four racks (51) all extend into the second slide grooves (11).

6. The wafer centering mechanism for a glue coating machine according to claim 2, characterized in that: The lower end of the annular tooth (53) is rotatably connected to the upper end of the base (1), the lower ends of the four gears (54) are rotatably connected to the upper end of the base (1) via a rotating shaft, and the four push rods (52) all extend into the rectangular through slot (4).

7. The wafer centering mechanism for a glue coating machine according to claim 1, characterized in that: A suction cup (8) is installed at the upper end of the hollow column (6).

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