Differential speed grinding and conveying system for silicon slag and silicon wafer production system
By designing a differential grinding conveying system, the silicon slag is removed by using the differential between the drum and the steel wire roller brush, the problem of silicon slag residue in the silicon wafer manufacturing process is solved, and the yield and production safety of the silicon wafer are improved.
Patent Information
- Application Number
- CN202420854953.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-23
AI Technical Summary
During the silicon wafer manufacturing process, the residue of silicon slag will cause safety hazards and residual glue on the crystal support surface, affecting the yield of the silicon wafer. The existing technology has not effectively solved this problem.
A differential grinding conveying system for silicon slag is designed, by installing a plurality of drums and at least one steel wire roller brush on the conveying surface of the rack, the difference between the drum and the steel wire roller brush is used to remove silicon slag on the surface of the plastic plate.
Automatic removal of silicon slag is achieved, avoiding the risk of silicon slag cracking and splashing in subsequent processes, and improving the cleanliness of the crystal support surface and the yield of the silicon wafer.
Smart Images
Figure CN222696818U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of solar photovoltaic manufacturing technology, and in particular to a differential grinding and conveying system for silicon slag and a silicon wafer production system. Background Art
[0002] In a single crystal furnace, silicon raw materials are pulled into silicon round rods through a crystal pulling process. The silicon round rods are then machined into silicon square rods. The silicon square rods are transferred to a slicing unit for mechanical processing to form silicon wafers, which are used to manufacture batteries for solar power generation.
[0003] During the silicon wafer manufacturing process, silicon slag will remain on the plastic plate after the silicon wafer is debonded. If the residual silicon slag is not cleaned in time, the silicon slag will crack and splash during the subsequent electromagnetic heating process, causing safety hazards. It will also affect the heating effect of the crystal tray, resulting in residual glue on the surface of the final crystal tray, affecting the yield of the silicon wafer.
[0004] To address the above-mentioned problems, no effective solution has been proposed yet. Utility Model Content
[0005] The embodiments of the present application provide a differential grinding and conveying system for silicon slag and a silicon wafer production system, so as to at least solve the technical problem of residual silicon slag in the silicon wafer manufacturing process in the related art.
[0006] According to one aspect of an embodiment of the present application, a differential grinding and conveying system for silicon slag is provided, comprising: a crystal support, a plastic plate, a frame, a roller drive motor, a sprocket, a chain, a roller brush drive motor, a wire roller brush, a motor mounting seat, and a roller; a plurality of rollers, at least one wire roller brush, and a plurality of rollers are sequentially installed from one end to the other end of the conveying surface of the frame, the conveying surface is used to convey the crystal support and the plastic plate under the crystal support through the rollers, the mounting surface of the frame is installed with a roller drive motor and a roller brush drive motor, the roller drive motor drives the roller to rotate through an adapted sprocket and chain, the roller brush drive motor drives the wire roller brush to rotate through an adapted sprocket and chain, and the differential speed formed between the wire roller brush and the roller is used to remove silicon slag on the surface of the plastic plate.
[0007] According to another aspect of an embodiment of the present application, a silicon wafer production system is also provided, including the above-mentioned differential grinding and conveying system for silicon slag.
[0008] In an embodiment of the present application, a differential grinding and conveying system for silicon slag is provided, including a crystal support, a plastic plate, a frame, a roller drive motor, a sprocket, a chain, a roller brush drive motor, a wire roller brush, a motor mounting seat and a roller; a plurality of rollers, at least one wire roller brush and a plurality of rollers are installed in sequence from one end to the other end of the conveying surface of the frame, the conveying surface is used to convey the crystal support and the plastic plate under the crystal support through the rollers, the mounting surface of the frame is installed with a roller drive motor and a roller brush drive motor, the roller drive motor drives the roller to rotate through an adapted sprocket and chain, the roller brush drive motor drives the wire roller brush to rotate through an adapted sprocket and chain, the differential speed formed between the wire roller brush and the roller is used to remove silicon slag on the surface of the plastic plate, thereby solving the technical problem of residual silicon slag in the silicon wafer manufacturing process in the related art. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0010] Figure 1 It is a schematic diagram of an optional differential grinding and conveying system for silicon slag according to an embodiment of the present application.
[0011] In the figure:
[0012] 1-crystal support, 2-plastic plate, 3-frame, 4-roller drive motor, 5-sprocket, 6-chain, 7-roller brush drive motor, 8-wire roller brush, 9-motor mounting seat, 10-roller. DETAILED DESCRIPTION
[0013] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0014] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.
[0015] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0016] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.
[0017] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0018] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0019] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.
[0020] Figure 1 is a schematic diagram of an optional differential grinding and conveying system for silicon slag according to an embodiment of the present application, such as Figure 1 As shown, including:
[0021] Crystal support 1, plastic plate 2, frame 3, roller drive motor 4, sprocket 5, chain 6, roller brush drive motor 7, wire roller brush 8, motor mounting seat 9 and roller 10.
[0022] It should be noted that the sprocket 5 and the chain 6 may be two sets, with the roller drive motor and the roller brush drive motor each using one set.
[0023] A plurality of rollers 10, at least one wire roller brush 8 and a plurality of rollers 10 (i.e., the wire roller brush 8 is in the middle and rollers 10 are on both sides) are sequentially installed from one end to the other end of the conveying surface (i.e., the top) of the frame 3. The conveying surface is used to convey the crystal support 1 and the plastic plate 2 under the crystal support 1 through the rollers 10. A roller drive motor 4 and a roller brush drive motor 7 are installed on the mounting surface (i.e., the bottom) of the frame 3. The roller drive motor 4 drives the roller 10 to rotate through a set of matching sprockets 5 and chains 6. The roller brush drive motor 7 drives the wire roller brush 8 to rotate through another set of matching sprockets 5 and chains 6. The silicon slag on the surface of the plastic plate 2 is removed by the differential speed formed between the wire roller brush 8 and the roller 10.
[0024] In an embodiment of the present application, a differential grinding and conveying system for silicon slag is provided, including a crystal support 1, a plastic plate 2, a frame 3, a roller drive motor 4, a sprocket 5, a chain 6, a roller brush drive motor 7, a wire roller brush 8, a motor mounting seat 9 and a roller 10; a plurality of rollers 10, at least one wire roller brush 8 and a plurality of rollers 10 are sequentially installed from one end to the other end of the conveying surface of the frame 3, the conveying surface is used to convey the crystal support 1 and the plastic plate 2 under the crystal support 1 through the roller 10, the mounting surface of the frame 3 is installed with a roller drive motor 4 and a roller brush drive motor 7, the roller drive motor 4 drives the roller 10 to rotate through the matching sprocket 5 and chain 6, the roller brush drive motor 7 drives the wire roller brush 8 to rotate through the matching sprocket 5 and chain 6, the differential speed formed between the wire roller brush 8 and the roller 10 is used to remove the silicon slag on the surface of the plastic plate 2, thereby solving the technical problem of residual silicon slag in the silicon wafer manufacturing process in the related art.
[0025] This application proposes a new type of silicon slag differential grinding conveyor line, which completes the grinding of silicon slag during the conveying process of the crystal tray and the plastic plate, saving the grinding time of silicon slag, thereby improving production efficiency and achieving the purpose of reducing costs and increasing efficiency. As an optional embodiment, the following is combined with Figure 1 The technical solution of this application is further described in detail:
[0026] The silicon slag differential grinding conveyor line of the present application is mainly composed of a crystal support 1, a plastic plate 2, a frame 3, a roller drive motor 4, a sprocket 5, a chain 6, a roller brush drive motor 7, a wire roller brush 8, a motor mounting seat 9, and a roller 10; when the conveyor line is working, the drive motor 4 drives the sprocket 5 to rotate, the sprocket 5 drives the chain 6 to rotate, and the chain 6 drives the roller 10 to rotate, thereby driving the crystal support 1 and the plastic plate 2 to transmit on the roller 10, the roller brush drive motor 7 drives the sprocket 5 to rotate, the sprocket 5 drives the chain 6 to rotate, and the chain 6 drives the wire roller brush 8 to rotate. When the crystal support 1 and the plastic plate 2 pass through the wire roller brush 8, the roller brush drive motor 7 rotates at high speed, thereby driving the wire roller brush 8 to rotate, and a differential speed is formed between the wire roller brush 8 and the roller 10, thereby removing the silicon slag on the surface of the plastic plate 2.
[0027] This solution can realize the silicon slag grinding process of the crystal tray and the plastic plate on the automatic conveyor line without manual intervention and without affecting the flow rhythm of the conveyor line.
[0028] According to another aspect of an embodiment of the present application, a silicon wafer production system is also provided, including the above-mentioned differential grinding and conveying system for silicon slag, and the specific implementation method is shown above.
[0029] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.
Claims
1. A differential grinding and conveying system for silicon slag, characterized in that: include: Crystal support (1), plastic plate (2), frame (3), roller drive motor (4), sprocket (5), chain (6), roller brush drive motor (7), wire roller brush (8), motor mounting seat (9) and roller (10); A plurality of rollers (10), at least one steel wire brush (8) and a plurality of rollers (10) are sequentially mounted from one end to the other end of the conveying surface of the frame (3); the conveying surface is used to convey the crystal tray (1) and the plastic plate (2) below the crystal tray (1) through the rollers (10); the mounting surface of the frame (3) is mounted with the roller drive motor (4) and the roller brush drive motor (7); the roller drive motor (4) drives the roller (10) to rotate through an adapted sprocket (5) and a chain (6); the roller brush drive motor (7) drives the steel wire brush (8) to rotate through an adapted sprocket (5) and a chain (6); the speed differential formed between the steel wire brush (8) and the roller (10) is used to remove silicon slag on the surface of the plastic plate (2).
2. A silicon wafer production system, characterized in that: A differential speed grinding and conveying system for silicon slag comprising the silicon slag according to claim 1.