A contactless silicon wafer transmission angle adjustment track

Abstract

The utility model discloses a contactless silicon wafer transmission angle adjustment track, comprising a silicon wafer body, a silicon wafer guide column, a synchronous belt with a boss, a driving servo motor, an adjustment mechanism, and a track body. The silicon wafer body is evenly placed on the synchronous belt with a boss, the synchronous belt with a boss is driven by the driving servo motor, the synchronous belt with a boss is arranged between the track bodies, and the track body is provided with a silicon wafer guide column and an adjustment mechanism. The utility model is designed to be installed in an integrated manner through the contactless track and the silicon wafer guide, and the installation and debugging are simple. The contactless track is designed to have an adjustable left and right tilt angle, and cooperates with the side roller guide to better correct the position of the silicon wafer and avoid the risk of fragments during the silicon wafer transmission process.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer conveying, in particular to a contactless silicon wafer transmission angle adjustment track. Background Art

[0002] Thin film preparation technology has a very wide range of applications in VLSI technology. According to its film forming method, it can be divided into two categories: physical vapor deposition (PVD) and chemical vapor deposition (CVD). Plasma enhanced chemical vapor deposition (PECVD) is a type of chemical vapor deposition. Its most prominent advantage is its low deposition temperature. The thin film deposited by PECVD has excellent electrical properties, good substrate adhesion and excellent step coverage. Because of these advantages, it has a wide range of applications in VLSI, optoelectronic devices, MEMS and other fields. Silicon wafer transmission is an important equipment in the manufacturing process of solar panels and an important technical link in the process of plasma enhanced chemical vapor deposition (PECVD). The most commonly used method is to use a servo motor to drive a synchronous belt structure to transmit silicon wafers. This method of transmitting silicon wafers is usually that the synchronous belt made of polyurethane directly contacts the silicon wafer and uses friction to transfer the silicon wafer. The biggest disadvantage of this method is that the surface of the silicon wafer will be contaminated to varying degrees when it contacts the synchronous belt, which will affect the subsequent PECVD coating effect of the silicon wafer or the effect of performing other processing techniques, which will also directly affect the performance of the entire product.

[0003] The existing silicon wafer conveyors are all single-line conveyors, and the conveying direction of the track is fixed and the angle cannot be adjusted. The silicon wafer guide columns on both sides of the track cannot fit the silicon wafer body well, and the conveying efficiency is low. For example, a silicon wafer loading device, a silicon wafer unloading device and a silicon wafer flipping and conveying system disclosed in publication number CN213093215U, in which the silicon wafers are conveyed to the loading track in one direction, are convenient for taking out the silicon wafers in the basket after the flipping is completed, and the flipping and conveying efficiency of the silicon wafers is improved. However, the angle of the track cannot be adjusted during the conveying process, and the silicon wafers conveyed in the track cannot be limited or assisted in the conveying. Errors are prone to occur during the conveying process, resulting in a high fragmentation rate.

[0004] Therefore, it is necessary to invent a contactless silicon wafer transmission angle adjustment track to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a contactless silicon wafer transmission angle adjustment track to solve the problem that the track angle cannot be adjusted during the silicon wafer transportation process, the track guide column cannot fit the silicon wafer transportation angle, and transportation errors are prone to occur.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a contactless silicon wafer transmission angle adjustment track, comprising a silicon wafer body, a silicon wafer guide column, a synchronous belt with a boss, a driving servo motor, an adjustment mechanism, and a track body. The silicon wafer body is evenly placed on the synchronous belt with a boss, the synchronous belt with a boss is driven by a driving servo motor, the synchronous belt with a boss is arranged between the track bodies, and the track body is provided with a silicon wafer guide column and an adjustment mechanism.

[0007] Preferably, the silicon wafer guide pillars are provided in a plurality of groups, and the plurality of groups of silicon wafer guide pillars are evenly arranged on the side of the track body, and the height of the silicon wafer guide pillars is flush with the track body.

[0008] Preferably, the bottom surface of the silicon wafer body contacts the raised surface on the synchronous belt with bosses, and the width of the silicon wafer body matches the distance between the track bodies.

[0009] Preferably, the synchronous belt with bosses is evenly and fixedly provided with bosses, the distances between adjacent bosses are equal, and two synchronous belts with bosses are provided, and both of the two synchronous belts with bosses are driven by a driving servo motor.

[0010] Preferably, the adjustment mechanism is a standard part, and manually rotating the angle of the hinge will lift or sink the middle of the track body on both sides.

[0011] Preferably, the track body is composed of two sets of double tracks, the distance between the two sets of double tracks is equal, and silicon wafer guide pillars are arranged on opposite sides of the double tracks.

[0012] In the above technical solution, the technical effects and advantages provided by the utility model are:

[0013] 1. The utility model uses the non-contact track and the silicon wafer guide to form an integrated installation, which is easy to install and debug. The non-contact track is designed to have an adjustable left and right tilt angle, and cooperates with the side roller guide to better correct the position of the silicon wafer and avoid the risk of fragmentation during the transmission of the silicon wafer;

[0014] 2. The utility model facilitates the installation of the track through the angle adjustment mechanism, and uses its own lifting or sinking to adjust the conveying angle of the track, so that the guide column on the track body can better assist the conveying of the silicon wafer body, reduce the fragmentation rate and ensure the efficient conveying of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the three-dimensional structure of the silicon wafer guide column of the utility model;

[0017] Figure 3This is a front view of the adjustment mechanism of the utility model;

[0018] Figure 4 It is a top view of the synchronous belt with bosses of the utility model.

[0019] Description of reference numerals:

[0020] 1. Silicon wafer body; 2. Silicon wafer guide column; 3. Synchronous belt with boss; 4. Driving servo motor; 5. Adjustment mechanism; 6. Track body. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0022] The utility model provides Figure 1-4 A contactless silicon wafer transmission angle adjustment track is shown, comprising a silicon wafer body 1, a silicon wafer guide column 2, a synchronous belt with a boss 3, a driving servo motor 4, an adjustment mechanism 5, and a track body 6. The silicon wafer body 1 is evenly placed on the synchronous belt with a boss 3, the synchronous belt with a boss 3 is driven by the driving servo motor 4, the synchronous belt with a boss 3 is arranged between the track bodies 6, and the track bodies 6 are provided with silicon wafer guide columns 2 and an adjustment mechanism 5.

[0023] By utilizing the point contact between the synchronous belt 3 with bosses and the bottom of the silicon wafer body 1 and the silicon wafer guide columns 2 on both sides of the track body 6, the positions of multiple silicon wafer bodies 1 can be adjusted to ensure smooth transportation of the silicon wafer bodies 1, and the angle of transportation of the silicon wafer bodies 1 can also be adjusted.

[0024] There are multiple groups of silicon wafer guide columns 2, which are evenly arranged on the side of the track body 6. The height of the silicon wafer guide columns 2 is flush with the track body 6. The bottom surface of the silicon wafer body 1 contacts the raised surface of the synchronous belt 3 with bosses. The width of the silicon wafer body 1 matches the distance between the track body 6. The synchronous belt 3 with bosses is evenly fixed with bosses, and the distances between adjacent bosses are equal. There are two synchronous belts 3 with bosses, and both of them are driven by a driving servo motor 4.

[0025] A plurality of silicon wafer guide pillars 2 are used to adjust the position of the silicon wafer body 1 during the conveying process and ensure smooth conveying. During the conveying process, the position of the silicon wafer guide pillars 2 is always kept in the middle without deviation.

[0026] The adjustment mechanism 5 is a standard part. Manually rotating the angle of the hinge will lift or sink the middle of the track body 6 on both sides. The track body 6 consists of two sets of double tracks. The distance between the two sets of double tracks is equal. Silicon wafer guide columns 2 are set on the opposite sides of the double tracks.

[0027] The adjustment mechanism 5 can be conveniently installed in the track body 6 to adjust the conveying angle of the silicon wafer body 1 in the track body 6, better cooperate with the guidance of the silicon wafer guide column 2 on the side, and have higher conveying efficiency.

[0028] Working principle of this utility model:

[0029] Refer to the instruction manual Figure 1-3 When using the utility model, first, the silicon wafer body 1 enters the track body 6 through the front-end wafer launcher, drives the servo motor 4 to electrically drive the synchronous belt 3 with bosses to rotate, and the synchronous belt 3 with bosses hooks the silicon wafer body 1 suspended on the non-contact track and transmits it along the conveying direction of the synchronous belt;

[0030] Refer to the instruction manual Figure 3-4 When using the utility model, by manually adjusting the tilting or sinking angle position of the adjustment mechanism 5, the silicon wafer body 1 suspended on the contactless track is attached to the silicon wafer guide column 2 on the side of the silicon wafer due to gravity during the transportation process, thereby correcting the position of the silicon wafer body 1, reducing the transmission fragmentation rate of the silicon wafer body 1, and improving the accuracy of the rear-end vacuum suction cup in sucking the silicon wafer body 1, better meeting the overall processing technology.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0032] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A contactless silicon wafer transmission angle adjustment track, comprising a silicon wafer body (1), a silicon wafer guide column (2), a synchronous belt with a boss (3), a driving servo motor (4), an adjustment mechanism (5), and a track body (6), characterized in that: The silicon wafer body (1) is evenly placed on a synchronous belt with a boss (3), the synchronous belt with a boss (3) is driven by a driving servo motor (4), the synchronous belt with a boss (3) is arranged between track bodies (6), and the track bodies (6) are provided with silicon wafer guide columns (2) and an adjustment mechanism (5).

2. The contactless silicon wafer transmission angle adjustment track according to claim 1, characterized in that: The silicon wafer guide columns (2) are provided in multiple groups, and the multiple groups of silicon wafer guide columns (2) are evenly arranged on the side of the track body (6), and the height of the silicon wafer guide columns (2) is flush with the track body (6).

3. The contactless silicon wafer transmission angle adjustment track according to claim 2, characterized in that: The bottom surface of the silicon chip body (1) contacts the raised surface on the synchronous belt (3) with a boss, and the width of the silicon chip body (1) matches the distance between the track bodies (6).

4. The contactless silicon wafer transmission angle adjustment track according to claim 1, characterized in that: The synchronous belt with bosses (3) is evenly and fixedly provided with bosses, and the distances between adjacent bosses are equal. Two synchronous belts with bosses (3) are provided, and the two synchronous belts with bosses (3) are driven by a driving servo motor (4).

5. The contactless silicon wafer transmission angle adjustment track according to claim 1, characterized in that: The adjustment mechanism (5) is a standard part, and the middle of the track body (6) on both sides can be lifted or sunken by manually rotating the angle of the hinge.

6. The contactless silicon wafer transmission angle adjustment track according to claim 3, characterized in that: The track body (6) is composed of two groups of double tracks, the distance between the two groups of double tracks is equal, and silicon wafer guide pillars (2) are arranged on opposite sides of the double tracks.

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