ITO thin film deposition device
By setting a movable soft indenter on the pallet surface of the ITO film deposition device to fix the substrate, the problem of shaking of the substrate during the deposition process is solved, and the deposition quality and stability are improved.
Patent Information
- Application Number
- CN202420928735.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In the existing ITO film deposition technology, the substrate may shake between the pallet during rotation, affecting the deposition effect.
An ITO film deposition device is designed, and a soft press head that can be moved up and down is provided on the surface of the tray. The soft press head is used to fix the substrate by extrusion of the internal mechanism to maintain the stability of the substrate.
By fixing the substrate, the quality and stability of ITO film deposition are improved, the shaking during the deposition process is reduced, and the overall deposition effect is improved.
Smart Images

Figure CN222700394U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of ITO thin film deposition technology, and specifically relates to an ITO thin film deposition apparatus. Background Technology
[0002] Indium tin oxide (ITO) thin film is an N-type oxide semiconductor. Because it uses tin and oxygen as donors, it maintains stable conductivity and visible light transmittance at room temperature. Furthermore, its high mechanical hardness and good chemical stability make it a commonly used thin film material in heterojunction solar cells. ITO thin film deposition using vacuum evaporation deposition technology first involves a heating evaporation process, a phase transition from the condensed phase to the gaseous phase. Since each evaporated substance has a different saturated vapor pressure at different temperatures, the composition changes during evaporation, with some components entering the evaporation space as gas or vapor.
[0003] In existing technologies, the substrate is usually placed inside a vacuum chamber, and a motor drives the substrate to rotate slowly during the deposition process. However, the substrate is usually directly facing the surface of the tray, which means that the substrate and the tray may shake during the rotation, affecting the deposition effect. Utility Model Content
[0004] To address the problems existing in the prior art, the purpose of this utility model is to provide an ITO thin film deposition apparatus that can achieve the following: a soft pressure head that can move up and down is provided on the surface of the tray. After the tray enters the vacuum chamber, the soft pressure head is squeezed by the internal mechanism to fix the substrate, thereby maintaining the stability of the substrate installation.
[0005] To achieve the above objectives, this utility model provides the following technical solution:
[0006] An ITO thin film deposition apparatus includes a worktable and a substrate. A control console is disposed on one side of the upper surface of the worktable, and a vacuum chamber is fixed on the other side of the upper surface of the worktable. The top of the vacuum chamber is open. Hydraulic lifting mechanisms are symmetrically arranged on both sides of the vacuum chamber. Lifting covers are fixed to the output ends of the two hydraulic lifting mechanisms and are positioned above the vacuum chamber. A particle emitter is disposed below the vacuum chamber, and an ITO target is disposed inside the vacuum chamber, positioned directly above the particle emitter. A motor is disposed on the top of the lifting covers. The motor output end is provided with a rotating shaft, which passes through the lifting cover. A rotating disk is provided on the surface of the rotating shaft, and the rotating disk is adapted to the internal size of the vacuum chamber opening. A tray is provided at the bottom of the rotating shaft, and mounting grooves are evenly opened on the surface of the tray. The substrate is placed inside the mounting groove. Protrusions are evenly arranged on the surface of the rotating shaft, and each protrusion corresponds to a mounting groove. A sliding rod slides vertically through the inner side of the protrusion. A pressure plate is horizontally arranged at the bottom of the sliding rod. A soft pressure head is provided on the lower surface of the end of the pressure plate away from the sliding rod. The soft pressure head is suspended above the mounting groove.
[0007] Furthermore, the rotating disk has uniformly provided mounting holes on its side surface, and an extrusion head slides through the inner side of the mounting holes, with the end of the extrusion head being hemispherical.
[0008] Furthermore, an extension rod is provided at one end of the extrusion head near the rotating shaft, and the extension rod passes through the mounting hole.
[0009] Furthermore, a spring is sleeved on the surface of the extension rod, the spring is placed inside the mounting hole, and one end of the spring is in contact with the end surface of the extrusion head.
[0010] Furthermore, a connecting rod is hinged to the end of the extension rod away from the extrusion head, and the connecting rod is hinged to the top of the slide rod at the end away from the extension rod.
[0011] Furthermore, a vacuum pump is installed on one side of the vacuum chamber.
[0012] Furthermore, an observation window is provided on the front side of the vacuum chamber.
[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: the substrate is placed one by one in the mounting groove on the surface of the tray, and the top lifting cover is moved by the hydraulic mechanism, which then moves the tray down into the vacuum chamber. After it moves into place, the soft pressure head above the tray can be moved down by the internal mechanism to squeeze the substrate, keep the substrate stable, and thus improve the deposition quality. Conversely, after the work is completed, the tray is moved up, and the soft pressure head will also move up automatically and be suspended above the substrate for easy material removal. Attached Figure Description
[0014] Figure 1This is a three-dimensional structural diagram of the present invention;
[0015] Figure 2 This is a longitudinal front sectional view of the present invention.
[0016] Figure 3 For the present utility model Figure 2 A magnified structural diagram of area A.
[0017] The attached diagram lists the components represented by each number as follows:
[0018] 1. Workbench; 2. Control console; 3. Vacuum chamber; 4. Observation window; 5. Hydraulic lifting mechanism; 6. Lifting cover; 7. Vacuum pump; 8. ITO target; 9. Particle emitter; 10. Motor; 11. Rotary disk; 12. Rotating shaft; 13. Tray; 14. Mounting slot; 15. Substrate; 16. Protrusion; 17. Slide rod; 18. Pressure plate; 19. Soft pressure head; 20. Mounting hole; 21. Extrusion head; 22. Spring; 23. Extension rod; 24. Connecting rod. Detailed Implementation
[0019] To make the objectives and advantages of this utility model clearer, the following detailed description is provided in conjunction with embodiments. It should be understood that the following text is merely used to describe one or more specific embodiments of this utility model and does not strictly limit the scope of protection specifically claimed by this utility model.
[0020] Please refer to Figures 1-3 As shown, an ITO thin film deposition apparatus includes a worktable 1 and a substrate 15. A control console 2 is provided on one side of the upper surface of the worktable 1 to control multiple units externally. A vacuum chamber 3 is fixed on the other side of the upper surface of the worktable 1. The top of the vacuum chamber 3 is open. Hydraulic lifting mechanisms 5 are symmetrically arranged on both sides of the vacuum chamber 3. Lifting covers 6 are fixed to the output ends of the two hydraulic lifting mechanisms 5. The lifting covers 6 are placed above the vacuum chamber 3. The lifting covers 6 can be lowered to seal the top of the vacuum chamber 3, so that a sealed space is formed inside the vacuum chamber 3. A particle emitter 9 is provided at the bottom inside the vacuum chamber 3. An ITO target 8 is provided inside the vacuum chamber 3 and is placed directly above the particle emitter 9. A vacuum pump 7 is provided on one side of the vacuum chamber 3 to extract the gas inside the vacuum chamber 3. An observation window 4 is provided on the front side of the vacuum chamber 3 to facilitate external observation of the deposition situation inside the vacuum chamber 3.
[0021] Please refer to Figure 2 and Figure 3As shown, a motor 10 is installed at the top of the lifting cover 6, and a rotating shaft 12 is installed at the output end of the motor 10. The rotating shaft 12 passes through the lifting cover 6, and a rotating disk 11 is installed on the surface of the rotating shaft 12. The rotating disk 11 is adapted to the internal size of the opening of the vacuum chamber 3. The size of the rotating disk 11 is slightly smaller than the top of the vacuum chamber 3 to prevent obstruction during rotation. A tray 13 is installed at the bottom of the rotating shaft 12. The surface of the tray 13 is evenly provided with mounting grooves 14. The mounting grooves 14 are stepped through holes. The substrate 15 is placed inside the mounting grooves 14 to achieve the support of the substrate. During the synchronous deposition of the substrate 15, the surface of the rotating shaft 12 is uniformly provided with protrusions 16, which correspond one-to-one with the mounting groove 14. A slide rod 17 slides vertically through the inner side of the protrusion 16. The protrusions 16 are used to ensure that the slide rod 17 can only slide in the vertical direction. A pressure plate 18 is provided horizontally at the bottom of the slide rod 17. A soft pressure head 19 is provided on the lower surface of the end of the pressure plate 18 away from the slide rod 17. The soft pressure head 19 is suspended above the mounting groove 14. When the slide rod 17 moves down, the soft pressure head 19 can press down and fix the substrate 15.
[0022] The rotating disk 11 has uniformly opened mounting holes 20 on its side surface. The mounting holes 20 are opened horizontally, and the extrusion head 21 slides through the inner side of the mounting hole 20. The end of the extrusion head 21 is hemispherical. The hemispherical structure can be squeezed by the inner wall of the vacuum chamber 3 when the rotating disk 11 moves down, so as to drive the extrusion head 21 to contract inside the mounting hole 20.
[0023] Please refer to Figure 3 As shown, an extension rod 23 is provided at one end of the extrusion head 21 near the rotating shaft 12. The extension rod 23 passes through the mounting hole 20. A spring 22 is sleeved on the surface of the extension rod 23. The spring 22 is placed inside the mounting hole 20. One end of the spring 22 is in contact with the end surface of the extrusion head 21. The elastic force of the spring 22 causes the extrusion head 21 to extend beyond the side surface of the rotating disk 11, so that the soft pressure head 19 is suspended above the mounting groove 14 for easy loading and unloading. A connecting rod 24 is hinged to the end of the extension rod 23 away from the extrusion head 21. The end of the connecting rod 24 away from the extension rod 23 is hinged to the top of the slide rod 17. The connection direction of the connecting rod 24 is such that when the extrusion head 21 moves inward, it can drive the slide rod 17 to move downward, thereby driving the soft pressure head 19 to press down and fix the substrate 15.
[0024] The working principle of this utility model is as follows: The lifting cover 6 is moved up and down by the hydraulic lifting mechanism 5 on both sides to control whether the top of the vacuum chamber 3 is open. The ITO target material 8 is placed above the particle emitter 9. When the lifting cover 6 is at its highest position, multiple substrates 15 to be processed can be placed inside the mounting groove 14. At the same time, due to the presence of the spring 22, the pressure plate 18 is placed at its highest position. Conversely, during operation, the lifting cover 6 is moved down by the hydraulic lifting mechanism 5 to seal the opening at the top of the vacuum chamber 3. Then, the vacuum pump 7... The vacuum chamber 3 is evacuated. When the lifting cover 6 is at its lowest position, the rotating disk 11 will be placed inside the vacuum chamber 3. At this time, the extrusion head 21 will be extruded and move into the mounting hole 20, thereby driving the extension rod 23 to move in the direction of the rotating shaft 12. The connecting rod 24 drives multiple sliding rods 17 to move down. The presence of the protrusion 16 makes the sliding rods 17 only able to move in the vertical direction. When the sliding rods 17 move down, they can drive the pressure plate 18 to move down. The soft pressure head 19 presses down and fixes the substrate 15 to ensure the stability of the substrate 15.
[0025] The above description is merely a preferred embodiment of this utility model. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications should also be considered within the scope of protection of this utility model. Structures, devices, and operating methods not specifically described or explained in this utility model, unless otherwise specified or limited, shall be implemented using conventional methods in the field.
Claims
1. An ITO thin film deposition device, comprising a workbench (1) and a substrate (15), wherein a control console (2) is provided on one side of the upper surface of the workbench (1), and a vacuum chamber (3) is fixed on the other side of the upper surface of the workbench (1), wherein the top of the vacuum chamber (3) is open, and wherein: Hydraulic lifting mechanisms (5) are symmetrically arranged on both sides of the vacuum chamber (3); lifting covers (6) are fixed at the output ends of the two hydraulic lifting mechanisms (5); the lifting covers (6) are placed above the vacuum chamber (3); a particle emitter (9) is arranged at the bottom of the vacuum chamber (3); an ITO target material (8) is arranged inside the vacuum chamber (3); the ITO target material (8) is placed directly above the particle emitter (9); a motor (10) is arranged on the top of the lifting cover (6); a rotating shaft (12) is arranged at the output end of the motor (10); the rotating shaft (12) passes through the lifting cover (6); a rotating disk (11) is arranged on the surface of the rotating shaft (12); the rotating disk (11) is adapted to the open internal dimensions of the vacuum chamber (3), a tray (13) is arranged at the bottom of the rotating shaft (12), a mounting groove (14) is evenly opened on the surface of the tray (13), the substrate (15) is placed inside the mounting groove (14), and bumps (16) are evenly arranged on the surface of the rotating shaft (12), the bumps (16) correspond one to one with the mounting grooves (14), a slide bar (17) is vertically slidably penetrated on the inner side of the bumps (16), a pressure plate (18) is horizontally arranged at the bottom of the slide bar (17), a soft pressure head (19) is arranged on the lower surface of one end of the pressure plate (18) away from the slide bar (17), and the soft pressure head (19) is suspended above the mounting groove (14).
2. An ITO thin film deposition device according to claim 1, characterized in that: The side surface of the rotating disk (11) is evenly provided with mounting holes (20), and an extrusion head (21) is slidably penetrated inside the mounting hole (20), and the end of the extrusion head (21) is hemispherical.
3. An ITO thin film deposition device according to claim 2, characterized in that: An extension rod (23) is provided at one end of the extrusion head (21) close to the rotating shaft (12), and the extension rod (23) passes through the mounting hole (20).
4. The ITO thin film deposition device according to claim 3, characterized in that: A spring (22) is sleeved on the surface of the extension rod (23), the spring (22) is placed inside the mounting hole (20), and one end of the spring (22) is in contact with the end surface of the extrusion head (21).
5. An ITO thin film deposition device according to claim 4, characterized in that: One end of the extension rod (23) facing away from the extrusion head (21) is hingedly connected to a connecting rod (24), and one end of the connecting rod (24) facing away from the extension rod (23) is hingedly connected to the top of the sliding rod (17).
6. The ITO thin film deposition device according to claim 1, characterized in that: A vacuum pump (7) is provided on one side of the vacuum chamber (3).
7. The ITO thin film deposition device according to claim 1, characterized in that: An observation window (4) is provided on the front side of the vacuum chamber (3).