Anti-pollution anode for target center of magnetron sputtering
By adding anti-pollution anode in the center of the target material of the magnetron sputtering equipment, the problem of easy contamination in the center of the target material is solved, and a purer and stable film result is achieved, and the old equipment can be modified at low cost.
Patent Information
- Application Number
- CN202420871040.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-25
AI Technical Summary
In the magnetron sputtering vacuum coating process, the center position of the target material is easily contaminated and damaged due to long-term use, resulting in high-pressure discharge and pollutants entering the film, affecting the purity and defect-freeness of the film.
A central anti-pollution anode for magnetron sputtering target is designed. By adding a central anode to the anode body and fixing it to the target through a connecting tube and a mounting mechanism, the anode area on the target surface is increased, glow discharge is promoted, and the film is protected by water cooling.
It effectively prevents contamination in the center of the target material, improves the purity and stability of the film, extends the anode replacement cycle, and can transform and upgrade old equipment at low cost.
Smart Images
Figure CN222700397U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of magnetron sputtering, in particular to a central anti-pollution anode for a target material used for magnetron sputtering. Background Art
[0002] In the magnetron sputtering vacuum coating process, since the material particles coming out of the target surface have a certain divergence angle, and the material particles moving toward the substrate have a certain probability of colliding with the gas molecules between the target and the substrate, thereby changing the direction of movement, this will cause a part of the material particles that have been sputtered to move in the opposite direction and adhere to the target surface. The reversely attached particles in the etching track area will be sputtered again, and the material particles in the non-etching area will not be sputtered again, so they will gradually accumulate to form a dirty area on the target surface, especially the dirty area in the center of the target. Due to the loose structure of the covering, it is easy to oxidize and cause poor charge conduction. This can easily form local charge accumulation in the center, causing high-voltage discharge and thus generating pollutants into the film. This shortcoming seriously affects the application of magnetron sputtering in high-purity defect-free films. For this reason, we proposed a center-anti-pollution anode for magnetron sputtering targets to solve the above problems. Utility Model Content
[0003] The utility model aims to provide a center-contamination-proof anode for a target material for magnetron sputtering, so as to solve the problem in the background technology that the center position of the target material may be contaminated and damaged after long-term use.
[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a target center anti-pollution anode for magnetron sputtering, comprising an anode body, wherein the target is arranged in the anode body,
[0005] An etching area is arranged on the upper side of the target material, a central anode is arranged on the anode body, two ends of the central anode are fixedly connected with connecting tubes, and one end of the connecting tube is arranged on the anode body;
[0006] A mounting mechanism, the mounting mechanism is arranged on the connecting pipe, and the mounting mechanism fixes the central anode on the anode body;
[0007] A supporting mechanism is provided on the connecting pipe and is used to increase the rigidity of the connecting pipe.
[0008] Preferably, the central anode is located at the center of the upper side of the target material, and the connecting tube is in a U-shape protruding upward.
[0009] Preferably, the connecting tube is a hollow tube, a flow groove is provided at the center position of the central anode, the flow groove is connected to the connecting tube, and a water injection port is provided at the center position of the upper end of the connecting tube.
[0010] Preferably, a fixing ring is fixedly mounted on the water injection port, a connecting ring is fixedly mounted on the fixing ring, a water inlet plug is fixedly mounted on the connecting ring, and the water inlet plug is arranged in the upper end of the water injection port.
[0011] Preferably, the mounting mechanism includes a bonding plate, which is fixedly mounted at one end of the connecting tube, the shape of the bonding plate is adapted to the shape of the upper side of the anode body, a pressure plate is rotatably mounted on the bonding plate, a rotating shaft is provided at the rotating connection between the bonding plate and the pressure plate, and a torsion spring is provided on the rotating shaft.
[0012] Preferably, the supporting mechanism comprises a pressure reducing block, the pressure reducing block is fixedly mounted on the connecting pipe, the left and right sides of the pressure reducing block are fixedly mounted on the left and right ends of the connecting pipe, and the upper end of the pressure reducing block is fixedly mounted on the upper end of the connecting pipe.
[0013] Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model increases the anode area on the target surface by adding a central anode, which makes it easier for the target to produce glow discharge. By matching the diameter of the non-sputtering area in the center of the target, the anode part in the center of the target can completely cover the non-sputtering area in the center of the target, thereby protecting the target as a whole, so that the pollution of reverse-attached particles generated during the entire sputtering process only occurs on the anode surface, so that only a purer film than before can be obtained by regularly replacing the anode, and the stability of the film quality within each cleaning cycle can be maintained. The central anode is water-cooled to prevent the film attached to it from falling off due to high temperature stress, thereby increasing the single-use time. This design can be achieved by adding a central anode to the original anode, so that old equipment can be upgraded at a low cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a schematic diagram of the structural cross section of the central anode of the utility model;
[0017] Figure 3 For this utility model Figure 2 A is a partial enlarged schematic diagram;
[0018] Figure 4For this utility model Figure 2 A partial enlarged schematic diagram of B in the figure.
[0019] In the figure: 1. anode body; 2. target material; 3. etching area; 4. central anode; 5. connecting pipe; 6. circulation slot; 7. water inlet; 8. fixing ring; 9. connecting ring; 10. water inlet plug; 11. bonding plate; 12. pressure plate; 13. rotating shaft; 14. torsion spring; 15. pressure relief block. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-4 The utility model provides an embodiment: a target center anti-pollution anode for magnetron sputtering, comprising an anode body 1, a target material 2 is arranged in the anode body 1,
[0022] An etching area 3 is provided on the upper side of the target material 2, a central anode 4 is provided on the anode body 1, both ends of the central anode 4 are fixedly connected with connecting tubes 5, and one end of the connecting tube 5 is provided on the anode body 1;
[0023] A mounting mechanism, which is disposed on the connecting pipe 5 and which fixes the central anode 4 on the anode body 1;
[0024] Support mechanism, the support mechanism is arranged on the connecting tube 5, and the support mechanism is used to increase the rigidity of the connecting tube 5. The device increases the anode area on the target surface by arranging the central anode 4, so that it is easier for the target to generate glow discharge. By matching the diameter of the non-sputtering area in the center of the target, the central anode 4 of the target can completely cover the non-sputtering area in the center of the target, thereby protecting the target as a whole. Moreover, this can be achieved by adding the central anode 4 to the original anode, so that the old equipment can be upgraded at a low cost;
[0025] Furthermore, the central anode 4 is located at the center of the upper side of the target 2, and the connecting tube 5 is a U-shaped protrusion, such as Figure 1 As shown, this structure enables the central anode 4 to be stably placed on the anode body 1 and operate normally, thereby increasing the stability of the device during use.
[0026] Furthermore, the connecting tube 5 is a hollow tube, a flow slot 6 is provided at the center of the central anode 4, the flow slot 6 is connected to the connecting tube 5, and a water injection port 7 is provided at the center of the upper end of the connecting tube 5. Figure 1 and Figure 3 As shown, this structure allows the central anode 4 to be water-cooled, so that the film attached thereto will not fall off due to high temperature stress, thereby increasing the single use time.
[0027] Further, a fixing ring 8 is fixedly installed on the water injection port 7, a connecting ring 9 is fixedly installed on the fixing ring 8, a water inlet plug 10 is fixedly installed on the connecting ring 9, and the water inlet plug 10 is arranged in the upper end of the water injection port 7, such as Figure 3 As shown, this structure allows the water inlet plug 10 to be easily closed, thereby increasing the convenience of using the device.
[0028] Furthermore, the mounting mechanism includes a bonding plate 11, which is fixedly mounted on one end of the connecting tube 5, and the shape of the bonding plate 11 is adapted to the shape of the upper side of the anode body 1. A pressing plate 12 is rotatably mounted on the bonding plate 11, and a rotating shaft 13 is provided at the rotating connection between the bonding plate 11 and the pressing plate 12, and a torsion spring 14 is provided on the rotating shaft 13. Figure 2 and Figure 4 As shown, this structure enables the central anode 4 to be stably mounted on the anode body 1, thereby increasing the stability of the device during use.
[0029] Further, the support mechanism includes a pressure relief block 15, the pressure relief block 15 is fixedly mounted on the connecting pipe 5, the left and right sides of the pressure relief block 15 are fixedly mounted on the left and right ends of the connecting pipe 5, and the upper end of the pressure relief block 15 is fixedly mounted on the upper end of the connecting pipe 5, such as Figure 2 As shown, this structure prevents the connecting pipe 5 from being easily deformed, so that the connecting pipe 5 can be used for a long time.
[0030] Working principle: The anode body 1 is added with a central anode 4, which is connected with a connecting tube 5 to fix the central anode 4 with the anode body 1 around the target 2, so that the central anode 4 can be parallel to the surface of the target 2 and maintain a gap of two to three millimeters to suppress discharge. In addition, we use the connecting tube 5 as a connector to fix the central anode 4 and the anode body 1. Water flows in the tube to ensure timely cooling of the central anode 4, so that the film attached to it will not fall off due to high temperature stress, which greatly increases the replacement cycle of the anode body 1. When installing the central anode 4, the pressure plate 12 is unfolded in opposite directions. At this time, the torsion spring 14 accumulates force, and then the bonding plate 11 is closed on the anode body 1, and then the pressure plate 12 is released to make it bond with the outer surface of the anode body 1. When injecting water, take out the water inlet plug 10 and inject water through the water injection port 7. The above is the entire working principle of the utility model.
[0031] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.
Claims
1. A target center anti-pollution anode for magnetron sputtering, comprising an anode body (1), wherein a target material (2) is arranged in the anode body (1), Features: An etching area (3) is provided on the upper side of the target material (2), a central anode (4) is provided on the anode body (1), both ends of the central anode (4) are fixedly connected to connecting tubes (5), and one end of the connecting tube (5) is provided on the anode body (1); A mounting mechanism, the mounting mechanism being arranged on the connecting pipe (5), and the mounting mechanism fixing the central anode (4) on the anode body (1); A supporting mechanism, wherein the supporting mechanism is arranged on the connecting pipe (5), and the supporting mechanism is used to increase the rigidity of the connecting pipe (5).
2. The center-contamination-proof anode for a magnetron sputtering target according to claim 1, characterized in that: The central anode (4) is located at the center of the upper side of the target material (2), and the connecting tube (5) is in a U-shape that protrudes upward.
3. The center-contamination-proof anode for a magnetron sputtering target according to claim 1, characterized in that: The connecting pipe (5) is a hollow pipe, a flow groove (6) is provided at the center of the central anode (4), the flow groove (6) is connected to the connecting pipe (5), and a water injection port (7) is provided at the center of the upper end of the connecting pipe (5).
4. The center-contamination-proof anode for a magnetron sputtering target according to claim 3, characterized in that: A fixing ring (8) is fixedly mounted on the water injection port (7), a connecting ring (9) is fixedly mounted on the fixing ring (8), a water inlet plug (10) is fixedly mounted on the connecting ring (9), and the water inlet plug (10) is arranged in the upper end of the water injection port (7).
5. The center-contamination-proof anode for a magnetron sputtering target according to claim 1, characterized in that: The mounting mechanism comprises a bonding plate (11), wherein the bonding plate (11) is fixedly mounted on one end of the connecting tube (5), wherein the shape of the bonding plate (11) is adapted to the shape of the upper side of the anode body (1), wherein a pressure plate (12) is rotatably mounted on the bonding plate (11), wherein a rotating shaft (13) is provided at the rotating connection between the bonding plate (11) and the pressure plate (12), wherein a torsion spring (14) is provided on the rotating shaft (13).
6. The center-contamination-proof anode for a magnetron sputtering target according to claim 1, characterized in that: The support mechanism comprises a pressure reducing block (15), the pressure reducing block (15) being fixedly mounted on the connecting pipe (5), the left and right sides of the pressure reducing block (15) being fixedly mounted on the left and right ends of the connecting pipe (5), and the upper end of the pressure reducing block (15) being fixedly mounted on the upper end of the connecting pipe (5).