A fast unlocking fingerprint module and fingerprint electronic device

Abstract

A fast-unlocking fingerprint module and fingerprint electronic device, the fingerprint module includes: a fingerprint recognition component, which is used to collect fingerprint unlocking information, read the fingerprint entry information in the buffer for comparison, and identify the fingerprint recognition information in the first data format; an acceleration module, including a buffer and a signal converter; the buffer is used to store the fingerprint entry information; the signal converter is used to convert the fingerprint recognition information in the first data format into a second data format; and the unlocking efficiency using the second data format is higher than the unlocking efficiency using the first data format; FPC, which is used to transmit the fingerprint recognition information in the first data format from the fingerprint recognition component to the acceleration module, and transmit the fingerprint recognition information in the second data format to the opposite system mainboard. In this way, the fingerprint recognition unlocking time can be effectively shortened, the recognition unlocking efficiency can be improved, and the user needs can be further met. For intensive application scenarios, such as fingerprint clocking machines, the effect is particularly prominent.

Description

Technical Field

[0001] The present application relates to the field of biometric identification technology, and in particular to a fingerprint module and fingerprint electronic device for fast unlocking. Background Art

[0002] Fingerprint modules are widely used in various scenarios, such as mobile phones, door locks, fingerprint time clocks and other electronic products. Conventional fingerprint modules take about 1 second from fingerprint recognition to unlocking, and users usually hope that the unlocking response is as fast as possible, especially for some special scenarios, such as fingerprint clocking in during rush hour, which can easily cause congestion for employees, and the need to speed up fingerprint recognition and unlocking time is particularly prominent.

[0003] Based on this, how to design a fingerprint module for fast unlocking and improve recognition and unlocking efficiency has become an urgent problem to be solved. Summary of the invention

[0004] In order to solve at least one problem existing in the prior art, the purpose of this application is to provide a fast-unlocking fingerprint module and fingerprint electronic device, which can effectively shorten the fingerprint recognition and unlocking time, improve the recognition and unlocking efficiency, and further enhance the user experience. For intensive application scenarios, such as fingerprint clocking machines, the effect is particularly prominent.

[0005] To achieve the above purpose, the fingerprint module for fast unlocking provided by this application includes:

[0006] A fingerprint recognition component is used to collect fingerprint unlocking information, read the fingerprint entry information in the buffer for comparison, and identify the fingerprint recognition information in the first data format;

[0007] The acceleration module includes a buffer and a signal converter; the buffer is used to store the fingerprint entry information; the signal converter is used to convert the fingerprint identification information in the first data format into a second data format; wherein the unlocking time using the second data format is shorter than the unlocking time using the first data format;

[0008] The FPC is used to transmit the fingerprint identification information in the first data format from the fingerprint identification component to the acceleration module, and transmit the fingerprint identification information in the second data format to the opposite system mainboard.

[0009] Optionally, the FPC includes,

[0010] The inner stacking portion of the FPC forms a stacking structure with the fingerprint recognition component and forms an electrical connection;

[0011] An FPC extension portion, the acceleration module is connected to the top of the FPC extension portion;

[0012] The FPC connecting portion is connected between the FPC inner overlapping portion and the FPC outer extending portion.

[0013] Further optionally, a first step structure is formed between the acceleration module and the FPC extension portion, and a sealing ring is provided on the first step structure.

[0014] Further optionally, a sealing layer is further provided on the upper surface of the acceleration module, and the sealing layer and the sealing ring form an integral sealing cover structure.

[0015] Further optionally, the sealing layer is a sealing layer made of elastic material.

[0016] Optionally, the fingerprint recognition component includes:

[0017] A fingerprint sensing chip is welded on the upper surface of the inner overlapped portion of the FPC and is used to collect and identify fingerprint information;

[0018] An insulating cover plate, covering the upper surface of the fingerprint sensing chip and fixedly connected to the fingerprint sensing chip;

[0019] A conductive outer ring is sleeved on the outer periphery of the fingerprint sensing chip and the insulating cover plate, is fixedly connected to the insulating cover plate, and is electrically connected to the ground terminal of the FPC;

[0020] A reinforcing sheet is positioned below the inner overlapped portion of the FPC and is used to reinforce the fingerprint recognition component.

[0021] Further optionally, the thickness of the reinforcing sheet is greater than twice the thickness of the FPC; the outer edge of the reinforcing sheet and the FPC connecting portion form a second step structure, and a bending buffer glue is further provided on the second step structure.

[0022] Optionally, the FPC connecting portion is a FPC section that has been softened.

[0023] Optionally, the first data format is an integrated circuit bus IIC format, and the second data format is a serial peripheral interface SPI format.

[0024] To achieve the above-mentioned purpose, the present application also provides a fingerprint electronic device, including: the fingerprint module for quick unlocking as described above.

[0025] The present application discloses a fast-unlocking fingerprint module and fingerprint electronic device, which collects fingerprint unlocking information through a fingerprint recognition component, reads the fingerprint entry information in a buffer for comparison, and identifies the fingerprint recognition information in a first data format; and configures an acceleration module including a buffer and a signal converter, so that on the one hand, a buffer is used to store the fingerprint entry information, and the fingerprint entry information does not need to be stored inside the chip of the fingerprint recognition component, which can effectively reduce the chip load and thus shorten the fingerprint recognition unlocking time; on the other hand, a signal converter is used to convert the fingerprint recognition information in the first data format into a second data format with a higher recognition unlocking speed, further shortening the fingerprint recognition unlocking time. As a result, the recognition unlocking efficiency can be effectively improved, and the user experience can be enhanced. In particular, for intensively used application scenarios, such as fingerprint clocking machines, the effect is particularly prominent. In addition, the fast-unlocking fingerprint module has a long service life.

[0026] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or may be understood by practicing the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The accompanying drawings are used to provide a further understanding of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings:

[0028] Figure 1 A top view of a fingerprint module for quick unlocking according to an embodiment of the present application;

[0029] Figure 2 for Figure 1 AA cross-section of the fingerprint module for quick unlocking;

[0030] Figure 3 for Figure 1 Communication diagram of fingerprint module for quick unlocking;

[0031] Figure 4 The structure block diagram of the fingerprint electronic device according to the embodiment of the present application.

[0032] Specifically, the following reference numerals are included:

[0033] Fingerprint module-100;

[0034] Fingerprint recognition component-20; fingerprint sensor chip-21; insulating cover plate-22; conductive outer ring-23; reinforcement sheet-24;

[0035] Acceleration module-30; Sealing cover overall structure-31;

[0036] FPC-40; FPC inner overlapping part-41; FPC outer extension part-42; FPC connecting part-43; FPC interface end-44; bending buffer glue-45. DETAILED DESCRIPTION

[0037] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be construed as being limited to the embodiments described herein. Instead, these embodiments are provided to provide a more thorough and complete understanding of the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not intended to limit the scope of protection of the present application.

[0038] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0039] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0040] Combination Figure 1-3 As shown, the fast unlocking fingerprint module 100 includes: a fingerprint recognition component 20, an acceleration module 30 and an FPC 40 (Flexible Printed Circuit).

[0041] The fingerprint recognition component 20 is used to collect fingerprint unlocking information, read the fingerprint entry information in the buffer for comparison, and recognize the fingerprint recognition information in the first data format.

[0042] The acceleration module 30 includes a buffer and a signal converter (not shown in the figure). The buffer is used to store fingerprint entry information; the signal converter is used to convert fingerprint identification information in a first data format into a second data format.

[0043] The unlocking time using the second data format is shorter than the unlocking time using the first data format. In a specific example, the first data format may be an IIC (Inter-Integrated Circuit) format, and the second data format may be an SPI (Serial Peripheral interface) format.

[0044] The FPC 40 is used to transmit the fingerprint identification information in the first data format from the fingerprint identification component 20 to the acceleration module 30, and transmit the fingerprint identification information in the second data format to the opposite end system mainboard.

[0045] According to the fast unlocking fingerprint module 100 provided in the embodiment of the present application, the fingerprint unlocking information is collected through the fingerprint recognition component 20, and the fingerprint entry information in the buffer is read for comparison to identify the fingerprint recognition information in the first data format; and by configuring the acceleration module 30 including the buffer and the signal converter, on the one hand, the buffer is used to store the fingerprint entry information, and the fingerprint entry information does not need to be stored inside the chip of the fingerprint recognition component 20, which can effectively reduce the chip load and improve the recognition response rate, thereby shortening the fingerprint recognition unlocking time; on the other hand, the signal converter is used to convert the fingerprint recognition information in the first data format into the second data format with a higher recognition unlocking speed, further shortening the fingerprint recognition unlocking time. As a result, the recognition unlocking efficiency can be effectively improved, and the user experience can be enhanced. Especially for intensive application scenarios, such as fingerprint clocking machines, the effect is particularly prominent.

[0046] In the embodiment of the present application, the FPC 40 includes an FPC inner overlap portion 41 , an FPC outer extension portion 42 and an FPC connection portion 43 .

[0047] Among them, the FPC inner overlapping part 41 forms a stacked structure with the fingerprint recognition component 20 and forms an electrical connection; the FPC outer extension part 42 is connected to the acceleration module 30 above; the FPC connecting part 43 is connected between the FPC inner overlapping part 41 and the FPC outer extension part 42.

[0048] Preferably, a first step structure is formed between the acceleration module 30 and the FPC extension 42, and a sealing ring is provided on the first step structure, so that a seal is formed between the acceleration module 30 and the FPC extension 42. As a further preferred embodiment, a sealing layer is also provided on the upper surface of the acceleration module 30, and the sealing layer and the sealing ring constitute a sealing cover overall structure 31. Thus, moisture and oxidation resistance can be achieved through the sealing ring or the sealing cover overall structure 31, which helps to improve the service life of the fingerprint module 100. In a specific example, the sealing structure can be achieved by adding anti-mildew glue or anti-mildew paint.

[0049] Further optionally, the sealing layer is a sealing layer made of elastic material, which can form an anti-collision buffer, and help to further improve the service life of the fingerprint module 100.

[0050] In the embodiment of the present application, the fingerprint recognition component 20 includes: a fingerprint sensing chip 21, an insulating cover plate 22, a conductive outer ring 23 and a reinforcing sheet 24.

[0051] Among them, the fingerprint sensing chip 21, namely LGA (Land Grid Array, grid array package), is welded on the upper surface of the inner overlap portion 41 of the FPC, and is used to collect fingerprint unlocking information, read the fingerprint entry information in the buffer for comparison, and identify the fingerprint recognition information in the first data format. The insulating cover plate 22 covers the upper surface of the fingerprint sensing chip 21 and is fixedly connected to the fingerprint sensing chip 21. The conductive outer ring 23 is sleeved on the outer periphery of the fingerprint sensing chip 21 and the insulating cover plate 22, is fixedly connected to the insulating cover plate 22, and is electrically connected to the ground terminal of the FPC 40. The reinforcement sheet 24 is positioned below the inner overlap portion 41 of the FPC, and is used to reinforce the fingerprint recognition component 20.

[0052] Preferably, the thickness of the reinforcing sheet 24 is greater than twice the thickness of the FPC 40; the outer edge of the reinforcing sheet 24 and the FPC connecting portion 43 form a second step structure, and a bending buffer glue 45 is also provided on the second step structure. In other words, when the FPC 40 is bent at 90 degrees, it is easy to be damaged by the reinforcing sheet 24, so the bending buffer glue 45 is added between the reinforcing sheet 24 and the FPC 40 to protect the FPC 40 from damage, thereby further improving the service life of the fingerprint module 100.

[0053] In the embodiment of the present application, the FPC connection part 43 can be a softened FPC section. That is, the softened FPC connection part 43 is more flexible than the FPC inner overlap part 41 and the FPC outer extension part 42, which can be specifically reflected in a lower amount of internal metal wires, and can also be used to protect the FPC from damage, further improving the service life of the fingerprint module 100.

[0054] Figure 4 FIG. 1 is a structural block diagram of a fingerprint electronic device according to an embodiment of the present application. Figure 2 As shown, the fingerprint electronic device 1000 includes the fingerprint module 100 for quick unlocking in the above embodiment.

[0055] In a specific example, the fingerprint electronic device 1000 may be a fingerprint time clock, a mobile phone, or a door lock.

[0056] It should be noted that in the drawings, the sizes of layers, regions, components and their relative sizes may be exaggerated for clarity. The same or similar reference numerals throughout represent the same or similar components or components with the same or similar functions.

[0057] It should be noted that the concepts such as "first" and "second" mentioned in this application are only used to distinguish different data formats and structures, and are not used to limit the order, interdependence or relative importance of the functions performed by these data formats and structures.

[0058] It should be noted that when a structure or layer is referred to as being "on...", it may be directly on other components or layers, or there may be intervening components or structures. The relationship between structures should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection. It should be noted that the orientation or position relationship indicated by the terms "middle", "peripheral", "upper", "lower", etc. is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0059] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0060] Those skilled in the art can understand that the above are only preferred embodiments of the present application and are not intended to limit the present application. Although the present application is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions recorded in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A fingerprint module for fast unlocking, characterized in that: The fingerprint module comprises: A fingerprint recognition component is used to collect fingerprint unlocking information, read the fingerprint entry information in the buffer for comparison, and identify the fingerprint recognition information in the first data format; The acceleration module includes a buffer and a signal converter; the buffer is used to store the fingerprint entry information; the signal converter is used to convert the fingerprint identification information in the first data format into a second data format; wherein the unlocking time using the second data format is shorter than the unlocking time using the first data format; The FPC is used to transmit the fingerprint identification information in the first data format from the fingerprint identification component to the acceleration module, and to transmit the fingerprint identification information in the second data format to the opposite system mainboard.

2. The fast unlocking fingerprint module according to claim 1, characterized in that: The FPC includes, The inner stacking portion of the FPC forms a stacking structure with the fingerprint recognition component and forms an electrical connection; An FPC extension portion, the acceleration module is connected to the top of the FPC extension portion; The FPC connecting portion is connected between the FPC inner overlapping portion and the FPC outer extending portion.

3. The fast unlocking fingerprint module according to claim 2, characterized in that: A first step structure is formed between the acceleration module and the FPC extension portion, and a sealing ring is provided on the first step structure.

4. The fast unlocking fingerprint module according to claim 3, characterized in that: A sealing layer is also provided on the upper surface of the acceleration module, and the sealing layer and the sealing ring form an integral structure of a sealing cover.

5. The fast unlocking fingerprint module according to claim 4, characterized in that: The sealing layer is a sealing layer made of elastic material.

6. The fast unlocking fingerprint module according to claim 2, characterized in that: The fingerprint recognition component comprises: A fingerprint sensing chip is welded on the upper surface of the inner overlapped portion of the FPC and is used to collect and identify fingerprint information; An insulating cover plate, covering the upper surface of the fingerprint sensing chip and fixedly connected to the fingerprint sensing chip; A conductive outer ring is sleeved on the outer periphery of the fingerprint sensing chip and the insulating cover plate, is fixedly connected to the insulating cover plate, and is electrically connected to the ground terminal of the FPC; A reinforcing sheet is positioned below the inner overlapped portion of the FPC and is used to reinforce the fingerprint recognition component.

7. The fast unlocking fingerprint module according to claim 6, characterized in that: The thickness of the reinforcing sheet is greater than twice the thickness of the FPC; the outer edge of the reinforcing sheet and the FPC connecting portion form a second step structure, and a bending buffer glue is also provided on the second step structure.

8. The fast unlocking fingerprint module according to claim 2, characterized in that: The FPC connecting portion is a FPC section that has been softened.

9. The fast unlocking fingerprint module according to any one of claims 1 to 8, characterized in that: The first data format is an integrated circuit bus IIC format, and the second data format is a serial peripheral interface SPI format.

10. A fingerprint electronic device, characterized in that: include: A fingerprint module for quick unlocking as described in any one of claims 1 to 9.

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