Multipurpose tin planting pad

Abstract

The utility model provides a multipurpose tin planting pad which comprises a pad body, the pad body comprises a first placing face and a second placing face which are arranged back to back, at least two pairs of step sets are arranged on the two sides of the first placing face, and the heights of the step sets are sequentially increased from inside to outside; and symmetrical third step groups are arranged on two sides of the second placing surface. The tin planting pads required by chip tin planting and mainboard tin planting are combined into a whole, the convenience of maintenance personnel can be improved to a great extent, the first placement surface is provided with the two step groups so as to adapt to chips of various sizes and thicknesses, and the compatibility is high.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic manufacturing, and in particular relates to a multi-purpose tin-planting pad. Background Art

[0002] In the field of electronic manufacturing, chip tinning and motherboard tinning technology are the key to ensuring efficient and reliable assembly of electronic components. Chip tinning ensures perfect soldering of chip pins and PCB, enhancing the connection strength; motherboard tinning promotes fast and uniform soldering of components, improving assembly quality and efficiency.

[0003] However, in the prior art, most chip tinning pads have slots of uniform height, without adjustment space, and cannot adapt to chips of different thicknesses. When tinning chips of different thicknesses, they cannot fit perfectly with the steel mesh, resulting in poor tinning effect. There are a small number of tinning pads that have slots of different heights downward from the plane of the pad, but there is still a problem. The size of the slot is limited, and the chip may not be able to fit into the slot because it is too large. Moreover, in the current electronic manufacturing process, the processes of chip tinning and motherboard tinning are usually carried out separately, which means that two different tinning pads need to be used to complete them, which increases the time for staff to switch tools and is relatively cumbersome. If there is a tinning pad that can meet the needs of chip tinning and motherboard tinning at the same time, it will greatly improve the convenience of maintenance personnel. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model proposes a multi-purpose tin planting pad, which integrates the tin planting pads required for chip tin planting and motherboard tin planting into one, and can adapt to chips of various sizes and thicknesses, with strong compatibility.

[0005] The technical solution of the utility model is achieved in this way:

[0006] A multi-purpose tin planting pad comprises a pad body, wherein the pad body comprises a first placement surface and a second placement surface which are arranged back to back, at least two pairs of step groups are arranged on both sides of the first placement surface, and the heights of the step groups are successively increased from the inside to the outside; and symmetrical third step groups are arranged on both sides of the second placement surface.

[0007] In a preferred embodiment, a symmetrical first step group and a second step group are provided on both sides of the first placement surface, and the second step group is higher than the first step group and is provided outside the first step group.

[0008] In a preferred embodiment, the height of the first step group ranges from 0.4 mm to 0.6 mm.

[0009] In a preferred embodiment, the height of the second step group ranges from 0.9 mm to 1.1 mm.

[0010] In a preferred embodiment, the height of the third step group ranges from 1.5 mm to 2.5 mm.

[0011] In a preferred embodiment, the cushion body is rectangular and has a length of at least 10 cm.

[0012] In a preferred embodiment, the cross-section of the cushion body is an H-shaped structure.

[0013] In a preferred embodiment, the material of the mat body is antistatic silica gel.

[0014] Compared with the prior art, the utility model has the following advantages:

[0015] The utility model discloses a multi-purpose tin-planting pad, which includes a pad body, and the pad body includes a first placement surface and a second placement surface which are arranged back to back, wherein the first placement surface is used for chip tin-planting, and the tin-planting pad is provided with a large chip accommodating space, which can meet the needs of chips of various sizes, and a first step group and a second step group are symmetrically provided from the inside to the outside on both sides of the first placement surface, and the second step group is higher than the first step group, and maintenance personnel can place the tin-planting steel mesh on the corresponding step group to perform tin-planting work according to the thickness of the chip; the second placement surface is used for mainboard tin-planting, and the chip tin-planting and mainboard tin-planting are combined into a tin-planting pad, which can greatly improve the convenience of maintenance personnel. The utility model solves the problem in the prior art that the tin-planting pad is only provided with a slot of a certain height and has low compatibility; an upwardly protruding step group is provided on the pad body, and the surface of the pad body is relatively large, which can accommodate chips of different sizes and has stronger compatibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 This is a three-dimensional diagram of the multi-purpose tin-planting pad of the utility model;

[0018] Figure 2 It is a schematic diagram of the first placement surface of the multi-purpose tin planting pad of the utility model;

[0019] Figure 3 It is a schematic diagram of the second placement surface of the multi-purpose tin planting pad of the utility model;

[0020] Figure 4 It is a side view of the multi-purpose tin planting pad of the utility model.

[0021] Figure ID:

[0022] 100-Mat body;

[0023] 1- first placement surface;

[0024] 2- second placement surface;

[0025] 3-First step group;

[0026] 4- The second step group;

[0027] 5-The third set of steps. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present utility model. In addition, the terms "first", "second", "third", "fourth", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] See also Figures 1 to 4The utility model discloses a multi-purpose tin-planting pad, including a pad body 100, the pad body including a first placement surface 1 and a second placement surface 2 which are arranged back to back, the first placement surface 1 is used for chip tin-planting, due to the large difference in thickness of the current chips, in order to allow the chips to better fit with the tin-planting steel mesh, it is necessary to set steps of multiple heights to adapt to chips of different thicknesses, specifically, at least two pairs of step groups are set on both sides of the first placement surface 1; the second placement surface 2 is used for mainboard tin-planting, and the thickness difference of domestic mobile phone mainboards is small, and only one step group needs to be designed, specifically, symmetrical third step groups 5 are set on both sides of the second placement surface 2.

[0032] In this embodiment, a symmetrical first step group 3 and a second step group 4 are provided on both sides of the first placement surface 1 from the inside to the outside. The second step group 4 is higher than the first step group 1. Each step group includes two steps, and the two steps are respectively provided on both sides of the first placement surface 1.

[0033] Furthermore, when performing chip tinning, the utility model multi-purpose tinning pad will be used in conjunction with the common tinning steel mesh and magnetic base on the market. First, the pad body 100 is placed on the magnetic base, and then the chip is placed on the first placement surface 1. Under the suction of the magnetic base, the chip can be firmly fixed on the pad body 100. According to the thickness of the chip, a step group of suitable height is selected, and the tinning steel mesh is placed on the corresponding step group. In the prior art, the slots of chip tinning pads are all at the same height, without adjustment space, and poor compatibility. When the slot height is low but the chip is thicker, it will directly lead to the problem of incompatibility between the chip and the tinning pad; when the slot height is high but the chip is thinner, the tinning steel mesh cannot fit well with the chip, and problems such as large and small tin spots are prone to occur, requiring secondary work.

[0034] In this embodiment, the second placement surface 2 is used to plant tin on domestic mobile phone motherboards. Since the thickness of domestic mobile phone motherboards is not much different, it is sufficient to set a step group. Specifically, the height range of the third step group 5 is 1.5mm-2.5mm. In this embodiment, the height of the third step group is preferably 2mm, which can adapt to most mobile phone motherboards. When planting tin, first place the mobile phone motherboard on the second placement surface 2, and then place the tin planting steel grid on the third step group 5 to plant tin on the motherboard.

[0035] In this embodiment, both sides of the first placement surface 1 include at least two pairs of step groups, and the step groups are successively higher from the inside to the outside. Specifically, the step group close to the center of the first placement surface 1 is the lowest, and it is successively higher outward. When tinning the chip, the chip is first placed on the first placement surface 1 of the tinning pad, and then the tinning steel grid is placed on the appropriate step group according to the thickness of the chip. Setting at least two step groups has stronger compatibility and better tinning effect.

[0036] Specifically, the height of the first step group 3 ranges from 0.4 mm to 0.6 mm, and the height of the second step group 4 ranges from 0.9 mm to 1.1 mm.

[0037] In this embodiment, the height of the first step group 3 is preferably 0.5mm, and the height of the second step group 4 is preferably 1mm. When in use, first place the chip on the first placement surface 1, preliminarily determine the appropriate step group according to the thickness of the chip, and then place the tin-planting steel mesh on the corresponding step group. In actual operation, although the thickness of the chip is not exactly 0.5mm or 1mm, the height of the first step group 3 and the second step group 4 cannot be equal to the thickness of each chip, but setting the height of 0.5mm and 1mm is sufficient to cover the thickness of most chips on the market. Since the tin-planting steel mesh and the tin-planting pad are both elastic, for a small amount of height error, the tin-planting steel mesh can be pressed down to make the steel plate fit the chip; when the chip thickness does not exceed 0.5mm, the tin-planting steel mesh can be placed on the first step group 3, and the tin-planting steel mesh can be lightly pressed to fit the mesh surface to the chip; when the chip thickness exceeds 0.5mm but does not exceed 1mm, the steel mesh can be placed on the second step group of 1mm, and the tin-planting steel mesh can be lightly pressed to fit the mesh surface to the chip. Compared with the prior art, most chip tinning pads have slots of uniform height, no adjustment space, and poor compatibility. The utility model has stronger compatibility and can better adapt to chips of different heights.

[0038] In this embodiment, the pad body 100 is rectangular and has a length of at least 10 cm. Some existing tin-planting pads are configured to have a receiving groove for placing chips downwardly, and the chip is placed in the receiving groove and limited, and then a steel mesh is covered on the surface of the tin-planting pad for tin-planting. However, due to the limited size of the receiving groove, some larger chips cannot be placed in the receiving groove, making this type of tin-planting pad less compatible. The pad body 100 is configured to be rectangular and has a length of at least 10 cm, which increases the area for placing the chip. The chip or mobile phone motherboard can be placed on the first placement surface 1 or the second placement surface 2, and can adapt to various sizes of chips or motherboards, with stronger compatibility.

[0039] In this embodiment, the material of the mat body 100 is anti-static silicone, which eliminates static electricity accumulation, does not absorb dust, is soft, and is resistant to high temperatures.

[0040] Beneficial effects of the utility model:

[0041] 1. The slots of existing chip tinning pads are all at the same height, with no adjustment space. When the slot height is lower than the chip thickness, it will directly lead to the problem of incompatibility between the chip and the tinning pad; when the slot height is higher than the chip thickness, the tinning steel mesh cannot fit well with the chip, and problems such as large and small tinning spots are prone to occur, requiring secondary work, which is inefficient and wastes materials. The utility model is provided with a first step group 3 and a second step group 4 from the inside to the outside on both sides of the first placement surface 1 for chip tinning, and the second step group 4 is higher than the first step group 3, reducing the gap between the step group and the chip thickness to adapt to chips of different thicknesses, with higher compatibility and better effect when the tinning steel mesh fits.

[0042] 2. Some existing tin-planting pads, even if they are designed with accommodating grooves of different heights for chips, can be compatible with chips of different thicknesses, but the size of the accommodating grooves is limited, and the chip may not be placed in it due to being too large, and the adaptability is low. The multi-purpose tin-planting pad of the utility model is arranged with a first step group 3 and a second step group 4 protruding upward on the first placement surface 1, and the length of the first placement surface 1 is 10 cm, which can be compatible with most current and future chips.

[0043] 3. The utility model adopts anti-static silicone material. When there is a small deviation between the chip thickness and the step group, the tin-planting steel mesh can be lightly pressed to fit the chip.

[0044] 4. The multi-purpose tin planting pad of the utility model combines chip tin planting and mainboard tin planting on one tin planting pad, which can greatly improve the convenience of maintenance personnel.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A multi-purpose tin planting pad, characterized in that: The cushion body comprises a first placement surface and a second placement surface which are arranged back to back, at least two pairs of step groups are arranged on both sides of the first placement surface, and the heights of the step groups are increased from the inside to the outside; and symmetrical third step groups are arranged on both sides of the second placement surface.

2. A multi-purpose tin planting pad according to claim 1, characterized in that: A first step group and a second step group are symmetrically arranged on both sides of the first placement surface, and the second step group is higher than the first step group and arranged outside the first step group.

3. A multi-purpose tin planting pad according to claim 2, characterized in that: The height of the first step group ranges from 0.4 mm to 0.6 mm.

4. A multi-purpose tin planting pad according to claim 2, characterized in that: The height of the second step group ranges from 0.9 mm to 1.1 mm.

5. The multi-purpose tin planting pad according to claim 1, characterized in that: The height of the third step group ranges from 1.5 mm to 2.5 mm.

6. A multi-purpose tin planting pad according to claim 1, characterized in that: The mat body is rectangular and has a length of at least 10 cm.

7. The multi-purpose tin planting pad according to claim 1, characterized in that: The cross-section of the cushion body is an H-shaped structure.

8. The multi-purpose tin planting pad according to claim 1, characterized in that: The material of the mat body is antistatic silica gel.

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