Power device, heat dissipation system and power semiconductor equipment

Abstract

The utility model discloses a power device, a heat dissipation system and a power semiconductor device, which relate to the technical field of semiconductor heat dissipation, and comprise an insulating plate, a power semiconductor chip is arranged on a first side of the insulating plate, a second side of the insulating plate is used for directly dissipating heat or dissipating heat by arranging a heat dissipation component, and the insulating plate is provided with an insulating shell. A phase-change working medium is arranged in the insulating shell, and the insulating plate is used for transferring heat from the first side of the insulating plate to the second side of the insulating plate through the phase-change working medium. According to the utility model, the insulating plate is adopted to replace the original insulating substrate, so that the heat dissipation structure of the power device is simplified, the heat resistance can be effectively reduced, the heat dissipation performance is obviously improved by utilizing the high-efficiency phase change heat dissipation capability of the insulating plate, and the requirement of higher heat flux density of the power device can be met; meanwhile, the insulating structure of the insulating plate can meet the insulating requirement of the power semiconductor chip.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor heat dissipation, and more specifically to a power device, a heat dissipation system and a power semiconductor device. Background Art

[0002] As a core component of power electronic systems, power semiconductors have been widely used in transportation, electronics, industrial control, aerospace and other fields. Power semiconductors cover power devices and power integrated circuits, among which power devices mainly refer to discrete semiconductor devices that can handle high voltage and high current. As power devices develop towards high voltage and high current and pursue compact packaging volume, their power density continues to increase, bringing greater and greater heat dissipation challenges.

[0003] like Figure 1 As shown, in the power device of the conventional technology, the heat generated by the power semiconductor chip 20 needs to pass through the chip connection layer 31, the second insulating substrate metal layer 1, the insulating substrate 50 (ceramic layer), the first insulating substrate metal layer 2 and the substrate connection layer 3 in sequence, and finally reach the copper substrate 60. The copper substrate 60 further dissipates heat by directly contacting the external heat dissipation structure or indirectly using the thermal interface material. This multi-layer packaging structure has a large thermal resistance, which limits the heat dissipation performance of the power device.

[0004] Therefore, how to improve the heat dissipation performance of power devices has become a technical problem that needs to be solved urgently by those skilled in the art. Utility Model Content

[0005] In view of this, an object of the present invention is to provide a power device to improve the heat dissipation performance of the power device.

[0006] Another object of the present invention is to provide a heat dissipation system including the above-mentioned power device.

[0007] Another object of the present invention is to provide a power semiconductor device including the above-mentioned power device or heat dissipation system.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A power device comprises an insulating heat spreader and an insulating plate, a power semiconductor chip is used to be arranged on a first side of the insulating heat spreader, and a second side of the insulating heat spreader and the insulating plate is used to dissipate heat directly or by arranging a heat dissipation component. The insulating heat spreader and the insulating plate have an insulating shell, and a phase change medium is arranged in the insulating shell. The insulating plate is used to transfer heat from the first side of the insulating heat spreader to the second side of the insulating plate through the phase change medium.

[0010] Optionally, in the above power device, a thermal interface material is provided between the insulating plate and the heat dissipation component.

[0011] Optionally, in the above power device, a first insulating shell-covered metal layer is provided between the insulating plate and the heat dissipation component.

[0012] Optionally, in the above power device, a heat conducting plate is provided between the insulating plate and the heat dissipating component.

[0013] Optionally, in the above power device, the heat conducting plate is a copper substrate or a temperature homogenizing plate having an evaporation chamber.

[0014] A heat dissipation system comprises the above-mentioned power device and a heat dissipation component, wherein the power device is arranged on the heat dissipation component, and the heat dissipation component is used to dissipate heat for the power device.

[0015] Optionally, in the above heat dissipation system, the heat dissipation component includes heat dissipation fins arranged on the second side of the insulation plate.

[0016] Optionally, in the above heat dissipation system, the heat dissipation fins and the insulating housing are integrally formed; and / or,

[0017] One end of the heat dissipation fin is embedded in the insulating shell to directly contact with the phase-change working medium for heat exchange.

[0018] Optionally, in the above heat dissipation system, a heat conducting plate is provided on the second side of the insulating plate, and the heat dissipation component includes heat dissipation fins provided on a side of the heat conducting plate facing away from the insulating plate.

[0019] Optionally, in the above heat dissipation system, the heat conducting plate has an evaporation chamber, and one end of the heat dissipation fin is embedded in the evaporation chamber.

[0020] Optionally, in the above heat dissipation system, a first insulating shell metal-clad layer is provided on the second side of the insulating plate, and the heat dissipation component includes heat dissipation fins provided on a side of the first insulating shell metal-clad layer facing away from the insulating plate.

[0021] Optionally, in the above heat dissipation system, the heat dissipation component is used to exchange heat by contacting with an air-cooled cooling medium or a liquid-cooled cooling medium.

[0022] Optionally, in the above heat dissipation system, the heat dissipation component includes a heat dissipation substrate and heat dissipation fins, and the heat dissipation substrate is arranged between the power device and the heat dissipation fins.

[0023] Optionally, in the above-mentioned heat dissipation system, the heat dissipation component includes a heat sink and a heat exchanger, the power device is arranged on the heat sink, and the heat sink has a cooling cavity, the cooling cavity is filled with a cooling medium, and the heat sink and the heat exchanger form a loop through pipelines for the circulation of the cooling medium to transfer the heat of the heat sink to the heat exchanger.

[0024] Optionally, in the above heat dissipation system, the cooling medium is a two-phase cooling medium or a single-phase cooling medium.

[0025] A power semiconductor device comprises the above-mentioned power device or the above-mentioned heat dissipation system.

[0026] The power device provided by the utility model comprises an insulating plate, a power semiconductor chip is used to be arranged on the first side of the insulating plate, the second side of the insulating plate is used to dissipate heat directly or by arranging a heat dissipation component, the insulating plate has an insulating shell, a phase change medium is arranged in the insulating shell, and the insulating plate is used to transfer heat from the first side of the insulating plate to the second side through the phase change medium. After the heat generated by the power semiconductor chip with high heat flux density is diffused by the insulating plate, the heat flux density is greatly reduced, and the insulating plate can directly contact with the external heat dissipation structure for heat dissipation or indirectly contact with the structure such as the thermal interface material for heat dissipation, thereby eliminating the original first insulating substrate covered with a metal layer, a substrate connection layer and a copper substrate and other structures, greatly reducing the thermal resistance of the power device.

[0027] Compared with the prior art, the power device provided by the utility model adopts an insulating plate to replace the original insulating substrate, so that the heat dissipation structure of the power device is simplified, which can effectively reduce the thermal resistance, and significantly improve the heat dissipation performance by utilizing the efficient phase change heat dissipation capability of the insulating plate, which can meet the higher heat flux density requirements of the power device. At the same time, the insulating structure of the insulating plate can meet the insulation requirements of the power semiconductor chip.

[0028] The heat dissipation system provided by the present invention includes the above-mentioned power device and the heat dissipation component, the power device is arranged on the heat dissipation component, and the heat dissipation component is used to dissipate heat from the power device. The power semiconductor device provided by the present invention includes the above-mentioned power device or the above-mentioned heat dissipation system. Since it has the above-mentioned structure, it also has the above-mentioned beneficial effects, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a schematic diagram of the packaging structure of a power device in the prior art;

[0031] Figure 2 A schematic diagram of the structure of a power device disclosed in an embodiment of the utility model;

[0032] Figure 3 This is a schematic diagram of the structure of the insulation board disclosed in the embodiment of the utility model;

[0033] Figure 4 A schematic diagram of a first heat dissipation system disclosed in an embodiment of the utility model;

[0034] Figure 5 A schematic diagram of a second heat dissipation system disclosed in an embodiment of the utility model;

[0035] Figure 6 A schematic diagram of a third heat dissipation system disclosed in an embodiment of the utility model;

[0036] Figure 7 A schematic diagram of a fourth heat dissipation system disclosed in an embodiment of the present utility model;

[0037] Figure 8 A schematic diagram of a fifth heat dissipation system disclosed in an embodiment of the utility model;

[0038] Fig. 9 A schematic diagram of a sixth heat dissipation system disclosed in an embodiment of the present utility model;

[0039] Fig.10 This is a schematic diagram of a seventh heat dissipation system disclosed in an embodiment of the utility model.

[0040] Among them, 1 is the second insulating substrate covered with metal layer, 2 is the first insulating substrate covered with metal layer, and 3 is the substrate connection layer;

[0041] 10 is a packaging shell, 20 is a power semiconductor chip, 31 is a chip connection layer, 32 is a shell connection layer, 41 is a second insulating shell metal layer, 42 is a first insulating shell metal layer, 43 is a metal fin, 50 is an insulating substrate, 51 is an insulating plate, 511 is an insulating shell, 512 is a capillary structure, 513 is a phase change medium, 514 is a support column, 52 is an insulating fin, 60 is a copper substrate, 70 is a thermal interface material, 80 is a radiator, 90 is a cooling medium, 100 is a heat sink, 110 is a cooling cavity, 120 is a pipeline, 130 is a heat exchanger, and 140 is a temperature equalizing plate. DETAILED DESCRIPTION

[0042] The core of the utility model is to disclose a power device to improve the heat dissipation performance of the power device.

[0043] Another core of the utility model is to disclose a heat dissipation system including the above-mentioned power device.

[0044] Another core of the utility model is to disclose a power semiconductor device including the above-mentioned power device or heat dissipation system.

[0045] The following is an explanation of the embodiments with reference to the accompanying drawings. In addition, the embodiments shown below do not limit the contents of the utility model described in the claims. In addition, the entire contents of the structures represented by the following embodiments are not limited to those necessary as solutions of the utility model described in the claims. It should be noted that, for ease of description, only the parts related to the utility model are shown in the accompanying drawings. In the absence of conflict, the embodiments in the utility model and the features in the embodiments can be combined with each other.

[0046] Combination Figure 2-Figure 10 The power device disclosed in the embodiment of the utility model includes an insulating plate 51, a power semiconductor chip 20 is used to be arranged on the first side of the insulating plate 51, and the second side of the insulating plate 51 is used to dissipate heat directly or by arranging a heat dissipation component. The insulating plate 51 has an insulating shell 511, and a phase change medium 513 is arranged in the insulating shell 511. The insulating plate 51 is used to transfer heat from the first side of the insulating plate 51 to the second side through the phase change medium 513. The first side and the second side of the insulating plate 51 are opposite sides.

[0047] Among them, the insulating plate 51 can specifically be an insulating temperature-averaging plate, an insulating phase-change heat pipe, a phase-change insulating material in a thermal interface material (changed from solid to liquid), or the like, which has an insulating shell 511 and can conduct heat through a phase-change working medium 513. Taking the insulating temperature-averaging plate as an example, the insulating temperature-averaging plate is an improved heat dissipation element with insulation performance added on the basis of a traditional heat-averaging plate. It is specially designed in terms of material or structure, and can provide electrical insulation properties. While replacing the function of the original insulating substrate 50, it also has good heat dissipation properties, can prevent problems such as short circuits caused by power semiconductor chips 20, and improve safety.

[0048] After the heat generated by the power semiconductor chip 20 with high heat flux density is diffused through the insulating plate 51, the heat flux density is greatly reduced, and the insulating plate 51 can directly contact with the external heat dissipation structure for heat dissipation or indirectly contact with the structure such as the thermal interface material 70 for heat dissipation, thereby eliminating the original first insulating substrate covered with metal layer 2, substrate connecting layer 3 and copper substrate 60 and other structures, thereby greatly reducing the thermal resistance of the power device.

[0049] Compared with the prior art, the power device disclosed in the embodiment of the utility model adopts an insulating plate 51 to replace the original insulating substrate 50, so that the heat dissipation structure of the power device is simplified, the thermal resistance can be effectively reduced, and the high-efficiency phase change heat dissipation capability of the insulating plate 51 is utilized to significantly improve the heat dissipation performance, which can meet the higher heat flux density requirements of the power device. At the same time, the insulating structure of the insulating plate 51 can meet the insulation requirements of the power semiconductor chip 20.

[0050] Specifically, a second insulating shell metal layer 41 is usually provided between the insulating plate 51 and the power semiconductor chip 20. The second insulating shell metal layer 41 mainly functions to provide circuit connection and heat dissipation for the power semiconductor chip 20 and to connect the power semiconductor chip 20 with the insulating plate 51. The power semiconductor chip 20 can be provided on the second insulating shell metal layer 41 through the chip connection layer 31, and during the operation of the power device, the second insulating shell metal layer 41 can function to conduct current. The heat generated by the power semiconductor chip 20 can pass through the chip connection layer 31 and the second insulating shell metal layer 41 in sequence, and finally be transferred to the insulating plate 51 for heat dissipation.

[0051] The chip connection layer 31 may be an adhesive or solder. The material of the metal layer of the second insulating shell metal layer 41 is preferably copper, aluminum or other metals to have good thermal conductivity.

[0052] In order to protect the power semiconductor chip 20, the power semiconductor chip 20 is protected by a packaging shell 10. The packaging shell 10 can protect the outside of the power semiconductor chip 20 and is fixed to the insulating plate 51. The second side of the insulating plate 51 is exposed to the packaging shell 10, and heat can be dissipated by air cooling, liquid cooling, etc.

[0053] Figure 4-Figure 10 For the utility model Figure 2 Some further designs based on the disclosed technical solution correspond to at least one embodiment. It can be understood that the power device and the heat dissipation component, as well as the components of the power device, are usually parallel and closely arranged to ensure the heat conduction effect.

[0054] In order to reduce the thermal resistance between the insulating plate 51 and the heat dissipation component, a thermal interface material 70 is provided between the insulating plate 51 and the heat dissipation component. In addition, a first insulating shell covered with a metal layer 42, a heat conduction plate and other structures may also be provided between the insulating plate 51 and the heat dissipation component. Specifically, the heat conduction plate may be a structure having an evaporation chamber to achieve rapid heat conduction.

[0055] Combination Figure 5Specifically, the second side of the insulating plate 51 is first connected to the first insulating shell metal layer 42, and then assembled with the heat sink 80 and other heat dissipation components through the thermal interface material 70. The heat of the insulating plate 51 is first conducted through the first insulating shell metal layer 42, and then enters the heat dissipation component through the conduction of the thermal interface material 70, and finally dissipated through the heat dissipation component or directly dissipated.

[0056] Furthermore, the heat conducting plate is arranged on the second side of the insulating plate 51, and the heat dissipation component is connected to the heat conducting plate through the thermal interface material 70, that is, the heat conducting plate is arranged between the insulating plate 51 and the heat dissipation component, so that the heat of the insulating plate 51 is first conducted through the heat conducting plate, and then enters the heat dissipation component through conduction of the thermal interface material 70, and finally dissipated through the heat dissipation component.

[0057] The heat conduction area of ​​the heat conduction plate (the heat conduction area refers to the area of ​​a component that can conduct heat) is usually set to be larger than the heat conduction area of ​​the insulating plate 51 so that the heat conduction plate can further diffuse the heat.

[0058] The heat conducting plate may be a copper substrate 60 or a temperature averaging plate 140 (conventional temperature averaging plate). Figure 6 In the embodiment corresponding to the figure, the heat conducting plate is a copper substrate 60. The heat of the insulating plate 51 is further diffused through the copper substrate 60, and then enters the heat dissipation component through conduction of the thermal interface material 70, and finally dissipated through the heat dissipation component.

[0059] exist Figure 7 In the corresponding embodiment, the heat conducting plate is a temperature averaging plate 140 , and the heat of the insulating plate 51 is first conducted through the temperature averaging plate 140 , then enters the heat dissipation component through the conduction of the thermal interface material 70 , and finally dissipated through the heat dissipation component.

[0060] It should be noted that, because the outer shell of the insulating plate 51 is made of insulating material, it is not convenient to directly connect with the copper substrate 60 or the heat conducting plate 140 made of metal materials. Figure 6 and Figure 7 A first insulating shell metal layer 42 can be firstly arranged on the second side of the insulating plate 51, and then a heat conducting plate can be arranged through a shell connecting layer 32 (solder or adhesive, etc.), that is, the first insulating shell metal layer 42, the shell connecting layer 32, the heat conducting plate, the thermal interface material 70 and the heat dissipation component are arranged in sequence on the second side of the insulating plate 51.

[0061] In some embodiments, a separate heat dissipation component is not provided on the second side of the insulating plate 51. Instead, a heat dissipation portion is directly provided on the second side of the insulating plate 51 for heat dissipation. The heat dissipation portion may specifically be a fin structure or a groove structure that can increase the heat exchange area between the insulating plate 51 and the cooling medium 90.

[0062] The heat dissipation system disclosed in the utility model includes the above-mentioned power device and a heat dissipation component, the power device is arranged on the heat dissipation component, and the heat dissipation component is used to dissipate heat from the power device. Since it has the above-mentioned power device, it also has the above-mentioned structure and beneficial effects, which will not be repeated here.

[0063] Specifically, the heat dissipation component may include heat dissipation fins disposed on the second side of the insulating plate 51. The heat dissipation fins include but are not limited to flat fins, columnar fins, etc., and the second side of the insulating plate 51 and the heat dissipation fins may be cooled by air or liquid, that is, the cooling medium 90 of the insulating plate 51 and the heat dissipation fins may be an air-cooled cooling medium or a liquid-cooled cooling medium.

[0064] The heat dissipation fins may be directly disposed on the insulating shell 511 and formed integrally with the insulating shell 511 .

[0065] See also Figure 8 The figure shows a structure in which the second side of the insulating plate 51 is sintered with heat dissipation fins (insulating fins 52) to increase the heat exchange area, and the cooling medium 90 is a liquid cooling medium. The second side of the insulating plate 51 and the insulating fins 52 are in direct contact with the liquid cooling medium. Through the circulation of the liquid cooling medium, the insulating plate 51 and the heat dissipation fins can be continuously cooled. The liquid cooling medium can be water or the like, and is connected to the heat exchanger through a pipe to form a circulatory heat exchange loop. In addition, the fan can be directly used to blow the insulating plate 51 and the heat dissipation fins for air cooling and heat dissipation.

[0066] As a further optimization scheme, one end of the heat sink fin can be directly embedded in the insulating housing 511 (not shown in the figure) by means of opening a window or the like, so as to directly contact and exchange heat with the phase change medium 513, thereby greatly enhancing the heat exchange effect.

[0067] If a heat conducting plate is disposed on the second side of the insulating plate 51, and the heat conducting plate has an evaporation chamber for heat conduction, the heat dissipation component may include a heat dissipation fin disposed on the side of the heat conducting plate facing away from the insulating plate 51. Further, in this embodiment, one end of the heat dissipation fin may also be embedded in the evaporation chamber (not shown in the figure) to enhance the heat conduction effect.

[0068] If the second side of the insulating plate 51 is provided with a first insulating shell metal layer 42, the heat dissipation fins may also be provided on the first insulating shell metal layer 42, and heat dissipation is performed by air cooling or liquid cooling. Fig. 9 If a heat dissipation fin (metal fin 43) is added to the first insulating shell metal layer 42, the fin structure can be integrally formed with the same type of metal as the first insulating shell metal layer 42, or can be welded with different types of metal. The first insulating shell metal layer 42 and the metal fin 43 can adopt the same heat dissipation form as the above-mentioned insulating fin 52, which will not be repeated here.

[0069] In one embodiment, the heat dissipation component further includes a heat dissipation substrate, which is disposed between the power device and the heat dissipation fins, that is, the heat dissipation substrate and the heat dissipation fins constitute a conventional heat sink 80 structure. In other words, the heat dissipation component can directly be a conventional heat sink 80 structure, which includes a heat dissipation substrate and heat dissipation fins, and the heat dissipation substrate is disposed between the power device and the heat dissipation fins.

[0070] Combination Figure 4 , the heat sink 80 can be directly disposed on the second side of the insulating plate 51 through the thermal interface material 70. The thermal interface material 70 is disposed between the second side of the insulating plate 51 and the heat sink 80, so as to realize the connection between the heat sink 80 and the insulating plate 51. The heat of the insulating plate 51 enters the heat sink 80 after being conducted by the thermal interface material 70, and finally dissipated through the heat sink 80. Among them, the heat sink 80 can be a fin heat sink and other types, and the heat sink 80 can be cooled by air cooling, liquid cooling and other methods.

[0071] In one embodiment disclosed in the present utility model, combined with Fig.10 The heat dissipation component includes a heat dissipation plate 100 and a heat exchanger 130. The heat dissipation plate 100 is attached to the second side of the insulating plate 51 and has a cooling cavity 110. The cooling cavity 110 is filled with a cooling medium. The heat dissipation plate 100 and the heat exchanger 130 form a loop for the circulation of the cooling medium through the pipeline 120, and can transfer the heat of the heat dissipation plate 100 to the heat exchanger 130. When the heat is transferred to the heat dissipation plate 100 by the insulating plate 51, the cooling medium in the cooling cavity 110 will absorb the heat on the outer shell of the heat dissipation plate 100, and enter the heat exchanger 130 along the pipeline 120 for heat exchange. The heat at the heat exchanger 130 can be transferred to the external environment. The cooling medium that has completed the heat exchange will return to the cooling cavity 110 to absorb heat and continue the subsequent heat exchange process.

[0072] Among them, the cooling medium can be a two-phase cooling medium (such as water, refrigerant, etc.) or a single-phase cooling medium (such as silicone oil, hydrocarbons). The two-phase cooling medium has the conversion between liquid phase and gas phase, can absorb heat and gasify in the cooling cavity 110, and release heat and liquefy in the heat exchanger 130. Therefore, the circulation of the two-phase cooling medium in the loop can be achieved with the help of the phase change of the two-phase cooling medium itself (for example, the spatial position of the heat exchanger 130 is set higher than the cooling cavity 110), without the need to set a corresponding drive component. The single-phase cooling medium has no morphological change during the circulation process, so it is necessary to set a pump or other drive component on the pipeline 120 to drive it to complete the heat exchange cycle.

[0073] In addition, the heat dissipation component may also be a siphon radiator or other structure, which will not be described in detail here.

[0074] The insulating plate 51 disclosed in the embodiment of the utility model includes an insulating shell 511, a capillary structure 512 and a phase change medium 513. The power semiconductor chip 20 is used to be arranged on the first side shell of the insulating shell 511. The second side shell of the insulating shell 511 is used to dissipate heat directly or by setting a heat dissipation component. The first side shell and the second side shell of the insulating shell 511 are opposite. The phase change medium 513 is arranged in the insulating shell 511. The heat of the first side shell of the insulating shell 511 can be transferred to the second side shell of the insulating shell 511 through the phase change medium 513. The insulating shell 511 is made of insulating material. The capillary structure 512 is arranged on the inner wall of the insulating shell 511, which can promote the circulation of the phase change medium 513, reduce flow resistance, increase heat dissipation area, etc.

[0075] The heat generated by the power semiconductor chip 20 passes through the first side shell of the insulating shell 511 and the capillary structure 512 on the first side shell, causing the temperature of the phase change medium 513 in this area to rise, vaporize and absorb heat. Under the action of the pressure difference, the vaporized phase change medium 513 flows to the low-temperature area, that is, flows to the second side shell of the insulating shell 511, condenses and releases heat. This continuous cycle can transfer heat from the high-temperature area to the low-temperature area.

[0076] The insulating shell 511 is usually formed by laser welding an upper shell and a lower shell, and its material includes but is not limited to alumina ceramics, aluminum nitride ceramics, silicon carbide ceramics, silicon nitride ceramics, etc. The capillary structure 512 can be formed by directly processing a groove structure on the inner wall of the insulating shell 511 and then sintering it, or by making an insulating material such as glass into a liquid wick separately and placing it on the inner wall of the insulating shell 511 and sintering it.

[0077] Combination Figure 3 When the pressure-bearing capacity of the insulating plate 51 is insufficient, a support column 514 can be placed in the insulating shell 511. The two ends of the support column 514 are respectively supported between the first side shell and the second side shell of the insulating shell 511. The number of the support column 514 can be one or more, so as to increase the overall bearing pressure of the power device and avoid the unevenness of the shell plane of the insulating plate 51.

[0078] Furthermore, if a support column 514 is disposed in the insulating shell 511 , micro-grooves may be directly processed around the support column 514 or a liquid wick may be placed and sintered to enhance the liquid return capability of the insulating plate 51 .

[0079] The utility model also discloses a power semiconductor device including the power device or the heat dissipation system. Since it has the above structure, it also has the above beneficial effects, which will not be described in detail here.

[0080] The above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the utility model. Various modifications to these embodiments will be obvious to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. The specific technical means in some embodiments can be combined in part or in whole into another embodiment without being explicitly excluded by another embodiment. Therefore, the utility model will not be limited to the embodiments shown in this article, but will conform to the widest range consistent with the principles and novel features disclosed herein.

Claims

1. A power device, characterized in that: The invention comprises an insulating plate (51), a power semiconductor chip (20) being arranged on a first side of the insulating plate (51), a second side of the insulating plate (51) being used for direct heat dissipation or heat dissipation by arranging a heat dissipation component, the insulating plate (51) having an insulating shell (511), a phase change medium (513) being arranged in the insulating shell (511), and the insulating plate (51) being used for transferring heat from the first side of the insulating plate (51) to the second side through the phase change medium (513).

2. The power device according to claim 1, characterized in that: A thermal interface material (70) is provided between the insulating plate (51) and the heat dissipation component.

3. The power device according to claim 1, characterized in that: A first insulating shell-coated metal layer (42) is provided between the insulating plate (51) and the heat dissipation component.

4. The power device according to claim 3, characterized in that: A heat conducting plate is provided between the insulating plate (51) and the heat dissipating component.

5. The power device according to claim 4, characterized in that: The heat conducting plate is a copper substrate (60) or a temperature equalizing plate (140) having an evaporation chamber.

6. A heat dissipation system, characterized in that: It comprises the power device and a heat dissipation component as claimed in any one of claims 1 to 5, wherein the power device is arranged on the heat dissipation component, and the heat dissipation component is used to dissipate heat for the power device.

7. The heat dissipation system according to claim 6, characterized in that: The heat dissipation component comprises heat dissipation fins arranged on the second side of the insulation plate (51).

8. The heat dissipation system according to claim 7, characterized in that: The heat dissipation fins and the insulating housing (511) are integrally formed; and / or, One end of the heat dissipation fin is embedded in the insulating housing (511) so as to directly contact and exchange heat with the phase-change working medium (513).

9. The heat dissipation system according to claim 6, characterized in that: A heat conducting plate is arranged on the second side of the insulating plate (51), and the heat dissipation component comprises heat dissipation fins arranged on a side of the heat conducting plate facing away from the insulating plate (51).

10. The heat dissipation system according to claim 9, characterized in that: The heat conducting plate has an evaporation cavity, and one end of the heat dissipating fin is embedded in the evaporation cavity.

11. The heat dissipation system according to claim 6, characterized in that: A first insulating shell metal-clad layer (42) is provided on the second side of the insulating plate (51), and the heat dissipation component comprises heat dissipation fins provided on a side of the first insulating shell metal-clad layer (42) facing away from the insulating plate (51).

12. The heat dissipation system according to any one of claims 6 to 11, characterized in that: The heat dissipation component is used for exchanging heat by contacting with an air-cooled cooling medium or a liquid-cooled cooling medium.

13. The heat dissipation system according to claim 6, characterized in that: The heat dissipation component includes a heat dissipation substrate and heat dissipation fins, and the heat dissipation substrate is arranged between the power device and the heat dissipation fins.

14. The heat dissipation system according to claim 6, characterized in that: The heat dissipation component comprises a heat dissipation plate (100) and a heat exchanger (130), the power device is arranged on the heat dissipation plate (100), and the heat dissipation plate (100) has a cooling cavity (110), the cooling cavity (110) is filled with a cooling medium, and the heat dissipation plate (100) and the heat exchanger (130) form a loop for the circulation of the cooling medium through a pipeline (120), so as to transfer the heat of the heat dissipation plate (100) to the heat exchanger (130).

15. The heat dissipation system according to claim 14, characterized in that: The cooling medium is a two-phase cooling medium or a single-phase cooling medium.

16. A power semiconductor device, characterized in that: It comprises a power device as described in any one of claims 1 to 5 or a heat dissipation system as described in any one of claims 6 to 15.

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