RF circuit components, RF chip test systems

Abstract

The embodiment of the present application provides a radio frequency circuit component, a radio frequency chip test system and a radio frequency connector, wherein the radio frequency circuit component includes a substrate and a radio frequency connector; a circuit is formed on the substrate, the substrate can carry radio frequency devices, and the circuit is connected to the radio frequency devices; the radio frequency connector is connected to the substrate, the radio frequency connector includes a radio frequency connection part, and the radio frequency connection part is connected to the circuit through a welding object; the height of the radio frequency connection part relative to the substrate is greater than the height of the circuit, and the height of the welding object relative to the substrate gradually decreases from the radio frequency connection part to the circuit. By providing a welding object and gradually decreasing the height of the welding object relative to the substrate from the radio frequency connection part to the circuit, the impedance difference between the radio frequency connector 120 and the circuit 111 can be reduced, and the impedance from the radio frequency connector to the circuit can be gradually reduced, that is, the impedance has good continuity; inaccurate test results of radio frequency devices due to impedance mismatch and discontinuity can be prevented.

Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and in particular to a radio frequency circuit component, a radio frequency chip testing system and a radio frequency connector. Background Art

[0002] The RF circuit can be connected to the RF connector so that the RF circuit can be connected to other devices through the RF connector. For example, the RF connector can be connected to the cable of the test instrument to test the RF circuit. The impedance of the RF connector in the related art is usually not matched with the impedance of the RF circuit, which may lead to inaccurate test results of the RF circuit. Summary of the invention

[0003] The present application provides a radio frequency circuit component, a radio frequency chip testing system and a radio frequency connector, which can improve the accuracy of radio frequency device test results.

[0004] In a first aspect, an embodiment of the present application provides a radio frequency circuit component, wherein the radio frequency circuit component comprises:

[0005] A substrate, on which a circuit is formed, the substrate can carry a radio frequency device, and the circuit is connected to the radio frequency device;

[0006] A radio frequency connector, the radio frequency connector is connected to the substrate, the radio frequency connector includes a radio frequency connecting part, the radio frequency connecting part is connected to the circuit through a soldering object; the height of the radio frequency connecting part relative to the substrate is greater than the height of the circuit, and the height of the soldering object relative to the substrate gradually decreases from the radio frequency connecting part to the circuit.

[0007] In a second aspect, an embodiment of the present application provides a radio frequency connector, the radio frequency connector comprising:

[0008] A cable connecting portion, used for connecting cables;

[0009] A grounding part, used for grounding;

[0010] A radio frequency connection part, wherein a first end of the radio frequency connection part is connected to the cable connection part, and a transition part is formed at a second end of the radio frequency connection part, wherein a width of the transition part gradually decreases in a direction away from the first end.

[0011] In a third aspect, an embodiment of the present application provides a radio frequency circuit component, wherein the radio frequency circuit component includes:

[0012] A substrate, on which a circuit is formed, the substrate can carry a radio frequency device, and the circuit is connected to the radio frequency device;

[0013] The aforementioned RF connector is connected to the substrate, and the RF connecting portion of the RF connector is connected to the circuit.

[0014] In a fourth aspect, an embodiment of the present application provides a radio frequency chip testing system, including:

[0015] The aforementioned radio frequency circuit assembly;

[0016] A testing device is connected to the radio frequency connector in the radio frequency circuit assembly.

[0017] The RF circuit assembly, RF chip test system and RF connector provided by the embodiments of the present application, the RF circuit assembly includes a substrate and an RF connector; a circuit is formed on the substrate, the substrate can carry RF devices, and the circuit is connected to the RF device; the RF connector is connected to the substrate, the RF connector includes an RF connection part, and the RF connection part is connected to the circuit through a welding object; the height of the RF connection part relative to the substrate is greater than the height of the circuit, and the height of the welding object relative to the substrate gradually decreases from the RF connection part to the circuit. By setting the height of the welding object relative to the substrate to gradually decrease from the RF connection part to the circuit, the impedance from the RF connector to the circuit can be gradually reduced, that is, the impedance has good continuity; it can prevent the test results of the RF device from being inaccurate due to the impedance mutation from the RF connector to the circuit, that is, the impedance mismatch.

[0018] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory and cannot limit the disclosure of the embodiments of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 is a structural schematic diagram of a radio frequency circuit assembly provided in an embodiment of the present application;

[0021] Figure 2 is a schematic diagram of the structure of a radio frequency circuit assembly in some embodiments of the present application;

[0022] Figure 3 is a schematic diagram of the structure of a radio frequency circuit component in some other embodiments of the present application;

[0023] Figure 4 is a schematic diagram of the structure of a radio frequency circuit component in some other embodiments of the present application;

[0024] Figure 5a Shown is a schematic diagram of the impedance of a radio frequency circuit component in the related art;

[0025] Figure 5b Shown is a schematic diagram of a radio frequency device test result of a radio frequency circuit assembly in the related art;

[0026] Figure 6a Shown is a schematic diagram of the impedance of a radio frequency circuit component according to an embodiment of the present application;

[0027] Figure 6b Shown is a schematic diagram of the test results of the radio frequency device of the radio frequency circuit assembly of the embodiment of the present application;

[0028] Figure 7 It is a structural schematic diagram of a radio frequency connector provided in an embodiment of the present application;

[0029] Figure 8 is a structural schematic diagram of a radio frequency circuit assembly provided by another embodiment of the present application;

[0030] Fig. 9 It is a structural schematic diagram of a radio frequency chip testing system provided in an embodiment of the present application.

[0031] Description of reference numerals:

[0032] 100, RF circuit assembly; 110, substrate; 111, circuit; 120, RF connector; 121, RF connection portion; 121a, first end; 121b, second end; 121c, top end; 1201, transition portion; 122, cable connection portion; 123, grounding portion;

[0033] 10. Radio frequency device; 20. Soldering material; 200. Testing device. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0035] It should be understood that the present invention can be implemented in different forms and should not be construed as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present invention to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0036] In order to fully understand the present invention, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below, but in addition to these detailed descriptions, the present invention may also have other implementations.

[0037] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0038] See also Figure 1 , Figure 1 It is a structural schematic diagram of a radio frequency circuit component 100 provided in an embodiment of the present application.

[0039] The RF circuit assembly 100 can be used to test the RF device 10. For example, the RF circuit assembly 100 can be used in Fig. 9 The RF chip test system shown in the figure includes a RF circuit component 100 and a test device 200. The RF circuit component 100 carries a RF device 10, and the RF circuit component 100 is connected to the test device 200. The test device 200 can test the RF device 10 on the RF circuit component 100. For example, the test can obtain the S parameters of the RF device 10, but it is certainly not limited to this. S parameters can also be called scattering parameters, for example, including return loss and insertion loss. Optionally, the test device 200 can be a network analyzer.

[0040] In some embodiments, the RF device 10 to be tested may be a RF chip or a RF front-end module. The RF chip may be used for RF transceiver switching or power amplification or low noise amplification. The RF front-end module is a component that integrates two or more discrete devices such as a RF switch, a low noise amplifier, a coupler, a filter, a duplexer, a power amplifier, etc. into an independent module, thereby improving the integration and hardware performance, and miniaturizing the volume. Specifically, the RF front-end module can be applied to communication devices such as smart phones, tablet computers, and smart watches. The RF front-end module is, for example, a RF front-end module applied to communication devices such as LTE (Long Term Evolution, LTE for short), and 5G.

[0041] like Figure 1 or Figure 2 As shown, the RF circuit assembly 100 includes a substrate 110 and a RF connector 120 .

[0042] Among them, a circuit 111 is formed on the substrate 110. The substrate 110 may be a PCB (Printed Circuit Board), which is also called a printed circuit board or a printed circuit board in Chinese. It is a support for electronic components and a provider of electrical connections for electronic components. PCB can be made by electronic printing, so it can be called a "printed" circuit board.

[0043] The substrate 110 can carry the RF device 10 , and the circuit 111 is connected to the RF device 10 .

[0044] Optionally, the RF device 10 is detachably connected to the substrate 110. When the RF device 10 is connected to the substrate 110, the RF device 10 is at least connected to the circuit 111 on the substrate 110. For example, the detachable connection includes that the RF device 10 can be manually installed on the substrate 110 without the aid of tools, or the RF device 10 can be manually removed from the substrate 110, or the RF device 10 on the substrate 110 can be manually replaced. For example, a device connector is provided on the substrate 110, and the device connector is detachably connected to the RF device 10. The device connector is, for example, a plug-in connector, but is certainly not limited thereto.

[0045] Optionally, the RF device 10 is welded on the substrate 110. For example, a device welding portion is provided on the substrate 110, and the RF device 10 can be welded on the device welding portion.

[0046] The RF connector 120 is connected to the substrate 110, and the RF connector 120 is connected to the line 111 on the substrate 110 so as to be connected to the RF device 10 on the substrate 110 through the line 111; the RF connector 120 can also be connected to the testing device 200, so that the testing device 200 is connected to the RF device 10 through the RF connector 120 to test the RF device 10.

[0047] In some embodiments, the RF connector 120 may be a coaxial connector, such as an SMA (SubMiniature version A) coaxial connector, which may be used for transmission of RF, microwave, and millimeter wave (mmW) signals. Of course, the RF connector 120 is not limited to the coaxial connector, and may be used to connect the RF chip on the substrate 110 to the test device 200.

[0048] In some embodiments, see Figure 2 The RF connector 120 includes a RF connection portion 121 for connecting to the substrate 110, and also includes a cable connection portion 122 for connecting to a cable. The cable connection portion 122 may be a socket connection portion or a plug connection portion; see Figure 3The first end 121a of the RF connector 121 is connected to the cable connector 122, and the second end 121b of the RF connector 121 is welded to the substrate 110 and connected to the circuit 111. The cable connector 122 can connect the test device 200 via a cable, so that the RF connector 120 transmits signals between the test device 200 and the RF device 10.

[0049] In some embodiments, see Figure 2 , the RF connector 120 also includes a grounding portion 123, and the grounding portion 123 is used for grounding. For example, a grounding layer (not shown) is also formed on the substrate 110, and the grounding portion 123 of the RF connector 120 is connected to the grounding layer of the substrate 110. Optionally, the grounding portion 123 is welded on the substrate 110 and connected to the grounding layer of the substrate 110, so that the RF connector 120 can be stably connected to the substrate 110. The grounding of the grounding portion 123 of the RF connector 120 can also ensure the stable transmission of signals on the cable and the RF connector 120, reduce electromagnetic interference and noise in signal transmission, ensure the quality and stability of the signal, and improve the accuracy of the test.

[0050] In some embodiments, see Figure 2 The RF device 10 includes a RF chip, and a plurality of RF connectors 120 are connected to different signal terminals of the RF chip through different lines 111. One or more test devices 200 can be connected to the plurality of signal terminals of the RF chip through the plurality of RF connectors 120, so as to test the RF chip more comprehensively and accurately.

[0051] Please combine Figure 2 See also Figure 1 or Figure 3 or Figure 4 The RF connector 120 includes an RF connecting portion 121, which is connected to the circuit 111 through a soldering object 20; a height h1 of the RF connecting portion 121 relative to the substrate 110 is greater than a height h2 of the circuit 111, and a height of the soldering object 20 relative to the substrate 110 gradually decreases from the RF connecting portion 121 to the circuit 111.

[0052] In some embodiments, the RF connector 121 is connected to or overlaps at least a portion of the line segments of the circuit 111, and at least a portion of the line segments are line segments close to the RF connector 121. For example, when the RF connector 121 is placed at a corresponding welding position on the substrate 110, the RF connector 121 can be in direct contact with the circuit 111 so as to be welded through the welding object 20.

[0053] Exemplarily, a receiving portion is formed on the substrate 110 , the RF connector 121 is disposed in the receiving portion, and the line 111 extends to the receiving portion to connect with the RF connector 121 , so as to facilitate welding the RF connector 121 to the substrate 110 .

[0054] For example, the receiving portion on the substrate is a strip-shaped groove or through groove, and the circuit 111 on the substrate extends from the device welding portion to the groove or through groove. The RF connector 121 is a sheet-like structure, and the RF connector 121 is embedded in the groove or through groove in a direction substantially perpendicular to the substrate 110, and connected to the circuit 111, and then the RF connector 121 is welded to the substrate 110, which can ensure a reliable connection between the RF connector 121 and the circuit 111, so as to transmit signals between the test device 200 and the RF device 10.

[0055] Since the plane where the RF connector 121 is located is perpendicular to the plane where the substrate 110 is located, when the RF connector 121 is connected to the substrate 110 , a height h1 of the RF connector 121 relative to the substrate 110 is greater than a height h2 of the circuit 111 .

[0056] In the related art, when the RF connector is soldered to the substrate, all the excess solder at the soldering point is usually sucked away. Since the height h1 of the RF connector relative to the substrate is greater than the height h2 of the circuit, there is a significant height difference between the RF connector and the circuit of the substrate. The inventors of the present application have found that the impedance of the RF connector is usually higher than the impedance of the circuit on the substrate, that is, the impedance mismatch will lead to inaccurate test results of the S parameters of the RF device. Since the RF connector is directly connected to the circuit of the substrate, the impedance changes suddenly at the connection point, further exacerbating the inaccuracy of the test results.

[0057] See also Figure 5a to Figure 5b ,like Figure 5a The figure shows the impedance change from the RF connector to the device welding part (the figure shows the case where the RF device is not welded to the device welding part) in the related art, wherein the impedance at position 1 close to the RF connector is approximately 55.456 ohms, and the impedance at position 2 after the RF connector is approximately 48.309 ohms, with a sudden change of about 7 ohms. Figure 5b The figure shows the test results of the S parameters of the RF device in the related art. The horizontal axis represents the signal frequency and the vertical axis represents the value of the S parameter. In the test results, from position 1 to position R, the S parameter is generally higher than -30 decibels, and higher than -20 decibels at position R, which is not accurate enough.

[0058] The RF circuit assembly 100 of the embodiment of the present application, by providing a soldering object 20 connected to the RF connector 121, can lower the impedance of the RF connector 121, reduce the impedance difference between the RF connector 121 and the line 111, and improve the impedance matching between the RF connector 121 and the line 111, thereby improving the accuracy of the test results of the S parameters of the RF device. In addition, the height of the soldering object 20 relative to the substrate 110 in the embodiment of the present application gradually decreases from the RF connector 121 to the line 111, which can achieve a gradual decrease in impedance from the RF connector 120 to the line 111, that is, the impedance has good continuity, which can prevent the influence on the test results of the RF device 10 caused by the impedance mutation from the RF connector 120 to the line 111, and further improve the accuracy of the test results.

[0059] See also Figure 6a to Figure 6b ,like Figure 6a The figure shows the impedance change from the RF connector 120 to the device welding part (the figure shows the case where the RF device 10 is not welded to the device welding part) on the RF circuit assembly 100 of the embodiment of the present application, wherein the impedance at position 1 close to the RF connector 120 is approximately 51.290 ohms, and it can be determined that by setting the height of the welding object 20 relative to the substrate 110 to gradually decrease from the RF connection part 121 to the line 111, the impedance at the RF connection part 121 can be reduced; the impedance at position 2 after the RF connector 120 is approximately 48.055 ohms, and the impedance change from position 1 to position 2 is 3.235 ohms, which is much smaller than the 7 ohm mutation in the related art. Figure 6b The figure shows the test results of the S parameters of the RF device 10 using the RF circuit component 100 of the embodiment of the present application, where the horizontal axis represents the signal frequency and the vertical axis represents the value of the S parameter. Within the operating frequency range of the RF device 10, most of the S parameter values ​​of the RF device 10 are below -30 decibels, and are lower than -20 decibels at position R, which are lower than the test results of the related technology as a whole, and the test accuracy is higher.

[0060] In some embodiments, see Figure 1 The soldering object 20 is away from the side of the substrate 110 and extends in a straight line from the RF connector 121 to the line 111. In this way, the impedance from the RF connector 121 to the line 111 can be uniformly changed, thereby maximizing the accuracy of the test result.

[0061] In some other embodiments, see Figure 3 The soldering object 20 is away from one side of the substrate 110 , and extends in an arc shape from the RF connecting portion 121 to the circuit 111 , and the arc shape is concave toward the substrate 110 .

[0062] In some other embodiments, see Figure 4The soldering object 20 is located away from the substrate 110 , and extends in an arc shape from the RF connection portion 121 to the circuit 111 , and the arc shape is convex in a direction away from the substrate 110 .

[0063] In some embodiments, Figure 1 or Figure 3 or Figure 4 As shown, the end surface of the second end 121b of the RF connector 121 is perpendicular to the substrate 110; for example, the RF connector 121 is a rectangular sheet connector, and when the RF connector 121 is set on the substrate 110, one side of the rectangle is perpendicular to the substrate 110. Exemplarily, when the RF connector 120 is welded to the substrate 110, a portion of solder is retained at the welding point, and a portion of solder can be formed at the welding point by controlling the movement of the welding head. Figure 1 , Figure 3 or Figure 4 The solder shape shown can also be formed at the soldering point by adding tin after soldering. Figure 1 , Figure 3 or Figure 4 Preferably, the solder 20 is away from the side of the substrate 110, extending from the RF connection part 121 to the circuit 111 in an arc shape, and the arc shape is concave toward the substrate 110, which is less difficult to process and can improve the processing efficiency.

[0064] It should be noted that the shape of the soldering object 20 extending from the RF connection portion 121 to the line 111 on the side away from the substrate 110 is not limited to Figure 1 , Figure 3 or Figure 4 The shape shown may be, for example, a combination of a straight line, a concave arc, and a convex arc, so that the height of the solder 20 relative to the substrate 110 gradually decreases from the RF connector 121 to the circuit 111 .

[0065] In some embodiments, Figure 3 or Figure 4 As shown, the solder 20 extends from the top 121c of the RF connector 121 relative to the substrate 110 to the substrate 110. This can make the height transition from the RF connector 121 to the line 111 on the RF circuit assembly 100 smooth, ensure the continuity of the impedance from the RF connector 121 to the line 111, reduce impedance fluctuations, and improve test accuracy.

[0066] For example, the height of the soldering object 20 at the RF connector 121 relative to the substrate 110 is substantially equal to the height of the RF connector 121 relative to the substrate 110. Preferably, when the height of the soldering object 20 at the RF connector 121 relative to the substrate 110 is completely equal to the height of the RF connector 121 relative to the substrate 110, the continuity of the impedance is better.

[0067] In some embodiments, see Figure 2 The length of the projection of the soldering object 20 between the RF connector 121 and the circuit 111 on the substrate 110 is from one quarter to one times the length of the projection of the RF connector 121 on the substrate 110 . Figure 2 It is shown that the length of the projection of the soldering object 20 on the substrate 110 is 1 times the length of the projection of the RF connector 121 on the substrate 110. By setting the soldering object 20 within this length range, the impedance reduction near the RF device 10 can be prevented, and the accuracy of the test of the RF device 10 can be guaranteed.

[0068] Exemplarily, the length of the projection of the solder 20 between the RF connector 121 and the circuit 111 on the substrate 110 is one third of the length of the projection of the RF connector 121 on the substrate 110. This can reduce the impedance at the RF connector 121, better ensure the continuity of the impedance from the RF connector 121 to the circuit 111, and also make the impedance at the RF device 10 within a better range, which can better ensure the accuracy of the test of the RF device 10.

[0069] In other embodiments, Figure 7 As shown, the second end 121b of the RF connector 121 of the RF connector 120 is formed with a transition portion 1201, and the transition portion 1201 and the second end 121b of the RF connector 121 can be separately provided and connected, or can be provided in an integral manner (such as integrally formed); the width of the transition portion 1201 gradually decreases in the direction away from the first end 121a, and the width direction of the transition portion 1201 is, for example, parallel to the end face of the second end 121b of the RF connector 121. The transition portion 1201 is a conductor, for example, a metal of the same material as the RF connector 121. Figure 8 As shown, when the RF connector 120 is connected to the substrate 110, the height of the transition portion 1201 relative to the substrate 110 gradually decreases in the direction away from the first end 121a. When the RF connector 121 is welded to the substrate 110 by the welding object 20, it can be conveniently welded along the edge of the transition portion 1201, so that the height of the welding object 20 relative to the substrate 110 gradually decreases from the RF connector 121 to the line 111, so that the shape of the solder can be constructed without deliberately controlling the movement of the welding head, the processing difficulty is relatively low, and the processing efficiency can be improved.

[0070] The RF circuit assembly 100 provided in the embodiment of the present application includes a substrate 110 and an RF connector 120; a circuit 111 is formed on the substrate 110, the substrate 110 can carry an RF device 10, and the circuit 111 is connected to the RF device 10; the RF connector 120 is connected to the substrate 110, and the RF connector 120 includes an RF connector 121, and the RF connector 121 is connected to the circuit 111 through a soldering object 20; the height of the RF connector 121 relative to the substrate 110 is greater than the height of the circuit 111, and the height of the soldering object 20 relative to the substrate 110 gradually decreases from the RF connector 121 to the circuit 111. By providing the soldering object 20 and gradually decreasing the height of the soldering object 20 relative to the substrate 110 from the RF connector 121 to the circuit 111, the impedance difference between the RF connector 120 and the circuit 111 can be reduced, and the impedance from the RF connector 120 to the circuit 111 can be gradually reduced, that is, the impedance has good continuity, thereby improving the accuracy of the test results of the RF device 10.

[0071] Please refer to the above examples. Figure 7 ,like Figure 7 FIG. 1 is a schematic structural diagram of a radio frequency connector 120 provided in an embodiment of the present application.

[0072] like Figure 7 As shown, the RF connector 120 includes a cable connection portion 122, a grounding portion 123 and a RF connection portion 121; wherein the cable connection portion 122 is used to connect the cable, and the grounding portion 123 is used for grounding; the first end 121a of the RF connection portion 121 is connected to the cable connection portion 122, and the second end 121b of the RF connection portion 121 is formed with a transition portion 1201, and the width of the transition portion 1201 gradually decreases in the direction away from the first end 121a. The transition portion 1201 is a conductor, for example, a metal of the same material as the RF connection portion 121.

[0073] like Figure 8As shown, when the RF connector 120 is connected to the substrate 110, the height of the transition portion 1201 relative to the substrate 110 gradually decreases in the direction away from the first end 121a. When the RF connector 121 is welded to the substrate 110 by the solder 20, it can be conveniently welded along the edge of the transition portion 1201, so that the height of the solder 20 relative to the substrate 110 gradually decreases from the RF connector 121 to the line 111, without deliberately controlling the movement of the soldering head to construct the shape of the solder. Alternatively, the transition portion 1201 can be directly welded to the substrate 110 and connected to the line 111, and the impedance of the RF connector 120 can be reduced by the transition portion 1201 and the impedance from the RF connector 120 to the line 111 can be continuously changed. After the transition portion 1201 is welded to the substrate 110, the excess solder can be directly absorbed without adding additional tin to construct the solder 20, which can reduce the difficulty of processing and improve the processing efficiency.

[0074] The specific principle and implementation method of the RF connector 120 provided in the embodiment of the present application are similar to those of the RF circuit assembly 100 in the aforementioned embodiment, and will not be repeated here.

[0075] Please refer to the above examples. Figure 8 ,like Figure 8 FIG. 1 is a schematic structural diagram of a radio frequency circuit assembly 100 provided in another embodiment of the present application.

[0076] Figure 8 The RF circuit assembly 100 shown includes a substrate 110 and Figure 7 The RF connector 120 shown in the figure. A circuit 111 is formed on the substrate 110, the substrate 110 can carry the RF device 10, and the circuit 111 is connected to the RF device 10; the RF connector 120 is connected to the substrate 110, and the RF connecting portion 121 of the RF connector 120 is connected to the circuit 111. The height of the transition portion 1201 of the RF connector 120 relative to the substrate 110 gradually decreases in the direction away from the first end 121a.

[0077] The specific principle and implementation method of the RF circuit component 100 provided in the embodiment of the present application are similar to those of the RF circuit component 100 of the aforementioned embodiment, and will not be repeated here.

[0078] Please refer to the above examples. Fig. 9 ,like Fig. 9 Shown is a schematic block diagram of a radio frequency chip testing system provided by another embodiment of the present application.

[0079] The RF chip testing system includes the aforementioned RF circuit assembly 100 and a testing device 200 , wherein the testing device 200 is connected to the RF connector 120 in the RF circuit assembly 100 .

[0080] The specific principles and implementation methods of the RF chip testing system provided in the embodiment of the present application are similar to those of the RF circuit assembly 100 in the aforementioned embodiment, and will not be repeated here.

[0081] It should be understood that the terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0082] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there may be no intervening elements or layers. It should be understood that, although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer or part discussed below may be represented as a second element, component, region, layer or part.

[0083] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein for ease of description to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the accompanying drawings is flipped, then the elements or features described as "under other elements" or "under" or "under" will be oriented as "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0084] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present invention. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0085] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A radio frequency circuit assembly, characterized in that: The radio frequency circuit assembly comprises: A substrate, on which a circuit is formed, the substrate can carry a radio frequency device, and the circuit is connected to the radio frequency device; A radio frequency connector, the radio frequency connector is connected to the substrate, the radio frequency connector includes a radio frequency connecting part, the radio frequency connecting part is connected to the circuit through a soldering object; the height of the radio frequency connecting part relative to the substrate is greater than the height of the circuit, and the height of the soldering object relative to the substrate gradually decreases from the radio frequency connecting part to the circuit.

2. The radio frequency circuit assembly according to claim 1, characterized in that: The RF connection portion is connected to or overlaps with at least a portion of a line segment of the circuit, and the at least a portion of the line segment is a line segment close to the RF connection portion.

3. The radio frequency circuit assembly according to claim 1, characterized in that: The length of the projection of the soldering object between the RF connector and the circuit on the substrate is one quarter to one time the length of the projection of the RF connector on the substrate.

4. The radio frequency circuit assembly according to claim 3, characterized in that: The length of the projection of the soldering object between the RF connector and the circuit on the substrate is one third of the length of the projection of the RF connector on the substrate.

5. The radio frequency circuit assembly according to any one of claims 1 to 4, characterized in that: The soldering object is located away from the side of the substrate and extends in a straight line from the RF connection portion to the circuit; or The soldering object is located away from the substrate and extends in an arc shape from the RF connection portion to the circuit, and the arc shape is concave toward the substrate; or The soldering object is located away from the substrate at one side thereof and extends from the RF connection portion to the circuit in an arc shape, and the arc shape is convex in a direction away from the substrate.

6. The radio frequency circuit assembly according to any one of claims 1 to 4, characterized in that: The solder object extends from a top end of the RF connection portion relative to the substrate to the substrate.

7. The radio frequency circuit assembly according to any one of claims 1 to 4, characterized in that: The RF connector further comprises a cable connecting portion for connecting a cable, a first end of the RF connecting portion is connected to the cable connecting portion, and a second end of the RF connecting portion is welded to the substrate and connected to the circuit.

8. The radio frequency circuit assembly according to claim 7, characterized in that: An end surface of the second end of the RF connecting portion is perpendicular to the substrate.

9. The radio frequency circuit assembly according to claim 7, characterized in that: A transition portion is formed at the second end of the RF connection portion, and a height of the transition portion relative to the substrate gradually decreases in a direction away from the first end.

10. The radio frequency circuit assembly according to any one of claims 1 to 4, characterized in that: The radio frequency device includes a radio frequency chip, and each of the plurality of radio frequency connectors is connected to a different signal end of the radio frequency chip through a different line.

11. A radio frequency circuit assembly, characterized in that: The radio frequency circuit assembly comprises: A substrate, on which a circuit is formed, the substrate can carry a radio frequency device, and the circuit is connected to the radio frequency device; A radio frequency connector, wherein the radio frequency connector is connected to the substrate, and a radio frequency connecting portion of the radio frequency connector is connected to the circuit; a first end of the radio frequency connecting portion is used to connect a cable, and a transition portion is formed at a second end of the radio frequency connecting portion, and a width of the transition portion gradually decreases in a direction away from the first end.

12. A radio frequency chip testing system, characterized in that: include: A radio frequency circuit component, wherein the radio frequency circuit component is the radio frequency circuit component according to any one of claims 1 to 10, or the radio frequency circuit component according to claim 11; A testing device is connected to the radio frequency connector in the radio frequency circuit assembly.

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