A high power erbium-ytterbium fiber amplifier structure

Abstract

The utility model relates to a high-power erbium-ytterbium optical fiber amplifier structure, comprising: a chassis, which is provided with an upper accommodating cavity and a lower accommodating cavity which are isolated from each other; an optical fiber component, which is arranged in the chassis, and the optical fiber component comprises a pump laser component and an erbium-ytterbium co-doped optical fiber component, the pump laser component is arranged in the upper accommodating cavity, the erbium-ytterbium co-doped optical fiber component is arranged in the lower accommodating cavity, and the pump laser component and the erbium-ytterbium co-doped optical fiber component are connected through an optical path element; a heat dissipation device, which is arranged in the chassis, and the heat dissipation device comprises heat dissipation fins and a heat dissipation fan, the heat dissipation fins are arranged between the upper accommodating cavity and the lower accommodating cavity, a heat dissipation channel is arranged in the heat dissipation fins, and the heat dissipation fan is arranged opposite to the heat dissipation channel. By adopting this structure, the heat dissipation efficiency of the heat dissipation device is improved, and the problem of unstable power of the amplifier at high temperature is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical fibers, in particular to a high-power erbium-ytterbium optical fiber amplifier structure. Background Art

[0002] With the continuous development of science and technology, fiber optic communication technology has become one of the main means of modern communication. In the fiber optic communication system, the fiber amplifier is a key component, and its performance directly affects the stability of the entire communication system. However, the fiber amplifier will generate a lot of heat energy during operation. If this heat energy cannot be effectively discharged, the amplifier performance will be degraded or even damaged. The traditional fiber amplifier heat dissipation method mainly adopts natural heat dissipation. Natural heat dissipation is to discharge heat through natural convection and radiation of the amplifier. This method is simple, but the heat dissipation efficiency is low, especially in high temperature environment, the heat dissipation effect is worse.

[0003] Therefore, there is an urgent need to provide a high-power erbium-ytterbium fiber amplifier structure to solve the above problems. Utility Model Content

[0004] The utility model aims to overcome the shortcomings and defects of the prior art, provide a high-power erbium-ytterbium optical fiber amplifier structure, improve the heat dissipation efficiency of the heat dissipation device, and solve the problem of unstable power of the amplifier at high temperature.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A high-power erbium-ytterbium fiber amplifier structure, characterized by comprising:

[0007] The chassis has an upper accommodating chamber and a lower accommodating chamber which are isolated from each other;

[0008] An optical fiber assembly is arranged in the chassis, the optical fiber assembly comprises a pump laser assembly and an erbium-ytterbium co-doped optical fiber assembly, the pump laser assembly is arranged in the upper accommodating cavity, the erbium-ytterbium co-doped optical fiber assembly is arranged in the lower accommodating cavity, and the pump laser assembly and the erbium-ytterbium co-doped optical fiber assembly are connected through an optical path element;

[0009] A heat dissipation device is arranged in the chassis, and the heat dissipation device includes heat dissipation fins and a heat dissipation fan. The heat dissipation fins are arranged between the upper accommodating cavity and the lower accommodating cavity. A heat dissipation channel is arranged in the heat dissipation fins, and the heat dissipation fan is arranged opposite to the heat dissipation channel.

[0010] The chassis comprises a lower cover plate, a lower shell, an upper cover plate and an upper shell, wherein the lower cover plate is arranged on the lower shell to form a lower accommodating cavity, and the upper cover plate is arranged on the upper shell to form an upper accommodating cavity.

[0011] The heat dissipation fins include an upper heat dissipation fin and a lower heat dissipation fin. The lower heat dissipation fin is arranged at the upper end of the lower shell, and the upper heat dissipation fin is arranged at the lower end of the upper shell. The upper heat dissipation fin and the lower heat dissipation fin are butt-jointed to form a heat dissipation fin.

[0012] The chassis is provided with an upper drawer opening and a lower drawer opening, wherein the upper drawer opening is arranged on the upper shell body, and the lower drawer opening is arranged on the lower shell body, the upper heat sink can be pulled out and placed in the upper drawer opening, and the lower heat sink can be pulled out and placed in the lower drawer opening.

[0013] The upper shell and the lower shell are both provided with ventilation holes, and the ventilation holes are provided in multiple groups.

[0014] The high-power erbium-ytterbium fiber amplifier structure also includes a main control board and a temperature sensor. Two temperature sensors are provided, and the two temperature sensors are respectively arranged in the upper accommodating cavity and the lower accommodating cavity. The main control board is arranged in a chassis, and the optical fiber assembly, the heat dissipation device and the temperature sensor are all electrically connected to the main control board. The two temperature sensors are used to monitor the temperature inside the chassis.

[0015] Hanging ears are arranged on both sides of the chassis to facilitate the fixing of the chassis.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] In the utility model, an upper accommodating chamber and a lower accommodating chamber are isolated from each other; an optical fiber assembly is arranged in a chassis, and the optical fiber assembly comprises a pump laser assembly and an erbium-ytterbium co-doped optical fiber assembly, wherein the pump laser assembly is arranged in the upper accommodating chamber, and the erbium-ytterbium co-doped optical fiber assembly is arranged in the lower accommodating chamber, wherein the pump laser assembly and the erbium-ytterbium co-doped optical fiber assembly are connected through an optical path element; a heat dissipation device is arranged in the chassis to dissipate heat for the optical fiber assembly, and the heat dissipation device comprises a heat dissipation fin and a heat dissipation fan, wherein the heat dissipation fin is arranged between the upper accommodating chamber and the lower accommodating chamber, and a heat dissipation channel is formed between the heat dissipation fins, and the heat generated by the erbium-ytterbium co-doped optical fiber assembly during operation is dissipated through the heat dissipation fins, so as to prevent the optical fiber assembly from being damaged or affecting the working speed due to excessive temperature; the heat dissipation fan is arranged opposite to the heat dissipation channel, and through the arrangement of the heat dissipation fan, the flow and exchange of air are accelerated, and the heat dissipation efficiency of the heat dissipation device is further improved, so as to solve the problem that the power of the amplifier is unstable at high temperature, and the optical fiber amplifier can be made to work stably within a certain temperature range. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of the utility model.

[0019] Figure 2 It is a rear view of the utility model.

[0020] Figure 3 It is a top view of the utility model.

[0021] The above drawings include the following reference numerals:

[0022] 1. Chassis, 11. Upper accommodating cavity, 12. Lower accommodating cavity, 21. Pump laser assembly, 22. Erbium-Ytterbium co-doped optical fiber assembly, 31. Heat dissipation fins, 311. Upper heat sink, 312. Lower heat sink, 32. Cooling fan, 41. Upper drawer opening, 42. Lower drawer opening, 5. Ventilation hole, 61. Main control board, 62. Temperature sensor, 7. Mounting ear. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0024] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] The technical solution of the utility model proposes a high-power erbium-ytterbium optical fiber amplifier structure.

[0027] Reference Figures 1 to 3 , in this embodiment, includes:

[0028] The chassis 1 has an upper accommodating chamber 11 and a lower accommodating chamber 12 which are isolated from each other;

[0029] The optical fiber assembly is arranged in the chassis 1, and the optical fiber assembly includes a pump laser assembly 21 and an erbium-ytterbium co-doped optical fiber assembly 22. The pump laser assembly 21 is arranged in the upper accommodating cavity 11, and the erbium-ytterbium co-doped optical fiber assembly 22 is arranged in the lower accommodating cavity 12. The pump laser assembly 21 and the erbium-ytterbium co-doped optical fiber assembly 22 are connected through an optical path element.

[0030] The heat dissipation device is arranged in the chassis 1, and the heat dissipation device includes heat dissipation fins 31 and a heat dissipation fan 32. The heat dissipation fins 31 are arranged between the upper accommodating cavity 11 and the lower accommodating cavity 12. A heat dissipation channel is arranged in the heat dissipation fins 31, and the heat dissipation fan 32 is arranged opposite to the heat dissipation channel.

[0031] Optionally, in this embodiment, the chassis 1 includes an upper accommodating chamber 11 and a lower accommodating chamber 12, and the upper accommodating chamber 11 and the lower accommodating chamber 12 are isolated from each other; the optical fiber assembly is arranged in the chassis 1, and the optical fiber assembly includes a pump laser assembly 21 and an erbium-ytterbium co-doped optical fiber assembly 22, wherein the pump laser assembly 21 is arranged in the upper accommodating chamber 11, and the erbium-ytterbium co-doped optical fiber assembly 22 is arranged in the lower accommodating chamber 12, wherein the pump laser assembly 21 and the erbium-ytterbium co-doped optical fiber assembly 22 are connected through an optical path element, and the pump laser assembly 21 and the erbium-ytterbium co-doped optical fiber assembly 22 are main heating elements; a heat dissipation device is arranged in the chassis 1 to dissipate heat from the optical fiber assembly, and the heat dissipation device includes a heat dissipation fin 31 and a heat dissipation fan 32, wherein the heat dissipation fin The sheet 31 is arranged between the upper accommodating chamber 11 and the lower accommodating chamber 12, and a heat dissipation channel is formed between the heat dissipation fins 31, that is, the heat generated by the pump laser component 21 arranged in the upper accommodating chamber 11 and the erbium-ytterbium co-doped optical fiber component 22 located in the lower accommodating chamber 12 during operation is dissipated through the heat dissipation fins 31, so as to prevent the optical fiber component from being damaged due to excessive temperature or affecting the working speed; the heat dissipation fan 32 is arranged opposite to the heat dissipation channel, that is, the heat dissipation efficiency of the single heat dissipation fin 31 is not high. By setting the heat dissipation fan 32, the flow and exchange of air are accelerated, and the heat dissipation efficiency of the heat dissipation device is further improved, so as to solve the problem that the power of the amplifier is unstable at high temperature, and the optical fiber amplifier can work stably within a certain temperature range.

[0032] In this embodiment, the chassis 1 includes a lower cover plate, a lower shell, an upper cover plate and an upper shell, wherein the lower cover plate is arranged on the lower shell to form a lower accommodating cavity 12, and the upper cover plate is arranged on the upper shell to form an upper accommodating cavity 11, that is, the upper cover plate and the lower cover plate are detachably connected to the shell of the chassis 1, which is convenient for observing, repairing and replacing the internal components. Further, the heat dissipation fin 31 includes an upper heat dissipation fin 311 and a lower heat dissipation fin 312, wherein the lower heat dissipation fin 312 is arranged at the upper end of the lower shell, and the upper heat dissipation fin 311 is arranged at the lower end of the upper shell, and the heat dissipation fin 31 is formed by docking the upper heat dissipation fin 311 and the lower heat dissipation fin 312, and the heat dissipation channel is formed between the upper heat dissipation fin 311 and the lower heat dissipation fin 312, wherein the shape of the heat dissipation channel is not limited here, and thermal conductive silicone grease can be filled in the heat dissipation channel, which can further improve the heat dissipation efficiency of the heat dissipation device and make the working temperature of the optical fiber amplifier more stable.

[0033] In this embodiment, an upper drawer opening 41 and a lower drawer opening 42 are provided on the chassis 1. The upper drawer opening 41 is provided on the upper shell body, and the lower drawer opening 42 is provided on the lower shell body. The upper heat sink 311 can be pulled out and placed in the upper drawer opening 41, and the lower heat sink 312 can be pulled out and placed in the lower drawer opening 42. The heat dissipating fins 31 are easily damaged or dusty due to long-term use. In conventional devices, the heat dissipating fins 31 are fixed in the chassis 1 and cannot be replaced, which may cause damage or dust accumulation, resulting in reduced heat dissipation efficiency. Through the drawer pull-out setting, the device can conveniently take out the heat dissipating fins 31 for inspection, cleaning and replacement, thereby maintaining the heat dissipation efficiency of the heat dissipating fins 31. In other embodiments, the heat dissipating fan 32 can also be pulled out and placed in the drawer, which is convenient for subsequent replacement and cleaning of the fan.

[0034] In this embodiment, ventilation holes 5 are provided on both the upper shell and the lower shell, and there are multiple groups of ventilation holes 5, which are evenly distributed on the upper shell and the lower shell. Through the setting of the ventilation holes 5, the air in the device can circulate and exchange with the outside air more quickly, further improving the heat dissipation efficiency of the heat dissipation device.

[0035] In this embodiment, the high-power erbium-ytterbium fiber amplifier structure also includes a main control board 61 and a temperature sensor 62. The temperature sensor 62 is provided with two, and the two temperature sensors 62 are respectively arranged in the upper accommodating chamber 11 and the lower accommodating chamber 12. The two temperature sensors 62 are used to monitor the working temperature of the erbium-ytterbium co-doped optical fiber and transmit the monitored signal to the main control board 61. The optical fiber assembly, the heat dissipation device and the temperature sensor 62 are all electrically connected to the main control board 61. The main control board 61 makes real-time adjustments based on the temperature information fed back by the temperature sensor 62 to control the working efficiency of the cooling fan 32 and the working state of the optical fiber assembly to prevent the temperature in the chassis 1 from being too high. Furthermore, the chassis 1 is provided with hanging ears 7 on both sides. The arrangement of the hanging ears 7 facilitates the installation and fixation of the chassis 1 and prevents it from being moved due to external interference during use.

[0036] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A high power erbium-ytterbium fiber amplifier structure, characterized in that: include: The chassis has an upper accommodating chamber and a lower accommodating chamber which are isolated from each other; An optical fiber assembly is arranged in the chassis, the optical fiber assembly comprises a pump laser assembly and an erbium-ytterbium co-doped optical fiber assembly, the pump laser assembly is arranged in the upper accommodating cavity, the erbium-ytterbium co-doped optical fiber assembly is arranged in the lower accommodating cavity, and the pump laser assembly and the erbium-ytterbium co-doped optical fiber assembly are connected through an optical path element; A heat dissipation device is arranged in the chassis, and the heat dissipation device includes heat dissipation fins and a heat dissipation fan. The heat dissipation fins are arranged between the upper accommodating cavity and the lower accommodating cavity. A heat dissipation channel is arranged in the heat dissipation fins, and the heat dissipation fan is arranged opposite to the heat dissipation channel.

2. A high power Erbium-Ytterbium fiber amplifier structure according to claim 1, characterized in that: The chassis comprises a lower cover plate, a lower shell, an upper cover plate and an upper shell, wherein the lower cover plate is arranged on the lower shell to form a lower accommodating cavity, and the upper cover plate is arranged on the upper shell to form an upper accommodating cavity.

3. A high power Erbium-Ytterbium fiber amplifier structure according to claim 2, characterized in that: The heat dissipation fins include an upper heat dissipation fin and a lower heat dissipation fin. The lower heat dissipation fin is arranged at the upper end of the lower shell, and the upper heat dissipation fin is arranged at the lower end of the upper shell. The upper heat dissipation fin and the lower heat dissipation fin are butt-jointed to form a heat dissipation fin.

4. A high power Erbium-Ytterbium fiber amplifier structure according to claim 3, characterized in that: The chassis is provided with an upper drawer opening and a lower drawer opening, wherein the upper drawer opening is arranged on the upper shell body, and the lower drawer opening is arranged on the lower shell body, the upper heat sink can be pulled out and placed in the upper drawer opening, and the lower heat sink can be pulled out and placed in the lower drawer opening.

5. A high power Erbium-Ytterbium fiber amplifier structure according to claim 2, characterized in that: The upper shell and the lower shell are both provided with ventilation holes, and the ventilation holes are provided in multiple groups.

6. A high power Erbium-Ytterbium fiber amplifier structure according to claim 1, characterized in that: The high-power erbium-ytterbium fiber amplifier structure also includes a main control board and a temperature sensor. Two temperature sensors are provided, and the two temperature sensors are respectively arranged in the upper accommodating cavity and the lower accommodating cavity. The main control board is arranged in a chassis, and the optical fiber assembly, the heat dissipation device and the temperature sensor are all electrically connected to the main control board. The two temperature sensors are used to monitor the temperature inside the chassis.

7. A high power Erbium-Ytterbium fiber amplifier structure according to claim 1, characterized in that: Hanging ears are arranged on both sides of the chassis to facilitate the fixing of the chassis.

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