Vibration devices and electronic equipment
By designing the combination of circuit board and piezoelectric body in electronic devices, the problem of large space occupation and single vibration experience in common motors in electronic devices is solved, and the vibration effect at multiple positions and levels is achieved, which improves the lightness and user experience of the equipment.
Patent Information
- Application Number
- CN202421179319.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-05-27
AI Technical Summary
Common Z-axis linear motors and X-axis linear motors have problems such as large space occupation and single vibration experience in electronic devices.
A vibration device is designed, including a circuit board and at least two piezoelectric bodies. The piezoelectric bodies are respectively arranged in different areas of the circuit board and are electrically connected to the control circuit, so that multi-position and multi-level vibration effects can be achieved through piezoelectric effect.
The vibration device is simple in structure and takes up a small space, which helps improve the lightness of the vibration device and its equipment, and provides a richer user experience through multi-position vibration.
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Figure CN222706480U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of electronic technology, and in particular to a vibration device and an electronic device. Background Art
[0002] In electronic devices, vibration feedback devices can help users gain a more multi-dimensional experience during use, and are therefore widely used in functional areas such as incoming call vibration and operation vibration.
[0003] In the related art, the motor is the main power source for providing vibration feedback. However, the common Z-axis linear motor and X-axis linear motor have the problems of large space occupation and single vibration experience when applied to electronic devices. Utility Model Content
[0004] The present disclosure provides a vibration device and an electronic device to solve related technical problems.
[0005] A first aspect of the present disclosure provides a vibration device, comprising:
[0006] Circuit board, including control circuit;
[0007] At least two piezoelectric bodies are respectively arranged in different areas of the circuit board, and the piezoelectric bodies are respectively conductively connected to the control circuit.
[0008] Optionally, the circuit board includes at least two connected extension sections, and free ends of the extension sections are provided with piezoelectric connecting parts; the piezoelectric bodies are respectively arranged at different piezoelectric connecting parts.
[0009] Optionally, the extension section includes a strip structure; the circuit board also includes a main body, and the other end of the extension section opposite to the free end is connected to the main body.
[0010] Optionally, the extension section includes a first section and a second section that are bent relative to each other; the first section and the second section are bent in a first direction parallel to the thickness direction of the circuit board, or the first section and the second section are bent in a second direction perpendicular to the first direction.
[0011] Optionally, the vibration device further includes a buffer layer, and the buffer layer covers the piezoelectric body.
[0012] Optionally, the material of the buffer layer includes silica gel.
[0013] Optionally, the vibration device further includes a glue layer, and the glue layer is arranged on a side of the circuit board facing away from the piezoelectric body.
[0014] Optionally, at least one piezoelectric body can be controlled to vibrate and deform in a direction parallel to the thickness of the circuit board;
[0015] And / or, at least one piezoelectric body can be controlled to vibrate and deform in a direction perpendicular to the thickness of the circuit board.
[0016] Optionally, the piezoelectric body includes a piezoelectric film layer disposed on the circuit board.
[0017] According to a second aspect of the present disclosure, an electronic device is provided, comprising any vibration device described in the first aspect.
[0018] Optionally, the electronic device includes a rear shell, and the vibration device is fixed to the inner surface of the rear shell by bonding with an adhesive layer.
[0019] The technical solution provided by the present disclosure can at least achieve the following beneficial effects:
[0020] The vibration device disclosed in the present invention includes a circuit board and at least two piezoelectric bodies, has a simple structure, occupies a small space, and helps to improve the lightness and thinness of the vibration device and the electronic device using the vibration device. The piezoelectric bodies are arranged in different areas of the circuit board, and energy and control signals can be transmitted through the conductive connection between the piezoelectric bodies and the control circuit of the circuit board, thereby obtaining vibration effects in multiple positions and at multiple levels.
[0021] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.
[0023] Figure 1 is a schematic diagram of a three-dimensional structure of a vibration device in an exemplary embodiment of the present disclosure;
[0024] Figure 2 is a partial structural diagram of an electronic device in an exemplary embodiment of the present disclosure;
[0025] Figure 3 is a schematic diagram of an exploded structure of a vibration device in an exemplary embodiment of the present disclosure;
[0026] Figure 4 is a schematic diagram of a partial cross-sectional structure of an electronic device in an exemplary embodiment of the present disclosure;
[0027] Figure 5 It is a schematic diagram of a partial structure of an electronic device in another exemplary embodiment of the present disclosure. DETAILED DESCRIPTION
[0028] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this specification. Instead, they are merely examples of devices and methods consistent with some aspects of this specification as detailed in the appended claims.
[0029] The terms used in this disclosure are only for the purpose of describing specific embodiments and are not intended to limit the disclosure. Unless otherwise defined, the technical terms or scientific terms used in this specification should be understood by people with ordinary skills in the field to which the disclosure belongs. The words "first", "second" and similar words used in this specification and claims do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantitative limit, but indicate the existence of one. "Multiple" or "several" means two and more than two. Unless otherwise specified, words such as "front", "rear", "lower" and / or "upper" are only for the convenience of explanation and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect.
[0030] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. The singular forms of "a", "the" and "the" used in this specification and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.
[0031] In electronic devices, vibration feedback devices can help users gain a more multi-dimensional experience during use, and are therefore widely used in functions such as incoming call vibration and operation vibration. In related technologies, motors are the main power source for providing vibration feedback. However, common Z-axis linear motors and X-axis linear motors have the problem of large space occupation and single vibration experience when applied to electronic devices.
[0032] The present disclosure provides a vibration device. Figure 1is a schematic diagram of a three-dimensional structure of a vibration device in an exemplary embodiment of the present disclosure, Figure 2 is a partial structural diagram of an electronic device in an exemplary embodiment of the present disclosure, such as Figure 1 , Figure 2 As shown, the vibration device 1 includes a circuit board 11 and at least two piezoelectric bodies 12. The circuit board 11 includes a control circuit, and the piezoelectric bodies 12 are respectively arranged in different areas of the circuit board 11, and the piezoelectric bodies 12 are respectively conductively connected to the control circuits.
[0033] The vibration device 1 includes a circuit board 11 and at least two piezoelectric bodies 12, has a simple structure, occupies a small space, and helps to improve the lightness and thinness of the vibration device 1 and the electronic device 2 using the vibration device 1. The piezoelectric bodies 12 are arranged in different areas of the circuit board 11, and energy and control signals can be transmitted through the piezoelectric bodies 12 and the control circuits of the circuit board 11, so as to obtain multi-position and multi-level vibration effects and improve the human-computer interaction experience.
[0034] It should be noted that the piezoelectric body 12 may refer to a component that can be deformed along a preset direction under the control of an electrical signal based on the piezoelectric effect, and the piezoelectric body 12 can use the above deformation to form regular vibrations. The material of the piezoelectric body 12 may include quartz, ceramics, polymer materials, etc., and the present disclosure is not limited to this. In an embodiment of the present disclosure, the piezoelectric body 12 may be a piezoelectric film layer supported by the above-mentioned material having a piezoelectric effect, and the piezoelectric film layer may be assembled on the circuit board 11 through the SMT (Surface Mount Technology) process, which reduces the overall size of the vibration device 1 and helps to achieve the miniaturization of the vibration device 1. In some embodiments, the overall thickness of the vibration device 1 may be less than or equal to 0.2 mm.
[0035] In addition, the circuit board 11 may be a circuit board 11 including a hard substrate, or may be a flexible circuit board 11. When the circuit board 11 is a flexible circuit board 11, the weight and space occupied by the vibration device 1 may be further reduced, and the bending performance may be improved.
[0036] The circuit board 11 may be rectangular, circular or irregular in shape, and the present disclosure does not limit the shape of the circuit board 11. When the circuit board 11 is irregular in shape, it can flexibly adapt to the spatial layout inside the electronic device 2 and avoid other components inside the electronic device 2.
[0037] In some embodiments, the circuit board 11 includes at least two connected extension sections 111, the free ends of the extension sections 111 are provided with piezoelectric connecting parts 1113, and the piezoelectric bodies 12 are respectively provided at different piezoelectric connecting parts 1113. Providing the extension sections 111 for the circuit board 11 and arranging the piezoelectric connecting parts 1113 at the free ends of the extension sections 111 can optimize the structural distribution of the circuit board 11 and facilitate the flexible layout of the piezoelectric bodies 12.
[0038] The free end of the extension segment 111 may refer to the end of two connected extension segments 111 , where one extension segment 111 is away from the other extension segment 111 .
[0039] Furthermore, the extension section 111 may include a strip structure, and the circuit board 11 further includes a main body 112, and the other end of the extension section 111 opposite to the free end is connected to the main body 112. The width of the extension section 111 of the strip structure is reduced, so that it is easy to bend flexibly in the length direction. The connection between the extension section 111 of the strip structure and the main body 112 can not only facilitate the mutual connection between multiple extension sections 111, but also improve the overall structural stability and reliability of the circuit board 11 with the help of the structure of the main body 112.
[0040] The other end of the extension section 111 opposite to the free end may be directly or indirectly connected to the main body 112. For example, the other end of some extension sections 111 opposite to the free end may be directly connected to the main body 112, and the other end of all extension sections 111 opposite to the free end may be connected to another extension section 111, thereby achieving indirect connection with the main body 112.
[0041] It should be noted that the shape of the main body 112 can be circular, rectangular or other irregular shapes, and the present disclosure is not limited thereto. When the main body 112 is circular, the other end of the extension section 111 opposite to the free end can be connected to any edge position of the main body 112 in the circumferential direction. For example, the extension sections 111 directly connected to the main body 112 can be evenly distributed along the circumference of the main body 112.
[0042] In some embodiments, the extension section 111 includes a first section 1111 and a second section 1112 that are bent relative to each other, and the first section 1111 and the second section 1112 are bent in a first direction parallel to the thickness direction of the circuit board 11. Figure 1-Figure 3 As shown, the first section 1111 and the second section 1112 are bent in a second direction perpendicular to the first direction. The bending of the extension section 111 can avoid the internal components of the electronic device 2, which helps to expand the distribution of the piezoelectric connection part 1113, and use the piezoelectric body 12 set in the piezoelectric connection part 1113 to achieve vibration feedback effects in different areas. Figure 3 The dashed arrow in may represent the first direction, and the dash-dot arrow may represent the second direction.
[0043] Among them, the extension section 111 may include a first section 1111 and a second section 1112 bent along a first direction, and may also include a first section 1111 and a second section 1112 bent along a second direction. The first direction may refer to a thickness direction parallel to the circuit board 11, and the second direction may refer to any direction in a plane perpendicular to the thickness direction of the circuit board 11. The angle between the first section 1111 and the second section 1112 after bending may be 90 degrees, or may be other angles that can achieve the expected distribution path, and the present disclosure is not limited to this. In addition, the above-mentioned extension section 111 may include multiple groups of first sections 1111 and second sections 1112, and the first sections 1111 and the second sections 1112 may be bent along the first direction and / or the second direction.
[0044] In some embodiments, Figure 3 , Figure 4 As shown, the vibration device 1 may further include a buffer layer 13 , which covers the piezoelectric body 12 to transmit pressure and form a buffer effect.
[0045] In some embodiments, the buffer layer 13 can cover the piezoelectric body 12 and the circuit board 11 to facilitate processing, manufacturing and assembly. In other embodiments, the buffer layer 13 can be the same shape as the piezoelectric body 12 to cover the piezoelectric body 12 and avoid interfering with the structure and function of other areas of the circuit board 11.
[0046] The material of the buffer layer 13 may be silicone or other elastic materials, which is not limited in the present disclosure.
[0047] In some embodiments, the vibration device 1 may further include an adhesive layer 14 , which is disposed on a side of the circuit board 11 facing away from the piezoelectric body 12 , so as to fix the vibration device 1 .
[0048] The structure of the adhesive layer 14 may be the same as that of the circuit board 11, so as to achieve an overall fixing effect on the device. Alternatively, the structure of the adhesive layer 14 may include at least two first parts having the same shape as the piezoelectric body 12 and a second part having the same shape as the main body 112 of the circuit board 11, so that the adhesive layer 14 is arranged in a region corresponding to the piezoelectric body 12 and the main body 112 on the side of the circuit board 11 facing away from the piezoelectric body 12, so as to simplify the structural layout of the adhesive layer 14.
[0049] In other embodiments, the vibration device 1 may also be fixed to the corresponding structure of the electronic device 2 by means of snap connection, threaded connection, etc.
[0050] In some embodiments, Figure 5 As shown, at least one piezoelectric body 12 can be controlled to vibrate and deform in a direction parallel to the thickness of the circuit board 11. And / or, in other embodiments, at least one piezoelectric body 12 can be controlled to vibrate and deform in a direction perpendicular to the thickness of the circuit board 11. The selection and control of the vibration direction of the piezoelectric body 12 can enrich the user's vibration feedback experience and help improve the user experience.
[0051] Since the piezoelectric body 12 can be deformed along a preset direction under the control of an electrical signal based on the piezoelectric effect, and the above deformation can be used to form regular vibrations, the piezoelectric body 12 at one, two or more positions can be selected to vibrate through the control of the electrical signal, and the vibration amplitude of the piezoelectric body 12 at different positions can be adjusted, thereby obtaining multi-position and multi-level vibration effects.
[0052] The present disclosure further provides an electronic device 2, such as Figure 2 , Figure 4 , Figure 5 As shown, the electronic device 2 includes the vibration device 1 mentioned above.
[0053] Since the vibration device 1 includes a circuit board 11 and at least two piezoelectric bodies 12, the structure is simple and the space occupied is small, which helps to improve the lightness and thinness of the vibration device 1 and the electronic device 2 using the vibration device 1. The piezoelectric bodies 12 are arranged in different areas of the circuit board 11, and energy and control signals can be transmitted through the conductive connection between the piezoelectric bodies 12 and the control circuit of the circuit board 11, so as to obtain vibration effects in multiple positions and at multiple levels.
[0054] Among them, an electrical connection part can be provided on the vibration device 1, for example, an electrical connection part can be set on the main body 112 of the circuit board 11, and the electrical connection part is used to achieve electrical connection and control signal transmission with the control motherboard of the electronic device 2, so that the vibration device 1 is controlled by the control motherboard of the electronic device 2.
[0055] It should be noted that the position of the piezoelectric body 12 of the above-mentioned vibration device 1 can correspond to a specific area of the electronic device 2, such as the user's habitual operation area, the physical function button area, the virtual function button area, etc. The present disclosure does not limit the distribution position of the piezoelectric body 12.
[0056] In some embodiments, the vibration device 1 can be fixed to the middle frame, rear case 21, screen, etc. of the electronic device 2, and the present disclosure does not limit this. The vibration device 1 can be fixed to the inner surface of the rear case 21 or the middle frame by bonding with an adhesive layer.
[0057] It should be noted that the electronic device 2 may be a mobile phone, a tablet computer, a vehicle-mounted terminal, a medical terminal, a wearable device, etc., and the present disclosure does not limit this.
[0058] The above is only a preferred embodiment of the present disclosure and does not limit the present disclosure in any form. Although the present disclosure has been disclosed as a preferred embodiment as above, it is not used to limit the present disclosure. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present disclosure. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present disclosure without departing from the content of the technical solution of the present disclosure are still within the scope of the technical solution of the present disclosure.
Claims
1. A vibration device, characterized in that: include: Circuit board, including control circuit; At least two piezoelectric bodies, the piezoelectric bodies are respectively arranged in different areas of the circuit board, and the piezoelectric bodies are respectively conductively connected to the control circuit; The circuit board comprises at least two connected extension sections, and the free ends of the extension sections are provided with piezoelectric connecting parts; the piezoelectric bodies are respectively arranged at different piezoelectric connecting parts.
2. The vibration device according to claim 1, characterized in that The extension section includes a strip structure; the circuit board also includes a main body, and the other end of the extension section opposite to the free end is connected to the main body.
3. The vibration device according to claim 1, characterized in that The extension section includes a first section and a second section that are bent relative to each other; the first section and the second section are bent in a first direction parallel to the thickness direction of the circuit board, or the first section and the second section are bent in a second direction perpendicular to the first direction.
4. The vibration device according to claim 1, characterized in that A buffer layer is also included, and the buffer layer covers the piezoelectric body.
5. The vibration device according to claim 4, characterized in that The material of the buffer layer includes silica gel.
6. The vibration device according to claim 1, characterized in that It also includes an adhesive layer, which is arranged on a side of the circuit board facing away from the piezoelectric body.
7. The vibration device according to claim 1, characterized in that At least one piezoelectric body can be controlled to vibrate and deform in a direction parallel to the thickness of the circuit board; And / or, at least one piezoelectric body can be controlled to vibrate and deform in a direction perpendicular to the thickness of the circuit board.
8. The vibration device according to claim 1, characterized in that The piezoelectric body includes a piezoelectric film layer arranged on the circuit board.
9. An electronic device, characterized in that: Comprising a vibration device as described in any one of claims 1-8.
10. The electronic device according to claim 9, characterized in that: The electronic device comprises a rear shell, and the vibration device is fixed to the inner surface of the rear shell by bonding with an adhesive layer.