A plastic packaging mold for semiconductors

Abstract

The utility model relates to the technical field of plastic packaging molds, and more specifically, to a plastic packaging mold for semiconductors. The utility model is provided with a motor to drive a connecting plate to move downward, thereby causing a sliding rod to move downward. At this time, the elastic pressure applied to the sliding sleeve by a spring causes the sliding sleeve to elastically squeeze the surface of the semiconductor to prevent the semiconductor from being crushed. At the same time, the lengths of multiple sliding sleeves decrease in sequence, which can prevent bubbles from remaining in the plastic packaging and being unable to be discharged due to the surface of the semiconductor parts being fully covered at the same time when the semiconductor parts are squeezed, thereby increasing the exhaust effect on the inner side of the plastic packaging film.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic packaging molds, in particular to a plastic packaging mold used for semiconductors. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields. Semiconductors need to be plastic-sealed during production and transportation. Under current technology, the efficiency of removing air from the inside of the plastic film during the plastic sealing of semiconductor parts is low. If there is a large amount of air inside the semiconductor parts after plastic sealing, the life of the semiconductor parts will be reduced, and even the semiconductor parts will be damaged, which will not only reduce production efficiency, but also cause waste of resources. In view of this, we propose a plastic sealing mold for semiconductors. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor plastic packaging mold to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides a kind of plastic packaging mold for semiconductors, including a conveying device, a film conveying device is arranged on the top of the conveying device, an exhaust device is arranged on the inner side of the film conveying device, and the exhaust device includes a connecting plate. A telescopic motor is fixedly provided on the upper side of the film conveying device, and the end of the telescopic shaft of the telescopic motor is fixedly connected to the top of the connecting plate. A plurality of sliding rods arranged in a rectangular array are fixedly connected to the bottom end of the connecting plate. A sliding sleeve is slidingly arranged on the outer side of the sliding rod. The connecting plate is driven downward by the telescopic motor to squeeze the semiconductor parts, and the air inside the package is discharged by squeezing.

[0005] As a further improvement of the technical solution, a spring is fixedly connected between the end of the sliding rod and the inner wall of the sliding sleeve, and the lengths of the plurality of sliding sleeves decrease in sequence.

[0006] As a further improvement of the technical solution, a connecting sleeve is fixedly connected to the outer side of the connecting plate, and a heating plastic sleeve is fixedly connected to the bottom end of the connecting sleeve.

[0007] As a further improvement of the technical solution, a cutting sleeve is slidably arranged on the outer side of the connecting sleeve, and the top end of the cutting sleeve is fixedly connected to two hydraulic cylinders respectively located on both sides of the telescopic motor.

[0008] As a further improvement of the technical solution, the film conveying device includes a casing, a plurality of fixed plates are fixedly connected to the top of the casing, a unwinding roller and a winding roller are rotatably arranged between two fixed plates at corresponding positions, and a plurality of guide rollers are rotatably arranged inside the casing.

[0009] As a further improvement of the technical solution, the conveying device includes two frames, two conveying rollers are rotatably arranged between the two frames, one side of one of the frames is fixedly connected to a driving motor, the output shaft end of the driving motor is fixedly connected to one of the conveying rollers, a conveyor belt is transmission-connected between the two conveying rollers, and a plurality of cutting grooves are equidistantly provided on the outside of the conveyor belt, and the cutting grooves match the cutting sleeve.

[0010] Compared with the prior art, the utility model has the following beneficial effects:

[0011] The invention is applied to a semiconductor plastic packaging mold. A motor is set to drive the connecting plate to move downward, thereby moving the slide rod downward. At this time, the elastic pressure applied to the slide sleeve by the spring causes the slide sleeve to elastically squeeze the surface of the semiconductor to prevent the semiconductor from being crushed. At the same time, the lengths of multiple slide sleeves decrease in sequence, which can prevent bubbles from remaining in the plastic packaging and being unable to be discharged due to the surface of the semiconductor parts being fully covered at the same time when the semiconductor parts are squeezed, thereby increasing the exhaust effect on the inside of the plastic packaging film. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 It is a cross-sectional structural schematic diagram of the utility model;

[0014] Figure 3 It is a cross-sectional structural schematic diagram of the utility model membrane conveying device;

[0015] Figure 4 It is a cross-sectional structural schematic diagram of the utility model exhaust device.

[0016] The meaning of each number in the figure is:

[0017] 1. Conveying device; 11. Frame plate; 12. Conveying roller; 13. Conveying belt; 14. Cutting groove; 2. Film conveying device; 21. Casing; 22. Fixing plate; 23. Unwinding roller; 24. Winding roller; 25. Guide roller; 3. Exhaust device; 31. Cutting sleeve; 32. Hydraulic cylinder; 33. Connecting plate; 34. Telescopic motor; 35. Sliding rod; 36. Sliding sleeve; 37. Connecting sleeve; 38. Heating plastic sealing sleeve. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0020] Example 1

[0021] See also Figure 1-Figure 4 As shown, this embodiment provides a kind of application to semiconductor plastic packaging mold, including a conveying device 1, a film conveying device 2 is arranged on the top of the conveying device 1, an exhaust device 3 is arranged on the inner side of the film conveying device 2, the conveying device 1 includes two frames 11, two conveying rollers 12 are rotatably arranged between the two frames 11, one side of one of the frames 11 is fixedly connected with a driving motor, the output shaft end of the driving motor is fixedly connected with one of the conveying rollers 12, the conveying roller 12 is driven to rotate by the driving motor, and a conveyor belt 13 is transmission-connected between the two conveying rollers 12, and the conveying of semiconductor parts by the conveyor belt 13 has the advantage of being more stable. The film conveying device 2 includes a casing 21, and a plurality of fixed plates 22 are fixedly connected to the top of the casing 21. A unwinding roller 23 and a winding roller 24 are rotatably arranged between two fixed plates 22 at corresponding positions. The plastic film is transported by the arrangement of the unwinding roller 23 and the winding roller 24. When the film plastic-sealed by the semiconductor parts is cut, it can continue to move, so that the winding roller 24 collects the waste film for subsequent processing to avoid waste of resources. In addition, a plurality of guide rollers 25 are rotatably arranged on the inner side of the casing 21. The position of the plastic film is limited by the arrangement of the guide rollers 25 to prevent the plastic film from sagging due to its own gravity and affecting the plastic sealing of the semiconductor parts.

[0022] The exhaust device 3 includes a connecting plate 33, a telescopic motor 34 is fixedly provided on the upper side of the film conveying device 2, the end of the telescopic shaft of the telescopic motor 34 is fixedly connected to the top of the connecting plate 33, and a plurality of sliding rods 35 arranged in a rectangular array are fixedly connected to the bottom of the connecting plate 33. A sliding sleeve 36 is slidably provided on the outer side of the sliding rod 35. The connecting plate 33 is driven downward by the telescopic motor 34 to make the sliding sleeve 36 squeeze the semiconductor parts, and the air inside the plastic sealing film is expelled by squeezing, so as to avoid affecting the storage life of the semiconductor parts due to excessive residual air in the package. The lengths of the plurality of sliding sleeves 36 decrease in sequence. When the connecting plate 33 moves downward, the plurality of sliding sleeves 36 are arranged in a successively decreasing length to avoid the semiconductor parts being squeezed due to the semiconductor parts being squeezed. The surfaces of the conductor parts are fully covered at the same time, resulting in residual bubbles in the plastic seal and unable to be discharged, thereby increasing the exhaust effect on the inside of the plastic film. A spring is fixedly connected between the end of the slide rod 35 and the inner wall of the sleeve 36. The setting of the spring can not only prevent the sleeve 36 from slipping, but also enable the sleeve 36 to elastically pressurize the semiconductor parts to prevent the semiconductor parts from being squeezed and damaged. A connecting sleeve 37 is fixedly connected to the outside of the connecting plate 33, and a heating plastic sealing sleeve 38 is fixedly connected to the bottom of the connecting sleeve 37. When the air inside the plastic film is squeezed out, as the connecting plate 33 continues to move downward, the plastic sealing film on the upper and lower sides of the semiconductor is squeezed and heated by the setting of the heating plastic sealing sleeve 38 to complete the plastic sealing of the semiconductor.

[0023] A cutting sleeve 31 is slidably arranged on the outside of the connecting sleeve 37, and two hydraulic cylinders 32 are fixedly connected to the top of the cutting sleeve 31 and are respectively located on both sides of the telescopic motor 34. A plurality of cutting grooves 14 are equidistantly provided on the outside of the conveyor belt 13, and the cutting grooves 14 match the cutting sleeve 31. After the semiconductor is plastic-sealed, the hydraulic cylinder 32 moves the cutting sleeve 31 downward to the cutting groove 14 provided on the surface of the conveyor belt 13 to cut the plastic film, and the conveyor belt 13 continues to convey it.

[0024] In a specific use of a semiconductor encapsulation mold according to the present embodiment, the user places the semiconductor on the surface of the conveyor belt 13 and conveys it through the conveyor belt 13. When the semiconductor moves to the bottom of the connecting plate 33, the conveying stops. At this time, the connecting plate 33 is driven downward by the telescopic motor 34, and the elastic pressure applied to the sliding sleeve 36 by the spring causes the sliding sleeve 36 to squeeze the surface of the semiconductor. The setting of the plurality of sliding sleeves 36 with decreasing lengths in sequence avoids the residual bubbles in the plastic film and makes them unable to be discharged due to the full coverage of the surface of the semiconductor parts when the semiconductor parts are squeezed, thereby increasing the exhaust effect on the inner side of the plastic film. After the semiconductor is encapsulated, the cutting sleeve 31 is driven by the hydraulic cylinder 32 to move into the incision groove 14 to cut the plastic film, and the encapsulated semiconductor is output by the conveyor belt 13, and multiple semiconductors are continuously encapsulated in this cycle.

[0025] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor plastic packaging mold, comprising a conveying device (1), characterized in that: A film conveying device (2) is arranged at the top of the conveying device (1), and an exhaust device (3) is arranged inside the film conveying device (2). The exhaust device (3) includes a connecting plate (33). A telescopic motor (34) is fixedly arranged on the upper side of the film conveying device (2). The end of the telescopic shaft of the telescopic motor (34) is fixedly connected to the top of the connecting plate (33). The bottom of the connecting plate (33) is fixedly connected to a plurality of sliding rods (35) arranged in a rectangular array. A sliding sleeve (36) is slidably arranged on the outer side of the sliding rod (35). The telescopic motor (34) drives the connecting plate (33) to move downward so that the sliding sleeve (36) squeezes the semiconductor parts, and the air inside the package is discharged by squeezing.

2. The semiconductor plastic packaging mold according to claim 1, characterized in that: A spring is fixedly connected between the end of the sliding rod (35) and the inner wall of the sliding sleeve (36), and the lengths of the plurality of sliding sleeves (36) decrease in sequence.

3. The semiconductor plastic packaging mold according to claim 1, characterized in that: A connecting sleeve (37) is fixedly connected to the outer side of the connecting plate (33), and a heating plastic sealing sleeve (38) is fixedly connected to the bottom end of the connecting sleeve (37).

4. The semiconductor plastic packaging mold according to claim 3, characterized in that: A cutting sleeve (31) is slidably disposed outside the connecting sleeve (37), and the top end of the cutting sleeve (31) is fixedly connected to two hydraulic cylinders (32) respectively located on both sides of the telescopic motor (34).

5. The semiconductor plastic packaging mold according to claim 1, characterized in that: The film conveying device (2) comprises a casing (21), a plurality of fixed plates (22) are fixedly connected to the top of the casing (21), a reeling roller (23) and a reeling roller (24) are rotatably arranged between two of the fixed plates (22) at corresponding positions, and a plurality of guide rollers (25) are rotatably arranged inside the casing (21).

6. The semiconductor plastic packaging mold according to claim 1, characterized in that: The conveying device (1) comprises two frame plates (11), two conveying rollers (12) are rotatably arranged between the two frame plates (11), one side of one of the frame plates (11) is fixedly connected to a driving motor, the output shaft end of the driving motor is fixedly connected to one of the conveying rollers (12), a conveying belt (13) is transmission-connected between the two conveying rollers (12), a plurality of notch grooves (14) are equidistantly provided on the outer side of the conveying belt (13), and the notch grooves (14) match the cutting sleeve (31).

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