A test board structure for wafer detection and wafer testing equipment
By introducing induction components and multiple induction ends into the test board structure of the wafer test equipment, the problem of inconvenient judgment of the contact between the probe and the wafer in the prior art is solved, and automatic high-precision detection position is realized, and wafer damage is avoided.
Patent Information
- Application Number
- CN202323412794.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-13
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2033-12-13
AI Technical Summary
When the test board structure of the existing wafer testing equipment moves with the wafer to be tested, it is impossible to intuitively judge the contact between the probe card and the wafer, resulting in some probes not being in contact or being pressed too deep and damaging the wafer.
A test board structure for wafer detection is designed, using induction components and multiple induction ends distributed in different positions in the test area, and the contact between the probe and the wafer is determined by the change of the circuit state of the induction end, and a signal feedback is sent to the external test equipment to realize automatic alignment and abutment.
Automatic and high-precision control of test board movement is achieved to ensure accurate alignment of probes and wafers, avoiding miscalculation and wafer damage.
Smart Images
Figure CN222719663U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductors, and in particular to a test board structure for wafer detection and wafer testing equipment. Background Art
[0002] Photonic and electronic integrated circuit wafers are usually tested at the wafer level before being divided into chips and packaged into products. Wafer-level testing is of great significance for reducing the cost of chip testing, ensuring product yield, and controlling product costs. Currently, using probe cards to test devices on wafers is a very common method in today's semiconductor device testing.
[0003] At present, the test equipment used for wafer testing is usually a test board (i.e., a probe card) equipped with several probes. By controlling the test board to move up and down, the probes are all in contact with the corresponding contacts on the wafer, thereby testing the wafer. However, when the test board structure moves toward the wafer to be tested, it is impossible to visually determine the contact between the probe card and the wafer. It can only be determined by manually judging the changes in the needle tip through a microscope, which can easily cause some probes to fail to contact the wafer and cause misdetection, or press too deeply and damage the wafer, and there is a problem of inconvenience in aligning the probes with the wafer contacts.
[0004] In view of this, it is indeed necessary to provide a technical solution to the above problems. Utility Model Content
[0005] The utility model aims to provide a test board structure and a wafer testing device for wafer detection, so as to solve the problem that the test board structure is inconvenient to align with the contact points of the wafer to be tested.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A test board structure for wafer detection includes a test board main body, a sensing component and a connector, wherein the test board main body is provided with a plurality of test probes, and the plurality of test probes form a test area, and the test board main body is provided with a sensing component that can be connected to an external test device, and the sensing component has a plurality of sensing ends, and the ends of the sensing ends are flush with the ends of the test probes, and the plurality of sensing ends are respectively distributed at multiple sides of the test area. When the test board is tested, the sensing ends are in an energized state, and the sensing component can determine whether the test probes are all in contact with the product to be tested according to the circuit state of each of the sensing ends, and send signal feedback to the external test device.
[0008] As an improvement to the structure of the test board, the sensing component includes a sensor and a plurality of sensing probes. The plurality of sensing probes are respectively distributed at different positions in the test area as the sensing ends and are all electrically connected to the sensor.
[0009] As an improvement of the test board structure, the sensing component further includes a connector having at least two connection ends, one connection end of the connector is connected to the sensing component, and the other connection end is used to connect to an external test device.
[0010] As an improvement to the structure of the test board, the number of the sensing probes is 2-6.
[0011] As an improvement to the structure of the test board, the number of the sensing probes is four.
[0012] As an improvement to the structure of the test board, the four sensing probes are respectively located at four sides of the test area.
[0013] As an improvement to the structure of the test board, the sensor is an electronic relay.
[0014] As an improvement to the test board structure, the connector is a socket.
[0015] As an improvement of the test board structure, a fixing plate is further included for mounting the test board body, the sensing component and the connector, so as to integrate the test board body, the sensing component and the connector into one.
[0016] A wafer testing device comprises a testing board, wherein the testing board is the testing board structure described above.
[0017] Compared with the prior art, the beneficial effects of the present invention are:
[0018] 1) The sensing component of the utility model determines whether several test probes are in contact with the wafer to be tested through the changes in the circuit state after each sensing end is in contact with the wafer to be tested, and then controls the movement distance of the test board to ensure the test accuracy of the wafer, so as to achieve the purpose of automatically and highly accurately controlling the movement of the test board, and realizes the effect of automatically aligning and contacting the test probe with the wafer to be tested, thereby preventing the situation where the test probe is not in contact with the wafer to be tested and thus causing erroneous detection, or the test board is pressed down too deeply and thus crushing the wafer.
[0019] 2) The utility model distributes multiple sensing ends of the sensing component at different positions of the test area to sense the downward pressure of the test probes at each position, improve the accuracy of determining whether the test probes are in contact with the wafer, reduce sensing deviation, and effectively reduce the probability of misjudgment. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0021] Figure 1 This is a front view of a test board structure for wafer detection provided by the utility model.
[0022] Figure 2 The utility model provides a three-dimensional structural schematic diagram of a test board structure for wafer detection.
[0023] In the figure: 1-test board body, 11-test probe, 12-test area, 2-sensing component, 21-sensing probe, 22-sensor, 23-connector, 3-fixing plate. DETAILED DESCRIPTION
[0024] In order to make the technical solution and advantages of the utility model clearer, the utility model and its beneficial effects will be further described in detail below in combination with specific implementation methods and drawings of the specification, but the implementation methods of the utility model are not limited thereto.
[0025] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0026] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt the conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.
[0027] like Figure 1 and Figure 2As shown, a test board structure for wafer detection includes a test board body 1, a sensing component 2 and a connector 23. The test board body 1 is provided with a plurality of test probes 11, and the plurality of test probes 11 form a test area 12. The test board body 1 is provided with a sensing component 2 which can be connected to an external test device. The sensing component 2 has a plurality of sensing ends, and the ends of the sensing ends are flush with the ends of the test probes 11. The plurality of sensing ends are respectively distributed at multiple sides of the test area 12. When the test board is tested, the sensing ends are energized, and the sensing component 2 can determine whether the test probes 11 are all in contact with the product to be tested according to the circuit status of each sensing end, and send signal feedback to the external test device.
[0028] Specifically, the end of the sensing end is flush with the needle tip of the test probe 11. The test board is used to be installed on an external test device, and the test board is driven up and down by the external test device to perform the test operation after abutting against the wafer to be tested. When the wafer needs to be powered on for testing, the sensing component 2 is first connected to the external test device and powered on, and then the external test device is controlled to drive the test board to move until the test probe 11 abuts and connects with the corresponding position on the wafer to be tested; in this process, since the sensing ends are all powered on, the sensing ends flush with the test probe 11 are short-circuited after contacting the wafer, and the corresponding circuit state changes. When the sensing component 2 detects that the circuit states of multiple sensing ends have all changed, the sensing component 2 is triggered, and it is determined that the test probes 11 are all abutting against the corresponding positions of the wafer to be tested, and a signal feedback is sent to the external test device. After receiving the signal feedback, the external test device stops operating, and the test board no longer continues to move downward, thereby determining that the test probes 11 on the test board body 1 are all abutting against the wafer to be tested.
[0029] The sensing component 2 of the present invention determines whether several test probes 11 are in contact with the wafer to be tested through the changes in the circuit state after each sensing end is in contact with the wafer to be tested, and then controls the movement distance of the test board, so as to achieve the purpose of automatically and accurately controlling the movement of the test board, and realizes the effect of automatically aligning and abutting the test probes 11 with the wafer to be tested, thereby preventing the situation where the test probes 11 are not in contact with the wafer to be tested and thus causing misdetection, or the test board is pressed too deeply and thus crushing the wafer; the multiple sensing ends of the sensing component 2 are distributed at different positions of the test area 12, so as to sense the pressing condition of the test probes 11 at each position, thereby improving the accuracy of determining whether the test probes 11 are in contact with the wafer, reducing the sensing deviation, and effectively reducing the probability of misjudgment.
[0030] In some embodiments of the present application, the sensing component 2 includes a sensor 22 and a plurality of sensing probes 21. The plurality of sensing probes 21 are distributed as sensing ends at different positions in the test area 12 and are all electrically connected to the sensor 22. Specifically, the sensing probes 21 are mounted on the test board body 1 and are all electrically connected to the sensor 22 through a circuit. The sensing probes 21 are the same size as the test probes 11. The sensor 22 senses the circuit changes of the plurality of sensing probes 21 in real time. If the sensing probes 21 are all in contact with the wafer, the circuits connected to the sensing probes 21 are all changed, and the sensor 22 is triggered, and it is determined that the test probes 11 are all in contact with the wafer, and a signal feedback is sent to an external test device. After receiving the signal feedback, the external test device controls the operation to prevent the test probes 11 from being over-pressed and causing damage to the wafer; if only some of the sensing probes 21 are in contact with the wafer and the circuit state changes, the sensor 22 is not triggered, and the external test device continues to drive the test downward until the circuit state changes after the sensing probes 21 are in contact with the wafer, and the sensor 22 is triggered. This ensures that the test probes 11 in the test area 12 are in contact with the wafer, thereby avoiding the situation where the test probes 11 do not make contact and cause misdetection or the test probes 11 are pressed too deeply and damage the wafer.
[0031] In some embodiments of the present application, the sensing component 2 further includes a connector 23 having at least two connection ends, one connection end of the connector 23 is connected to the sensing component 2, and the other connection end is used to connect to an external test device. Specifically, the sensor 22 is connected to the external test device through the connector 23. The setting of the connector 23 can achieve that the sensor 22 can transmit signal feedback to the external test device, and the external test device can also power the sensor 22.
[0032] In some embodiments of the present application, the number of the sensing probes 21 is 2-6. Specifically, the number of the sensing probes 21 may be 2, 3, 4, 5, or 6.
[0033] In some embodiments of the present application, the number of the sensing probes 21 is four.
[0034] In some embodiments of the present application, four sensing probes 21 are respectively located at four sides of the test area 12. Specifically, the number of sensing probes 21 is set to four, and they are respectively set at the four sides of the test area 12. If the test area 12 is square, they are respectively set at the front, back, left, and right sides; if the test area 12 is circular, they are respectively set at both ends of the test area 12 and between the middle and the end of the test area 12; the sensing probes 21 are arranged in such a dispersed manner, and the test area 12 is divided into multiple parts by the four sensing probes 21, so as to respectively sense the downward pressure of the test probes 11 in multiple parts, whether they are all in contact with the wafer, effectively improve the sensing accuracy of the sensing component 2, and greatly reduce the probability of misjudgment; the setting of the four sensing probes 21, while ensuring the sensing accuracy, avoids adding too many sensing probes 21, and prevents unnecessary cost waste.
[0035] In some embodiments of the present application, the sensor 22 is an electronic relay.
[0036] In some embodiments of the present application, the connector 23 is a socket.
[0037] In some embodiments of the present application, a fixing plate 3 is further included for installing the test board body 1, the sensing component 2 and the connector 23, so that the test board body 1, the sensing component 2 and the connector 23 are integrated into one. Specifically, the fixing plate 3 is made of an insulating material, such as a bakelite board, so that a high level of safety is ensured while installing the test board body 1, the sensing component 2 and the connector 23. The test board body 1, the sensing component 2 and the connector 23 are integrated into one by the fixing plate 3, so that the neatness of the test board is improved, and it is easier to install and transport. In other embodiments, the test board body 1 is installed on the fixing plate 3, and the sensing component 2 and the connector 23 are both arranged on the test board body 1.
[0038] A wafer testing device includes a test board, and the test board is the above-mentioned test board structure. Specifically, the wafer testing device is the above-mentioned external testing device, which includes the above-mentioned test board structure, and determines whether a number of test probes 11 are in contact with the wafer to be tested through the circuit state changes that occur after each sensing end of the test board abuts the wafer to be tested, and then controls the moving distance of the test board, so as to achieve the effect of automatically and highly accurately controlling the moving distance of the test board, and realizing the automatic alignment and abutment of the test probes 11 with the wafer to be tested.
[0039] According to the disclosure and teaching of the above description, the technicians in the field of the utility model can also change and modify the above implementation. Therefore, the utility model is not limited to the above specific implementation, and any obvious improvement, replacement or modification made by the technicians in this field on the basis of the utility model belongs to the protection scope of the utility model. In addition, although some specific terms are used in this specification, these terms are only for the convenience of explanation and do not constitute any limitation to the utility model.
Claims
1. A test board structure for wafer inspection, characterized in that: The invention comprises a test board body, a sensing component and a connector. The test board body is provided with a plurality of test probes, and the plurality of test probes form a test area. The test board body is provided with a sensing component which can be connected to an external test device. The sensing component has a plurality of sensing ends, and the ends of the sensing ends are flush with the ends of the test probes. The plurality of sensing ends are respectively distributed at multiple sides of the test area. When the test board is tested, the sensing ends are energized. The sensing component can determine whether the test probes are all in contact with the product to be tested according to the circuit state of each of the sensing ends, and send signal feedback to the external test device.
2. A test board structure for wafer inspection according to claim 1, characterized in that: The sensing component includes a sensor and a plurality of sensing probes. The plurality of sensing probes are respectively distributed at different positions in the test area as sensing ends and are all electrically connected to the sensor.
3. A test board structure for wafer inspection according to claim 2, characterized in that: The sensing component further comprises a connector having at least two connection ends, one connection end of the connector is connected to the sensing component, and the other connection end is used to connect to an external testing device.
4. The test board structure for wafer inspection according to claim 2, characterized in that: The number of the sensing probes is 2-6.
5. The test board structure for wafer inspection according to claim 4, characterized in that: The number of the sensing probes is 4.
6. The test board structure for wafer inspection according to claim 5, characterized in that: The four sensing probes are respectively located at four sides of the test area.
7. The test board structure for wafer inspection according to claim 2, characterized in that: The sensor is an electronic relay.
8. The test board structure for wafer inspection according to claim 3, characterized in that: The connector is a socket.
9. The test board structure for wafer inspection according to claim 3, characterized in that: It also includes a fixing plate for mounting the test board body, the sensing component and the connector, so as to integrate the test board body, the sensing component and the connector into one.
10. A wafer testing device, characterized in that: It comprises a test board, wherein the test board is a test board structure as described in any one of claims 1 to 9.