Operation and heat dissipation function integration unit and electronic equipment

Abstract

The utility model relates to an operation and heat dissipation function integration unit and electronic equipment. The unit comprises a first computing power board and a heat dissipation piece. A plurality of first raised lines are arranged on the first plate surface of the heat dissipation piece side by side; the first computing power board comprises a first substrate, a plurality of first chip belts are arranged on one board surface of the first substrate, and the number of the first chip belts is the same as that of the first raised lines; the first plate face of the heat dissipation piece is connected with the first substrate through at least two sets of first spring bolts, and the two sets of first spring bolts are located outside the two first protruding strips located on the outermost side of the first plate face respectively. And a spring in the first spring bolt is pressed on the plate surface, which is not provided with the first chip belt, of the first substrate. According to the utility model, a structural form which is simple and convenient to manufacture and control the processing precision is realized, the fitting uniformity and tightness between the heat dissipation piece and the computing force plate are fully ensured, and in addition, the fitting tightness between the heat dissipation piece and the computing force plate can also be flexibly adjusted.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic computing equipment, in particular to an integrated unit of computing and heat dissipation functions and electronic equipment. Background Art

[0002] In order to meet the current consumers' increasing demand for computing power of electronic computing devices, a method of integrating multiple computing boards into the same electronic computing device to obtain a high-computing power electronic device has emerged. In order to promptly dissipate the significant heat generated by these computing boards when they are working, people connect heat dissipation elements to these computing boards to fully and quickly perform heat exchange on these computing boards through the heat dissipation elements.

[0003] The current method of connecting the heat dissipation element to the computing board usually requires very high manufacturing precision for both, but the degree of fit between the two is relatively low, which makes it inconvenient to manufacture and use, and the heat dissipation effect also urgently needs to be further improved. Utility Model Content

[0004] Based on the above situation, the main purpose of the utility model is to provide an integrated unit and electronic equipment with computing and heat dissipation functions, which can relax the manufacturing accuracy of the heat sink and effectively improve the technical effect of the uniformity and tightness of the fit between the heat sink and the computing board.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is as follows:

[0006] In a first aspect, the utility model provides a computing and heat dissipation function integrated unit, characterized in that it includes a first computing board and a heat dissipation member, wherein the main bodies of the first computing board and the heat dissipation member are both plate-shaped;

[0007] The heat sink has a first plate surface and a second plate surface that are disposed in opposition to each other, a plurality of first convex strips are arranged side by side on the first plate surface, the first convex strips protrude from a region of the first plate surface where no first convex strips are arranged, the first convex strips at least avoid edges of two opposite first sides of the first plate surface, and the two first sides are respectively located outside the two outermost first convex strips;

[0008] The first computing board includes a first substrate, a plurality of first chip strips are arranged on a board surface of the first substrate, and each of the first chip strips includes a plurality of chips; the number of the first chip strips and the first convex strips is the same, and the first chip strips at least avoid the edges of two opposite second sides of the board surface where the first chip strips of the first substrate are located, and the two second sides are respectively located outside the two outermost first chip strips;

[0009] The first computing board is installed on the first board surface of the heat sink, wherein the plurality of first convex strips are bonded to the plurality of first chip strips in a one-to-one correspondence;

[0010] At least two groups of first panel bolt holes are formed on the first panel of the heat sink, and the first panel is connected to the first base plate by at least two groups of first spring bolts, wherein two groups of first spring bolts are respectively located outside the two first convex strips located on the outermost sides of the first panel, and each group of first spring bolts is inserted into the corresponding first panel bolt hole group;

[0011] The spring in the first spring bolt is pressed on the board surface of the first substrate where no first chip strip is arranged.

[0012] Preferably, the number of the first ridges is a multiple of N, N>1, starting from the first ridge closest to one of the first edges of the first board surface 110, every N consecutive adjacent first ridges constitute a first ridge group, and in the first board surface of the heat sink, a group of first spring bolts is provided at a position relative to the first computing board in the portion between every two adjacent first ridge groups.

[0013] Preferably, the number of bolt holes in all groups of first panel surface bolt hole groups is the same;

[0014] The total number of chips in each first chip strip (100) is ≥M, where M is a predetermined value; the number of first board surface bolt holes in each group of first board surface bolt holes is L, where (1 / 3)M≥L≥(1 / 5)M.

[0015] Preferably, the heat sink is a liquid cooling heat sink, comprising a top cover portion and a flow channel portion, and the main bodies of the top cover portion and the flow channel portion are both plate-shaped;

[0016] The flow channel portion, the top cover portion and the first computing board are arranged in sequence, the first plate surface of the heat sink is the side of the top cover portion facing the first computing board, and the second plate surface of the heat sink is the side of the flow channel portion away from the top cover portion; the flow channel portion has a first surface, and the first surface is the side thereof facing the top cover portion;

[0017] At the setting position of each first spring bolt, a first computing plate through hole is opened at the corresponding position of the first computing plate, a top cover through hole is opened at the corresponding position of the top cover, and a flow channel threaded hole is opened at the corresponding position of the first surface of the flow channel. Each first spring bolt passes through the first computing plate through hole and the top cover through hole corresponding to the setting position thereof and is screwed into the flow channel threaded hole.

[0018] Preferably, the flow channel portion is provided with a protruding end corresponding to each threaded hole of the flow channel portion, the protruding end protrudes from the first surface of the flow channel portion, and the threaded hole of the flow channel portion is provided at the protruding end; the through hole of the top cover portion is plug-fitted with the protruding end correspondingly, and the protruding end does not extend out of the side of the top cover portion away from the flow channel portion.

[0019] Preferably, a heat conducting material layer is provided between each first convex strip and the corresponding chip of the first chip strip.

[0020] Preferably, the unit further comprises a second computing board, the main body of which is in the shape of a plate;

[0021] A plurality of second convex strips are arranged side by side on the second plate surface of the heat sink, the second convex strips protrude from the area of ​​the second plate surface where no second convex strips are arranged, the second convex strips at least avoid the edges of two opposite third sides of the second plate surface, and the two third sides are respectively located outside the two outermost second convex strips;

[0022] The second computing board includes a second substrate, a plurality of second chip strips are provided on a board surface of the second substrate, and each second chip strip includes a plurality of chips; the number of the second chip strips is the same as the number of the second convex strips, and the second chip strips at least avoid the edges of two opposite fourth sides of the board surface where the second chip strips of the second substrate are located, and the two fourth sides are respectively located outside the two outermost second chip strips;

[0023] The second computing board is installed on the second board surface of the heat sink, wherein the plurality of second convex strips are bonded to the plurality of second chip strips in a one-to-one correspondence;

[0024] The second plate surface of the heat sink is connected to the second base plate via at least two groups of second spring bolts, wherein two groups of second spring bolts are respectively located outside the two outermost second convex strips of the second plate surface;

[0025] The spring in the second spring bolt is pressed on the board surface of the second substrate where no second chip strip is arranged.

[0026] Preferably, the number of the second convex strips is the same as that of the first convex strips, wherein each second convex strip is disposed at a position corresponding to that of a first convex strip.

[0027] Preferably, the manner in which the second plate surface is fitted with the second computing plate corresponds to the manner in which the first plate surface is fitted with the first computing plate, and the manner corresponds to that the number of groups of first spring bolts and second spring bolts is the same, and the setting positions of each group of first spring bolts and a group of second spring bolts correspond to each other, and in the first spring bolt groups and the second spring bolt groups corresponding to each other in the setting positions, the number of first spring bolts and the second spring bolts is the same, and the setting positions of each first spring bolt and a second spring bolt correspond to each other.

[0028] In a second aspect, the utility model provides an electronic device, comprising the above-mentioned computing and heat dissipation function integrated unit.

[0029] The utility model provides a plurality of first convex strips on the first plate surface of the heat sink, and the plurality of first convex strips are fitted one by one with the plurality of first chip strips on the first computing board through the one-to-one correspondence, and a plurality of groups of first spring bolts are used to adjust and improve the fitting degree between the heat sink and the first computing board, and the springs in the first spring bolts are pressed on the first computing board, so as to achieve a simple structure that is easy to manufacture and control the processing accuracy, and fully ensure the uniformity and tightness of the fitting between the heat sink and the first computing board. In addition, the tightness of the fitting between the heat sink and the first computing board can also be flexibly adjusted.

[0030] Other beneficial effects of the utility model will be explained through the introduction of specific technical features and technical solutions in the specific implementation manner. Through the introduction of these technical features and technical solutions, those skilled in the art should be able to understand the beneficial technical effects brought about by the technical features and technical solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

[0032] Figure 1 A schematic diagram of the three-dimensional structure of a preferred embodiment of the computing and heat dissipation function integrated unit provided by the utility model;

[0033] Figure 2 A schematic diagram of the three-dimensional structure of a preferred embodiment of the computing and heat dissipation function integrated unit provided by the utility model after hiding the first computing board;

[0034] Figure 3 A schematic diagram of the three-dimensional structure of a preferred embodiment of the first computing board provided by the utility model;

[0035] Figure 4 A schematic diagram of the three-dimensional structure of a preferred embodiment of the top cover provided by the utility model;

[0036] Figure 5 A schematic diagram of the three-dimensional structure of a preferred embodiment of the flow channel portion provided by the utility model;

[0037] Figure 6 A three-dimensional structural schematic diagram of another preferred embodiment of the computing and heat dissipation function integrated unit provided by the utility model;

[0038] Figure 7 for Figure 6 A cross-sectional elevational view of the three-dimensional structure shown.

[0039] Description of Figure Numbers:

[0040] Label name Label name Label name 100 Heat sink 131 Top cover through hole 212 Second side 110 First board 140 Runner 213 First hash board through hole 111 The first convex strip 141 First surface 300 Second hashboard 112 The first ridge group 142 Threaded hole of flow channel 400 First spring bolt set 113 First side 143 Overhang 401 First spring bolt 120 Second board 200 The first hashboard 500 Second spring bolt set 121 Second ridge 210 First substrate 501 Second spring bolt 130 Top cover 211 First chip strip 600 Thermally conductive material layer DETAILED DESCRIPTION

[0041] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the following detailed description of the present invention, some specific details are described in detail. In order to avoid confusing the essence of the present invention, known methods, processes, procedures, and components are not described in detail.

[0042] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0043] Unless the context clearly requires otherwise, throughout the specification and claims, the words "include", "comprising" and similar words should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0044] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" is two or more.

[0045] First, see Appendix Figure 1-7 The utility model provides a computing and heat dissipation function integrated unit, including a first computing board 200 and a heat dissipation element 100, wherein the main bodies of the first computing board 200 and the heat dissipation element 100 are both plate-shaped;

[0046] The heat sink 100 has a first plate surface 110 and a second plate surface 120 which are arranged in a manner opposite to each other. A plurality of first ridges 111 are arranged side by side on the first plate surface 110. The first ridges 111 protrude from a region of the first plate surface 110 where no first ridges are arranged. The first ridges 111 at least avoid edges of two opposite first sides 113 of the first plate surface 110. The two first sides 113 are respectively located outside the two outermost first ridges 111.

[0047] The first computing board 200 includes a first substrate 210, and a plurality of first chip strips 211 are provided on a board surface of the first substrate 210, and each of the first chip strips 211 includes a plurality of chips; the number of the first chip strips 211 and the first convex strips 111 is the same, and the first chip strips 211 at least avoid the edges of two opposite second sides 212 of the board surface where the first chip strips of the first substrate 210 are located, and the two second sides 212 are respectively located outside the two outermost first chip strips 211;

[0048] The first computing board 200 is installed on the first board surface 110 of the heat sink 100, wherein the plurality of first convex strips 111 are bonded to the plurality of first chip strips 211 in a one-to-one correspondence;

[0049] At least two groups of first board surface bolt hole groups are provided on the first board surface 110 of the heat sink 100, and the first board surface 110 is connected to the first base plate 210 by at least two groups of first spring bolts, wherein two groups of first spring bolts are respectively located outside the two outermost first convex strips 111 on the first board surface 110, and each group of first spring bolts is inserted into the corresponding first board surface bolt hole group;

[0050] The spring in the first spring bolt 401 is pressed on the surface of the first substrate 210 where the first chip strip 211 is not provided.

[0051] Specifically, in the computing and heat dissipation function integrated unit provided by the utility model, a heat sink 100 is used to dissipate heat for the first computing board 200 that is fitted and connected thereto. The first computing board 200 provides high-speed computing capability by providing a plurality of first chip strips 211, each of which includes a plurality of chips. Accompanying this high-speed computing capability is a large amount of heat generated when these chips are working. The primary purpose of the utility model is to enable the heat sink 100 to fit closely to these first chip strips 211 through a simple structure that is easy to manufacture and process, so that the heat generated by these first chip strips 211 when working can be timely conducted and exchanged.

[0052] To this end, the utility model provides a plurality of first convex strips 111 on the first board surface 110 of the heat sink 100, so that the first convex strips 111 protrude from the area of ​​the first board surface 110 where the first convex strips are not provided, and at least avoid the edges of the two opposite first sides 113 of the first board surface 110, thereby, these first convex strips 111 can be used to correspond one by one with the plurality of first chip strips 211 on the first computing board 200. Through the provision of these first convex strips 111, it is easy to ensure the surface flatness of the bonding point between the heat sink and the chip strip of the computing board (only the high surface flatness of these convex strips needs to be ensured, and there is no need to require high surface flatness for the entire first board surface, thereby effectively reducing the processing difficulty and significantly improving the production efficiency), so as to increase the degree of bonding between it and the chip strip.

[0053] Since the edges of at least two opposite first sides 113 on the first board surface 110 of the heat sink 100 are avoided by the first convex strip 111, installation space is reserved for the installation components (the first spring bolts 401 in the present invention) between the heat sink 100 and the first substrate 210 of the first computing board 200. Obviously, on the first substrate 210 of the first computing board 200, the first chip strip 211 avoids the edges of the two opposite second sides 212 of the board surface, which also reserves installation space for the first spring bolts 401.

[0054] Those skilled in the art can understand that, according to actual use needs, the installation space can be larger and does not have to be limited to the edges of the two opposite first sides 113 (and the two opposite second sides 212), but at least the edges must be reserved. Therefore, in practical applications, taking the first board surface 110 of the heat sink 100 as an example, it is sufficient to arrange two of the at least two groups of first spring bolts outside the two outermost first ridges 111 on the first board surface 110 (for example, when looking down at the first board surface 110, if a plurality of first ridges 111 are arranged side by side in the left-right direction, one of the two groups of first spring bolts is arranged outside the first ridge 111 located on the leftmost side, and the other group is arranged outside the first ridge 111 located on the rightmost side). The space outside each of the two outermost first ridges 111 on the first board surface 110 (extending all the way to the first side 113) is the installation space for the two groups of first spring bolts. Of course, the first spring bolts may not be limited to the two groups arranged outside the two first convex strips 111 on the outermost sides of the first plate surface 110, but may also have more first spring bolt groups (see the attached Figure 1 One of the first spring bolt groups 400 is shown in a dotted line.

[0055] Therefore, the first board surface 110 of the heat sink 100 and the first substrate 210 of the first computing board 200 are connected by at least two groups of first spring bolts. In addition to the two groups of first spring bolts distributed on the outermost side, there may also be a first spring bolt group arranged between a first convex strip 111 and a first convex strip 111 adjacent thereto, so that more than two groups of first spring bolts can apply a pressing force to the fit between the heat sink 100 and the first computing board 200, and cooperate with the setting mode that the spring of the first spring bolt 401 is pressed on the board surface of the first substrate 210 where the first chip strip is not provided, so as to further improve the fit uniformity and tightness between the heat sink 100 and the first computing board 200, and the fit tightness can also be flexibly adjusted by the tightening degree of the first spring bolt 401.

[0056] It can be seen that the structural form of the computing and heat dissipation function integrated unit provided by the utility model is simple and easy to manufacture, which is also conducive to controlling the processing accuracy, and fully guarantees the uniformity and tightness of the fit between the heat sink 100 and the first computing board 200, so as to fully guarantee the heat dissipation conduction effect of the first computing board 200. In addition, the fit tightness between the heat sink 100 and the first computing board 200 can also be flexibly adjusted according to the actual use effect.

[0057] Preferably, see in particular the attached Figure 2 , the number of the first ridges 111 is a multiple of N, N>1, starting from the first ridge 111 closest to one of the first edges 113 of the first board surface 110, every N consecutive adjacent first ridges 111 constitute a first ridge group 112, and in the first board surface 110 of the heat sink 100, a group of first spring bolts is provided at a position relative to the first computing board 200 in a portion between every two adjacent first ridge groups 112.

[0058] By setting the reasonable spacing distribution of the multiple groups of first spring bolts as above, the number of the first spring bolts 401 is not too large, so as not to cause waste of materials, and it is also beneficial to make the pressure applied by the multiple groups of first spring bolts on the multiple first chip strips 211 sufficient and as uniform as possible, thereby further improving the uniform heat dissipation effect of the first computing board 200.

[0059] The value of N can be flexibly selected according to actual use requirements. In a specific implementation, N can be 3.

[0060] Preferably, the number of bolt holes in all groups of first panel surface bolt hole groups is the same;

[0061] The total number of chips in each first chip strip (100) is ≥M, where M is a predetermined value; the number of first board bolt holes in each group of first board bolt hole groups is L, where (1 / 3)M≥L≥(1 / 5)M. Generally speaking, the total number of chips between the first chip strips 211 may not be exactly the same, but will not be less. In order to help ensure that the number of first spring bolts 401 is also sufficient to provide sufficient and as uniform a clamping force as possible for these chips, the number of first board bolt holes in each group of first board bolt hole groups is L, where (1 / 3)M≥L≥(1 / 5)M, where M is a predetermined value (in a specific implementation, M can be the total number of chips included in the first chip strip 211 that contains the least number of chips among all the first chip strips 211). In this way, while ensuring that there are enough first board bolt holes, it can be ensured that enough first spring bolts can be inserted into them to provide a clamping force for the chips. Of course, it is not necessary to insert the first spring bolts into all the first board bolt holes in all cases. Instead, the number of first spring bolts used can be flexibly adjusted according to the needs of different usage scenarios such as chip clamping force and assembly convenience. That is, when the number of first spring bolts in each group is defined as P, the number P satisfies P≤L.

[0062] Preferably, see in particular the attached Figure 4 and 5 The heat sink 100 is a liquid cooling heat sink, including a top cover portion 130 and a flow channel portion 140, and the main bodies of the top cover portion 130 and the flow channel portion 140 are both plate-shaped;

[0063] The flow channel portion 140, the top cover portion 130 and the first computing board 200 are arranged in sequence, the first board surface 110 of the heat sink 100 is the side of the top cover portion 130 facing the first computing board 200, and the second board surface 120 of the heat sink 100 is the side of the flow channel portion 140 away from the top cover portion 130; the flow channel portion 140 has a first surface 141, and the first surface 141 is the side thereof facing the top cover portion 130;

[0064] At the setting position of each first spring bolt 401, a first computing plate through hole 213 is opened at the corresponding position of the first computing plate 200, a top cover through hole 131 is opened at the corresponding position of the top cover 130, and a flow channel threaded hole 142 is opened at the corresponding position of the first surface 141 of the flow channel 140. Each first spring bolt 401 passes through the first computing plate through hole 213 and the top cover through hole 131 corresponding to the setting position thereof and is screwed into the flow channel threaded hole 142.

[0065] The computing and heat dissipation function integrated unit provided by the utility model is suitable for liquid cooling heat dissipation using a coolant to carry away the heat generated by the computing board. The first computing board 200 can be located above the top cover portion 130 of the liquid cooling heat sink, and the flow channel portion 140 can be located below the top cover portion 130. The coolant can flow in the flow channel in the flow channel portion 140, and the heat from the first computing board 200 transferred to the flow channel through the liquid cooling heat sink is used to complete heat exchange and achieve heat dissipation.

[0066] At this time, by respectively opening the first computing plate through hole 213, the top cover through hole 131 and the flow channel threaded hole 142 at the corresponding positions of the relevant components, the first spring bolt 401 can be installed in a simple structure to complete the fixing of the first computing plate 200 to the heat sink 100. The top cover 130 and the flow channel 140 can be welded to fully ensure the assembly firmness between the two.

[0067] Preferably, see in particular the attached Figure 5 The flow channel portion 140 is provided with a protruding end 143 corresponding to each of the flow channel portion threaded holes 142, and the protruding end 143 protrudes from the first surface 141 of the flow channel portion 140, and the flow channel portion threaded hole 142 is provided at the protruding end 143; the top cover portion through hole 131 is correspondingly plug-fitted with the protruding end 143, and the protruding end 143 does not extend out of the side of the top cover portion 130 away from the flow channel portion 140.

[0068] By setting the above-mentioned protruding end 143, the top cover through hole 131 can be correspondingly inserted and matched with the protruding end 143, which is conducive to quickly positioning the top cover 130 at a suitable position above the flow channel 140. The height of the protruding end 143 is not greater than the thickness of the top cover 130, so that after the assembly between the first computing board and the heat sink is completed, the protruding end 143 does not extend out of the side of the top cover 130 away from the flow channel 140, which can ensure that the protruding end 143 is not so high as to lift up the first computing board 200, so that its chip belt 211 cannot be closely attached to the first convex strip 111 of the first board surface 110.

[0069] Preferably, see in particular the attached Figure 7 A heat conducting material layer 600 is provided between each first convex strip 111 and the corresponding chip of the first chip strip 211 .

[0070] The material layer disposed between the chip and the first convex strip 111 can effectively fill the tiny gap between the two. Compared with not filling the material layer and leaving the tiny gap with air, the utility model obviously provides a thermal conductive material layer 600 here, which is more convenient for the rapid and sufficient conduction of the heat from the chip, and further improves the heat dissipation effect of the computing and heat dissipation function integrated unit. The thermal conductive material layer 600 is, for example, a silicone grease layer, a gel layer, or a thermal pad.

[0071] Preferably, see in particular the attached Figure 6 and 7 , the unit further includes a second computing board 300, the main body of the second computing board 300 is in a plate shape;

[0072] A plurality of second convex strips 121 are arranged side by side on the second plate surface 120 of the heat sink 100. The second convex strips 121 protrude from a region of the second plate surface 120 where no second convex strips 121 are arranged. The second convex strips 121 at least avoid the edges of two opposite third sides of the second plate surface 120. The two third sides are respectively located outside the two outermost second convex strips 121.

[0073] The second computing board 300 includes a second substrate, and a plurality of second chip strips are provided on a board surface of the second substrate, and each second chip strip includes a plurality of chips; the number of the second chip strips is the same as the number of the second convex strips 121, and the second chip strips at least avoid the edges of two opposite fourth sides of the board surface where the second chip strips of the second substrate are located, and the two fourth sides are respectively located outside the two outermost second chip strips;

[0074] The second computing board 300 is installed on the second board surface 120 of the heat sink 100, wherein the plurality of second convex strips 121 are bonded to the plurality of second chip strips in a one-to-one correspondence;

[0075] The second plate surface 120 of the heat sink 100 is connected to the second base plate by at least two sets of second spring bolts (in the attached Figure 6 In the figure, one of the second spring bolt groups 500 is framed by a dotted line for illustration), wherein two groups of second spring bolts are respectively located outside the two second convex strips 121 located at the outermost sides of the second plate surface 120;

[0076] The spring in the second spring bolt 501 is pressed on the surface of the second substrate where no second chip strip is provided.

[0077] The essence of the fitting installation method between the second board surface 120 of the heat sink 100 and the second computing board 300 is the same as the fitting installation method between the first board surface 110 and the first computing board 200. Similarly, a simple structure that is easy to manufacture and control processing accuracy can be obtained, which fully ensures the uniformity and tightness of the fitting between the heat sink and the computing board, and the technical effect that the tightness of the fitting between the heat sink and the computing board can be flexibly adjusted.

[0078] At this time, the main structural forms of the second computing board 300 and the first computing board 200 (including the arrangement of the chip belt, etc.) can also be the same.

[0079] Preferably, see in particular the attached Figure 7 The number of the second ridges 121 is the same as the number of the first ridges 111 , wherein each second ridge 121 is disposed at a position corresponding to that of a first ridge 111 .

[0080] The “arrangement positions correspond to each other” means that each second convex strip 121 and a first convex strip 111 are symmetrically arranged with the main body of the heat sink 100 interposed therebetween.

[0081] Preferably, the manner in which the second plate surface 120 and the second computing power plate 300 are fitted and connected corresponds to the manner in which the first plate surface 110 and the first computing power plate 200 are fitted and connected, and the manner corresponds to that the number of groups of the first spring bolts 401 and the second spring bolts 501 is the same, and the setting positions of each group of first spring bolts and a group of second spring bolts correspond to each other, and among the first spring bolt groups and the second spring bolt groups corresponding to the setting positions, the number of the first spring bolts 401 and the second spring bolts 501 is the same, and the setting positions of each first spring bolt 401 and a second spring bolt 501 correspond to each other.

[0082] Through the corresponding arrangement in the above manner, the pre-design of the installation positions of the multiple groups of first spring bolts and the multiple groups of second spring bolts, as well as the actual installation operation can be carried out more conveniently and quickly, and the comprehensive clamping force provided to the first computing force plate 200 and the second computing force plate 300 can also be as equal and balanced as possible.

[0083] At this time, the flow channel threaded hole 142 can be a through hole that passes through the entire flow channel 140 in the height direction. A first spring bolt 401 can be inserted into the same through hole, and a second spring bolt 501 can also be inserted in the opposite direction.

[0084] In a second aspect, the utility model further provides an electronic device, comprising the above-mentioned integrated unit for computing and heat dissipation functions.

[0085] Those skilled in the art will appreciate that, without conflict, the above-mentioned preferred solutions can be freely combined and superimposed.

[0086] It should be understood that the above-mentioned embodiments are merely illustrative and not restrictive. Without departing from the basic principles of the present invention, various obvious or equivalent modifications or substitutions that can be made by technicians in this field to the above details will be included in the scope of the claims of the present invention.

Claims

1. A computing and heat dissipation integrated unit, characterized in that: It comprises a first computing board (200) and a heat sink (100), wherein the main bodies of the first computing board (200) and the heat sink (100) are both in the shape of a plate; The heat sink (100) comprises a first plate surface (110) and a second plate surface (120) which are arranged in opposite directions, a plurality of first convex strips (111) are arranged side by side on the first plate surface (110), the first convex strips (111) protrude from a region of the first plate surface (110) where no first convex strips are arranged, the first convex strips (111) at least avoid the edges of two opposite first sides (113) of the first plate surface (110), and the two first sides (113) are respectively located outside the two outermost first convex strips (111); The first computing board (200) comprises a first substrate (210), a plurality of first chip strips (211) are arranged on a board surface of the first substrate (210), and each of the first chip strips (211) comprises a plurality of chips; the number of the first chip strips (211) and the number of the first convex strips (111) are the same, the first chip strips (211) at least avoid the edges of two opposite second sides (212) of the board surface where the first chip strips of the first substrate (210) are located, and the two second sides (212) are respectively located outside the two outermost first chip strips (211); The first computing board (200) is installed on the first board surface (110) of the heat sink (100), wherein the plurality of first convex strips (111) are bonded to the plurality of first chip strips (211) in a one-to-one correspondence; At least two groups of first plate surface bolt hole groups are provided on the first plate surface (110) of the heat sink (100); the first plate surface (110) and the first base plate (210) are connected via at least two groups of first spring bolts, wherein two groups of first spring bolts are respectively located outside the two first convex strips (111) located at the outermost sides of the first plate surface (110); each group of first spring bolts is inserted into a corresponding first plate surface bolt hole group; The spring in the first spring bolt (401) is pressed onto the surface of the first substrate (210) where no first chip strip is provided.

2. The unit according to claim 1, characterized in that The number of the first convex strips (111) is a multiple of N, N>1, and starting from the first convex strip (111) closest to one of the first edges of the first plate surface (110), every N consecutive adjacent first convex strips (111) constitute a first convex strip group (112), and in the first plate surface (110) of the heat sink (100), a group of first spring bolts is provided at a position relative to the first computing board (200) and between a portion between every two adjacent first convex strip groups (112).

3. The unit according to claim 1, characterized in that The number of bolt holes in all groups of first plate surface bolt hole groups is the same; The total number of chips in each first chip strip (211) is ≥M, where M is a predetermined value; the number of first board surface bolt holes in each group of first board surface bolt holes is L, where (1 / 3)M≥L≥(1 / 5)M.

4. The unit according to claim 1, characterized in that The heat sink (100) is a liquid cooling heat sink, comprising a top cover portion (130) and a flow channel portion (140), wherein the main bodies of the top cover portion (130) and the flow channel portion (140) are both plate-shaped; The flow channel portion (140), the top cover portion (130) and the first computing board (200) are arranged in sequence; the first board surface (110) of the heat sink (100) is a side of the top cover portion (130) facing the first computing board (200); the second board surface (120) of the heat sink (100) is a side of the flow channel portion (140) facing away from the top cover portion (130); the flow channel portion (140) has a first surface (141), and the first surface (141) is a side thereof facing the top cover portion (130); At the setting position of each first spring bolt (401), a first computing plate through hole (213) is opened at a corresponding position of the first computing plate (200), a top cover through hole (131) is opened at a corresponding position of the top cover (130), and a flow channel threaded hole (142) is opened at a corresponding position of the first surface (141) of the flow channel (140), and each first spring bolt (401) passes through the first computing plate through hole (213) and the top cover through hole (131) corresponding to the setting position thereof, and is screwed into the flow channel threaded hole (142).

5. The unit according to claim 4, characterized in that The flow channel portion (140) is provided with a protruding end (143) corresponding to each of the flow channel portion threaded holes (142); the protruding end (143) protrudes from the first surface (141) of the flow channel portion (140); the flow channel portion threaded hole (142) is provided at the protruding end (143); the top cover portion through hole (131) is plug-fitted with the protruding end (143) correspondingly, and the protruding end (143) does not extend out of a side of the top cover portion (130) facing away from the flow channel portion (140).

6. The unit according to claim 1, characterized in that A heat-conducting material layer (600) is provided between each first convex strip (111) and the chip of the corresponding first chip strip (211).

7. The unit according to any one of claims 1 to 6, characterized in that The unit further comprises a second computing board (300), the main body of the second computing board (300) being in the shape of a plate; A plurality of second convex strips (121) are arranged side by side on the second plate surface (120) of the heat sink (100), the second convex strips (121) protrude from an area of ​​the second plate surface (120) where no second convex strips are arranged, the second convex strips (121) at least avoid the edges of two opposite third sides of the second plate surface, and the two third sides are respectively located outside the two outermost second convex strips (121); The second computing board (300) comprises a second substrate, a plurality of second chip strips are arranged on a board surface of the second substrate, and each second chip strip comprises a plurality of chips; the number of the second chip strips and the number of the second convex strips (121) are the same, and the second chip strips at least avoid the edges of two opposite fourth sides of the board surface where the second chip strips of the second substrate are located, and the two fourth sides are respectively located outside the two outermost second chip strips; The second computing board (300) is installed on the second board surface (120) of the heat sink (100), wherein the plurality of second convex strips (121) are bonded to the plurality of second chip strips in a one-to-one correspondence; The second plate surface (120) of the heat sink (100) is connected to the second base plate via at least two groups of second spring bolts, wherein two groups of second spring bolts are respectively located outside two second convex strips located at the outermost sides of the second plate surface; The spring in the second spring bolt (501) is pressed onto the surface of the second substrate where no second chip strip is provided.

8. The unit according to claim 7, characterized in that The number of the second convex strips (121) is the same as the number of the first convex strips (111), wherein the arrangement position of each second convex strip (121) corresponds to that of a first convex strip (111).

9. The unit according to claim 8, characterized in that The manner in which the second plate surface (120) and the second computing plate (300) are fitted and connected corresponds to the manner in which the first plate surface (110) and the first computing plate (200) are fitted and connected, and the manner corresponds to the manner in which the first spring bolts (401) and the second spring bolts (501) are fitted and connected in the same number, and the setting positions of each group of first spring bolts and a group of second spring bolts correspond to each other, and in the first spring bolt groups and the second spring bolt groups with corresponding setting positions, the number of the first spring bolts (401) and the second spring bolts (501) are the same, and the setting positions of each first spring bolt (401) and a second spring bolt (501) correspond to each other.

10. An electronic device, characterized in that: It comprises a computing and heat dissipation function integrated unit as described in any one of claims 1 to 9.

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