A universal new structural adapter plate
By replacing the cable board with high-density connectors in the test environment, the cable production cycle is long, complex and cost-effective, and the effect of simplifying the connection architecture, improving versatility and efficiency, and reducing costs is achieved.
Patent Information
- Application Number
- CN202420970289.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-07
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-05-07
AI Technical Summary
In the existing testing environment construction methods, the production cycle of cable is long, complex, high cost, and takes up a large area of use, resulting in limited application and reduced versatility.
The high-density connectors are used to replace the original cable board design, increasing the number of resources and performance, simplifying the manufacturing process, reducing costs, and improving the system's universality and stability by optimizing the layout of the power layer and signal layer.
It has achieved simplified connection architecture, improved versatility and efficiency, reduced costs, reduced fault tolerance, and has wider applicability.
Smart Images

Figure CN222721660U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of PCB boards, in particular to a universal new-structure adapter board. Background Art
[0002] The current test environment is built in such a way that the pogo-type universal board on the T5830ES is connected to the adapter board through spring pins, and the adapter board is connected to the cable board through a connector. The cable is welded to the cable board using welding technology, and the cable board needs to use an additional mechanical support frame to support the connection and leveling of the cable connection board and the adapter board. This structure leads to a long production cycle and complex production of the cable, high cost, and a large area of use, so that all machine resources cannot be led out, which limits the application and reduces the versatility.
[0003] In view of this, we propose a simple high-density and high-performance adapter board to solve the existing problems. This design mainly uses a high-density connector to replace the original cable board design, which increases the number of resources and performance, is more convenient to use, and the manufacturing process is simpler, which greatly saves costs, improves efficiency, and reduces fault tolerance. This design is an improvement on the original design system, making it more applicable and less costly. Utility Model Content
[0004] The main purpose of the utility model is to provide a universal new structure adapter plate.
[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:
[0006] A universal new structure adapter board, the adapter board includes multiple layers, from top to bottom are a top layer, a signal layer, a programmable power supply PPS layer, a power layer, a ground layer and a bottom layer, the bottom layer is a resource module connected to a pogo type universal board of a T5830 test system, a connector is fixedly installed on the top board, a product test board is fixedly connected to the connector, and the test board is connected to a chip to be tested to form a closed loop, six resource modules are fixedly arranged on the bottom board, the six resource modules are evenly distributed on both sides of the bottom board, and each resource module is respectively provided with 48 signal points.
[0007] Furthermore, the power supply layer includes 8 groups of power supplies and 8 groups of power supply remote detection modules corresponding to the 8 groups of power supplies, and each group of power supplies retains a welding point for welding a power supply bypass capacitor at one end close to the connector.
[0008] Furthermore, six connector pads are evenly distributed and fixed on both sides of the bottom plate, and the pads are control signal pads or high voltage power pads.
[0009] Furthermore, the pad is welded to the connector and then connected to the test board through a flat cable. Characters A and B are added on both sides of the connector as the installation direction of the connector. The connector is also provided with an anti-mock device to prevent reverse insertion.
[0010] Furthermore, a programmable power supply is provided on the resource module, and the programmable power supply of the programmable power supply PPS layer is connected through copper foil, and the programmable power supply PPS and its corresponding Sense line are on the same layer.
[0011] Furthermore, the ground layer is divided into a common ground layer GND layer and a second ground layer GND2 layer. The common ground layer is placed on the upper and lower layers of the PPS power signal, the common signal and the control signal respectively. The GND2 layer is arranged on the upper and lower layers of the power layer so that the power layer can fully refer to the GND2 layer. The signal layer and the signal layer, the signal layer and the PPS layer, the PPS layer and the PPS layer, and the PPS layer and the power layer are all separated by the referenced ground layer.
[0012] Furthermore, the exposed pads on the top layer are all insulated, the signal lines are all made equal in length, and the line spacing between the signal lines is maintained at more than 5 times the line width.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] The utility model is based on a pogo type universal board (H7-912591) on a test platform T5830ES, and solves the problem of building a test environment for FT and CP.
[0015] The performance of the adapter board has been optimized. Compared with the adapter boards currently used in the market, the number of channels has been increased, the connection architecture has been simplified, the versatility has been improved, and the cost has been saved. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a top view of the utility model;
[0017] Figure 2 It is a bottom view of the utility model.
[0018] Reference numerals
[0019] 1. Top layer; 2. Resource plate; 3. General plate; 6. Bottom layer; 7. Connector; 10. Solder point; 11. Pad. DETAILED DESCRIPTION
[0020] The preferred embodiments of the present invention are described in detail below in conjunction with the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the protection scope of the present invention.
[0021] See also Figure 1-2 As shown, the purpose of the present invention is to provide a PCB board of a universal connection board to solve the problems raised in the above background technology.
[0022] To achieve the above-mentioned purpose, the utility model provides the following technical solution: the positions of the six resource modules in the adapter board correspond one-to-one to the resource modules in the pogo-type universal board (H7-912591), and the adapter board uses six high-density high-speed connectors corresponding to the six resource modules and is close to the resource modules corresponding to the pogo-type universal board (H7-912591), and adopts an orderly arrangement to achieve the consistency of the signal of each module.
[0023] Moreover, the positions of the common signal pads, power pads, control signal pads, and SENSE pads in each connector are consistent. Even if the connector is plugged in incorrectly, the power signal and the ground will not be short-circuited, thereby not burning the device or board, ensuring its safety and practicality.
[0024] The specific plan is: this universal adapter board is a 24-layer PCB board, which is divided into a top layer, a signal layer, a programmable power supply PPS layer, a power layer, a ground layer and a bottom layer.
[0025] The bottom resource module is connected to the pogo-type universal board (H7-912591) of the T5830 test system. The top board is connected to the product test board through a connector, and the test board is then connected to the chip to be tested, thus forming a closed loop for wafer testing or post-packaging testing.
[0026] From the perspective of the top board, the bottom board includes six resource modules. The left half is resource modules 1, 2, and 3 from top to bottom, and the right half is resource modules 4, 5, and 6. Each resource module has 48 signals, 8 groups of power supplies and their corresponding 8 groups of power sense, as well as other control signal pads or high-voltage power pads. Each group of power supplies has a solder point near the connector end for soldering power bypass capacitors, which can adjust the capacitor parameters over a wider range according to the power requirements of different test environments.
[0027] The power supply is evenly distributed, which can be applied to the testing of different chips, improving the efficiency and versatility. The top board includes 6 connector pads, which are used to solder the connectors, and then connected to the test board through the cable. A and B characters are added on both sides of the connector as the installation direction of the connector to better guide the operator and avoid the misoperation of plugging the connector in the wrong direction. The connector itself also has a foolproof device to prevent reverse plugging.
[0028] The programmable power supply on the resource module is connected through copper foil, and the programmable power supply PPS and its corresponding Sense line are on the same layer, which improves stability.
[0029] The ground layer is divided into the ordinary GND layer and the GND2 layer.
[0030] The PPS power signal, common signal and control signal refer to the common ground layer, and the power layer refers to the GND2 layer.
[0031] The signal layer and the signal layer, the signal layer and the PPS layer, the PPS layer and the PPS layer, and the PPS layer and the power layer are all separated by the reference ground layer, thereby reducing the power crosstalk problem and ensuring the integrity of the power supply.
[0032] The exposed pads on the top layer board must be insulated to avoid short circuits caused by metal objects placed on the front.
[0033] The signal lines are all made of equal length, and the same structure is produced by replication, which can eliminate the problem of signal asynchrony at the board level. The line spacing between signal lines is kept at more than 5 times the line width, eliminating mutual interference between signals.
[0034] The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiment. Any equivalent modifications or changes made by ordinary technicians in this field based on the contents disclosed in the present invention should be included in the protection scope recorded in the claims.
Claims
1. A universal new structure adapter plate, characterized by: The adapter board comprises multiple layers, which are, from top to bottom, a top layer (1), a signal layer, a programmable power supply PPS layer, a power supply layer, a ground layer and a bottom layer (6). The bottom layer (6) is a resource plate (2) connected to a pogo type universal board (3) of a T5830 test system. A connector (7) is fixedly mounted on the top layer (1). A product test board is fixedly connected to the connector (7). The test board is then connected to a chip to be tested to form a closed loop. Six resource modules are fixedly arranged on the bottom layer (6). The six resource modules are evenly distributed on both sides of the bottom layer (6). Each resource module is provided with 48 signal points.
2. A universal new structure adapter plate according to claim 1, characterized in that: The power supply layer (4) includes 8 groups of power supplies and 8 groups of power supply remote detection modules corresponding to the 8 groups of power supplies. Each group of power supplies has a welding point (10) for welding a power supply bypass capacitor at one end close to the connector (7).
3. A universal new structure adapter plate according to claim 1, characterized in that: Six soldering pads (11) of connectors (7) are evenly distributed and fixedly disposed on both sides of the bottom layer. The soldering pads (11) are control signal soldering pads (11) or high-voltage power soldering pads (11).
4. A universal new structure adapter plate according to claim 3, characterized in that: The soldering pad (11) is soldered to the connector (7) and then connected to the test board via a flat cable. Characters A and B are added on both sides of the connector (7) as the installation direction of the connector (7). The connector (7) is also provided with an anti-mute device to prevent reverse insertion.
5. The universal new structure adapter plate according to claim 1 is characterized in that: The resource module (8) is provided with a programmable power supply, and the programmable power supply of the programmable power supply PPS layer is connected through copper foil, and the programmable power supply PPS and its corresponding Sense line are on the same layer.
6. A universal new structure adapter plate according to claim 1, characterized in that: The ground layer (5) is divided into a common ground layer GND layer and a second ground layer GND2 layer. The common ground layer is placed on the upper and lower layers of the PPS power signal, the common signal and the control signal respectively. The GND2 layer is arranged on the upper and lower layers of the power layer so that the power layer can fully refer to the GND2 layer. The signal layer and the signal layer, the signal layer and the PPS layer, the PPS layer and the PPS layer, and the PPS layer and the power layer are separated by the referenced ground layer.
7. A universal new structure adapter plate according to claim 1, characterized in that: The exposed pads (11) of the top layer (1) are all insulated, the signal lines are all made equal in length, and the line spacing between the signal lines is maintained at more than 5 times the line width.