A resin prepreg honeycomb high-efficiency impregnation processing device

Abstract

The utility model discloses a resin prepreg honeycomb efficient glue dipping processing device, comprising a device body, a glue dipping tank is arranged in the device body, a flat placement plate is arranged in the middle of the glue dipping tank, the placement plate divides the glue dipping tank into two parts, an upper part and an lower part; a plurality of through holes are evenly arranged in the middle of the placement plate; a cover body is arranged on the top of the device body, a telescopic cylinder is arranged on the cover body, a pressing plate is fixedly connected after the piston rod of the telescopic cylinder penetrates the cover body, the pressing plate is in close contact with the inner wall of the glue dipping tank, and the inner wall of the glue dipping tank is smooth; a glue supply mechanism is arranged on the device body; the glue of the device flows through the honeycomb holes inside the honeycomb under pressure, during which the flowing glue contacts the internal structure of the honeycomb more fully than the static glue; under the action of pressure, the glue is also promoted to penetrate the honeycomb, which is beneficial to the rapid glue dipping of the honeycomb.

Description

Technical Field

[0001] The utility model belongs to the technical field of resin honeycomb processing, and in particular relates to a resin prepreg honeycomb high-efficiency glue-impregnation processing device. Background Art

[0002] Prepreg resin honeycomb has the advantages of light weight and high rigidity. It is a composite resin honeycomb material and is widely used in aircraft, high-speed railways, etc. Adding lightweight and rigid honeycomb sandwich materials between two layers of panels can greatly improve the load-bearing capacity without significantly increasing the weight. It can be widely used in aircraft floors, doors, interiors, tail wings, fairings, as well as the inner walls, ceilings, luggage racks, etc. of high-speed railways.

[0003] During processing, the honeycomb needs to be dipped in glue and cured to obtain the finished honeycomb. Currently, the resin honeycomb is generally placed directly in the glue liquid. Due to the honeycomb structure, it is difficult for the glue liquid to fully contact the honeycomb structure inside the resin honeycomb, which leads to low dipping efficiency and poor dipping effect. Utility Model Content

[0004] The utility model provides a resin prepreg honeycomb efficient dipping processing device, in which glue liquid flows through the honeycomb holes inside the honeycomb under pressure, during which the flowing glue liquid contacts the internal structure of the honeycomb more fully than the static glue liquid; under the action of pressure, the glue liquid is also promoted to penetrate the honeycomb, which is beneficial to the rapid dipping of the honeycomb, so as to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a resin prepreg honeycomb high-efficiency dipping treatment device, comprising a device body, a dipping tank is provided in the device body, a flat placement plate is provided in the middle of the dipping tank, and the placement plate divides the dipping tank into two upper and lower parts; a plurality of through holes are evenly arranged in the middle of the placement plate; a cover body is provided on the top of the device body, and a downward telescopic cylinder is provided on the cover body, and a pressure plate is fixedly connected to the piston rod of the telescopic cylinder after passing through the cover body, and the pressure plate is tightly attached to the inner wall of the dipping tank, and the inner wall of the dipping tank is smooth; the device body is provided with a glue supply mechanism.

[0006] Preferably, a placement groove is provided on the top surface of the placement plate, and the through hole is opened in the placement groove.

[0007] Preferably, the outer edge of the cover body and the top edge of the device body are provided with corresponding connecting parts and are fixed by fastening screws.

[0008] Preferably, a positioning rod is installed on the top of the pressure plate, and the cover body is provided with a hole for the positioning rod to pass through, and a linear bearing slidably connected to the positioning rod is installed in the hole.

[0009] Preferably, the glue supply mechanism comprises a glue supply head mounted on the pressure plate, a hose connected to the glue supply head is mounted on the device body, and a solenoid valve is mounted at the connection between the glue supply head and the hose.

[0010] Preferably, the device body is supported by four supporting legs located at the four corners of the bottom.

[0011] Preferably, a liquid outlet pipe is provided at the bottom of the device body, and a valve is provided on the liquid outlet pipe.

[0012] Preferably, a placement block is provided in the glue dipping tank, and the placement plate is placed on the placement block.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The glue will flow through the honeycomb holes inside the honeycomb under pressure. During this period, the flowing glue will contact the internal structure of the honeycomb more fully than the static glue.

[0015] 2. Under the action of pressure, the glue liquid is also promoted to penetrate the honeycomb, which is conducive to the rapid glue impregnation of the honeycomb. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the top view structure of the placement plate of the utility model.

[0018] In the figure: 1. Device body; 2. Glue dipping tank; 3. Placement plate; 4. Through hole; 5. Cover; 6. Telescopic cylinder; 7. Pressing plate; 8. Placement tank; 9. Connecting part; 10. Fastening screw; 11. Positioning rod; 12. Linear bearing; 13. Glue supply head; 14. Hose; 15. Solenoid valve; 16. Support leg; 17. Liquid outlet pipe; 18. Valve; 19. Placement block. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-2The utility model provides a resin prepreg honeycomb efficient dipping processing device, comprising a device body 1, wherein the device body 1 is provided with a dipping tank 2, wherein a flat placement plate 3 is provided in the middle of the dipping tank 2, wherein the placement plate 3 divides the dipping tank 2 into two parts, an upper part and an lower part; a plurality of through holes 4 are evenly arranged in the middle of the placement plate 3; a cover body 5 is provided on the top of the device body 1, wherein the cover body 5 is provided with a downward telescopic cylinder 6, wherein the piston rod of the telescopic cylinder 6 penetrates through the cover body 5 and is fixedly connected with a pressing plate 7, wherein the pressing plate 7 is in close contact with the inner wall of the dipping tank 2, wherein the inner wall of the dipping tank 2 is smooth; the device body 1 is provided with a glue supply mechanism; during processing, the honeycomb The nest is placed flat in the placement groove 8 on the placement plate 3 in the glue dipping tank 2 through an external mechanism. The placement groove 8 is designed to match the size of the honeycomb. Sufficient glue is added to the glue dipping tank 2 of the device body 1 through the glue supply mechanism. The glue will be supplied to the honeycomb for dipping. During this period, the pressing plate 7 is driven to slowly descend by the telescopic cylinder 6 until it stops at the set position, giving glue pressure. The glue will pass through the honeycomb holes inside the honeycomb under pressure, and then flow into the lower space of the glue dipping tank 2 through the through hole 4. During this period, the flowing glue will contact the internal structure of the honeycomb more fully than the static glue. At the same time, under the action of pressure, the glue is also promoted to penetrate the honeycomb, which is beneficial to the rapid dipping of the honeycomb.

[0021] Specifically, a placement groove 8 is provided on the top surface of the placement plate 3, and the through hole 4 is opened in the placement groove 8; in this embodiment, the honeycomb is not easy to slide during dipping, and the through hole 4 is located below the honeycomb, so that the glue liquid can enter the through hole 4 through the honeycomb holes inside the honeycomb after being pressurized.

[0022] Specifically, the outer edge of the cover body 5 and the top edge of the device body 1 are provided with corresponding connecting parts 9, and are fixed by fastening screws 10; in this embodiment, the cover body 5 can be opened and fixed by fastening screws 10 to ensure stability during the dipping operation.

[0023] Specifically, a positioning rod 11 is installed on the top of the pressure plate 7, and a hole for the positioning rod 11 to pass through is provided on the cover body 5, and a linear bearing 12 slidably connected to the positioning rod 11 is installed in the hole; in this embodiment, when the telescopic cylinder 6 drives the pressure plate 7 to move up and down, the positioning rod 11 cooperates with the linear bearing 12 to provide stability for the pressure plate 7 when it is raised and lowered.

[0024] Specifically, the glue supply mechanism includes a glue supply head 13 installed on the pressure plate 7, a hose 14 connected to the glue supply head 13 is installed on the device body 1, and a solenoid valve 15 is installed at the connection between the glue supply head 13 and the hose 14; in this embodiment, an external glue supply device is connected through the hose 14 to add sufficient glue liquid into the glue dipping tank 2 of the device body 1 through the glue supply head 13, and then the solenoid valve 15 is closed. The hose 14 is set to a sufficient length to avoid interfering with the lifting and lowering of the pressure plate 7. When the pressure plate 7 is placed down to press the glue liquid by closing the solenoid valve 15, the glue liquid enters the hose 14 in the reverse direction.

[0025] Specifically, the device body 1 is supported by four supporting legs 16 located at the four corners of the bottom; in this embodiment, the supporting legs 16 provide space for installing a liquid outlet mechanism at the bottom of the device body 1 .

[0026] Specifically, a liquid outlet pipe 17 is provided at the bottom of the device body 1 , and a valve 18 is provided on the liquid outlet pipe 17 ; in this embodiment, the glue liquid in the glue dipping tank 2 is easily discharged through the liquid outlet pipe 17 .

[0027] Specifically, a placement block 19 is provided in the glue dipping tank 2, and the placement plate 3 is placed on the placement block 19; in this embodiment, the placement plate 3 is detachable to facilitate subsequent cleaning and replacement.

[0028] In order to facilitate understanding of the above technical solution of the present invention, the working principle or operation method of the present invention in the actual process is described in detail below.

[0029] Working principle: During processing, the honeycomb is placed flat in the placement groove 8 on the placement plate 3 in the glue dipping tank 2 through an external mechanism. The placement groove 8 is designed to match the size of the honeycomb. The external glue supply device is connected through a hose 14, and sufficient glue is added to the glue dipping tank 2 of the device body 1 through the glue supply head 13. Then the solenoid valve 15 is closed, and the glue will be supplied to the honeycomb for dipping. During this period, the pressing plate 7 is driven to slowly descend by the telescopic cylinder 6 until it stops at the set position, and the glue pressure is applied. The glue will pass through the honeycomb holes inside the honeycomb under pressure, and then flow into the lower space of the glue dipping tank 2 through the through hole 4. During this period, the flowing glue will contact the internal structure of the honeycomb more fully than the static glue. At the same time, under the action of pressure, the glue is also promoted to penetrate the honeycomb, which is conducive to the rapid dipping of the honeycomb.

[0030] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A resin prepreg honeycomb high-efficiency impregnation treatment device, comprising a device body (1), characterized in that: The device body (1) is provided with a glue dipping tank (2), a flat placement plate (3) is provided in the middle of the glue dipping tank (2), and the placement plate (3) divides the glue dipping tank (2) into two upper and lower parts; a plurality of through holes (4) are evenly arranged in the middle of the placement plate (3); a cover body (5) is provided on the top of the device body (1), and a telescopic cylinder (6) is provided on the cover body (5), and a piston rod of the telescopic cylinder (6) passes through the cover body (5) and is fixedly connected with a pressing plate (7), and the pressing plate (7) is in close contact with the inner wall of the glue dipping tank (2), and the inner wall of the glue dipping tank (2) is smooth; the device body (1) is provided with a glue supply mechanism.

2. A resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: The top surface of the placement plate (3) is provided with a placement groove (8), and the through hole (4) is opened in the placement groove (8).

3. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1 is characterized in that: The outer edge of the cover body (5) and the top edge of the device body (1) are provided with corresponding connecting parts (9) and are fixed by fastening screws (10).

4. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: A positioning rod (11) is arranged on the top of the pressure plate (7), and a hole for the positioning rod (11) to pass through is arranged on the cover body (5), and a linear bearing (12) slidably connected to the positioning rod (11) is arranged in the hole.

5. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: The glue supply mechanism comprises a glue supply head (13) mounted on the pressure plate (7); a hose (14) connected to the glue supply head (13) is mounted on the device body (1); and a solenoid valve (15) is mounted at the connection between the glue supply head (13) and the hose (14).

6. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: The device body (1) is supported by four supporting legs (16) located at the four corners of the bottom.

7. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: A liquid outlet pipe (17) is provided at the bottom of the device body (1), and a valve (18) is provided on the liquid outlet pipe (17).

8. The resin prepreg honeycomb high-efficiency impregnation treatment device according to claim 1, characterized in that: A placement block (19) is provided in the glue dipping tank (2), and the placement plate (3) is placed on the placement block (19).

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