A polishing head structure and a polishing head driving device

Abstract

The utility model discloses a polishing head structure and a polishing head driving device, wherein the polishing head structure includes a bearing member and N pressure adjustment components, wherein N≥2, the bearing member includes a side plate and a cross plate, the side plate surrounds a hollow cavity, the cross plate cover is arranged on one side of the hollow cavity, any one of the pressure adjustment components includes an elastic member and at least one piezoelectric actuator, the elastic member is arranged in the hollow cavity, the elastic member has a first surface and a second surface arranged oppositely, the first surface is distributed with piezoelectric actuators, and the second surface is used to fit at least part of the third surface of a workpiece to be polished; any one of the piezoelectric actuators has a polishing state in which a first pressure is generated in the corresponding elastic member, in the polishing state, the elastic member is deformed and generates a second pressure on the workpiece to be polished, the piezoelectric actuator generates a corresponding pressure according to the applied electric field, reduces the time to reach the set pressure, thereby improving the response speed of the pressure adjustment, and further improving the wafer flattening effect.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a polishing head structure and a polishing head driving device. Background Art

[0002] Chemical mechanical polishing is a method for flattening or polishing semiconductor materials. Chemical mechanical polishing combines surface chemical action and mechanical grinding to remove different materials on the wafer surface at the micron or nanometer level, thereby achieving wafer surface flattening. During the flattening process, the polishing head structure directly affects the polishing efficiency, uniformity and surface quality.

[0003] There is a polishing head structure, including a base, a flexible film, and a plurality of thin sheets. The upper surface of the flexible film and the base are enclosed to form a sealed cavity. The plurality of thin sheets are distributed in the sealed cavity at intervals to divide the sealed cavity into a plurality of independent sub-chambers. Any sub-chamber is connected to an external gas supply source, and the gas supply source can deliver gas to each sub-chamber separately. During the flattening process, the lower surface of the flexible film contacts the wafer, and the polishing rate of the corresponding area on the wafer is controlled by the pressure in each sub-chamber.

[0004] However, in the above-mentioned polishing head structure, due to the high compressibility of the gas, it takes a long time for the gas supply source to deliver gas to the sub-chamber to reach the set pressure, resulting in a slow response to the pressure adjustment, making it impossible to adjust the pressure acting on the wafer in time, thereby resulting in poor wafer flattening effect. Utility Model Content

[0005] In view of this, the utility model provides a polishing head structure and a polishing device to solve the problem that the existing gas has high compressibility, and it takes a long time for the gas supply source to deliver gas to the sub-chamber to reach the set pressure, which leads to slow response of pressure adjustment, making it impossible to adjust the pressure acting on the wafer in time, thereby resulting in poor flattening effect of the wafer.

[0006] The utility model provides a polishing head structure, comprising:

[0007] A bearing member, the bearing member comprises a side plate and a transverse plate, the side plates enclose a hollow cavity, and the transverse plate cover is arranged on one side of the hollow cavity;

[0008] N pressure adjustment assemblies, any one of which comprises an elastic member and at least one piezoelectric actuator, the elastic member being arranged in the hollow cavity, the elastic member having a first surface and a second surface arranged opposite to each other, the piezoelectric actuator being distributed on the first surface, and the second surface being used for contacting at least a portion of a third surface of the workpiece to be polished;

[0009] Where N≥2;

[0010] Any of the piezoelectric actuators has a polishing state in which a first pressure is applied to the elastic member. In the polishing state, the elastic member is deformed and a second pressure is applied to the workpiece to be polished.

[0011] Optionally, in the above-mentioned polishing head structure, the sum of the areas of N second surfaces is less than or equal to the area of ​​the third surface.

[0012] Optionally, in the above-mentioned polishing head structure, any one of the pressure adjustment components further includes a pressure-bearing plate, and the pressure-bearing plate is arranged between the elastic member and the piezoelectric actuator.

[0013] Optionally, in the above-mentioned polishing head structure, the N pressure adjustment assemblies are distributed around the central axis of the hollow cavity at different angular positions; or the N pressure adjustment assemblies are distributed sequentially along the radial direction of the hollow cavity.

[0014] Optionally, in the above-mentioned polishing head structure, multiple pressure adjustment components are distributed around the central axis of the hollow cavity at different angular positions to form a first pressure adjustment combination area, N pressure adjustment components form M first pressure adjustment combination areas, the M first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity, and the areas of the M first pressure adjustment combination areas gradually increase along the radial direction of the hollow cavity; wherein 2≤M<N.

[0015] Optionally, in the above-mentioned polishing head structure, any one of the elastic members is a closed cavity surrounded by a flexible film, and there is gas in the closed cavity.

[0016] Optionally, in the above-mentioned polishing head structure, the carrier also includes a partition plate, which is fixedly connected to the inner wall of the side plate to separate the hollow cavity into a first accommodating cavity and a second accommodating cavity, and the piezoelectric actuator, the elastic member and the workpiece to be polished are all located in the second accommodating cavity, and the piezoelectric actuator is fixedly connected to the partition plate.

[0017] Optionally, the above-mentioned polishing head structure also includes a control component, which is arranged in the first accommodating cavity and fixedly connected to the partition plate. The N piezoelectric actuators have a common electrode and N control electrodes, and the common electrode and the N control electrodes are electrically connected to the control component.

[0018] The utility model also provides a polishing head, comprising:

[0019] A bearing member, the bearing member comprises a side plate and a transverse plate, the side plates enclose a hollow cavity, and the transverse plate cover is arranged on one side of the hollow cavity;

[0020] N pressure adjustment components are located in the hollow cavity; any one of the pressure adjustment components includes at least one piezoelectric actuator, a pressure plate and a closed chamber, one side surface of the pressure plate is attached to a portion of the third surface of the workpiece to be polished, the closed chamber is arranged on a side surface of the pressure plate away from the workpiece to be polished, the closed chamber is surrounded by a flexible film, and there is gas in the closed chamber, the piezoelectric actuator is arranged on a side surface of the closed chamber away from the pressure plate, and the piezoelectric actuator is fixedly connected to the inner wall of the hollow cavity;

[0021] Where N≥2;

[0022] Any of the piezoelectric actuators has a polishing state in which a first pressure is generated on the corresponding closed chamber. In the polishing state, the closed chamber is deformed and a second pressure is generated on the workpiece to be polished.

[0023] The utility model also provides a polishing head driving device, comprising the above-mentioned polishing head structure, and further comprising:

[0024] A driving member, the driving member is fixedly connected to the transverse plate, and the driving member can drive the bearing member to rotate;

[0025] A rotating electrical connector, the rotating electrical connector comprising a fixed portion and a rotating portion, the fixed portion is fixedly connected to the driving member, and the rotating portion is fixedly connected to the transverse plate;

[0026] The control element is electrically connected to the circuit system via the rotating electrical connector.

[0027] The technical solution provided by the utility model has the following advantages:

[0028] 1. The polishing head structure provided by the utility model includes a bearing member and N pressure adjustment components, wherein N≥2, the bearing member includes a side plate and a cross plate, the side plates surround a hollow cavity, the cross plate cover is arranged on one side of the hollow cavity, any one of the pressure adjustment components includes an elastic member and at least one piezoelectric actuator, the elastic member is arranged in the hollow cavity, the elastic member has a first surface and a second surface arranged opposite to each other, the first surface is distributed with piezoelectric actuators, and the second surface is used to fit at least a part of the third surface of the workpiece to be polished; any one of the piezoelectric actuators has a polishing state in which a first pressure is generated on the elastic member, in which the elastic member is deformed and a second pressure is generated on the workpiece to be polished, the piezoelectric actuator can generate a corresponding pressure according to the applied electric field, that is, only the corresponding electric field needs to be applied to generate the set pressure, and there is no need for a gas supply source to transport gas into the sub-chamber, which reduces the time to reach the set pressure, thereby improving the response speed of the pressure adjustment, so that the polishing head can quickly adjust the pressure acting on the workpiece to be polished, thereby improving the effect of wafer flattening. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 It is a structural schematic diagram of the polishing head driving device provided by the utility model;

[0031] Figure 2 It is a structural schematic diagram of multiple piezoelectric actuators and common electrodes provided by the utility model;

[0032] Figure 3 It is a top view of the first distribution mode of the side plate, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0033] Figure 4 It is a top view of the second distribution mode of the side plate, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0034] Figure 5 A top view of a third distribution mode of the side plates, multiple piezoelectric actuators, and N pressure-bearing plates provided by the utility model;

[0035] Figure 6 A top view of a fourth distribution mode of the side plates, the plurality of piezoelectric actuators, and the N pressure-bearing plates provided by the utility model.

[0036] Description of reference numerals:

[0037] 1. Carrying member; 11. Side plate; 111. Hollow cavity; 1111. First accommodating cavity; 1112. Second accommodating cavity; 12. Horizontal plate; 13. Partition plate;

[0038] 21. piezoelectric actuator; 211. common electrode; 212. control electrode; 213. piezoelectric ceramic; 22. elastic member; 23. pressure plate;

[0039] 3. Parts to be polished;

[0040] 4. Control parts;

[0041] 5. driving member; 51. driving shaft;

[0042] 6. Rotating electrical connector;

[0043] 71. Power supply; 72. Host computer; 73. First cable; 74. Second cable; 75. Third cable; 76. Fourth cable. DETAILED DESCRIPTION

[0044] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0045] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0048] Example 1

[0049] The polishing head structure provided in this embodiment is as follows: Figures 1 to 5 As shown, it includes a carrier 1 and N pressure adjustment components, wherein N≥2, the carrier 1 includes a side plate 11 and a cross plate 12, the side plate 11 surrounds a hollow cavity 111, and the cross plate 12 covers one side of the hollow cavity 111, and any pressure adjustment component includes an elastic member 22 and at least one piezoelectric actuator 21, the elastic member 22 is arranged in the hollow cavity 111, the elastic member 22 has a first surface and a second surface that are relatively arranged, the piezoelectric actuator 21 is distributed on the first surface, and the second surface is used to fit at least a portion of the third surface of the workpiece 3 to be polished; any piezoelectric actuator 21 has a polishing state in which a first pressure is generated in the corresponding elastic member 22, and in the polishing state, the elastic member 22 is deformed and generates a second pressure on the workpiece 3 to be polished.

[0050] Specifically, the workpiece 3 to be polished is a filler layer on a wafer or a substrate (semiconductor). In the present embodiment, the workpiece 3 to be polished can be a wafer. The side plate 11 is annular. The shape of the side plate 11 matches the shape of the wafer. The side plate 11 is a retaining ring used to limit the wafer. Preferably, the side plate 11 is annular, that is, the hollow cavity 111 is cylindrical. The cross plate 12 is located above the side plate 11. The cross plate 12 covers the opening on one side of the hollow cavity 111. Preferably, the side plate 11 is connected to the top of the cross plate 12. The connection method can be one-piece molding, welding, bolt connection, gluing or other fixed connection. The shape of the cross plate 12 matches the shape of the wafer. Preferably, the cross plate 12 is circular. When the polishing head is working, the workpiece 3 to be polished is placed in from the opening on one side of the hollow cavity 111 away from the cross plate 12. At this time, N pressure adjustment components are distributed on the upper surface of the workpiece 3 to be polished, which are used to adjust the pressure of different areas of the workpiece 3 to be polished. By providing an electric field to the piezoelectric actuator 21, the piezoelectric ceramic 213 in the piezoelectric actuator 21 is deformed to generate pressure on the load. The piezoelectric actuator 21 directly applies pressure after applying the electric field. The piezoelectric actuator 21 transmits pressure through electrical signals instead of air pressure, thereby improving the pressure response speed of the polishing head structure, and the pressure output by the piezoelectric actuator 21 has high precision, so that the polishing head structure can accurately and quickly adjust the pressure of different areas of the workpiece 3 to be polished, thereby realizing multi-area pressure control of the workpiece 3 to be polished to adapt to different surface conditions of the workpiece 3 to be polished, and improving the polishing precision and uniformity, so that the workpiece 3 to be polished can quickly achieve the set polishing effect. By arranging an elastic member 22 between the piezoelectric actuator 21 and the workpiece 3 to be polished, the pressure generated by the piezoelectric actuator 21 is buffered, so as to avoid drastic changes in the pressure generated by the piezoelectric actuator 21 on the workpiece 3 to be polished, which affects the polishing effect.

[0051] In the polishing head structure provided in this embodiment, the piezoelectric actuator 21 generates corresponding pressure according to the applied electric field, that is, the set pressure can be generated by applying the corresponding electric field, and there is no need for a gas supply source to transport gas into the sub-chamber, which reduces the time to reach the set pressure, thereby improving the response speed of the pressure adjustment, so that the polishing head structure can quickly adjust the pressure acting on the workpiece to be polished, thereby improving the flattening effect of the wafer.

[0052] The polishing head structure provided in this embodiment is as follows: Figure 1 As shown, each pressure adjustment assembly corresponds to an elastic member 22, the first surface is the upper surface of the elastic member 22, the second surface is the lower surface of the elastic member 22, the third surface is the upper surface of the workpiece 3 to be polished, and N second surfaces are distributed on the third surface. Each second surface corresponds to an independent pressure adjustment area of ​​the polishing workpiece, and the sum of the areas of the N second surfaces is less than or equal to the area of ​​the third surface. Preferably, the sum of the areas of the N second surfaces is equal to the area of ​​the third surface, that is, the N second surfaces cover the entire third surface.

[0053] like Figure 1 As shown, in the polishing head structure provided by this embodiment, each pressure adjustment assembly includes a pressure plate 23, which is arranged between the corresponding elastic member 22 and the piezoelectric actuator 21. The pressure plate 23 is made of rigid material and can move in the hollow cavity 111. The piezoelectric actuator 21 generates pressure on the pressure plate 23, and the lower surface of the pressure plate 23 presses the elastic member 22 to deform the elastic member 22, thereby causing the elastic member 22 to generate pressure on the upper surface of the polishing member. The pressing surface of the pressure plate 23 on the elastic member 22 is the entire lower surface. Therefore, a small number of piezoelectric actuators 21 can achieve the same pressing area of ​​the elastic member 22, thereby reducing the number of piezoelectric actuators 21, reducing the cost of the polishing head structure, and improving the economic benefits of the polishing head structure. Moreover, by applying pressure to the corresponding area of ​​the workpiece 3 to be polished through the elastic member 22, the pressure fluctuations in different areas on the upper surface of the workpiece 3 to be polished can be reduced, thereby reducing the influence of the pressure fluctuations on the polishing effect. Each pressure plate 23 has at least one piezoelectric actuator 21. Of course, 2, 3, 4, 5 or other numbers of piezoelectric actuators may be provided. Persons skilled in the art may adjust the number of piezoelectric actuators 21 provided on the pressure plate 23 as required. The pressure plates 23 correspond to the elastic members 22 one by one. The pressure generated by the piezoelectric actuators 21 acts on the elastic members 22 through the pressure plates 23. The elastic members 22 deform to buffer the pressure and avoid drastic changes in pressure between adjacent pressure plates 23, thereby improving polishing accuracy and polishing uniformity.

[0054] The polishing head structure provided in this embodiment, any pressure adjustment component also includes at least one pressure sensor (not shown in the figure), the piezoelectric actuator 21 corresponds to the pressure sensor one by one, the pressure sensor is arranged between the piezoelectric actuator 21 and the pressure plate 23, of course, the pressure sensor can also be arranged between the pressure plate 23 and the elastic member 22, the piezoelectric sensor is used to obtain the pressure generated by the piezoelectric actuator 21, and the information fed back by the piezoelectric sensor can improve the pressure control accuracy of the polishing workpiece 3.

[0055] like Figure 3 As shown, in the polishing head structure provided in this embodiment, N pressure adjustment components are distributed around the central axis of the hollow cavity 111 at different angular positions. Figure 3 Taking the perspective of as an example, the N pressure plates 23 are all fan-shaped, and the N pressure plates 23 are distributed around the center of the workpiece 3 to be polished at different angular positions to cover the upper surface of the workpiece 3 to be polished. Of course, the pressure plates 23 can also be arc-shaped or other shapes. The area of ​​the lower surface of each elastic member 22 is equal to the area of ​​the upper surface of the corresponding pressure plate 23 to achieve pressure control over a large area of ​​the workpiece 3 to be polished.

[0056] In an alternative embodiment, Figure 4As shown, N pressure adjustment components are distributed in sequence along the radial direction of the hollow cavity, wherein each pressure plate 23 is in a circular shape, and the N circular rings are distributed in the radial direction of the workpiece 3 to be polished. The centers of the N circular rings are all points on the central axis of the hollow cavity 111, and the N circular rings are concentric, and the surface areas of the N pressure plates 23 increase in sequence along the radial direction of the workpiece 3 to be polished, and the N elastic members 22 are arranged one by one corresponding to the N circular rings. By distributing the N pressure adjustment components in the above manner, the pressure control in the radial direction and the control of the removal speed on the workpiece 3 to be polished can be achieved.

[0057] In another alternative implementation, Figure 5 Taking the perspective of as an example, six pressure adjustment components are distributed around the central axis of the hollow cavity 111 at different angular positions to form a first pressure adjustment combination area. The number of pressure adjustment components in each first pressure adjustment combination area can be adjusted as needed. The number of pressure adjustment components in each first pressure adjustment combination area is the same. N pressure adjustment components form M first pressure adjustment combination areas. At this time, M is N / 6. The M first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity 111. The area of ​​the M first pressure adjustment combination areas gradually increases along the radial direction of the hollow cavity 111; that is, the area of ​​each pressure plate increases along the radial direction. In the first pressure adjustment combination area located in the center, the pressure plates 23 corresponding to each pressure adjustment component are all fan-shaped, and the six fan-shaped ones are surrounded by a circle. In the remaining first pressure adjustment combination areas, the pressure plates 23 corresponding to each pressure adjustment component are all arc-shaped. The six pressure plates in the same first pressure adjustment combination area are surrounded by a ring shape, and the shape of each pressure plate 23 is also adjusted as needed. The polishing head structure can realize pressure control on a small area of ​​the workpiece 3 to be polished, and has a good effect on uneven surface thickness of the workpiece 3 to be polished.

[0058] In a third alternative embodiment, Figure 6Taking the perspective as an example, the first pressure adjustment combination area located in the center is formed by six pressure adjustment components distributed around the central axis of the hollow cavity 111 at different angular positions. The number of pressure adjustment components in each first pressure adjustment combination area can be adjusted as needed. The number of pressure adjustment components in each pressure adjustment combination area can be the same or different. The number of pressure adjustment components in the first pressure adjustment combination area located in the outermost circle is greater than the number of pressure adjustment components in the first pressure adjustment combination area located in the center. N pressure adjustment components form M pressure adjustment combination areas, where 2≤M<N. The number of pressure adjustment components in each first pressure adjustment combination area increases along the radial direction of the hollow cavity to ensure that a set number of pressure adjustment components are present in the same area. In the first pressure adjustment combination area located in the center, the pressure plates 23 corresponding to each pressure adjustment component are all fan-shaped, and the six fan-shaped components form a circle. In the remaining first pressure adjustment combination areas, the pressure plates 23 corresponding to each first pressure adjustment combination area are all arc-shaped, and all pressure plates in the same pressure adjustment combination area form a circular ring. The polishing head structure can realize pressure control in a certain area of ​​the polished part, thereby realizing precise polishing of the surface of the polished part.

[0059] In the polishing head structure provided in this embodiment, each elastic member 22 is a closed cavity surrounded by a flexible film, and the closed cavity is filled with gas. Of course, the closed cavity can also be formed by connecting multiple independent sub-cavities. The elastic member 22 can play a buffering role, avoiding the pressure step change at the junction of adjacent pressure plates, and also avoiding the drastic change of the pressure acting on the workpiece 3 to be polished. As an alternative embodiment, the elastic member 22 can also be other elastic materials.

[0060] like Figure 1 As shown, the polishing head structure provided in this embodiment, the carrier 1 also includes a partition plate 13, the partition plate 13 is located in the hollow cavity 111, the partition plate 13 is fixedly connected to the inner wall of the side plate 11, so as to separate the hollow cavity 111 into a first accommodating cavity 1111 and a second accommodating cavity 1112, the piezoelectric actuator 21, the elastic member 22 and the workpiece 3 to be polished are all located in the second accommodating cavity 1112, and N piezoelectric actuators 21 are all fixedly connected to the partition plate 13.

[0061] like Figure 1 and Figure 2 As shown, the polishing head structure provided in this embodiment also includes a control component 4, which is a microcontroller. The control component 4 is fixed on the upper surface of the partition plate 13, and the control component 4 is located in the first accommodating cavity 1111. The N piezoelectric actuators 21 have a common electrode 211 and N control electrodes 212. The common electrode 211 and the N control electrodes 212 are electrically connected to the control component 4 through cables. By setting a common motor, the complexity of wiring is reduced.

[0062] The polishing head structure provided in this embodiment has an installation process as described below:

[0063] First, the side panel 11 and the horizontal panel 12 are integrally formed by injection molding or 3D printing, and then the control component 4 is fixedly connected to the upper surface of the partition plate by bolts or gluing, and then the common motor and N control electrodes 212 are connected to each port of the control component 4 by cables, and a cable channel is provided on the partition plate for the cables to pass through, and then N piezoelectric actuators 21 are fixedly connected to the lower surface of the partition plate by bolts or gluing, and then the partition plate is fixedly connected to the inner wall of the side panel 11 by welding or gluing, and then N pressure sensors are pasted one by one on the piezoelectric actuator 21, and then the pressure plate is pasted to the corresponding pressure sensor, and then the elastic component 22 is pasted to the corresponding pressure plate to complete the installation.

[0064] Example 2

[0065] The polishing head provided in this embodiment includes a supporting member and N pressure adjustment components, wherein N ≥ 2; the supporting member includes side plates and cross plates, the side plates enclose a hollow cavity, and the cross plate cover is arranged on one side of the hollow cavity; the N pressure adjustment components are all located in the hollow cavity, and any one of the pressure adjustment components includes at least one piezoelectric actuator, a pressure plate, and a closed chamber, one side surface of the pressure plate is attached to a portion of the third surface of the workpiece to be polished, the closed chamber is arranged on the side surface of the pressure plate away from the workpiece to be polished, the closed chamber is surrounded by a flexible film, and there is gas in the closed chamber, the piezoelectric actuator is arranged on the side surface of the closed chamber away from the pressure plate, and the piezoelectric actuator is fixedly connected to the inner wall of the hollow cavity; any one of the piezoelectric actuators has a polishing state in which a first pressure is generated on the corresponding closed chamber, and in the polishing state, the closed chamber is deformed and generates a second pressure on the workpiece to be polished.

[0066] Example 3

[0067] The polishing head driving device provided in this embodiment includes the above-mentioned polishing head structure, and also includes a driving member 5, a rotating electrical connector 6 and a circuit system. The driving member 5 is a motor, and the driving member 5 is fixedly connected to the upper surface of the horizontal plate 12 through a driving shaft 51. The driving member 5 is used to drive the polishing head structure to rotate. The rotating electrical connector 6 includes a fixed part and a rotating part. The rotating part is fixedly connected to the outer wall of the horizontal plate 12, and the fixed part is fixedly connected to the driving member 5. The fixing method can be threaded connection, bolt connection or other common fixing methods. The rotating electrical connector 6 is made of conductive material. The rotating electrical connector 6 is a slip ring, and the circuit system includes a power supply 71 and a host computer 72. The control component 4 is connected to the rotating part through a first cable 73, and the fixed part is connected to the power supply 71 through a third cable 75. The control component 4 is connected to the rotating part through a second cable 74, and the fixed part is connected to the host computer 72 through a fourth cable 76. The host computer 72 communicates with the control component 4 through the second cable 74, the rotating electrical connector 6, and the fourth cable 76. The power supply 71 provides electrical energy to the control component 4 through the first cable 73, the rotating electrical connector 6, and the third cable 75.

[0068] The polishing head driving device provided in this embodiment has high polishing accuracy and high polishing efficiency, thereby improving the planarization effect of the polishing device.

[0069] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A polishing head structure, characterized in that: include: A carrier (1), the carrier (1) comprising a side plate (11) and a transverse plate (12), the side plate (11) enclosing a hollow cavity (111), and the transverse plate (12) covering one side of the hollow cavity (111); N pressure adjustment assemblies, any one of which comprises an elastic member (22) and at least one piezoelectric actuator (21), the elastic member (22) being arranged in the hollow cavity (111), the elastic member (22) having a first surface and a second surface arranged opposite to each other, the piezoelectric actuator (21) being distributed on the first surface, and the second surface being in contact with at least a portion of a third surface of a workpiece (3) to be polished; Where N≥2; Any of the piezoelectric actuators (21) has a polishing state in which a first pressure is generated on the corresponding elastic member (22); in the polishing state, the elastic member (22) is deformed and generates a second pressure on the workpiece (3) to be polished.

2. The polishing head structure according to claim 1, characterized in that: The sum of the areas of the N second surfaces is less than or equal to the area of ​​the third surface.

3. The polishing head structure according to claim 1, characterized in that: Any one of the pressure adjustment assemblies further comprises a pressure-bearing plate (23), wherein the pressure-bearing plate (23) is arranged between the elastic member (22) and the piezoelectric actuator (21).

4. The polishing head structure according to claim 3, characterized in that: The N pressure adjustment components are distributed around the central axis of the hollow cavity (111) at different angular positions; or the N pressure adjustment components are distributed in sequence along the radial direction of the hollow cavity.

5. The polishing head structure according to claim 1 or 4, characterized in that: The plurality of pressure adjustment components are distributed around the central axis of the hollow cavity (111) at different angular positions to form a first pressure adjustment combination area, N pressure adjustment components form M first pressure adjustment combination areas, and the M first pressure adjustment combination areas are distributed in sequence along the radial direction of the hollow cavity (111); wherein 2≤M<N.

6. The polishing head structure according to claim 1, characterized in that: Any one of the elastic members (22) is a closed cavity surrounded by a flexible film, and there is gas in the closed cavity.

7. The polishing head structure according to claim 6, characterized in that: The carrier (1) further comprises a partition plate (13), wherein the partition plate (13) is fixedly connected to the inner wall of the side plate (11) so as to separate the hollow cavity (111) into a first accommodating cavity (1111) and a second accommodating cavity (1112); the piezoelectric actuator (21), the elastic member (22) and the workpiece to be polished (3) are all located in the second accommodating cavity (1112), and the piezoelectric actuator (21) is fixedly connected to the partition plate (13).

8. The polishing head structure according to claim 7, characterized in that: It also includes a control component (4), which is arranged in the first accommodating cavity (1111) and fixedly connected to the partition plate (13); the N piezoelectric actuators (21) have a common electrode (211) and N control electrodes (212); and the common electrode (211) and the N control electrodes (212) are both electrically connected to the control component (4).

9. A polishing head structure, characterized in that: include: A bearing member, the bearing member comprises a side plate and a transverse plate, the side plates enclose a hollow cavity, and the transverse plate cover is arranged on one side of the hollow cavity; N pressure adjustment components are located in the hollow cavity; any one of the pressure adjustment components includes at least one piezoelectric actuator, a pressure plate and a closed chamber, one side surface of the pressure plate is attached to a portion of the third surface of the workpiece to be polished, the closed chamber is arranged on a side surface of the pressure plate away from the workpiece to be polished, the closed chamber is surrounded by a flexible film, and there is gas in the closed chamber, the piezoelectric actuator is arranged on a side surface of the closed chamber away from the pressure plate, and the piezoelectric actuator is fixedly connected to the inner wall of the hollow cavity; Where N≥2; Any of the piezoelectric actuators has a polishing state in which a first pressure is generated on the corresponding closed chamber. In the polishing state, the closed chamber is deformed and a second pressure is generated on the workpiece to be polished.

10. A polishing head driving device, characterized in that: The polishing head structure according to any one of claims 1 to 9 further comprises: A driving member (5), wherein the driving member (5) is fixedly connected to the transverse plate (12), and the driving member (5) is capable of driving the bearing member (1) to rotate; A rotating electrical connector (6), the rotating electrical connector (6) comprising a fixed portion and a rotating portion, the fixed portion being fixedly connected to the driving member (5), and the rotating portion being fixedly connected to the transverse plate (12); The control element (4) is electrically connected to the circuit system via the rotating electrical connector (6).

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