Wafer glass carrier raw material grinding device

Abstract

The utility model discloses a wafer glass carrier raw material grinding device, including a mounting foot and a rubber pad, wherein the mounting foot is provided with a mounting hole inside, and a hydraulic cylinder is installed on the upper end of the mounting foot, a connecting plate is provided at the top of the hydraulic cylinder, and a storage box is provided at the rear side of the connecting plate, a built-in groove is provided inside the storage box, and a glass ring is provided inside the built-in groove, and the rubber pad is arranged on the inner wall of the glass ring. The wafer glass carrier raw material grinding device can limit the glass carrier through the glass ring, and the rubber pad can protect the rear surface of the glass carrier to avoid abrasion on the surface of the glass carrier, the adhesive strip can be attached to the table, and can be used together with the mounting hole to improve the stability of the mounting foot and prevent shaking, the corresponding ruler can conveniently adjust the lateral position of the grinding disc, and can grind different positions of the glass carrier, and the hydraulic cylinder can drive the grinding disc to move vertically.

Description

Technical Field

[0001] The utility model relates to the technical field of glass carriers, in particular to a device for polishing wafer glass carrier raw materials. Background Art

[0002] Glass wafer carrier, also known as glass substrate, is an important basic material in semiconductor technology. It is mainly used to carry and support the growth of thin film semiconductor materials, microelectronic device manufacturing and other processes. Specifically, its main functions include: the conductor glass wafer carrier provides a flat, pure, high-temperature resistant substrate for thin film deposition, ensuring that the semiconductor material can be uniformly filmed in a stable environment. High-quality wafer carriers can accurately control the thickness of the semiconductor film and its uniformity across the entire surface, which is essential for the manufacture of high-performance microelectronic devices. Glass polishing refers to the use of mechanical equipment and abrasives to produce tiny cutting and grinding on the glass surface to achieve the requirements of smoothness and precision. Its basic principle is to rub the rigid abrasive against the glass surface, grind the surface, and remove the tiny unevenness and dirt on the glass surface. Commonly used abrasives include aluminum oxide, silicon carbide, zirconium oxide, etc., and their particle size and hardness can be adjusted as needed. The glass wafer carrier is to mechanically grind the surface of the wafer to remove the damaged layer and residual layer on the surface, so that the surface of the wafer maintains flatness, smoothness and cleanliness. The process parameters of wafer grinding and polishing include grinding parameters and polishing parameters. Among them, grinding parameters include rotation speed, feed speed, grinding pressure, etc., while polishing parameters include key parameters such as the selection of polishing liquid, polishing time, polishing pressure, etc. Under different process requirements, it is necessary to select appropriate process parameters according to actual production needs.

[0003] As shown in the application number: CN202221431008.X, the utility model relates to the technical field of glass production, and discloses a four-side grinding device for glass production, including a carrier, an adjustable supporting mechanism including a bottom slide rail, the outer wall of the bottom slide rail is slidably connected to a top slider, the top of the top slider is bonded with a first anti-slip pad, the grinding mechanism includes a first fixed side plate, the telescopic end of the first electric push rod is fixedly connected to the second fixed side plate, the side wall of the second fixed side plate is fixedly connected to the second electric push rod, the inner wall of the connecting ear plate is rotatably connected to the grinding wheel through a grinding shaft, and the top of the connecting ear plate is fixedly connected to a grinding motor; by setting the grinding mechanism, it is convenient to grind the four sides of the glass at the same time, and the position of the grinding wheel can be adjusted according to the actual size of the glass, so as to facilitate grinding of glass of different sizes, and in addition, by setting the adjustable supporting mechanism, it is convenient to appropriately adjust the position of the bottom support according to the actual size of the glass, so that glass of different sizes can be evenly supported.

[0004] Similar to the above application, there are still the following deficiencies:

[0005] When the existing device is stored, the surface will directly contact the storage box, causing damage to the package surface of the glass slide.

[0006] Therefore, in view of this, the existing structure and defects are studied and improved, and a wafer glass carrier raw material grinding device is proposed, in order to achieve a more practical purpose. Utility Model Content

[0007] The purpose of the utility model is to provide a wafer glass carrier raw material grinding device to solve the problems raised in the above background technology.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer glass carrier raw material polishing device, comprising a mounting foot and a rubber pad, the mounting foot having a mounting hole therein, and a hydraulic cylinder being installed at the upper end of the mounting foot, a connecting plate being provided at the top end of the hydraulic cylinder, and a storage box being provided at the rear side of the connecting plate, a built-in groove being provided inside the storage box, and a glass ring being provided inside the built-in groove, and the rubber pad being placed on the inner wall of the glass ring.

[0009] Furthermore, a corresponding scale is installed on the inner wall of the connecting plate, and a fixing block is provided at the end of the connecting plate.

[0010] Furthermore, a connecting rod is provided on the inner wall of the top end of the hydraulic cylinder, and a sliding sleeve is installed on the outer side of the middle part of the connecting rod.

[0011] Furthermore, a telescopic rod is provided at the end of the sliding sleeve, and a motor is installed at the bottom end of the sliding sleeve.

[0012] Furthermore, a grinding disc is installed at the bottom end of the cylinder, and the cylinder and the grinding disc are threadedly connected.

[0013] Furthermore, an adhesive strip is arranged on the bottom surface of the mounting foot, and the area of ​​the adhesive strip occupies two-thirds of the area of ​​the mounting foot.

[0014] Furthermore, the glass rings are distributed at equal distances inside the built-in groove, and the glass rings are connected to the rubber pads by adhesive bonding.

[0015] Compared with the prior art, the beneficial effects of the utility model are: the wafer glass carrier raw material grinding device adopts an adjustment structure, which can adjust the horizontal and vertical positions of the grinding disk, so as to grind the surface of the glass carrier and grind glass carriers of different thicknesses. At the same time, the storage structure is used to protect the glass carrier while storing it.

[0016] 1. The utility model can limit the glass slide through the glass ring, and the rubber pad can protect the rear surface of the glass slide to avoid wear on the surface of the glass slide. The adhesive strip can be pasted to the table top, and can be used together with the mounting hole to improve the stability of the mounting foot and effectively prevent shaking. The corresponding ruler can facilitate the adjustment of the lateral position of the grinding disc, and different positions of the glass slide can be polished. The hydraulic cylinder can be used to drive the grinding disc to move vertically, and glass slides of different thicknesses can be polished. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the main three-dimensional structure of the wafer glass carrier raw material grinding device of the utility model;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the storage box of the wafer glass carrier raw material grinding device of the utility model;

[0019] Figure 3 This is a schematic diagram of the installation foot structure of the wafer glass carrier raw material grinding device of the utility model;

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the connecting plate of the wafer glass carrier raw material grinding device of the utility model.

[0021] In the figure: 1. Mounting foot; 2. Mounting hole; 3. Hydraulic cylinder; 4. Connecting plate; 5. Storage box; 6. Connecting rod; 7. Sliding sleeve; 8. Telescopic rod; 9. Fixed block; 10. Motor; 11. Grinding disc; 12. Built-in groove; 13. Glass ring; 14. Rubber pad; 15. Adhesive strip; 16. Corresponding ruler. DETAILED DESCRIPTION

[0022] The following is a further detailed description of the implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0023] like Figure 1-Figure 4As shown, a wafer glass carrier raw material grinding device includes a mounting foot 1 and a rubber pad 14, a mounting hole 2 is opened inside the mounting foot 1, and a hydraulic cylinder 3 is installed on the upper end of the mounting foot 1, a connecting plate 4 is arranged on the top end of the hydraulic cylinder 3, and a storage box 5 is arranged on the rear side of the connecting plate 4, a built-in groove 12 is arranged inside the storage box 5, and a glass ring 13 is opened inside the built-in groove 12, the rubber pad 14 is placed on the inner wall of the glass ring 13, a corresponding scale 16 is installed on the inner wall of the connecting plate 4, and a fixing block 9 is arranged at the end of the connecting plate 4, a connecting rod 6 is arranged on the inner wall of the top end of the hydraulic cylinder 3, and a sliding sleeve 7 is installed on the outer side of the middle part of the connecting rod 6, a telescopic rod 8 is arranged on the end of the sliding sleeve 7, and a motor 10 is installed on the bottom end of the sliding sleeve 7, a grinding disc 11 is installed on the bottom end of the motor 10, and the motor 10 and the grinding disc 11 is a threaded connection, and an adhesive strip 15 is arranged on the bottom surface of the mounting foot 1, and the area of ​​the adhesive strip 15 accounts for two-thirds of the area of ​​the mounting foot 1. The glass ring 13 is equidistantly distributed inside the built-in groove 12, and the glass ring 13 and the rubber pad 14 are adhesively connected. The glass ring 13 can limit the glass slide, and the rubber pad 14 can protect the rear surface of the glass slide to avoid wear on the surface of the glass slide. The adhesive strip 15 can be adhered to the table top, and can be used together with the mounting hole 2 to improve the stability of the mounting foot 1 and effectively prevent shaking. The corresponding ruler 16 is convenient for adjusting the lateral position of the grinding disc 11, and can grind different positions of the glass slide. The hydraulic cylinder 3 can drive the grinding disc 11 to move vertically, and can grind glass slides of different thicknesses.

[0024] Working principle: When the wafer glass carrier raw material grinding device is in use, first Figure 1-Figure 4 , press the mounting foot 1 so that the adhesive strip 15 on the bottom surface thereof is adsorbed to the table surface, and at the same time, the limit bolt is passed through the mounting hole 2, so that the mounting foot 1 can be fixed, thereby improving the stability of the mounting foot 1. After installation, the glass slide is placed under the grinding disc 11, and the height of the grinding disc 11 is adjusted according to the thickness of the glass slide. The hydraulic cylinder 3 is used to drive the grinding disc 11 to move downward so that the grinding disc 11 can contact the surface of the glass slide. The motor 10 is turned on to drive the grinding disc 11 to rotate, thereby grinding the surface of the glass slide. The polished glass slide can be placed in the glass ring 13 inside the storage box 5. The glass ring 13 can limit the glass slide, and at the same time, the rubber pad 14 can protect the rear surface of the glass slide to avoid wear on the surface of the glass slide.

[0025] The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific uses.

Claims

1. A wafer glass carrier raw material grinding device, comprising a mounting foot (1) and a rubber pad (14), characterized in that: The mounting foot (1) is provided with a mounting hole (2) inside, and a hydraulic cylinder (3) is installed at the upper end of the mounting foot (1), a connecting plate (4) is provided at the top end of the hydraulic cylinder (3), and a storage box (5) is provided at the rear side of the connecting plate (4), a built-in groove (12) is provided inside the storage box (5), and a glass ring (13) is provided inside the built-in groove (12), and the rubber pad (14) is arranged on the inner wall of the glass ring (13).

2. The wafer glass carrier raw material grinding device according to claim 1, characterized in that: A corresponding scale (16) is installed on the inner wall of the connecting plate (4), and a fixing block (9) is provided at the end of the connecting plate (4).

3. The wafer glass carrier raw material grinding device according to claim 1, characterized in that: A connecting rod (6) is provided on the inner wall of the top end of the hydraulic cylinder (3), and a sliding sleeve (7) is installed on the outer side of the middle part of the connecting rod (6).

4. The wafer glass carrier raw material grinding device according to claim 3, characterized in that: A telescopic rod (8) is provided at the end of the sliding sleeve (7), and a motor (10) is installed at the bottom end of the sliding sleeve (7).

5. The wafer glass carrier raw material grinding device according to claim 4, characterized in that: A grinding disc (11) is installed at the bottom end of the motor (10), and the motor (10) and the grinding disc (11) are threadedly connected.

6. The wafer glass carrier raw material grinding device according to claim 1, characterized in that: An adhesive strip (15) is arranged on the bottom surface of the mounting foot (1), and the area of ​​the adhesive strip (15) accounts for two thirds of the area of ​​the mounting foot (1).

7. The wafer glass carrier raw material grinding device according to claim 1, characterized in that: The glass rings (13) are distributed at equal distances inside the built-in groove (12), and the glass rings (13) and the rubber pads (14) are connected by adhesive bonding.

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