Surface treatment device with collection function

Abstract

The utility model discloses a surface treatment device with a collection function, which relates to the technical field of copper wire processing, and includes an electroplating treatment box arranged at the top of a base, and a collection component is arranged above the base; the interior of the collection component includes a collection plate arranged at one side of the electroplating treatment box, and a through hole is opened at the center of the collection plate, and a collection box is arranged directly below the through hole and at the top of the base; the interior of the collection component also includes a vertical plate arranged at one side of the base, and a motor is installed on the surface of the vertical plate. In the utility model, the moisture remaining on the copper wire after silver plating can be dried and collected by the collection plate and the heating plate, so as to avoid directly collecting the silver-plated copper wire with residual moisture, which affects the product quality of the silver-plated copper wire, and the baffle can be moved out from the interior of the partition by squeezing the second squeezing ball by the first squeezing ball, so as to increase the distance between the two sides of the partition, so that more silver-plated copper wires can be rolled up, thereby improving its working efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of copper wire processing, in particular to a surface treatment device with a collection function. Background Art

[0002] Silver-plated copper wire is called silver-plated copper wire or silver-plated wire in some occasions. It is a thin wire made by silver-plating oxygen-free copper wire or low-oxygen copper wire and then drawing it through a wire drawing machine. When the copper wire is silver-plated, the pre-treated copper wire is hung in the electroplating tank to ensure that the copper wire is completely immersed in the liquid. Connect the positive cable to the copper wire and the negative cable to the silver anode in the electroplating tank. Turn on the power and set the appropriate current and time parameters for silver plating. According to the requirements of the silver plating solution, it is usually necessary to carry out the silver plating within a certain current and time range to obtain the appropriate silver plating thickness.

[0003] At present, the surface treatment device with a collection function generally collects the silver-plated copper wire through a winding roller after silver-plating the copper wire. After the silver-plating is completed, a certain amount of moisture remains on the surface of the copper wire, which directly affects the product quality of the silver-plated copper wire after it is collected. At the same time, when the copper wire is collected by the winding roller, the height of the partitions on both sides of the winding roller is the height after it can accommodate the silver-plated copper wire. When a large amount of silver-plated copper wire needs to be collected, the winding roller needs to be replaced to continue collecting, which reduces work efficiency. Utility Model Content

[0004] The utility model provides a surface treatment device with a collecting function, which can dry and collect the residual moisture on the copper wire after silver plating through a collecting plate and a heating plate, so as to avoid directly collecting the silver-plated copper wire with residual moisture, which affects the product quality of the silver-plated copper wire, and through the squeezing of the second squeezing ball by the first squeezing ball, the baffle can be moved out from the inside of the partition, and the distance between the two sides of the partition can be increased, so that more silver-plated copper wires can be rolled up, thereby improving its working efficiency, and in summary, solves the problems in the background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A surface treatment device with a collection function comprises an electroplating treatment box arranged on the top of a base, and a collection component is arranged above the base;

[0007] The interior of the collecting assembly includes a collecting plate arranged on one side of the electroplating treatment box, and a through hole is opened at the center of the collecting plate, and a collecting box is arranged directly below the through hole and at the top of the base;

[0008] The interior of the collecting assembly also includes a vertical plate arranged on one side of the base, and a motor is installed on the surface of the vertical plate. The output end of the motor is connected to a connecting rod, and one side of the connecting rod is connected to a partition, and rollers are arranged between the partitions.

[0009] As a further description of the above technical solution:

[0010] A fixing plate is arranged directly above the collecting plate and at the outlet side of the electroplating treatment box, and a heating plate is connected to the bottom end of the fixing plate.

[0011] As a further description of the above technical solution:

[0012] The collecting plate is an arc-shaped collecting plate.

[0013] As a further description of the above technical solution:

[0014] The surface of the connecting rod is threadedly connected to an annular plate, and a sliding groove is provided on one side of the annular plate, a sliding block is slidably connected to the inside of the sliding groove, and a mounting rod is connected to one side of the sliding block, one end of the mounting rod is connected to a first squeezing ball, cross plates are equidistantly arranged in an inner ring of the partition, and a moving rod is slidably connected to the surface of the cross plate, one end of the moving rod is connected to a second squeezing ball, and a spring is connected between the second squeezing ball and the cross plate, and the other end of the moving rod is connected to a baffle.

[0015] As a further description of the above technical solution:

[0016] The mounting rod is movably sleeved with the surface of the partition plate, and the surfaces of the first extrusion ball and the second extrusion ball are in contact.

[0017] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0018] In the utility model, the moisture remaining on the copper wire after silver plating can be dried and collected by means of a collecting plate and a heating plate, so as to avoid directly collecting the silver-plated copper wire with residual moisture, which would affect the product quality of the silver-plated copper wire. Moreover, by squeezing the second squeezing ball by the first squeezing ball, the baffle can be moved out from the interior of the partition, and the distance between the two sides of the partition can be increased, so that more silver-plated copper wires can be rolled up, thereby improving the working efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of a surface treatment device with a collection function;

[0020] Figure 2 This is a schematic diagram of the surface structure of the connecting rod in the utility model;

[0021] Figure 3It is a schematic diagram of the surface structure of the annular plate in the utility model;

[0022] Figure 4 It is a schematic diagram of the internal structure of the partition board of the utility model.

[0023] Legend:

[0024] 1. Base; 2. Electroplating treatment box; 3. Fixed plate; 4. Collecting plate; 5. Collecting box; 6. Through hole; 7. Motor; 8. Connecting rod; 9. Partition; 10. Roller; 11. Annular plate; 12. Slide groove; 13. Sliding block; 14. Mounting rod; 15. First squeezing ball; 16. Horizontal plate; 17. Moving rod; 18. Second squeezing ball; 19. Spring; 20. Baffle. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Reference Figure 1-Figure 4 A surface treatment device with a collecting function comprises an electroplating treatment box 2 arranged at the top of a base 1, a collecting assembly is arranged above the base 1; the interior of the collecting assembly comprises a collecting plate 4 arranged at one side of the electroplating treatment box 2, and a through hole 6 is opened at the center of the collecting plate 4, and a collecting box 5 is arranged directly below the through hole 6 and at the top of the base 1; the interior of the collecting assembly also comprises a vertical plate arranged at one side of the base 1, and a motor 7 is installed on the surface of the vertical plate, a connecting rod 8 is connected to the output end of the motor 7, and a partition 9 is connected to one side of the connecting rod 8, and a roller 10 is arranged between the partitions 9. After the copper wire is silver-plated, it can be led out from the outlet of the electroplating treatment box 2 and pass under the heating plate. The moisture on the surface of the copper wire after silver plating can be dried by the heating plate, and at the same time, the roller 10 When winding, the silver-plated copper wire is moving, so that the remaining residual water droplets on its surface can be dropped into the inside of the collecting plate 4 for collection. If more silver-plated copper wires need to be collected, the annular plate 11 can be rotated to drive the first squeezing ball 15 to move, so that the first squeezing ball 15 can be moved to the surface of the second squeezing ball 18 and squeezed to move it, so that the baffle 20 can be moved out from the inside of the partition 9, so as to expand the distance between the two sides of the partition 9 so that more silver-plated copper wires can be wound. The inside of the electroplating treatment box 2 is provided with an electroplating tank (not shown, and the existing copper wire silver plating technology can be referred to). Through the liquid in the electroplating tank and the power on, the silver ions in the solution react chemically with the copper wire to complete the silver plating. This is a prior art, so it is not explained in detail.

[0027] Furthermore, a fixing plate 3 is provided directly above the collecting plate 4 and on the outlet side of the electroplating treatment box 2, and a heating plate is connected to the bottom end of the fixing plate 3, which is convenient for drying the moisture remaining on the surface of the silver-plated copper wire.

[0028] Furthermore, the collecting plate 4 is an arc-shaped collecting plate 4, and the center of the arc-shaped collecting plate 4 is concave, which is convenient for the water droplets remaining on the surface of the silver-plated copper wire to fall into the inside of the collecting plate 4, and flow into the inside of the collecting box 5 through the through hole 6 through the concave part for collection. Of course, the size of the collecting plate 4 is operated according to actual conditions.

[0029] Furthermore, the surface of the connecting rod 8 is threadedly connected to an annular plate 11, and a slide groove 12 is provided on one side of the annular plate 11, a slider 13 is slidably connected inside the slide groove 12, and a mounting rod 14 is connected to one side of the slider 13, and one end of the mounting rod 14 is connected to a first squeezing ball 15, and a transverse plate 16 is equidistantly arranged in an annular shape inside the partition 9, and a moving rod 17 is slidably connected to the surface of the transverse plate 16, one end of the moving rod 17 is connected to a second squeezing ball 18, and a spring 19 is connected between the second squeezing ball 18 and the transverse plate 16, and the other end of the moving rod 17 is connected to a baffle 20. The annular plate 11 can also move when the surface of the connecting rod 8 rotates. When the annular plate 11 rotates, it can move on the surface of the slider 13 through the slide groove 12, and drive the mounting rod 14 and the first squeezing ball 15 to move through the slider 13 and the slide groove 12, so that the first squeezing ball 15 can be moved to the surface of the second squeezing ball 18 and squeeze it. After being squeezed, the second squeezing ball 18 can drive the moving rod 17 and the baffle 20 to move, and the baffle 20 can be moved out from the inside of the partition 9, thereby increasing the distance between the two sides of the partition 9, which is convenient for collecting more silver-plated copper wires.

[0030] Furthermore, the mounting rod 14 and the surface of the partition 9 are movably connected, and the first squeezing ball 15 contacts the surface of the second squeezing ball 18, which is convenient for the movement of the annular plate 11, which can drive the mounting rod 14 and the first squeezing ball 15 to move, and move the first squeezing ball 15 to the surface of the second squeezing ball 18 to squeeze it.

[0031] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A surface treatment device with a collection function, comprising an electroplating treatment box (2) arranged on the top of a base (1), characterized in that: A collecting assembly is arranged above the base (1); The interior of the collecting assembly includes a collecting plate (4) arranged on one side of the electroplating treatment box (2), and a through hole (6) is opened at the center of the collecting plate (4), and a collecting box (5) is arranged directly below the through hole (6) and at the top of the base (1); The interior of the collecting assembly also includes a vertical plate arranged on one side of the base (1), and a motor (7) is installed on the surface of the vertical plate. The output end of the motor (7) is connected to a connecting rod (8), and one side of the connecting rod (8) is connected to a partition (9), and rollers (10) are arranged between the partitions (9).

2. A surface treatment device with a collection function according to claim 1, characterized in that: A fixing plate (3) is arranged directly above the collecting plate (4) and on the outlet side of the electroplating treatment box (2), and a heating plate is connected to the bottom end of the fixing plate (3).

3. A surface treatment device with a collection function according to claim 1, characterized in that: The collecting plate (4) is an arc-shaped collecting plate (4).

4. The surface treatment device with collection function according to claim 1, characterized in that: The surface of the connecting rod (8) is threadedly connected to an annular plate (11), and a sliding groove (12) is provided on one side of the annular plate (11). A sliding block (13) is slidably connected inside the sliding groove (12), and a mounting rod (14) is connected to one side of the sliding block (13). One end of the mounting rod (14) is connected to a first squeezing ball (15). The inner ring of the partition (9) is equidistantly provided with a transverse plate (16), and the surface of the transverse plate (16) is slidably connected to a moving rod (17). One end of the moving rod (17) is connected to a second squeezing ball (18), and a spring (19) is connected between the second squeezing ball (18) and the transverse plate (16). The other end of the moving rod (17) is connected to a baffle (20).

5. The surface treatment device with collection function according to claim 4, characterized in that: The mounting rod (14) and the surface of the partition plate (9) are movably sleeved, and the surfaces of the first squeezing ball (15) and the second squeezing ball (18) are in contact.

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