Memory chip test components and test modules

Abstract

The utility model proposes a memory chip test assembly and a test module, which belongs to the technical field of memory test devices, and specifically includes a DUT holder, a metal pressure head arranged on one side of the DUT holder, and a test mainboard arranged on the other side; the metal pressure head includes a protrusion and a step, a heating unit is arranged in the protrusion, a first contact group is arranged on the step, and the heating unit is electrically connected to the first contact group; a card slot for placing the DUT is arranged in the DUT holder, a first through hole and a metal probe arranged in the first through hole are vertically opened on the DUT holder corresponding to the first contact group, a second contact group is arranged on the test mainboard corresponding to the first contact group, one end of the metal probe abuts the first contact group, and the other end abuts the second contact group. The technical solution of the utility model adopts contact and spring probe contact electrical connection instead of wire connection, which greatly reduces the number of circuits of the whole machine, saves space, and improves system stability.

Description

Technical Field

[0001] The utility model relates to the technical field of memory testing devices, in particular to a memory chip testing component and a testing module. Background Art

[0002] BGA (Ball Grid Array) packaging (Ball Grid Array packaging) is to electrically connect the metal pads of the chip with the pads on the printed circuit board, where the external leads are solder balls, and the array is distributed on the plane of the packaging substrate. During the test of the chip using BGA packaging, the chip under test and the test motherboard are usually connected through conductive glue (Rubber Socket), and a certain downward pressure needs to be applied to the conductive glue to ensure the contact conduction.

[0003] Chip testing is an important part of ensuring chip quality during chip manufacturing. The test system includes a handler (sorter) and a tester. The handler (sorter) is responsible for transporting and sorting the chips to be tested, and provides downward pressure and test environment temperature; the tester is responsible for testing the chips. In order to improve the chip testing efficiency, the tester needs to test a large number of chips at the same time. The chips to be tested are arranged closely on the tester. As the demand for productivity continues to increase, the number of chips tested by the tester at the same time is also increasing.

[0004] The above chip testing process has the following defects: the existing Handler mostly uses overall temperature control because the chips under test are closely arranged. Due to the large area of ​​the temperature control area, uneven temperature is prone to occur. If each chip under test is equipped with a test component controlled by a Handler, the number of lines is too large, which is not feasible from the perspective of structural space, difficulty of disassembly and assembly, and reliability. Utility Model Content

[0005] The main purpose of the utility model is to solve the above-mentioned technical problems.

[0006] According to one aspect of the utility model, a memory chip test assembly is provided, comprising a DUT holder, a metal pressure head arranged on one side of the DUT holder, and a test mainboard arranged on the other side;

[0007] The metal pressure head includes a protrusion and a step, a heating unit is arranged in the protrusion, a first contact group is arranged on the step, and the heating unit is electrically connected to the first contact group;

[0008] The DUT holder is provided with a slot for placing the DUT, the protrusion abuts against the DUT, and the DUT holder is vertically provided with a first through hole corresponding to the first contact group and a metal probe arranged in the first through hole;

[0009] A contact group and a temperature sensor abutting the DUT, and a positioning plate for fixing the DUT holding frame are provided on one side of the test main board, and a temperature control unit is provided on the other side of the test main board. A second contact group is provided on the test main board corresponding to the first contact group, and the second contact group is electrically connected to the temperature sensor and the temperature control unit. A second through hole is penetrated through the positioning plate, and one end of the metal probe abuts the first contact group and penetrates the first through hole and the second through hole, and the other end abuts the second contact group.

[0010] Preferably, conductive glue is provided on the contact group, and the conductive glue is provided around the temperature sensor.

[0011] Preferably, the heating unit is arranged close to the DUT.

[0012] Preferably, two sides of the heating unit abut against the metal pressure head and the DUT respectively.

[0013] Preferably, the first contact group and the second contact group both include positive and negative contacts.

[0014] Preferably, the metal probe is a metal spring probe.

[0015] Preferably, the test mainboard uses PWM control to control the operation of the heating unit.

[0016] Preferably, the heating unit can be replaced by a refrigeration unit.

[0017] Preferably, a refrigeration unit is provided on the heating unit.

[0018] According to another aspect of the utility model, a memory chip test module is provided, comprising the memory chip test assembly described above, wherein the metal pressure head (11), the DUT holder (21) and the test main board (31) are arranged in an array on the same plane to form a unit layer structure.

[0019] The technical solution of the utility model adopts contact and spring probe contact electrical connection instead of wire connection, which eliminates the binding relationship between the temperature control circuit, temperature sensor and heating element due to the wire connection structure, greatly reduces the number of circuits in the whole machine, saves space, and improves system stability; the temperature control accuracy is higher than that of the overall temperature control; the heating power required for independent temperature control is smaller than that of the overall temperature control, and it is more energy-saving. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] With reference to the accompanying drawings, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings are only used for illustrative purposes and are not intended to limit the protection scope of the present utility model.

[0021] Figure 1 This is a schematic diagram of the structure of a memory chip test assembly involved in an embodiment of the utility model;

[0022] Figure 2 for Figure 1 A partial enlarged view of middle A;

[0023] Figure 3 for Figure 1 A partial enlarged view of B in the middle;

[0024] Figure 4 It is a further detailed structural diagram of the DUT holder involved in the embodiment of the utility model;

[0025] Figure 5 A schematic diagram of another three-dimensional structure of a metal pressing head according to an embodiment of the utility model.

[0026] Description of Figure Numbers:

[0027] 11. Metal pressure head; 111. Raised part; 112. Heat generating unit; 113. Step; 114. First contact group; 115. Line; 116. Pressure head PCB;

[0028] 21, DUT holder; 211, front end; 212, slot; 213, DUT; 214, first through hole; 215, metal probe; 216, DUT limit frame; 217, DUT limit claw;

[0029] 31. Test main board; 311. Conductive adhesive; 312. Positioning plate; 313. Temperature sensor; 314. Temperature control unit; 315. Second contact group; 316. Second through hole.

[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0032] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0033] The utility model provides a memory chip testing component, such as Figure 1 , 2 As shown in FIG. 3 , the test assembly includes a metal pressure head 11 , a DUT holder 21 and a test main board 31 from top to bottom.

[0034] The cross section of the metal pressing head 11 is a downward convex structure, specifically including a raised portion 111 connected to the DUT test surface and a step 113 connected to the DUT fixing surface. The Handler (sorting machine) applies downward pressure to the DUT (chip under test) 213 through the metal pressing head 11. Figure 1 As shown, the raised portion 111 of the metal press head 11 is in direct contact with the DUT 213. It can be known that the contact area between the raised portion 111 and the DUT 213 is as large as possible, and continuous contact can be achieved in the length and width directions of the DUT 213 to avoid uneven force on the DUT 213. The metal press head 11 is in full contact with the test surface of the DUT 213 to ensure the stability of the electrical signal transmission during the test. Preferably, the area of ​​the raised portion 111 is equivalent to the area of ​​the solder ball array distribution on the DUT 213.

[0035] Continue to see Figure 1 A heating unit 112 is arranged inside the raised portion 111 of the metal pressing head 11, and a first contact group 114 is arranged at the step 113 on either side of the metal pressing head 11. The first contact group 114 is electrically connected to the heating unit 112, and the electrically connected wire is preferably a twisted pair wire.

[0036] The heating unit 112 can heat the protrusion 111 uniformly, and the heating rate and temperature can be controlled by the control system. Therefore, the heating unit 112 can select resistance heating such as electric heating tube, thermistor (PTC), electric heating film. In order to improve the heat transfer efficiency and reduce the temperature gradient, the heating unit 112 is close to the contact surface between the protrusion 111 and the DUT 213, and can also be set on the surface of the protrusion 111 to directly contact the DUT 213.

[0037] It can be seen from the description that the heating unit 112 is used to heat the DUT213 for testing. In one embodiment, the heating unit 112 is arranged inside the metal pressing head 11, and the heat is conducted to the DUT213 through the protrusion 111. In another embodiment, the heating unit 112 is arranged between the contact surface of the metal pressing head 11 and the DUT213. Compared with the above embodiment, the heat conduction efficiency of the heating unit is higher, the temperature control is more precise, the heat loss is reduced, and the temperature test effect is more accurate.

[0038] like Figure 1As shown, DUT213 is fixed in DUT holder 21 during testing. In this solution, there is no restriction on how DUT holder fixes DUT. The optional methods are: the front end 211 of DUT holder 21 is provided with a card slot 212 for fixing DUT213, preferably by card fixing, and multiple groups are arranged to facilitate the disassembly, assembly and movement of DUT213. A limit frame and a movable buckle can also be set on DUT holder 21, and DUT is placed into DUT holder from the z-axis direction (vertical direction) downward, and the limit frame limits the position of DUT213 in the xy direction (left and right or front and back direction), and the movable buckle limits the position of DUT213 in the z direction (vertical direction).

[0039] The top of the DUT holder 21 contacts the step 113 of the metal press head 11 , and the vertical distance between the top of the DUT holder 21 and the slot 212 is smaller than the vertical height of the protrusion 111 , so as to ensure that the protrusion 111 can first contact the DUT 213 to achieve contact and power supply.

[0040] The first contact group 114 on the step 113 of the metal pressing head 11 on the DUT holder 21 is provided with a first through hole 214, and a metal probe 215 that can slide up and down is arranged in the first through hole 214. The length of the metal probe 215 is greater than the vertical height of the DUT holder 21. The metal probe 215 can be a spring probe, and the height can be automatically adjusted according to the up and down movement of the metal pressing head 11 to obtain a better electrical connection contact ( Figure 2 ).

[0041] The test main board 31 is located below the DUT holder 21 , and specifically includes a conductive adhesive 311 , a positioning plate 312 , a temperature sensor 313 and a temperature control unit 314 .

[0042] The conductive glue 311 is located directly below the DUT 213 and is arranged on the top of the test main board 31. A corresponding contact group (not shown in the figure) is arranged on the test main board 31 corresponding to the solder ball array on the DUT 213. The conductive glue 311 is located between the solder ball array on the DUT 213 and the contact group on the test main board 31. In order to ensure that the conductive glue 311 is accurately positioned, positioning plates 312 are arranged on both sides thereof. The positioning plates 312 are fixedly arranged on the test main board 31.

[0043] A temperature sensor 313 is provided on the test main board 31 for monitoring the surface temperature of the array solder balls on the DUT213 and the contact group on the test main board 31. When the temperature sensor 313 is set directly below the DUT, the conductive glue 311 opens a groove or through hole corresponding to the temperature sensor 313 to accommodate the temperature sensor 313.

[0044] The first contact group 114 on the step 113 of the metal pressing head 11 on the test main board 31 is provided with a second contact group 315, the second contact group 315 is electrically connected to the temperature sensor 313, and the first contact group 114 and the second contact group 315 are coaxial in the vertical direction ( Figure 3 ).

[0045] The second through hole 316 is formed on the positioning plate 312 corresponding to the second contact group 315 on the test main board 31. The positioning plate 312 is located at the bottom of the DUT holder 21. The first through hole 214 is roughly aligned with the second through hole 316. Due to machining errors, the first through hole 214 and the second through hole 316 are kept coaxial as much as possible so that the metal probe 215 passes through the first through hole 214 and the second through hole 316. The positioning plate 312 can further locate the position of the DUT holder 21.

[0046] In the embodiment, the temperature of a single DUT 213 is controlled, and a metal probe 215 is used to replace the wire to avoid complex circuit structure. The temperature of a single chip (DUT) is precisely controlled by the control system (test mainboard 31).

[0047] The temperature control unit 314 is disposed at the bottom of the test main board 31 and is electrically connected to the second contact group 315 for controlling the operation of the heating unit 112 and the temperature sensor 313 .

[0048] Working mode: During the test, DUT213 is fixed in the DUT holder 21, and the Handler (sorter) drives the metal press head 11 to move downward, the raised portion 111 of the metal press head 11 contacts the DUT213, the step 113 of the metal press head 11 contacts the DUT holder 21, the first contact group 114 contacts the top of the metal probe 215, and the metal press head 11 moves further downward, the DUT holder 21 contacts the positioning plate 312, the bottom of the metal probe 215 contacts the second contact group 315 on the test main board 31, and the heating unit 112 is electrically connected to the test main board 31 through the metal probe 215. At this time, the bottom of the DUT213 fixed in the DUT holder 21 contacts the conductive glue 311 on the test main board 31, the heating unit 112 in the metal press head 11 and the temperature sensor 313 on the test main board 31 are connected to the temperature control unit 314, and the test main board 31 starts testing.

[0049] Exemplarily, the first contact group 114 in the above structure is provided with positive and negative contacts, and similarly, the second contact group 315 is provided with positive and negative contacts. The electrical connection belongs to the existing technology in the electrical field and will not be described in detail here.

[0050] In the above embodiment, the test mainboard 31 can control the operation of the heating unit 112 by PWM control, and the temperature control unit 314 on the test mainboard 31 controls the duty cycle of power supply to the heating unit 112 according to the temperature information received from the temperature sensor 313 to achieve temperature regulation. Specifically, when the temperature monitored by the temperature sensor 313 is lower than the set temperature, the temperature control unit 314 controls to increase the duty cycle of power supply to increase the heating power of the heating unit 112; when the temperature monitored by the temperature sensor 313 is higher than the set temperature, the temperature control unit 314 controls to decrease the duty cycle of power supply to reduce the heating power of the heating unit 112, so as to achieve uniform temperature of the DUT and ensure that the temperature of the temperature control area is relatively stable.

[0051] The temperature control unit 314 in the above embodiment can adjust the heating power by adjusting the power supply voltage or power supply current of the heating unit 112 .

[0052] The heating unit 112 in the above embodiment can also be replaced by a refrigeration unit such as a cooling liquid distribution unit. 、 Semiconductor refrigeration chip. Taking the semiconductor refrigeration chip as an example, when the test temperature is required to be low, such as -50℃, the test mainboard controls the semiconductor refrigeration chip to work. When the heating unit and the cooling unit exist at the same time, the general test environment temperature range is -55℃~125℃. The test mainboard can control the heating unit and the cooling unit to work separately, and test the DUT in a wider temperature range.

[0053] The DUT holder disclosed in this application has a further refined structure, see Figure 4 , the DUT holder 21 includes a DUT limit frame 216, a DUT limit claw 217 and a metal probe 215. The DUT limit claw 217 can be opened movably. When the DUT 213 is placed, the DUT limit claw 217 is opened, and the DUT is placed in the DUT limit frame 216. Then the DUT limit claw 217 is closed to completely determine the relative position of the DUT 213 and the DUT holder 21. Otherwise, the DUT 213 can be taken out. Multiple DUT holders 21 are arranged in an array on a steel frame on the same plane to form a test module (test tray) (Test Tray). TestTray, as a part of the Handler, carries the DUT and circulates inside the Handler. The structure described in this patent is the situation when the Test Tray circulates to the test position. The workflow involved in the structure described in this patent does not include taking and placing the DUT 213 from the DUT holder 21. In the workflow involved in the structure described in this patent, the DUT 213 is always fixed in the DUT holder 21.

[0054] In the above embodiment, the present application discloses another structure of the metal pressure head. Compared with the original structure, the protrusion structure for contacting the DUT may not be provided. A pressure head PCB 116 is provided below the metal pressure head. A heating (cooling) unit 112 is welded and provided on the pressure head PCB 116 at a position corresponding to the DUT. A first contact group 114 is provided on the pressure head PCB 116 at a position corresponding to the metal probe 215. The first contact group 114 and the heating unit 112 are electrically connected through the pressure head PCB 116. When the metal pressure head 11 is pressed down, the heating unit 112 directly contacts the DUT 213, and the first contact group 114 contacts the metal probe 215 on the DUT holder 21. This structural design is more concise.

[0055] The technical solution of the utility model adopts contact and spring probe contact electrical connection instead of wire connection, which eliminates the binding relationship between the temperature control circuit, temperature sensor and heating element due to the wire connection structure, greatly reduces the number of circuits in the whole machine, saves space, and improves system stability; the temperature control accuracy is higher than that of the overall temperature control; the heating power required for independent temperature control is smaller than that of the overall temperature control, and it is more energy-saving.

Claims

1. A memory chip test assembly, characterized in that: It comprises a DUT holder (21), a metal pressure head (11) arranged on one side of the DUT holder (21), and a test main board (31) arranged on the other side; The metal pressure head (11) comprises a protruding portion (111) and a step (113); a heating unit (112) is arranged in the protruding portion (111); a first contact group (114) is arranged on the step (113); and the heating unit (112) is electrically connected to the first contact group (114); A slot (212) for placing a DUT (213) is provided in the DUT holder (21), the protrusion (111) abuts against the DUT (213), and a first through hole (214) and a metal probe (215) are vertically provided on the DUT holder (21) corresponding to the first contact group (114); A contact group and a temperature sensor (313) abutting against the DUT (213), and a positioning plate (312) for fixing the DUT holder (21) are provided on one side of the test main board (31); a temperature control unit (314) is provided on the other side of the test main board (31); a second contact group (315) is provided on the test main board (31) corresponding to the first contact group (114); the second contact group (315) is electrically connected to the temperature sensor (313) and the temperature control unit (314); a second through hole (316) is penetrated through the positioning plate (312); one end of the metal probe (215) abuts against the first contact group (114) and penetrates the first through hole (214) and the second through hole (316); and the other end abuts against the second contact group (315).

2. The memory chip test assembly according to claim 1, characterized in that: A conductive glue (311) is arranged on the contact group, and the conductive glue (311) is arranged around the temperature sensor (313).

3. The memory chip testing assembly according to claim 1, characterized in that: The heating unit (112) is arranged close to the DUT (213).

4. The memory chip testing assembly according to claim 3, characterized in that: Two sides of the heating unit (112) respectively abut against the metal pressure head (11) and the DUT (213).

5. The memory chip testing assembly according to claim 4, characterized in that: The first contact group (114) and the second contact group (315) both include positive and negative contacts.

6. The memory chip testing assembly according to claim 5, characterized in that: The metal probe (215) is a metal spring probe.

7. The memory chip testing assembly according to claim 5, characterized in that: The test mainboard (31) controls the operation of the heating unit (112) by using a PWM control method.

8. The memory chip test assembly according to any one of claims 1 to 7, characterized in that: The heating unit (112) may be replaced by a cooling unit.

9. The memory chip testing assembly according to any one of claims 1 to 7, characterized in that: The heating unit (112) is provided with a refrigeration unit.

10. A memory chip test module, characterized in that: A memory chip test assembly comprising any one of claims 1 to 9, wherein the metal pressure head (11), the DUT holder (21) and the test main board (31) are arranged in an array on the same plane to form a unit layer structure.

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