A binding structure of FPC

Abstract

The utility model discloses a binding structure of an FPC, comprising: conductive glue, a first FPC board and a second FPC board; the first FPC board is provided with a first binding groove, the first binding groove is provided with a copper layer electrically connected to the internal circuit of the first FPC board, the conductive glue has adhesiveness on both sides, the binding end of the second FPC board is provided with a copper layer electrically connected to the second FPC board, and the copper layer on the first FPC board and the copper layer on the second FPC board are electrically connected through the conductive glue. The design of the first binding groove facilitates the alignment of the second FPC board, reduces the binding error caused by manual work, and improves the alignment accuracy of the first FPC board and the second FPC board.

Description

Technical Field

[0001] The utility model relates to the field of flexible circuit boards, in particular to a binding structure of an FPC. Background Art

[0002] In the prior art, many FPCs cannot be automatically bound to each other due to their large size, so factories usually use manual binding. However, when manually binding two FPCs, manual operation errors are large, and the efficiency is low when aligning the two FPCs. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a binding structure for an FPC.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A binding structure of an FPC comprises: a conductive adhesive, a first FPC board and a second FPC board; the first FPC board is provided with a first binding groove, the first binding groove is provided with a copper layer electrically connected to an internal circuit of the first FPC board; both sides of the conductive adhesive are sticky; a binding end of the second FPC board is provided with a copper layer electrically connected to the second FPC board, and the copper layer on the first FPC board and the copper layer on the second FPC board are electrically connected via the conductive adhesive.

[0006] In one embodiment, a second binding groove is provided on the binding end of the second FPC board, and the copper layer is provided on the second binding groove.

[0007] In one embodiment, the length of the first binding groove is 0.2 mm greater than the length of the second binding groove, and the length of the first binding groove is 0.2 mm greater than the width of the second binding groove.

[0008] In one embodiment, the first FPC board is a rectangular parallelepiped structure, and the four sides of the first FPC board are set to have arc-shaped chamfers.

[0009] In one embodiment, the second FPC board is in an "L" shape.

[0010] In one embodiment, the conductive adhesive is ACF.

[0011] In one embodiment, the first binding groove is arranged at a central edge of the first FPC board.

[0012] In one embodiment, a reinforcing plate is provided on the back of the first FPC board.

[0013] In one embodiment, the reinforcing plate is a PCB board or a steel plate.

[0014] In one embodiment, the thickness of the steel plate is 0.02 mm.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The binding structure of the FPC of the utility model is provided with a conductive adhesive, a first FPC board and a second FPC board. The first FPC board is provided with a first binding groove, and the first binding groove is provided with a copper layer electrically connected to the internal circuit of the first FPC board. Both sides of the conductive adhesive are sticky. The binding end of the second FPC board is provided with a copper layer electrically connected to the second FPC board, and the copper layer on the first FPC board and the copper layer on the second FPC board are electrically connected through the conductive adhesive. The design of the first binding groove facilitates the alignment of the second FPC board, reduces the binding error caused by manual work, and improves the alignment accuracy of the first FPC board and the second FPC board. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a structural schematic diagram of the connection between the first FPC board and the second FPC board of the FPC binding structure in one embodiment of the utility model;

[0019] Figure 2 It is a structural schematic diagram of the binding structure of the FPC in one embodiment of the utility model;

[0020] Figure 3 This is a schematic diagram of the structure of the first FPC board in one embodiment of the utility model;

[0021] Figure 4 It is a schematic structural diagram of the second FPC board in one embodiment of the utility model.

[0022] Reference numerals:

[0023] Conductive adhesive 10 , first FPC board 20 , second FPC board 30 , first binding groove 40 , second binding groove 50 . DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0025] This application proposes a FPC binding structure, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4, including a conductive adhesive 10, a first FPC board 20 and a second FPC board 30. The first FPC board 20 is provided with a first binding groove 40. The design of the first binding groove 40 facilitates the alignment of the second FPC board 30. The first binding groove 40 is provided with a copper layer electrically connected to the internal circuit of the first FPC board 20. Both sides of the conductive adhesive 10 are sticky. The binding end of the second FPC board 30 is provided with a copper layer electrically connected to the second FPC board 30, and the copper layer on the first FPC board 20 and the copper layer on the second FPC board 30 are electrically connected through the conductive adhesive 10. Reduce the error caused by manual binding and improve the alignment accuracy of the first FPC board 20 and the second FPC board 30. Preferably, the conductive adhesive 10 is ACF.

[0026] In one embodiment, see Figure 2 , Figure 3 and Figure 4 , a second binding groove 50 is provided on the binding end of the second FPC board 30, the first binding groove 40 is aligned and bound with the second binding groove 50, and the first FPC board 20 and the second FPC board 30 are bonded by the conductive adhesive 10. At the connection between the first FPC board 20 and the second FPC board 30, its thickness is close to the thickness of the first FPC board 20 and the second FPC board 30, so that the binding of the first FPC board 20 and the second FPC board 30 is more beautiful. Among them, the copper layer is provided on the second binding groove 50, and the copper layers of the first FPC board 20 and the second FPC board 30 can realize a common ground. The length of the first binding groove 40 is greater than the length of the second binding groove 50 by 0.2mm, and the length of the first binding groove 40 is greater than the width of the second binding groove 50 by 0.2mm, which is used to locate and check the deviation of the copper layer between the first binding groove 40 and the second binding groove 50 to determine whether the two are aligned successfully and realize electrical connection. Specifically, the gap between the binding end of the second FPC board 30 and the first FPC board 20 is 0.1mm to improve the binding accuracy and binding efficiency. Furthermore, the first FPC board 20 is a rectangular parallelepiped structure, and the four sides of the first FPC board 20 are set to be arc-shaped chamfers, which can reduce the sharpness of the FPC and prevent the staff from being scratched by the right angles around. Figure 4 , the second FPC board 30 is in an “L” shape.

[0027] In another embodiment, see Figure 1, the first binding groove 40 is arranged at the center edge of the first FPC board 20, so that the second FPC board 30 does not need to be extended in length to be bonded at the center of the first FPC board 20, and the second FPC board 30 is bound at the edge of the first FPC board 20, which does not affect the welding of components on the first FPC board 20, saves the materials used for the first FPC board 20 and the second FPC board 30, and reduces the size. In addition, because the first FPC board 20 and the second FPC board 30 are flexible circuit boards with a relatively soft texture, after the components are welded on the first FPC board 20 and the second FPC board 30, it is difficult for the first FPC board 20 and the second FPC board 30 to weld and support the components, so a reinforcing plate is arranged on the back of the first FPC board 20, and the reinforcing plate is connected to the back of the component area, and the position of the component area is used to weld the components. Preferably, the reinforcing plate is a PCB board or a steel plate, and the PCB board or the steel plate has a certain hardness and can meet the requirements for reinforcing the component area. Among them, the thickness of the steel plate is 0.02mm.

[0028] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A binding structure of an FPC, characterized in that: include: Conductive adhesive, a first FPC board and a second FPC board; A first binding groove is provided on the first FPC board, and a copper layer electrically connected to the internal circuit of the first FPC board is provided on the first binding groove; both sides of the conductive adhesive are sticky; a copper layer electrically connected to the second FPC board is provided at the binding end of the second FPC board, and the copper layer on the first FPC board and the copper layer on the second FPC board are electrically connected through the conductive adhesive.

2. The binding structure of FPC according to claim 1, characterized in that: A second binding groove is arranged on the binding end of the second FPC board, and the copper layer is arranged on the second binding groove.

3. The binding structure of FPC according to claim 2, characterized in that: The length of the first binding groove is 0.2 mm greater than the length of the second binding groove, and the length of the first binding groove is 0.2 mm greater than the width of the second binding groove.

4. The binding structure of FPC according to claim 1, characterized in that: The first FPC board is a rectangular parallelepiped structure, and arc-shaped chamfers are arranged around the first FPC board.

5. The FPC binding structure according to claim 1, characterized in that: The second FPC board is in an "L" shape.

6. The binding structure of FPC according to claim 1, characterized in that: The conductive adhesive is ACF.

7. The FPC binding structure according to claim 1, characterized in that: The first binding groove is disposed at a central edge of the first FPC board.

8. The FPC binding structure according to claim 1, characterized in that: A reinforcing plate is arranged on the back of the first FPC board.

9. The FPC binding structure according to claim 8, characterized in that: The reinforcing plate is a PCB board or a steel plate.

10. The FPC binding structure according to claim 9, characterized in that: The thickness of the steel plate is 0.02 mm.

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