Power combination assembly and power amplifier unit using same

Abstract

The utility model provides a power combination component and a power amplifier unit using the same, and the power combination component comprises at least two input ends which are used for accessing power input, for example, when the power combination component is used for a power amplifier component, the power combination component is electrically connected with an amplifier stage through the input ends. The at least two coupling elements are electrically connected with the input ends respectively; the main output end is used for being electrically connected with all the input ends through the coupling element and outputting signals; the compensation circuit comprises at least one compensation component; the energy absorber is used for electrically connecting the input end and the compensation assembly; the compensation assemblies are electrically connected with at least one energy absorber respectively; the compensation assembly at least comprises a compensation line with fixed impedance. According to the scheme provided by the invention, electromagnetic interference caused by cooperative use of a plurality of power amplifier stages can be effectively avoided.

Description

Technical Field

[0001] The present application relates to the field of radio frequency applications, and in particular to a power combination component and a power amplifier unit using the component. Background Art

[0002] Plasma system is a common and widely used system in industrial production, for example, a system for providing power to a load or a plasma processing device.

[0003] Plasma systems usually require matching plasma equipment and plasma processes for use, through which materials, especially their surfaces, can be processed, such as coating, etching or activation. For example, such plasma process arrangements can be found in the production of architectural glass, photovoltaic modules, displays, semiconductor components (such as microcontrollers or semiconductor memory chips), etc. Since these are high-precision processes, the requirements for such plasma process arrangements and the plasma process supply systems that provide power for them are very high in terms of measurement and control accuracy, reliability, continuous operation, efficiency, etc. Such plasma process supply systems are usually designed for powers ≥2kW, preferably ≥4kW, and frequencies in the range of 2MHz to 200MHz, especially in the range of 10MHz to 50MHz. Such plasma process supply systems usually have at least one RF signal source, which provides the required power and controls it according to the process specifications. In addition, the plasma process supply system usually has one or more impedance matching circuits, which are intended to match the impedance at the output of the RF signal source with the impedance at the input of the plasma process. Due to the currently available transistors, the output power of the high-frequency signal source, especially the RF power amplifier stage with transistor amplifiers, is limited to between 100W and several kW. Therefore, in order to achieve higher output power, multiple high-frequency signal sources must be interconnected. The interconnection can be achieved in the RF power amplifier unit.

[0004] A power combiner for such a process is known, for example, from DE 20 2016 008 958 U1.

[0005] The disadvantage of such a power combiner is that it is only suitable for a limited power output. This is because the number of RF signal sources that can be placed around it is limited by the space. RF power amplifier units are designed to have the smallest possible losses at a high bandwidth. In particular, high-frequency signal sources for plasma process power supply systems require such RF power amplifier units. As the requirements for measurement and control accuracy and stability of plasma process supply systems continue to increase, the corresponding requirements on RF power amplifier units used for this purpose are also increasing. At high powers, RF power amplifier units usually require a lot of space. In addition, the problem of interference effects due to unwanted radiation is also increasing.

[0006] Therefore, based on the task of providing a radio frequency power amplifier unit, the present application provides a power combination component and a power amplifier unit using the component that can effectively alleviate and avoid the above-mentioned problems. Summary of the invention

[0007] The present application provides a power combination component and a power amplifier unit using the component.

[0008] In a first aspect, the present application provides a power combination component, comprising:

[0009] At least two input terminals are used for receiving power input. For example, when the power combination component is used in a power amplifier component, the input terminals are electrically connected to the amplifier stage.

[0010] at least two coupling elements, the coupling elements being electrically connected to the input terminals respectively;

[0011] A main output terminal, used to electrically connect all input terminals through the coupling element and output a signal;

[0012] Compensation circuit, including,

[0013] at least one compensating component;

[0014] an energy absorber for electrically connecting the input terminal and the compensation component;

[0015] The compensation components are each electrically connected to at least one energy absorber;

[0016] The compensation component includes at least one compensation line with fixed impedance.

[0017] In a second aspect, the present application provides a power amplifier unit, comprising at least two amplifier stages and the above-mentioned power combination component, the number of amplifier stages is equal to the number of input terminals of the power combination component, and each amplifier stage is connected to an input terminal respectively.

[0018] Through the above technical solution, compared with the prior art, the present application has the following beneficial effects:

[0019] By using the power amplifier unit provided in this application and its application in the radio frequency power supply system and the plasma process supply system:

[0020] 1. It can ensure that the loss of the power amplifier unit is minimized at high bandwidth;

[0021] 2. Effectively improve the measurement and control accuracy of the plasma process supply system;

[0022] 3. Reduce the space required for the power amplifier unit at high power;

[0023] 4. Reduce interference caused by electromagnetic radiation inside the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1a A schematic diagram of a first embodiment of a power combination assembly of the present application;

[0025] Figure 1b A schematic diagram of a second embodiment of the power combination assembly of the present application;

[0026] Figure 2 A schematic diagram of a third embodiment of the power combination assembly of the present application;

[0027] Figure 3 A schematic diagram of a fourth embodiment of the power combination assembly of the present application;

[0028] Figure 4a A schematic diagram of a fifth embodiment of the power combination assembly of the present application;

[0029] Figure 4b A schematic circuit diagram of an embodiment of a power amplifier unit of the present application;

[0030] Figure 5 A schematic diagram of the structure of an embodiment of a power amplifier unit of the present application;

[0031] Figure 6 Schematic diagram of the use of the power combination component and the power amplifier unit of the present application in the plasma direction. DETAILED DESCRIPTION

[0032] like Figure 1a As shown, the present application discloses a power combination component 1, which can be used in a power amplifier unit 10, which includes two input terminals In1 and In2, the two input terminals are used to electrically connect to the amplifier stages AS1 and AS2 of the power amplifier unit 10 to receive power signals, and the two input terminals are electrically connected to coupling elements L1 and L2 respectively. In this embodiment, the coupling element can be an inductor or a coupling cable with a predetermined length (for example, λ / 4). Such a radio frequency line can be used as a substitute or supplement for the inductor to take advantage of low loss. If several coupling elements are inductors, they can advantageously always have the same inductance value, and in particular they can be identical in structure. Multiple amplifier stages cannot usually be arranged very close to each other because they usually generate so much heat that they must be cooled by a cooling device, and / or because of their high power generation, the current and voltage are so high that they can negatively affect each other by emitting high-frequency fields.

[0033] One solution is to place the RF power amplifier stages further away and / or to shield them appropriately. In both cases, the outputs of the RF power amplifier stages can only be arranged at a certain distance from each other. Therefore, they have an unfavorable distance to the power combiner.

[0034] If the inputs of the power combiners are far apart from each other, the compensation line from the compensation circuit to the star point may become long and deviate from the theoretical ideal 0 mm. Such a long compensation line between the compensation circuit and the star point will cause unnecessary coupling and phase delay. This will deteriorate the coupling and input adaptation. So far, attempts to compensate these couplings by compensating gears or damping elements have not been successful and / or have resulted in undesirable power losses, which in addition to the efficiency loss of these powers often also lead to undesirable heat, which can be solved in this embodiment by the compensation circuit mentioned later.

[0035] And the two input terminals are electrically connected to the same main output terminal OUT through coupling elements L1 and L2 respectively, so as to realize unified power output. Through the above scheme, this embodiment has realized the basic power combination and unified output function.

[0036] like Figure 1a As shown, the power combination assembly 1 disclosed in the present application also includes a compensation circuit B, which includes two energy recoverers R1 and R2, and the two energy recoverers are electrically connected to the two input terminals respectively. The compensation circuit also includes a compensation component, which includes two compensation lines, which are respectively connected to the energy recoverers, and the ends of the two compensation lines away from the energy recoverers are connected to a common star point S to achieve circuit conduction.

[0037] In this case, all energy recoverers in this solution are implemented using resistors. The energy absorber can also be a component suitable for extracting electrical energy from the power combiner, for example, by converting it into heat energy. However, it is also conceivable that the component is designed to convert at least part of the energy so that this part is available again at another location.

[0038] The resistor specified as the energy absorber may be equal to an integer multiple of the corresponding input impedance.

[0039] In particular, the resistor acting as energy absorber may be equal to an integer divisor of the corresponding input impedance.

[0040] In particular, the resistance as energy absorber may be equal to 25Ω, 50Ω or 100Ω.

[0041] The compensation lines all have the following characteristics:

[0042] (1) There is fixed impedance.

[0043] (2) The length L satisfies the requirement of L=n*λ / 2.

[0044] This balanced line can be used to avoid cross-feeding of the RF power amplifier stage used as a high-frequency signal source and uneven distribution of reflected output power. If the amplitude, phase or internal resistance of the RF power amplifier stage connected to the power combiner is uneven, a push-pull signal that is harmful to the high-frequency signal source will be generated. In addition, or if the reflected power is unevenly distributed, the phase and / or amplitude of the various RF power amplifier stage components and the load impedance may vary. This may cause excessive stress on the most heavily loaded RF power amplifier stage components.

[0045] To avoid this, a balanced cable can be connected to the input of the power combiner.

[0046] The specified impedance of the compensation line may be equal to the impedance of the corresponding input terminal.

[0047] The specified impedance of the compensation line may be equal to an integer multiple of the corresponding input terminal impedance.

[0048] The fixed impedance of the compensation line may be equal to an integer divisor of the corresponding input terminal impedance.

[0049] The specified impedance of the compensation line can be equal to 25Ω, 50Ω or 100Ω.

[0050] Generally speaking, λ refers to the wavelength of the high-frequency signal within the corresponding line, ie in this case, the frequency within the operating frequency range, in particular the center frequency of the operating frequency range.

[0051] n∈N means that n is a natural number, that is, n=1, 2, 3, 4, ...

[0052] The "operating frequency range" refers to the operating frequency range of the power combining component and the RF power amplifier stage that can be connected to it, i.e. what they are designed for. This can be a very narrow operating frequency range, such as 13.54MHz-13.58MHz, or a slightly wider operating frequency range, such as 13.06MHz to 14.06MHz. In both cases, the center frequency is 13.56MHz. The operating frequency range is usually specified by the power combiner manufacturer as a nominal frequency range. This will vary depending on the application area of ​​the power combiner. If the power combiner is part of an RF power amplifier unit, it is also designed for at least this operating frequency range.

[0053] In this embodiment, two compensation lines are selected to simulate the scenario when the length of one compensation line (n*λ / 2) is unable to connect the two input terminals together. By using two compensation lines with the same characteristics, a better electromagnetic shielding effect can be effectively achieved.

[0054] like Figure 1aAs shown, when arranging the power combination component, the present solution arranges the two input ends at the cooling units CP1 and CP2 of the power amplifier unit 10 where they are located, so that the heat dissipation and cooling of each component of the power combination component can be effectively achieved. Among them, the heat dissipation unit can achieve the heat dissipation effect by water cooling or air cooling or a combination thereof. For example, the cooling device can be made of copper. The cooling device can be designed as a cold plate, at least in part. The cooling device can be composed of multiple parts of different materials. Examples of such cooling devices are disclosed and described in detail in the following public documents: WO 2019 / 072894A1, WO 2013 / 068004 A1, WO 2014 / 207185 A1. Therefore, the power combiner can be used for the high power described in the present disclosure, because the process heat generated by the components (such as energy absorbers), especially those components formed by resistors as compensation circuits, can be directly dissipated by the fluid located in the cooling unit. However, in particular, the power combiner can be distributed on several, preferably several cooling units separated from each other as described above.

[0055] like Figure 1b The second embodiment disclosed in this application is shown. Figure 1a The difference of the embodiment 1 shown is that:

[0056] Firstly, the technical solution disclosed in the second embodiment uses only one compensation line to form a compensation component, which is used to simulate a scenario when the length of one compensation line has met the space requirement of the power amplifier unit.

[0057] Secondly, the second embodiment is provided with a grounding capacitor C for connecting the main output terminal OUT to the ground (GND). The capacitor can be used together with the coupling element as a low-pass filter, through which unwanted harmonics can be filtered out.

[0058] It is also possible to use additional capacitors, which are connected to the ground connection upstream of the inductor. This makes it possible to implement a so-called pi circuit consisting of two capacitors and an inductor, which in turn can be used as a low-pass filter.

[0059] like Figure 2 The third embodiment of the present application is shown, which differs from the first embodiment in that it has a new branch formed by the coupling element L3, the input terminal In3, the energy absorber R3 and the compensation line W3 in series, which is arranged in parallel with the branch where the two input terminals In1 and In2 are located in the first embodiment, and the compensation line W3 is connected with the compensation lines W1 and W2 through the point S. And the new branch is arranged on the cooling unit CP3 of the power amplifier unit where the power combination component is located.

[0060] like Figure 3The fourth embodiment of the present application is shown, which differs from the third embodiment in that it has a new branch formed by the coupling element L4, the input terminal In4, the energy absorber R4 and the compensation line W4 connected in series, which is arranged in parallel with the branch where the three input terminals In1, In2 and In3 are located in the third embodiment, and the compensation line W4 is connected with the compensation lines W1, W2 and W3 through the point S. And the new branch is arranged on the cooling unit CP4 of the power amplifier unit where the power combination component is located.

[0061] like Figure 4a The fifth embodiment of the present application is shown. The difference between the fifth embodiment and the fourth embodiment is that this embodiment includes four branches formed by coupling elements, input terminals and energy absorbers connected in series, and the four branches are divided into two different element units, wherein the branch where the input terminals In1 and In2 are located is the first element unit 1a, and the branch where the input terminals In3 and In4 are located is the second element unit 1b. The two power units are respectively connected to the two ends of the compensation line W1, and the function of the compensation circuit is realized by a separate compensation line W1 in conjunction with four energy absorbers R1, R2, R3, and R4.

[0062] In addition, in this embodiment, the component unit 1a is used in the power amplifier stage assembly AU1, and the amplifier stages AS1 and AS2 are connected to the input terminals In1 and In2 respectively, and are arranged together on the cooling unit CP1. The component unit 1b is used in the power amplifier stage assembly AU2, and the amplifier stages AS3 and AS4 are connected to the input terminals In3 and In4 respectively, and are arranged together on the cooling unit CP2. The component units 1a and 1b are connected to the main output terminal OUT, and the power amplifier unit 10 is composed of all the above components and assemblies.

[0063] like Figure 4b FIG. 1 is an embodiment of the power amplifier unit of the present application. The technical solution of this embodiment differs from the technical solution of the fifth embodiment in that Figure 4b In the embodiment, two branch output terminals O1 and O2 are also included, wherein coupling elements L1 and L2 are commonly connected to the branch output terminal O1, and coupling elements L3 and L4 are commonly connected to the branch output terminal O2. Then, the two output terminals O1 and O2 are connected to the main output terminal OUT to realize power output.

[0064] Through the technical solution of the fifth or sixth embodiment, two or more power amplifier stage components AU1 and AU2 can be connected to each other, simplifying the line connection and improving the stability of the power amplifier unit.

[0065] Figure 4b Also shown is a possible connection arrangement of the two outputs O1 , O2 of the two power amplifier stage assemblies AU1 , AU2 to the main output.

[0066] A first output O1 of the first power amplifier stage assembly AU1 is connected to a first transmission line assembly TL1. The first transmission line assembly TL1 has a first signal conductor SL1 and a first reference conductor BL1.

[0067] A second output terminal O2 of the second power amplifier stage component AU2 is connected to a second transmission line component TL2.

[0068] The second transmission line component TL2 has a second signal conductor SL2 and a second reference conductor BL2.

[0069] The two signal conductors SL1, SL2 are designed to transmit the respective output signals of the power amplifier stage components AU1, AU2. The two reference conductors BL1, BL2 represent the reference potential of the two signal conductors SL1, SL2 and are electrically connected at a constant potential relative to the reference ground. In this example, this potential is the reference mass GND itself.

[0070] Two transmission line components TL1 and TL2 Merged and connected to a coupled line assembly TLC. The TLC coupled line assembly has an SLC coupled signal line and a BLC coupled reference line. The coupled signal line SLC is designed to transmit the combined output signal of the two power amplifier stage assemblies AU1 and AU2, that is, the sum of the output signals of the two power amplifier stage assemblies AU1 and AU2. The coupled reference conductor BLC represents the reference potential of the coupled signal conductor SLC and is electrically connected to a constant potential relative to the reference ground. In this case, this potential is the reference mass GND itself. The TLC coupled line assembly is connected to the main output terminal OUT output of the power amplifier unit 10.

[0071] In this example, the two transmission line components TL1 and TL2 can be designed as MSL microstrip lines.

[0072] In this example, the TLC coupled cable assembly can also be designed as a MSL microstrip cable. Another version of routing the RF power signal can also be considered, such as a coaxial cable line.

[0073] Figure 5 Another embodiment of the power amplifier unit 10 of the present application is shown. The power amplifier unit 10 and Figure 4b The power amplifier unit 10 is very similar to Figure 4b This is an attempt at the circuit level. Figure 5 This is a structural attempt. The connection arrangement of the two outputs O1, O2 of the two power amplifier stage components AU1, AU2 and the main output terminal OUT is designed as a CXL coaxial line. The description of the two transmission line components TL1, TL2, the two signal conductors SL1, SL2, the two reference conductors BL1, BL2, the coupled line component TLC, the coupled signal line SLC and the coupled reference conductor BLC can be found in Figure 4b can be found in the description.

[0074] The two cooling units CP1, CP2 may each have a heat sink section CS1, CS2. It is also conceivable that several heat sink sections of CS1, CS2 are arranged on a common cooling cover, but with local spacing between them (not shown in the figure). For example, a first heat sink section CS1 may be located on a first side of a cooling unit and a second heat sink section CS2 may be located on the back side of the same cooling unit.

[0075] and Figure 4b Compared with the power amplifier unit 10 in FIG. 1 , the power amplifier unit 10 shows circuit boards PCB1, PCB2, PCB12, and PCB34.

[0076] The circuit boards PCB1 and PCB12 are located on the first heat sink portion CS1, and thus are also located on the first cooling unit CP1 in this embodiment. The circuit boards PCB2 and PCB34 are located on the second heat sink portion CS2, and thus are also located on the second cooling unit CP2 in this manner. In addition, the power amplifier unit 10 has Figure 4b The power combination component 1 shown in the figure. Four amplifier stages AS1-AS4 are shown, each of which is divided into RF power amplifier stage components AU1, AU2. The figure also shows four coupling elements designed as inductors L1-L4, the main output terminal OUT output and the compensation circuit B. The compensation circuit B includes four energy absorbers designed as resistors R1-R4 and a compensation line W1 with a length of n*λ / 2.

[0077] The first two amplifier stages AS1, AS2 are arranged on the circuit board PCB12. The first two RF power amplifier stages AS1, AS2 are arranged on the first heat sink portion CS1 together with the circuit board PCB12, and therefore are also arranged on the first cooling unit CP1 in this embodiment. The second two RF power amplifier stages AS3-AS4 are arranged on the circuit board PCB34. The second two RF power amplifier stages AS3-AS4 are arranged on the second heat sink portion CS2 together with the second amplifier PCB34, and therefore are also arranged on the second cooling unit CP2 in this embodiment.

[0078] In addition, in other embodiments, PCB1 and PCB12 can be configured as one circuit board, and PCB2 and PCB34 can be configured as one circuit board. This simplifies manufacturing and reduces cable connections between PCBs, making the entire system more reliable.

[0079] Figure 6 The application of the power combination component 1 and the power amplifier unit 10 in any embodiment of the present application in the plasma process system 17 and the plasma process supply system 12 is shown.

[0080] The plasma process supply system 12 has a power amplifier unit 10 and a power combination assembly 1. These may be accomplished as described above.

[0081] The plasma process supply system 12 further includes an impedance matching circuit 11 .

[0082] The main output OUT of the power combination assembly 1 is connected to the input of the impedance matching circuit 11. The output of the impedance matching circuit 11 is connected to the load, which is the plasma process assembly in the plasma treatment assembly 13 in this example.

[0083] The plasma chamber 13 has:

[0084] - a substrate 15 treated by a plasma 16, for example by coating or etching,

[0085] An electrode 14 for coupling radio frequency power into the plasma chamber 13 in order to ignite and maintain the plasma 16 .

[0086] The impedance matching circuit 11 is designed to convert the input impedance of the plasma process at its output end into the output impedance of the power amplifier unit 10. For example, the design of such plasma processing systems and / or impedance matching circuits is described in the following publications: DE 10 2009 001 355 A1, DE 102011 007 597 A1, DE 10 2011 007 598 A1, WO 2021 / 209390 A1, WO 2021 / 255250 A1.

[0087] In any embodiment of the present application, the coupling element (especially designed as an inductor) and the energy absorber (especially designed as a resistor) and possible capacitors of the power synthesis component can be arranged on a printed circuit board. For example, the PCB can be a printed circuit board made of FR-4 material. Such an arrangement of components on a printed circuit board can be easily manufactured and can make contacting the components simple.

[0088] In particular, the PCB material may have a polytetrafluoroethylene-based material, also known as PTFE material, which is particularly suitable due to its low dielectric constant and low loss.

[0089] The name FR-4 stands for a class of flame-retardant and flame-retardant composite materials composed of epoxy resin and glass fiber fabric. The abbreviation FR stands for "Flame Retardant" in English and "Flame Retardant" in German.

[0090] Polytetrafluoroethylene-based materials, also referred to as PTFE materials, are many times more expensive than FR-4, but they can be used for printed circuit boards in the radio frequency range because they have particularly low losses in this frequency range. For this reason, PCBs can be designed to be thinner because this material has a lower dielectric constant and a higher dielectric strength to high electric fields.

[0091] In any embodiment of the present application, the compensation circuit may have an additional capacitor. The capacitor may be connected in series or in parallel to the energy absorber of the compensation circuit, and may be designed as a resistor in particular. This may increase the bandwidth of the decoupling.

[0092] In any embodiment of the present application, the compensating cable having a length of n*λ / 2 may be at least partially designed as a coaxial cable or a microstrip cable. In particular, the portion designed as a coaxial cable or a microstrip cable may be longer than the other portion of the compensating cable. This avoids interference that the balanced line may cause to other components, such as the RF power amplifier stage, or conversely, avoids interference from other components, such as the RF power amplifier stage, which may be transferred to the balanced line.

[0093] Ordinal numbers such as "first" and "second" described in the present application are only for indication and do not have any other meaning, such as a particular order, etc. In addition, for example, the term "first element" itself does not mean the existence of the "second element", and the term "second element" itself does not mean the existence of the "first element".

[0094] The term “a pair” as used herein may encompass not only a configuration in which the pair of elements have the same shape or structure as each other, but also a configuration in which the pair of elements have different shapes or structures from each other.

[0095] Finally, terms such as “substantially”, “about” and “approximately” as used herein mean a reasonable amount of deviation of the modified term such that the end result is not significantly changed.

[0096] Obviously, various variations and modifications of the present application are possible according to the above teachings. Therefore, it is understood that the present application can be implemented within the scope of the attached claims rather than as described in detail herein. Those skilled in the art should understand that the above embodiments do not limit the present application in any form, and any technical solution obtained by equivalent substitution or equivalent transformation falls within the scope of protection of the present application.

Claims

1. A power combination assembly, characterized in that: The power combination assembly comprises: At least two input terminals; at least two coupling elements, each of which is electrically connected to the input end; A main output terminal, used to electrically connect all input terminals through the coupling element and output a signal; Compensation circuit, including, at least one compensating component; an energy absorber, used to electrically connect the input terminal and the compensation component; The compensation components are each electrically connected to at least one of the energy absorbers; The compensation component includes at least one compensation line with fixed impedance.

2. The power combination assembly according to claim 1, characterized in that: The power combination component includes at least two element units, each of which includes at least two coupling elements arranged in parallel, one end of all the coupling elements is electrically connected to the main output end, one end of all the coupling elements away from the main output end is electrically connected to the input end and the energy absorber, and one end of all the energy absorbers of the same element unit away from the coupling element is commonly connected to the compensation component.

3. The power combination assembly according to claim 1 or 2, characterized in that: The length L of all the compensation lines is set to L=n*λ / 2, wherein n is a natural number, and λ is the wavelength of the high-frequency signal in the corresponding circuit corresponding to the compensation line.

4. The power combination assembly according to claim 3, characterized in that: The compensation circuit has an additional capacitance.

5. The power combination assembly according to claim 3, characterized in that: The main output terminal is electrically connected to a grounding capacitor, and one end of the grounding capacitor away from the main output terminal is grounded.

6. The power combination assembly according to claim 1 or 2, characterized in that: At least a portion of the compensation line is configured as a coaxial line or a microstrip line.

7. A power amplifier unit comprising at least two amplifier stages and a power combination assembly as claimed in any one of claims 1 to 6, characterized in that: The number of amplifier stages is equal to the number of input terminals of the power combination component, and each of the amplifier stages is connected to one of the input terminals.

8. The power amplifier unit according to claim 7, characterized in that: The power amplifier unit further comprises a cooling unit, and the power combination component is arranged on the cooling unit.

9. The power amplifier unit according to claim 8, characterized in that: The energy absorber and / or the coupling element are arranged on a circuit board.

10. The power amplifier unit according to claim 9, characterized in that: The power combination component is arranged on a circuit board.

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