Electroplating etching device

Abstract

The utility model relates to the technical field of circuit board processing, in particular to an electroplating etching device, comprising a reaction box, the top of the reaction box is slidably connected to a support frame through a driving member, the top of the support frame is fixed with a hair dryer and a cylinder, and a plating frame is arranged inside the support frame, the plating frame is fixedly connected to the axial end of the cylinder, and the bottom of the support frame is fixed with an electric clamp for fixing the circuit board, the output end of the hair dryer is connected with a bellows through an air hose; wherein, the bottom sides of the electroplating frame are slidably connected with mounting frames through adjustment components, the adjustment components are used to adjust the spacing between a pair of the mounting frames, the mounting frame is provided with the bellows, can adapt to circuit boards of different volumes, avoid inappropriate distances and angles that cannot dry the circuit boards well, and on the other hand, can speed up the processing efficiency of the circuit boards by accelerating the draining of the reaction liquid on the surface of the circuit boards.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to an electroplating etching device. Background Art

[0002] Circuit boards are basic components used to support and connect electronic components. They are usually made of insulating materials (such as epoxy resin or polyester) with conductive patterns printed on them to form circuit connections. During the processing, electrolyte solutions are deposited in specific areas on the circuit board through electroplating to form a metal layer. The unnecessary copper foil on the circuit board is then removed through etching, leaving copper traces that form the circuit pattern.

[0003] In order to speed up the processing efficiency of the circuit board, it is necessary to use an electroplating etching device to operate. For example, the prior art Chinese patent announcement number "CN216217814U" discloses an etching device for printed circuit board production, including a fuselage, a controller, a conveying device, a fixing frame, a circuit board, a spraying device, a waste water tank, a liquid storage tank and a water pump. A controller is provided in the middle of the front side of the fuselage, a display screen is provided above the controller, a baffle is provided on the left and right sides of the fuselage, a conveying device is provided in the fuselage, the conveying device passes through the right baffle to enter the fuselage and passes out from the left baffle, a conveying plate is provided on the upper surface of the conveying device, and a row of evenly spaced fixing frames are provided on the conveying plate. The utility model is provided with a high-pressure water pump and a high-pressure nozzle. The high-pressure nozzle sprays etching liquid on the circuit board at high speed at all times, and the etching liquid that has not reacted subsequently washes away the etching liquid that has reacted, so that the copper that has reacted can be prevented from being left on the circuit board, the etching accuracy is increased, and the etching speed is accelerated.

[0004] In specific operations, a spray device is used to etch the circuit board, but it is inconvenient to clean the etching liquid on the surface of the circuit board after the processing is completed, which affects the processing efficiency of the circuit board. Utility Model Content

[0005] The utility model aims to solve the disadvantages of the prior art that it is inconvenient to clean the reaction solution on the surface of the circuit board, which affects the processing efficiency of the circuit board, and proposes an electroplating etching device.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A plating etching device is designed, comprising a reaction box, the top of which is slidably connected to a support frame through a driving member, a blower and a cylinder are fixed on the top of the support frame, and a plating frame is arranged inside the support frame, the plating frame is fixedly connected to the shaft end of the cylinder, and an electric clamp for fixing a circuit board is fixed on the bottom of the support frame, and the output end of the blower is connected to a bellows through an air hose;

[0008] Wherein, mounting frames are slidably connected to both sides of the bottom of the electroplating rack via adjustment components, and the adjustment components are used to adjust the distance between a pair of the mounting frames, and the bellows is arranged inside the mounting frames.

[0009] Furthermore, the adjustment assembly includes a rotating rod, the rotating rod is fixedly installed on the top of the electroplating rack, and sliding grooves are opened on both sides of the rotating rod, the bottom of the rotating rod is rotatably connected to a swing arm, the two ends of the swing arm are rotatably connected to connecting rods, and the other end of the connecting rod is located in the sliding groove and is rotatably connected to the mounting frame through a rotating shaft.

[0010] Furthermore, a limiting block is fixed on the top of the rotating rod, and its periphery is slidably connected to a movable clamping seat through a limiting groove, a fixed clamping seat is fixed on the end face of the swing arm at the axis, the movable clamping seat is engaged with the fixed clamping seat, and a first spring is sleeved on the periphery of the rotating rod, and both ends of the first spring abut against the limiting block and the movable clamping seat.

[0011] Furthermore, the mounting frame is of a U-shaped structure, an air guide plate is provided in the bellows, and the air guide plate is rotatably connected to the mounting frame through raised portions on both sides of the top, and a clip is provided in the raised portion, and the angle of the bellows is adjusted through the clip.

[0012] Furthermore, the clamping part includes an insertion rod, the insertion rod is slidably connected to the protrusion through a socket, and an end cover is threadedly connected to the periphery, the top end of the insertion rod is provided with an arc surface, and the tail end thereof is provided with an avoidance groove for limiting a second spring, the second spring is sleeved on the periphery of the insertion rod, and its two ends abut against the avoidance groove and the end cover.

[0013] Furthermore, the side circumferential array of the mounting frame has a plurality of adjustment holes, and the adjustment holes match the insertion rods and can contact the arc surface.

[0014] The utility model proposes an electroplating etching device, which has the beneficial effect that: the utility model can adjust the distance between a pair of bellows at the same time through an adjustment component to ensure that the air output between the bellows on both sides is the same, and the blowing angle of the bellows can be adjusted through a clamping piece. On the one hand, it can adapt to circuit boards of different volumes and avoid inappropriate distances and angles that cannot dry the circuit boards well. On the other hand, it can speed up the processing efficiency of the circuit boards by accelerating the drainage of the reaction liquid on the surface of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of the utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the electroplating rack of the utility model;

[0017] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of area A;

[0018] Figure 4 It is a structural schematic diagram of the bellows of the utility model;

[0019] Figure 5 It is an enlarged structural diagram of the clamping member of the utility model.

[0020] In the figure: 1. reaction box; 2. driving part; 3. support frame; 4. hair dryer; 41. bellows; 42. raised part; 5. electroplating frame; 6. adjustment component; 61. rotating rod; 62. slide groove; 63. swing arm; 64. connecting rod; 65. movable card seat; 66. fixed card seat; 67. first spring; 7. mounting frame; 8. clamping part; 81. plug rod; 82. end cover; 83. arc surface; 84. second spring; 85. avoidance groove; 86. adjustment hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-5 , an electroplating etching device, comprising a reaction box 1, the top of the reaction box 1 is slidably connected to a support frame 3 through a driving member 2, a blower 4 and a cylinder are fixed on the top of the support frame 3, and a plating frame 5 is arranged inside the support frame 3, the plating frame 5 is fixedly connected to the shaft end of the cylinder, and an electric clamp for fixing a circuit board is fixed at the bottom of the support frame, and the output end of the blower 4 is connected to a bellows 41 through an air hose;

[0023] The bottom sides of the electroplating rack 5 are slidably connected with mounting racks 7 via adjustment components 6 . The adjustment components 6 are used to adjust the distance between a pair of mounting racks 7 . The bellows 41 is arranged inside the mounting rack 7 .

[0024] It should be added that a plating pool and an etching pool are formed in the reaction box 1 through a partition, and the plating pool and the etching pool are respectively injected with plating liquid and etching liquid, and the electroplating process is performed by connecting positive and negative electricity between the electroplating pool and the circuit board;

[0025] The driving member 2 includes a motor, the top of the reaction box 1 is slidably connected to the support frame 3 through a slide rail, a pair of the slide rails are respectively rotatably connected with a screw rod and a guide rod is fixedly installed, the screw rod is fixedly connected to the shaft end of the motor, the support frame 3 is threadedly connected to the screw rod and slidably connected to the guide rod;

[0026] Specifically, a cylinder is fixedly installed on the top of the support frame 3, and guide grooves are opened on both sides and guide rods are fixedly installed in the guide grooves. The plating frame 5 is fixedly connected to the axial end of the cylinder, and its two sides are slidably connected to the guide rods through protrusions.

[0027] Furthermore, the adjustment assembly 6 includes a rotating rod 61, the rotating rod 61 is fixedly installed on the top of the electroplating rack 5, and slide grooves 62 are opened on both sides of the rotating rod 61, the bottom of the rotating rod 61 is rotatably connected to a swing arm 63, and the two ends of the swing arm 63 are rotatably connected to connecting rods 64, and the other end of the connecting rod 64 is located in the slide groove 62 and is rotatably connected to the mounting frame 7 through a rotating shaft.

[0028] Furthermore, a limit block is fixed on the top of the rotating rod 61, and a movable clamping seat 65 is slidably connected to the outer periphery thereof through a limit groove, a fixed clamping seat 66 is fixed to the end surface of the swing arm 63 at the axis, and the movable clamping seat 65 is engaged with the fixed clamping seat 66, and a first spring 67 is sleeved on the outer periphery of the rotating rod 61, and the two ends of the first spring 67 abut against the limit block and the movable clamping seat 65;

[0029] It is worth mentioning that in order to prevent the mixing of the plating solution and the etching solution from affecting the processing quality, the reaction liquid on the surface of the circuit board is blown dry by the hair dryer 4 before the next process, and the spacing between the pair of the bellows 41 is adjusted by the adjustment component 6, and the angle of the bellows 41 is adjusted by the clamping member 8 to adapt to circuit boards of different volumes and avoid inappropriate angles and distances affecting the drying effect;

[0030] In specific operation, connecting ears are connected to both sides of the movable clamping seat 65, and the movable clamping seat 65 is pushed upward by the connecting ears to separate the movable clamping seat 65 from the fixed clamping seat 66, and then the pair of connecting rods 64 can be driven to move by rotating the swing arm 63, so as to adjust the distance between the pair of bellows 41;

[0031] Specifically, the outer periphery of the rotating rod 61 is provided with the limiting groove, and the inner wall of the axial hole of the movable clamping seat 65 is provided with a corresponding limiting block to prevent the movable clamping seat 65 from rotating synchronously with the fixed clamping seat 66;

[0032] Of course, in order to ensure that the mounting frame 7 moves smoothly, a guide groove is provided at the bottom of the electroplating rack 5, and the top of the mounting frame 7 is slidably connected to the guide groove through a guide block.

[0033] In more detail, the mounting frame 7 is of a U-shaped structure, the bellows 41 is provided with an air guide plate, and is rotatably connected to the mounting frame 7 via raised portions 42 on both sides of the top, and a clip 8 is provided in the raised portion 42, and the angle of the bellows 41 is adjusted via the clip 8.

[0034] In general, the clamping member 8 includes an insert rod 81, the insert rod 81 is slidably connected to the protrusion 42 through a socket, and an end cover 82 is threadedly connected to the periphery. The top end of the insert rod 81 is provided with an arc surface 83, and the tail end thereof is provided with an avoidance groove 85 for limiting the second spring 84. The second spring 84 is sleeved on the periphery of the insert rod 81, and its two ends abut against the avoidance groove 85 and the end cover 82.

[0035] Finally, the side circumferential array of the mounting frame 7 has a plurality of adjustment holes 86 , and the adjustment holes 86 match the insertion rods 81 and can contact the arc surface 83 .

[0036] Specifically, by squeezing the insertion rod 81 with fingers to retract it, the mounting frame 7 can rotate the bellows 41 when it contacts the arc surface 83, and the insertion rod 81 is engaged into the next adjustment hole 86 under the action of the second spring 84 to achieve the effect of adjusting the angle.

[0037] Working mode: When working, first push the movable card seat 65 upward to separate it from the fixed card seat 66, then drive the pair of connecting rods 64 to move by rotating the swing arm 63, and drive the pair of mounting frames 7 to move under the drive of the connecting rod 64, and release the movable card seat 65, which is again engaged with the fixed card seat 66 under the support of the first spring 67 to prevent the swing arm 63 from rotating freely;

[0038] Then squeeze the rod 81 to retract it, and when the mounting frame 7 can contact the arc surface 83, rotate the bellows 41, and the rod 81 is engaged in the next adjustment hole 86 under the action of the second spring 84 to achieve the effect of adjusting the angle. After that, the second spring 84 and the rod 81 can be replaced by unlocking the end cover 82;

[0039] Finally, multiple circuit boards are clamped by electric clamps, and the plating rack 5 is driven by the cylinder to enter the plating pool for processing. After completion, the cylinder drives the plating rack 5 to rise, and the hair dryer 4 cooperates with the bellows 41 to dry the circuit boards, and then the motor drives the screw rod and the guide rod to drive the support frame 3 to move toward the etching pool for processing.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An electroplating etching device, comprising a reaction box (1), characterized in that: The top of the reaction box (1) is slidably connected to a support frame (3) via a driving member (2); a blower (4) and a cylinder are fixed on the top of the support frame (3); a plating frame (5) is arranged inside the support frame; the plating frame (5) is fixedly connected to the axial end of the cylinder; an electric clamp for fixing a circuit board is fixed at the bottom of the support frame; an output end of the blower (4) is connected to a bellows (41) via an air hose; Wherein, the bottom sides of the electroplating rack (5) are slidably connected to mounting racks (7) via adjustment components (6), and the adjustment components (6) are used to adjust the distance between a pair of mounting racks (7), and the bellows (41) is arranged inside the mounting rack (7).

2. The electroplating etching device according to claim 1, characterized in that: The adjustment assembly (6) comprises a rotating rod (61), the rotating rod (61) is fixedly mounted on the top of the electroplating rack (5), and slide grooves (62) are provided on both sides of the rotating rod (61), the bottom of the rotating rod (61) is rotatably connected to a swing arm (63), the two ends of the swing arm (63) are rotatably connected to connecting rods (64), and the other end of the connecting rod (64) is located in the slide groove (62) and is rotatably connected to the mounting rack (7) via a rotating shaft.

3. The electroplating etching device according to claim 2, characterized in that: A limiting block is fixed on the top of the rotating rod (61), and a movable clamping seat (65) is slidably connected to the outer periphery of the rotating rod (61) through a limiting groove. A fixed clamping seat (66) is fixed on the end surface of the swing arm (63) at the axis center. The movable clamping seat (65) is engaged with the fixed clamping seat (66). A first spring (67) is sleeved on the outer periphery of the rotating rod (61), and two ends of the first spring (67) abut against the limiting block and the movable clamping seat (65).

4. The electroplating etching device according to claim 1, characterized in that: The mounting frame (7) is of a U-shaped structure. The wind box (41) is provided with a wind guide plate, which is rotatably connected to the mounting frame (7) via raised portions (42) on both sides of the top. The raised portions (42) are provided with a clamping piece (8), and the angle of the wind box (41) is adjusted via the clamping piece (8).

5. The electroplating etching device according to claim 4, characterized in that: The clamping member (8) comprises an insert rod (81), the insert rod (81) is slidably connected to the protruding portion (42) via an insert hole, and an end cover (82) is threadedly connected to the outer periphery thereof, the top end of the insert rod (81) is provided with an arc surface (83), and the tail end thereof is provided with an avoidance groove (85) for limiting a second spring (84), the second spring (84) is sleeved on the outer periphery of the insert rod (81), and the two ends thereof abut against the avoidance groove (85) and the end cover (82).

6. The electroplating etching device according to claim 5, characterized in that: The side circumferential array of the mounting frame (7) has a plurality of adjustment holes (86), and the adjustment holes (86) match the insertion rod (81) and can contact the arc surface (83).

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