Display panel and display device

Abstract

The utility model discloses a display panel and a display device. The display panel includes: a substrate assembly, the substrate assembly includes a glass substrate and an elastic support layer on one side of the glass substrate; a display function layer, the display function layer includes a plurality of light-emitting units, and the display function layer is located on the side of the glass substrate away from the elastic support layer; an encapsulation layer is located on the side of the light-emitting unit away from the substrate assembly. The technical solution of the embodiment of the utility model is that by setting an elastic support layer on one side of the substrate assembly, the elastic support layer can be compressed between the mask plate and the display panel to be encapsulated, and the elastic support layer supports the display panel to be encapsulated by its ability to restore elastic deformation, thereby reducing the gap between the mask plate and the display panel to be encapsulated. In the deposition process of thin film encapsulation, the gas is reduced from passing through the gap around the mask plate and the display panel to be encapsulated to form a non-target thin film, thereby improving the quality of thin film encapsulation, and providing a basis for the design of a narrow-frame display panel.

Description

Technical Field

[0001] The utility model relates to the technical field of display panels, and in particular to a display panel and a display device. Background Art

[0002] Thin-film packaging is required for AMOLED (Active-matrix organic light-emitting diode) packaging. Thin-film packaging not only affects the water barrier properties of AMOLED, but also affects the optical properties and subsequent processes.

[0003] When thin film packaging is used, a mask plate is required to deposit the material of the packaging layer on the substrate on one side of the mask plate to obtain the packaging film layer. In the prior art, after the packaging layer is deposited, a shadow will be formed around the target film forming area, which affects the subsequent process flow and is not conducive to the realization of a narrow frame. Utility Model Content

[0004] The utility model provides a display panel and a display device, which are used to reduce or eliminate deposition shadows formed around a target film forming area during thin film packaging.

[0005] According to one aspect of the present invention, there is provided a display panel, comprising:

[0006] A substrate assembly, the substrate assembly comprising a glass substrate and an elastic supporting layer on one side of the glass substrate;

[0007] A display function layer, the display function layer comprising a plurality of light-emitting units, the display function layer being located on a side of the glass substrate away from the elastic supporting layer;

[0008] The packaging layer is located on a side of the light emitting unit away from the substrate assembly.

[0009] Optionally, the thickness of the elastic supporting layer is greater than 100 microns.

[0010] Optionally, the encapsulation layer includes at least one inorganic encapsulation layer, and the elastic supporting layer is used to support the substrate assembly and the display function layer when preparing the inorganic encapsulation layer to reduce the difference in deposition gap between the mask plate and the side of the display function layer away from the substrate assembly.

[0011] Optionally, the thickness of the elastic support layer is greater than a first preset thickness, and the first preset thickness is equal to the thickness of the inorganic encapsulation layer in the display panel when preparing the setting.

[0012] The maximum gap between the mask plate and a side of the display function layer in the set display panel away from the substrate assembly, wherein the substrate assembly of the set display panel includes a glass substrate.

[0013] Optionally, the thickness of the elastic support layer under extreme compression is less than or equal to a second preset thickness, and the second preset thickness is equal to the thickness of the inorganic encapsulation layer in the display panel when preparing the setting.

[0014] A minimum gap is defined between the mask plate and a side of the display function layer in the set display panel that is away from the substrate assembly, wherein the substrate assembly of the set display panel includes a glass substrate.

[0015] Optionally, the encapsulation layer further comprises an organic encapsulation layer, and the organic encapsulation layer is located on a side of at least one of the inorganic encapsulation layers away from the elastic supporting layer.

[0016] Optionally, the inorganic encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, and the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0017] Optionally, the display panel further includes a protective layer, wherein the protective layer is located on a side of the encapsulation layer away from the elastic supporting layer, and the protective layer is used to protect the encapsulation layer.

[0018] Optionally, the elastic supporting layer is made of polyimide material.

[0019] According to another aspect of the present invention, a display device is provided, comprising the display panel described in any one of the first aspects.

[0020] The technical solution of the embodiment of the utility model is to set an elastic support layer on one side of the substrate assembly, and the elastic support layer can be compressed between the mask plate and the display panel to be packaged. The elastic support layer supports the display panel to be packaged through its ability to restore elastic deformation, thereby reducing the gap between the mask plate and the display panel to be packaged. In the deposition process of thin film packaging, the non-target thin film deposited by the gas through the gap around the mask plate and the display panel to be packaged is reduced, thereby improving the quality of thin film packaging and providing a basis for the design of narrow-frame display panels.

[0021] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present utility model, nor are they intended to limit the scope of the present utility model. Other features of the present utility model will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a schematic diagram of the structure of film deposition during thin film packaging in the prior art;

[0024] Figure 2 It is a schematic diagram of the structure after thin film packaging in the prior art;

[0025] Figure 3 A schematic diagram of the structure of a display panel provided by an embodiment of the utility model;

[0026] Figure 4 A schematic diagram of the structure of film deposition during thin film packaging in the prior art;

[0027] Figure 5 A schematic diagram of the structure of the display panel provided by the embodiment of the utility model during film deposition during thin film packaging;

[0028] Figure 6 A schematic diagram of the structure of another display panel provided by an embodiment of the utility model;

[0029] Figure 7 A schematic diagram of the structure of another display panel provided by an embodiment of the utility model;

[0030] Figure 8 A schematic diagram of the structure of another display panel provided in an embodiment of the utility model. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0032] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0033] As described in the background art, the prior art has the problem that after the encapsulation layer is deposited, a non-target thin film is formed around the target film-forming area, which affects the subsequent process flow and is not conducive to the realization of a narrow frame. Figure 1 It is a schematic diagram of the structure of deposition film formation during thin film packaging in the prior art. Figure 2 This is a schematic diagram of the structure after thin film packaging in the prior art. Figure 1 and Figure 2 The inventor has found that in the prior art, in the process of making the encapsulation layer, the display panel to be encapsulated is usually placed on the machine 100, and the machine 100 is a workbench for supporting the display panel. Support buttons 140 are arranged on both sides of the machine 100 to support the mask frame 110. The height of the support button 140 is fixedly set according to the size of the gap between the mask plate 120 and the display panel 200 to be encapsulated. By setting the support button 140 to have a smaller height, the mask plate 140 and the display panel 200 to be encapsulated are as close as possible, so that the gap between the mask plate 120 and the display panel 200 to be encapsulated is reduced to a certain extent. However, there are still gaps of different sizes between different chambers of the mask plate 140 and the edge areas on both sides of the mask plate 140 and the display panel 200 to be encapsulated. During the deposition of thin film encapsulation, the gas can pass through these gaps to deposit a very thin film around the target film forming area, resulting in shadows around the target film forming area. The shadows will affect the quality of the thin film encapsulation and the subsequent process flow, making it difficult to achieve a narrow-frame display panel.

[0034] Based on the above reasons, the utility model provides a display panel. Figure 3 A schematic diagram of the structure of a display panel provided by an embodiment of the utility model is shown in FIG. Figure 4 A schematic diagram of the structure of the deposition film during the prior art thin film packaging. Figure 5 This is a schematic diagram of the structure of the display panel provided by the embodiment of the utility model during the deposition of thin film packaging. Figure 3 , Figure 4 and Figure 5 The display panel includes: a substrate assembly 210, the substrate assembly 210 includes a glass substrate 211 and an elastic supporting layer 212 on one side of the glass substrate 211; a display function layer 220, the display function layer 220 includes a plurality of light-emitting units, and the display function layer 220 is located on a side of the glass substrate 211 away from the elastic supporting layer 212; and an encapsulation layer 230, which is located on a side of the light-emitting unit away from the substrate assembly 210.

[0035] The substrate assembly 210 is a base substrate for supporting other film layers of the display panel. The substrate assembly 210 includes a glass substrate 211 and an elastic support layer 212, wherein the glass substrate 211 is a hard substrate, which can provide good support for film layers such as the display function layer 220 in the display panel. The elastic support layer 212 has better flexibility than the glass substrate 211, and can provide good buffering, so that the display panel is not easily damaged when it falls.

[0036] The display function layer 220 is a film layer for the display panel to emit light, and includes a plurality of light-emitting units. The plurality of light-emitting units may be red, green or blue light-emitting units, and the light-emitting units include an anode layer, a cathode layer, and a light-emitting layer and a transfer layer between the anode layer and the cathode layer.

[0037] The encapsulation layer 230 is a film layer with certain flexibility and transparency, used to protect the display function layer 220 from water and oxygen corrosion and physical damage. The encapsulation layer 230 can be a thin film encapsulation layer. The encapsulation layer 230 can be a single film layer, or a composite film layer including at least two film layers. At least one layer of the encapsulation layer 230 can be prepared by deposition.

[0038] In this embodiment, the elastic support layer 212 is disposed on one side of the glass substrate 211. When the encapsulation layer deposition step is performed, the display panel 200 to be encapsulated is placed on the machine 100. Accordingly, the elastic support layer 212 is located between the glass substrate 211 and the machine 100. The elastic support layer 212 has certain compressibility and resilience. Figure 5 As shown, when the encapsulation layer is deposited, the elastic support layer 212 is disposed between the display panel 200 to be encapsulated and the machine 100, and different regions of the elastic support layer 212 are compressed to different degrees. The elastic support layer 212 has good resilience to restore elastic deformation, so the elastic support layer 212 can support the display panel 200 to be encapsulated through its resilience, thereby reducing Figure 4The gap between the mask plate 120 and the display panel 200 to be packaged is shown. In this way, the deposited thin film can be deposited in the target area, and the gap around the target area is very small, that is, the gap around the mask plate 120 and the display panel 200 to be packaged is very small; only a small amount of gas can be deposited around, which can reduce the film width and height of the non-target thin film formed outside the target film forming area, thereby improving the quality of thin film packaging and providing a basis for the design of narrow-frame display panels.

[0039] The technical solution of the embodiment of the utility model is to set an elastic support layer on one side of the substrate assembly, and the elastic support layer can be compressed between the mask plate and the display panel to be packaged. The elastic support layer supports the display panel to be packaged through its ability to restore elastic deformation, thereby reducing the gap between the mask plate and the display panel to be packaged. During the deposition process of the encapsulation layer, the non-target thin film formed by the gas deposited through the gap around the mask plate and the display panel to be packaged can be reduced, thereby improving the quality of thin film packaging and providing a basis for the design of narrow-frame display panels.

[0040] Continue to see Figure 3 , Figure 4 and Figure 5 Optionally, based on the above embodiment, the thickness of the elastic supporting layer 212 is greater than 100 microns.

[0041] Specifically, the gap thickness between the mask plate 120 and the display panel 200 to be packaged at different positions is different. In the prior art, the gap thickness between the mask plate 120 and the display panel 200 to be packaged is between 20 microns and 100 microns. To ensure that the elastic support layer 212 can support the display panel 200 to be packaged at each position through its ability to restore elastic deformation, thereby reducing the gap between the mask plate 120 and the display panel 200 to be packaged. Therefore, the thickness of the elastic support layer 212 can be set to be greater than 100 microns. Thus, at the maximum gap thickness, the elastic support layer 212 is ensured to be in a compressed state, and the display panel 200 to be packaged is supported by its ability to restore elastic deformation, thereby reducing the gap. The degree of compression of the elastic support layer 212 at different gap positions is different, so the thickness of the elastic support layer 212 at different gap positions in the compressed state is different. The thickness of the elastic supporting layer 212 in a compressed state is between 20 and 100 micrometers, which is the same as the thickness of the gap between the mask plate 120 and the display panel 200 to be packaged.

[0042] See also Figure 3Optionally, based on the above embodiments, the encapsulation layer 230 includes at least one inorganic encapsulation layer 231, and the elastic supporting layer 212 is used to support the substrate assembly 210 and the display function layer 220 when preparing the inorganic encapsulation layer 231, so as to reduce the difference in the deposition gap between the mask plate and the side of the display function layer 220 away from the substrate assembly.

[0043] Specifically, the encapsulation layer 230 can be an inorganic encapsulation layer 231. The inorganic encapsulation layer 231 can prevent water and oxygen from corroding the display function layer 220 and prevent the display function layer 220 from being physically damaged, thereby protecting the display function layer 220. When preparing the inorganic encapsulation layer 231, the elastic support layer 212 plays a supporting role under the substrate assembly 210 and the display function layer 220, and the elastic support layer 212 is compressed to a certain extent, thereby reducing the difference in the deposition gap between different positions between the mask plate 120 and the side of the display function layer 220 away from the substrate assembly. In addition, the shadow of the gas deposited around the display function layer through the gap is effectively controlled, thereby improving the preparation quality of the inorganic encapsulation layer 231 and improving the quality of thin film encapsulation. After the deposition is completed, the elastic support layer 102 can rebound to a flat state, thereby providing a flat plane for subsequent process steps. After the encapsulation is completed, the elastic support layer 102 can be removed, thereby obtaining a display panel with a higher yield rate.

[0044] Optionally, based on the above embodiments, the thickness of the elastic support layer 212 is greater than a first preset thickness, and the first preset thickness is equal to the maximum gap between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210 when preparing the inorganic encapsulation layer 231 in the set display panel, and the substrate assembly 210 of the set display panel includes a glass substrate 211.

[0045] Specifically, the mask plate 120 is provided with a plurality of cavities with openings, and the gap sizes between the cavities at different positions and the set display panel are different. The first preset thickness refers to the maximum gap thickness between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210 when the inorganic encapsulation layer 231 in the set display panel without the elastic support layer 212 is prepared. Setting the thickness of the elastic support layer 212 to be greater than the first preset thickness can keep the elastic support layer 212 in a compressed state at the position of the maximum gap, thereby reducing the gap between the mask plate 120 and the set display panel.

[0046] Optionally, based on the above embodiments, the thickness of the elastic support layer 212 under extreme compression is less than or equal to a second preset thickness, and the second preset thickness is equal to the minimum gap between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210 when preparing the inorganic encapsulation layer in the set display panel, and the substrate assembly 210 of the set display panel includes a glass substrate 211.

[0047] Specifically, the second preset thickness refers to the minimum gap thickness between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210 when the inorganic encapsulation layer 231 in the set display panel is prepared and the elastic support layer 212 is not set. The thickness of the elastic support layer 212 under extreme compression is set to be less than or equal to the second preset thickness, so that the elastic support layer 212 has sufficient shrinkage ability. At the position of the minimum gap between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210, the elastic support layer 212 can be fully compressed to support the set display panel. If the thickness of the elastic support layer 212 under extreme compression is greater than the second preset thickness, at the position of the minimum gap between the mask plate 120 and the side of the display function layer 220 in the set display panel away from the substrate assembly 210, the elastic support layer 212 will have a large support stress on the substrate assembly 210, which will affect the flatness of the substrate assembly 210 and the quality of the deposited film.

[0048] Figure 6 A schematic diagram of another display panel structure provided by an embodiment of the utility model. Figure 6 The encapsulation layer 230 further includes an organic encapsulation layer 232 , and the organic encapsulation layer 232 is located on a side of the at least one inorganic encapsulation layer 231 away from the elastic support layer 212 .

[0049] Specifically, the encapsulation layer 230 may be a structure of an inorganic encapsulation layer 231 and an organic encapsulation layer 232. The organic encapsulation layer 232 may be a thin film formed by an organic polymer material, which has good flexibility. The organic encapsulation layer 232 is arranged on the side of the inorganic encapsulation layer 231 away from the elastic support layer 212, which can be used to release stress while ensuring the flatness of the entire encapsulation layer 230. The organic material of the organic encapsulation layer 232 can extend the water and oxygen intrusion path, reduce the permeability of water vapor, etc., and improve the encapsulation performance. The inorganic encapsulation layer 231 can prevent water and oxygen from corroding the display function layer 220 and prevent the display function layer 220 from being physically damaged.

[0050] Figure 7 A schematic diagram of another display panel structure provided by an embodiment of the utility model. Figure 7The inorganic encapsulation layer includes a first inorganic encapsulation layer 231 and a second inorganic encapsulation layer 233 , and the organic encapsulation layer 232 is located between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233 .

[0051] Specifically, the encapsulation layer 230 may be a structure of two inorganic encapsulation layers, a first inorganic encapsulation layer 231 and a second inorganic encapsulation layer 233, and an organic encapsulation layer 232. The organic encapsulation layer 232 is disposed between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 233. The second inorganic encapsulation layer 233 may isolate the organic encapsulation layer 232 from corrosion by water and oxygen, and protect the organic encapsulation layer 232.

[0052] Figure 8 A schematic diagram of another display panel structure provided by an embodiment of the utility model. Figure 8 The display panel further includes a protection layer 300 . The protection layer 300 is located on a side of the encapsulation layer 230 away from the elastic supporting layer 212 . The protection layer 300 is used to protect the encapsulation layer 230 .

[0053] Specifically, the protection layer 300 is disposed on a side of the encapsulation layer 230 away from the elastic support layer 212 , and can protect the encapsulation layer 230 , thereby preventing the film of the encapsulation layer 230 from being damaged, thereby affecting the encapsulation of the display panel.

[0054] Optionally, the elastic supporting layer 212 is made of polyimide material.

[0055] Specifically, using polyimide material as the material of the elastic supporting layer 212 can reduce the preparation cost of the elastic supporting layer 212 .

[0056] The embodiment of the present invention further provides a display device. The display device provided by the embodiment of the present invention includes the display panel provided by any of the above embodiments, and has the beneficial effects of the display panel provided by any of the above embodiments, which will not be described in detail here.

[0057] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0058] The above specific implementations do not constitute a limitation on the protection scope of the present utility model. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A display panel, characterized in that: include: A substrate assembly, the substrate assembly comprising a glass substrate and an elastic supporting layer on one side of the glass substrate; A display function layer, the display function layer comprising a plurality of light-emitting units, the display function layer being located on a side of the glass substrate away from the elastic supporting layer; The packaging layer is located on a side of the light emitting unit away from the substrate assembly.

2. The display panel according to claim 1, characterized in that: The thickness of the elastic supporting layer is greater than 100 microns.

3. The display panel according to claim 1, characterized in that: The encapsulation layer includes at least one inorganic encapsulation layer, and the elastic supporting layer is used to support the substrate assembly and the display function layer when preparing the inorganic encapsulation layer to reduce the difference in deposition gap between the mask plate and the side of the display function layer away from the substrate assembly.

4. The display panel according to claim 3, characterized in that: The thickness of the elastic supporting layer is greater than a first preset thickness, which is equal to the maximum gap between the mask plate and the side of the display function layer in the set display panel away from the substrate assembly when preparing the inorganic encapsulation layer in the set display panel. The substrate assembly of the set display panel includes a glass substrate.

5. The display panel according to claim 3, characterized in that: The thickness of the elastic supporting layer under extreme compression is less than or equal to a second preset thickness, and the second preset thickness is equal to the minimum gap between the mask plate and the side of the display function layer in the set display panel away from the substrate assembly when preparing the inorganic encapsulation layer in the set display panel, and the substrate assembly of the set display panel includes a glass substrate.

6. The display panel according to claim 3, characterized in that: The encapsulation layer further comprises an organic encapsulation layer, and the organic encapsulation layer is located on a side of at least one of the inorganic encapsulation layers away from the elastic supporting layer.

7. The display panel according to claim 6, characterized in that: The inorganic encapsulation layer includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, and the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

8. The display panel according to claim 1, characterized in that: The display panel further includes a protective layer, which is located on a side of the encapsulation layer away from the elastic supporting layer, and is used to protect the encapsulation layer.

9. The display panel according to claim 1, characterized in that: The elastic supporting layer is made of polyimide material.

10. A display device, characterized in that: A display panel comprising any one of claims 1 to 9.

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