TO device welding positioning tooling

Abstract

The utility model provides a TO device welding positioning tool, which belongs to the technical field of electronic device packaging, and includes: a base and an insulating structure, wherein the base is provided with a positioning hole for inserting the pin of the TO device, and the top surface of the base is a supporting surface for supporting the cap of the TO device; the insulating structure is arranged in the positioning hole, and the pin passes through the insulating structure. The TO device welding positioning tool provided by the utility model is provided with an insulating structure in the positioning hole of the tool, and when the TO device is welded, the pin of the TO device is inserted into the insulating structure, and the cap of the TO device is supported on the top surface of the base. Since the pin of the TO device extends into the insulating structure, the insulating structure insulates the pin, thereby avoiding the problem of chip performance failure caused by the contact between the pin of the TO device and the lower electrode; during the sealing process, the pin of the TO device will not form a current loop, thereby ensuring the sealing area and sealing effect of the TO device.

Description

Technical Field

[0001] The utility model belongs to the technical field of electronic device packaging, and in particular relates to a TO device welding positioning tool. Background Art

[0002] TO device is a transistor package, the full name is Transistor Outline, mainly used for surface mount technology. Its design purpose is to enable the leads of the transistor to be formed to meet different application requirements.

[0003] The common welding method used for sealing TO devices is annular projection welding in resistance welding. The advantages of this welding method are easy position control, short welding time, suitability for mass production, relatively uniform strength at each point, less heat influence, and stable quality.

[0004] Resistance welding is a welding method in which the workpiece to be welded is pressed between two electrodes, and the electric current is used to generate heat on the resistance of the contact surface and adjacent areas of the workpiece, and it is heated to a molten or plastic state to form a metal bond.

[0005] The chip is packaged in the TO device, the negative pole is connected to the tube holder, and the positive pole is connected to the pin. During the sealing process, the voltage is 100-130V, the current is 4-6A, the capacitor is discharged instantaneously, and after the pin contacts the lower electrode, a circuit is formed when the upper and lower electrodes are sealed, causing the chip to fail. Utility Model Content

[0006] The embodiment of the utility model provides a TO device welding positioning tool, which aims to solve the problem of chip performance failure caused by the contact between the pin of the TO device and the lower electrode during the sealing process.

[0007] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a TO device welding positioning tool, including:

[0008] A base having positioning holes for inserting the pins of the TO device, wherein the top surface of the base is a supporting surface for supporting the cap of the TO device; and

[0009] The insulating structure is arranged in the positioning hole, and the pin passes through the insulating structure.

[0010] In one achievable manner, the insulating structure is an insulating sleeve coaxially disposed in the positioning hole, and the inner diameter of the insulating sleeve gradually shrinks from top to bottom.

[0011] In one achievable manner, the inner diameter of the positioning hole is a tapered structure that gradually decreases from top to bottom, and the outer diameter of the insulating sleeve is adapted to the inner diameter of the positioning hole.

[0012] In one feasible manner, the outer wall of the base is provided with at least one step, and the outer diameter of the step is larger than the outer diameter of the top surface of the base; the positioning hole is a stepped hole, and the stepped hole is divided into an upper insulating hole and a lower expanded hole from top to bottom, the inner diameter of the lower expanded hole is larger than the inner diameter of the upper insulating hole, and the insulating sleeve is arranged in the upper insulating hole.

[0013] In one achievable manner, the lower end of the insulating sleeve extends downward into the lower expansion hole.

[0014] In one achievable manner, the length of the insulating sleeve extending into the lower expansion hole is no more than 20 mm.

[0015] In one achievable manner, the wall thickness of the insulating sleeve is 5-10 mm.

[0016] In one achievable manner, the taper of the insulating sleeve is 5-10°.

[0017] In one achievable manner, the thickness of the insulating sleeve gradually increases from top to bottom, forming a tapered hole in the inner cavity.

[0018] Compared with the prior art, the TO device welding positioning tool provided by the utility model has the following beneficial effects: an insulating structure is arranged in the positioning hole of the tool, and the pins of the TO device pass through the insulating structure. When the TO device is welded, the pins of the TO device are inserted into the insulating structure, and the caps of the TO device are supported on the top surface of the base. Since the pins of the TO device extend into the insulating structure, the insulating structure insulates the pins, thereby avoiding the problem of chip performance failure caused by the contact between the pins of the TO device and the lower electrode; during the sealing process, the pins connected to the positive electrode of the chip packaged in the TO contact the insulating structure, but do not contact the lower electrode, so no current loop is formed, thereby avoiding chip performance failure, thereby ensuring the sealing area and sealing effect of the TO device; at the same time, the diameter of the lower electrode positioning hole and the size of the cap solder ring are matched with each other, and the solder ring can completely contact the tube seat during sealing, thereby ensuring the shear force and airtightness of the sealing, and improving the sealing area and sealing effect of the TO device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the three-dimensional structure of a TO device welding positioning tool provided by an embodiment of the utility model;

[0020] Figure 2 A schematic diagram of the main structure of a TO device welding positioning tool provided by an embodiment of the utility model;

[0021] Figure 3 For along Figure 2 Schematic diagram of the cross-sectional structure along the AA line;

[0022] Figure 4 A schematic diagram of the sealing structure of a TO device provided in an embodiment of the utility model;

[0023] Description of reference numerals:

[0024] 1. Base; 11. First step; 12. Positioning hole; 121. Upper insulating hole; 122. Lower expansion hole; 2. TO device; 21. Cap; 22. Pin; 23. Seat; 3. Insulation structure; 4. Upper electrode; 5. Lower electrode. DETAILED DESCRIPTION

[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0026] In the description of the present invention, it should be noted that if terms such as "upper" and "lower" indicate orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0027] Please also read Figure 1 and Figure 2 The TO device welding positioning tool provided by the utility model is now described. The TO device welding positioning tool comprises: a base 1 and an insulating structure 3, the base 1 is provided with a positioning hole 12 for inserting the pin 22 of the TO device 2, and the top surface of the base 1 is a supporting surface for supporting the cap 21 of the TO device 2; the insulating structure 3 is arranged in the positioning hole 12, and the pin 22 passes through the insulating structure 3.

[0028] Compared with the prior art, the TO device 2 welding positioning tool provided by the utility model has the following beneficial effects: an insulating structure 3 is arranged in the positioning hole 12 of the tool, and the pin 22 of the TO device 2 passes through the insulating structure 3. When the TO device 2 is welded, the pin 22 of the TO device 2 is inserted into the insulating structure 3, and the cap 21 of the TO device 2 is supported on the top surface of the base 1. Since the pin 22 of the TO device 2 extends into the insulating structure 3, the insulating structure 3 insulates the pin 22, thereby preventing the pin 22 of the TO device 2 from contacting the lower electrode 5 and causing chip performance failure. In the process of welding, the pin 22 of the TO device 2 will not form a current loop, and the pin 22 connected to the positive electrode of the chip packaged in the TO device 2 contacts the insulating structure 3, but does not contact the lower electrode 5, so no current loop will be formed, which can avoid chip performance failure, thereby ensuring the welding area and welding effect of the TO device 2; at the same time, the diameter of the positioning hole 12 of the lower electrode 5 and the size of the solder ring of the tube cap 21 match each other, and the solder ring can completely contact the tube seat 23 during welding, thereby ensuring the shear force and airtightness of the welding, and improving the welding area and welding effect of the TO device 2.

[0029] See also Figure 4 The sealing principle of the TO device 2 shown is as follows: pressurize and energize between the upper electrode 4 and the lower electrode 5 to complete the resistance welding process when sealing the cap. The resistance of the welding part is R, the welding current is input I, and the power-on time is T. The resistance of the welding part is large, the temperature rises rapidly, the solder melts, and the welding of the tube seat 23 and the tube cap 21 is completed by a certain pressure, and a is the welding seam between the tube seat 23 and the tube cap 21. It can be seen that the insulating structure 3 set in the tooling can avoid the formation of a loop conduction when the upper electrode 4 and the lower electrode 5 are sealed.

[0030] In some embodiments, the insulating structure 3 is an insulating sleeve coaxially arranged in the positioning hole 12, and the inner diameter of the insulating sleeve gradually shrinks from top to bottom. The shrinking insulating sleeve has a shrinking effect on the pins 22 of the device, which can ensure the sealing area and sealing effect of the device, and avoid the problem of chip performance failure caused by the contact between the pins 22 of the TO device 2 and the lower electrode 5.

[0031] Specifically, the inner hole of the insulating sleeve forms a tapered hole that gradually contracts from top to bottom.

[0032] In some embodiments, the inner diameter of the positioning hole 12 is a tapered structure that gradually decreases from top to bottom, and the outer diameter of the insulating sleeve is adapted to the inner diameter of the positioning hole 12. The tapered positioning hole 12 is directly processed on the base 1, and the outer wall of the insulating sleeve is also a tapered structure. At this time, the insulating sleeve is inserted into the positioning hole 12, and positioning can be achieved under the matching tapered surfaces of the two.

[0033] In some embodiments, the outer wall of the base 1 is provided with at least one step 11, and the outer diameter of the step 11 is larger than the outer diameter of the top surface of the base 1; the positioning hole 12 is a stepped hole, and the stepped hole is divided into an upper insulating hole 121 and a lower expanded hole 122 from top to bottom, the inner diameter of the lower expanded hole 122 is larger than the inner diameter of the upper insulating hole 121, and the insulating sleeve is arranged in the upper insulating hole 121. The outer shape of the base 1 is designed as a stepped structure, which can match the installation position of the base 1; at the same time, the positioning hole 12 is a stepped hole, which expands the heat dissipation space at the lower end of the pin 22.

[0034] The number of steps on the outer wall of the base 1 can be designed according to the installation position of the matching welding machine, for example, Figure 1 The step shown is a two-stage step, that is, it has two steps.

[0035] In some embodiments, the lower end of the insulating sleeve extends downward into the lower expanded hole 122 to improve the insulation effect on the pin 22 .

[0036] In some embodiments, the length of the insulating sleeve extending into the lower expanded hole 122 is no more than 20 mm. By designing the overall length of the insulating sleeve and the length extending to the lower expanded hole 122, a good insulation effect of the pin 22 can be achieved and the generation of a current loop can be avoided, and cost optimization can be achieved and unnecessary waste can be avoided.

[0037] In some embodiments, the wall thickness of the insulating sleeve is 5-10 mm. The wall thickness of the insulating sleeve can be designed and manufactured according to the insulation level to ensure good insulation of the pin 22 and to ensure the welding area and welding effect.

[0038] In some embodiments, the taper of the insulating sleeve is 5-10°. The taper of the insulating sleeve is preferably such that it does not affect the vertical downward extension of the tube pins 22. The main purpose is to prevent the tube pins 22 from opening outward. This is because the tube pins 22 are thin and long. The freely extended tube pins 22 are easy to open outward, affecting the positioning of the tube seat 23, causing the tube seat 23 and the tube cap 21 to be out of axial alignment during sealing. The conical insulating sleeve gathers the tube pins 22, which is conducive to the positioning of the tube seat 23.

[0039] In some embodiments, the thickness of the insulating sleeve gradually increases from top to bottom, and the inner cavity is formed as a tapered hole. In this case, the outer wall of the insulating sleeve is a straight cylinder, and the pins 22 can be retracted as long as the inner wall of the insulating sleeve is a tapered hole.

[0040] The positioning hole 12 can be a straight hole, and the insulating sleeve can be tightly fitted in the positioning hole 12 .

[0041] Optionally, the insulating sleeve is bonded into the positioning hole 12 .

[0042] Optionally, the insulating structure 3 may also be insulating paint sprayed on the inner wall of the positioning hole 12 .

[0043] For example, the material of the insulating structure 3 may also be polyvinyl chloride, polyethylene, polytetrafluoroethylene, etc., which are not listed here one by one.

[0044] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A TO device welding positioning tool, characterized in that: include: A base (1) is provided with a positioning hole (12) for inserting a tube pin (22) of a TO device (2), and a top surface of the base (1) is a supporting surface for supporting a tube cap (21) of the TO device (2); as well as An insulating structure (3) is arranged in the positioning hole (12), and the pin (22) passes through the insulating structure (3).

2. The TO device welding positioning tool as claimed in claim 1, characterized in that: The insulating structure (3) is an insulating sleeve coaxially arranged in the positioning hole (12), and the inner diameter of the insulating sleeve gradually shrinks from top to bottom.

3. The TO component welding positioning tool as claimed in claim 2, characterized in that: The inner diameter of the positioning hole (12) is a tapered structure that gradually decreases from top to bottom, and the outer diameter of the insulating sleeve is adapted to the inner diameter of the positioning hole (12).

4. The TO component welding positioning tool as claimed in claim 3, characterized in that: The outer wall of the base (1) is provided with at least one step (11), and the outer diameter of the step (11) is greater than the outer diameter of the top surface of the base (1); the positioning hole (12) is a stepped hole, and the stepped hole is divided into an upper insulating hole (121) and a lower expanded hole (122) from top to bottom, the inner diameter of the lower expanded hole (122) is greater than the inner diameter of the upper insulating hole (121), and the insulating sleeve is arranged in the upper insulating hole (121).

5. The TO component welding positioning tool as claimed in claim 4, characterized in that: The lower end of the insulating sleeve extends downward into the lower expansion hole (122).

6. The TO component welding positioning tool as claimed in claim 5, characterized in that: The length of the insulating sleeve extending into the lower expansion hole (122) is no more than 20 mm.

7. The TO component welding positioning tool as claimed in claim 2, characterized in that: The wall thickness of the insulating sleeve is 5-10 mm.

8. The TO component welding positioning tool as claimed in claim 2, characterized in that: The taper of the insulating sleeve is 5-10°.

9. The TO component welding positioning tool as claimed in claim 2, characterized in that: The thickness of the insulating sleeve gradually increases from top to bottom, and the formed inner cavity is a tapered hole.

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