An injection mold for injection molded products with inserts

Abstract

The utility model relates to the technical field of injection molds, and particularly discloses an injection mold for injection molded products with inserts, comprising a top plate, a cylinder fixedly mounted on the top plate, guide rods fixedly connected to the four corners of the top plate, a water cooling device connected from the outside, a liquid inlet joint and a liquid outlet joint connected, coolant injected into the liquid inlet joint, the coolant flows along a coolant flow groove, and finally flows back to the water cooling device from the liquid outlet joint. The coolant flow groove is provided to solve the problem that the existing device has limited use scenarios and poor heat dissipation performance, and then the heat dissipation fan is started to take away the temperature of the semiconductor heat dissipation plate, so that the insert in the insert groove next to the semiconductor heat dissipation plate and the adjacent injection molding raw material are cooled, and the semiconductor heat dissipation plate is provided to accelerate the heat dissipation of the injection molding raw material close to the insert, thereby solving the problem that the existing device may cause damage to the insert.

Description

Technical Field

[0001] The utility model relates to the technical field of injection molds, in particular to an injection mold for injection molded products with inserts. Background Art

[0002] Plastic structural parts are generally formed by injection molding. Some electronic products need to be designed with inserts on their shells. Most existing injection molds with inserts use overall heat dissipation, and some inserts are not easy to fit with the injection material due to material characteristics or fitting methods. Some of them require the connection between the insert and the injection material to dissipate heat and solidify faster than other positions of the injection material.

[0003] At present, there is an existing injection mold with an insert (such as patent number: CN207564863U), which discloses an injection mold with an insert, including a fixed mold plate, a movable mold plate, a support plate, a cushion block, a fixed plate, a movable mold base plate and an ejector plate, wherein an insert rod, a first insert and a second insert are arranged coaxially with the insert rod, the first insert is sleeved on the insert rod, the second insert is located at the periphery of the first insert, and the insert rod is also wrapped with a push tube located below the first insert, and the fixed mold plate, the movable mold plate and the push tube jointly enclose an injection space. In the injection mold, the first insert is sleeved on the insert rod, the second insert is located at the periphery of the first insert, and the first insert and the second insert are arranged coaxially with the insert rod, so that the first insert and the second insert are not easy to be displaced during the molding process, and the mold is not easy to be damaged, while ensuring the accuracy and qualified rate of the final plastic structural parts.

[0004] However, during the implementation of the above technical solution, it was found that there were at least the following technical problems:

[0005] 1. The existing device is not equipped with a rapid heat dissipation mechanism. In some special scenarios, such as when the heat resistance of the insert itself is poor, or when it comes into contact with high-temperature injection molding materials and produces a chemical reaction, the heat dissipation of the entire injection mold is particularly important. Therefore, the existing device has limitations in usage scenarios and poor heat dissipation performance.

[0006] 2. The existing device does not have an accelerated cooling device at the position where the insert is required. When some special inserts need accelerated cooling due to low heat resistance, the insert may be damaged due to overheating of the injection molding material. Therefore, the existing device may cause damage to the insert when used. Utility Model Content

[0007] 1. Technical issues to be resolved

[0008] In view of the deficiencies in the prior art, the utility model provides an injection mold for injection molded products with inserts, which solves the technical problems that the existing devices have limited usage scenarios, poor heat dissipation performance, and may cause damage to the inserts.

[0009] (II) Technical solution

[0010] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:

[0011] An injection mold for an injection molded product with an insert comprises a top plate, a cylinder is fixedly mounted on the top plate, guide rods are fixedly connected to the four corners of the top plate, a fixed mold device is fixedly connected to the end of the guide rod away from the top plate, an injection molding device is slidably connected to the middle section of the guide rod, the fixed mold device comprises a bottom mold, and the injection molding device comprises an injection molding plate, the injection molding plate is fixedly connected to the telescopic rod of the cylinder, the injection molding plate is slidably connected to the middle section of the guide rod, and an upper mold is fixedly connected to the end of the injection molding plate facing the bottom mold.

[0012] Preferably: a fixed mold groove is provided at one end of the bottom mold close to the upper mold, a semiconductor heat sink is fixedly provided at one end of the bottom mold, an insert groove is provided on the side of the fixed mold groove of the bottom mold close to the semiconductor heat sink, a blocking groove is provided on the periphery of the fixed mold groove, the blocking groove is located on the inner side of the four guide rods, and the middle section of the blocking groove facing the semiconductor heat sink is blocked by the insert groove.

[0013] Preferably: a half groove is provided at one end of the injection molding plate which is coplanar with the semiconductor heat sink, a raw material inlet pipe is fixedly connected to the end of the injection molding plate away from the half groove, an insert fixing device is fixedly connected to the end of the upper mold close to the half groove, a plurality of discharge ports are provided at the end of the upper mold away from the injection molding plate, a barrier plate is provided on the outer side of the upper mold, the barrier plate is fixedly connected to the injection molding plate, the raw material inlet pipe passes through the injection molding plate and the upper mold, and is connected to each discharge port.

[0014] Preferably, the semiconductor heat sink is clamped with the half groove, one end of the semiconductor heat sink away from the bottom mold is fixedly connected to a heat sink fan, and one end of the semiconductor heat sink away from the heat sink fan is in contact with the insert fixing device.

[0015] Preferably: the bottom mold is located at the center of the insert fixing device and is fixedly installed with an electric push rod. A coolant circulation groove is also opened inside the bottom mold. One end of the coolant circulation groove is connected to a liquid inlet joint, and the other end is connected to a liquid outlet joint. The liquid inlet joint and the liquid outlet joint are both fixedly connected to the side of the bottom mold. The coolant circulation groove is located directly below the fixed mold groove and below the electric push rod.

[0016] Preferably: the upper mold is located directly above the fixed mold groove, the insert fixing device is located directly above the insert groove, the blocking plate is located directly above the blocking groove, the upper mold is slidably connected to the fixed mold groove, the blocking plate is slidably connected to the blocking groove, and the insert fixing device is slidably connected to the insert groove.

[0017] (III) Beneficial effects

[0018] 1. Connect the water cooling device from the outside, connect the liquid inlet joint and the liquid outlet joint, inject coolant into the liquid inlet joint, the coolant flows along the coolant flow groove, and finally flows back to the water cooling device from the liquid outlet joint. By providing the coolant flow groove, the problem that the existing device has limited use scenarios and poor heat dissipation performance is solved.

[0019] Second, the heat dissipation fan is started to take away the temperature of the semiconductor heat sink, so that the insert in the insert groove next to the semiconductor heat sink and the adjacent injection molding material are cooled down. The semiconductor heat sink is provided to accelerate the heat dissipation of the injection molding material close to the insert, thus solving the problem that the existing device may cause damage to the insert. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.

[0021] Figure 1 It is a right side plan view of the overall structure of the device of the utility model;

[0022] Figure 2 This is a left side structural diagram of the overall device of the utility model;

[0023] Figure 3 This is a bottom view of the overall structure of the device of the utility model;

[0024] Figure 4 This is a bottom mold structure diagram of the utility model;

[0025] Figure 5 This is a half-section structural diagram of the bottom mold of the utility model.

[0026] Legend: 1. Top plate; 2. Guide rod; 3. Injection plate; 4. Upper mold; 5. Bottom mold; 6. Electric push rod; 7. Semiconductor heat sink; 8. Liquid inlet connector; 9. Liquid outlet connector; 101. Cylinder; 301. Half groove; 302. Raw material inlet pipe; 303. Baffle plate; 401. Discharge port; 402. Insert fixing device; 501. Baffle groove; 502. Fixed mold groove; 503. Insert groove; 701. Cooling fan; 801. Cooling liquid circulation groove. DETAILED DESCRIPTION

[0027] The embodiment of the present application provides an injection mold for injection-molded products with inserts, thereby effectively solving the problems that existing devices have limited usage scenarios, poor heat dissipation performance, and may cause damage to the inserts.

[0028] like Figure 1, Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the technical solution in the embodiment of the present application effectively solves the technical problems that the existing device has limited usage scenarios and poor heat dissipation performance and may cause damage to the insert. The overall idea is as follows:

[0029] In view of the problems existing in the prior art, the utility model provides an injection mold for injection molded products with inserts, including a top plate 1, on which a cylinder 101 is fixedly installed, and the four corners of the top plate 1 are also fixedly connected to guide rods 2, one end of the guide rod 2 away from the top plate 1 is fixedly connected to a fixed mold device, the middle section of the guide rod 2 is slidably connected to an injection molding device, the fixed mold device includes a bottom mold 5, and the injection molding device includes an injection molding plate 3, the injection molding plate 3 is fixedly connected to the telescopic rod of the cylinder 101, the injection molding plate 3 is slidably connected to the middle section of the guide rod 2, and the end of the injection molding plate 3 facing the bottom mold 5 is fixedly connected to an upper mold 4.

[0030] A fixed mold groove 502 is provided at one end of the bottom mold 5 close to the upper mold 4, and a semiconductor heat sink 7 is fixedly provided at one end of the bottom mold 5. An insert groove 503 is also provided on the side of the fixed mold groove 502 of the bottom mold 5 close to the semiconductor heat sink 7, and a blocking groove 501 is also provided on the periphery of the fixed mold groove 502. The blocking groove 501 is located on the inner side of the four guide rods 2, and the middle section of the blocking groove 501 facing the semiconductor heat sink 7 is blocked by the insert groove 503.

[0031] A half groove 301 is provided at one end of the injection molding plate 3 which is coplanar with the semiconductor heat sink 7; a raw material inlet pipe 302 is fixedly connected to the end of the injection molding plate 3 away from the half groove 301; an insert fixing device 402 is fixedly connected to the end of the upper mold 4 close to the half groove 301; a plurality of discharge ports 401 are provided at the end of the upper mold 4 away from the injection molding plate 3; a baffle plate 303 is provided on the outer side of the upper mold 4; the baffle plate 303 is fixedly connected to the injection molding plate 3; the raw material inlet pipe 302 passes through the injection molding plate 3 and the upper mold 4, and is connected to each discharge port 401.

[0032] The semiconductor heat sink 7 is clamped with the half groove 301 , and one end of the semiconductor heat sink 7 away from the bottom mold 5 is fixedly connected to a heat sink fan 701 , and one end of the semiconductor heat sink 7 away from the heat sink fan 701 is in contact with the insert fixing device 402 .

[0033] The bottom mold 5 is located at the center of the insert fixing device 402 and is fixedly installed with an electric push rod 6. A coolant circulation groove 801 is also opened inside the bottom mold 5. One end of the coolant circulation groove 801 is connected to a liquid inlet joint 8, and the other end is connected to a liquid outlet joint 9. The liquid inlet joint 8 and the liquid outlet joint 9 are both fixedly connected to the side of the bottom mold 5. The coolant circulation groove 801 is located directly below the fixed mold groove 502 and below the electric push rod 6.

[0034] The upper mold 4 is located directly above the fixed mold groove 502, the insert fixing device 402 is located directly above the insert groove 503, the blocking plate 303 is located directly above the blocking groove 501, the upper mold 4 is slidably connected to the fixed mold groove 502, the blocking plate 303 is slidably connected to the blocking groove 501, and the insert fixing device 402 is slidably connected to the insert groove 503.

[0035] A water cooling device is connected from the outside, and the liquid inlet connector 8 and the liquid outlet connector 9 are connected. The coolant is injected into the liquid inlet connector 8, and the coolant flows along the coolant flow groove 801, and finally flows back to the water cooling device from the liquid outlet connector 9. At this time, the injection molding materials in the fixed mold groove 502 and the insert groove 503 can be cooled. Then the cooling fan 701 is started to take away the temperature of the semiconductor heat sink 7, so that the insert in the insert groove 503 next to the semiconductor heat sink 7 and the adjacent injection molding materials are cooled, which solves the problem that the existing device has limited usage scenarios and poor heat dissipation performance and may cause damage to the insert.

[0036] Working principle:

[0037] In the first step, the insert is placed in the insert groove 503, the cylinder 101 is started, the injection plate 3 is driven downward along the guide rod 2, the half groove 301 is clamped with the semiconductor heat sink 7, and the upper mold 4 is extended to the fixed mold groove 502. After the blocking plate 303 is clamped into the blocking groove 501, the insert fixing device 402 fixes and clamps the insert, and then the raw material is injected into the raw material inlet pipe 302, and injection molding is performed into the fixed mold groove 502 from the discharge port 401.

[0038] The second step is to connect the water cooling device from the outside, connect the liquid inlet joint 8 and the liquid outlet joint 9, inject the coolant into the liquid inlet joint 8, and the coolant flows along the coolant flow groove 801, and finally flows back to the water cooling device from the liquid outlet joint 9. At this time, the injection molding materials in the fixed mold groove 502 and the insert groove 503 can be cooled down, and then the cooling fan 701 is started to take away the temperature of the semiconductor heat sink 7, so that the insert in the insert groove 503 next to the semiconductor heat sink 7 and the adjacent injection molding materials can be cooled down.

[0039] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.

Claims

1. An injection mold for an injection molded product with an insert, comprising a top plate (1), a cylinder (101) being fixedly mounted on the top plate (1), and guide rods (2) being fixedly connected to the four corners of the top plate (1), characterized in that: One end of the guide rod (2) away from the top plate (1) is fixedly connected to a fixed mold device, and the middle section of the guide rod (2) is slidably connected to an injection molding device; Wherein, the fixed mold device comprises a bottom mold (5); The injection molding device comprises an injection molding plate (3), the injection molding plate (3) is fixedly connected to the telescopic rod of the cylinder (101), the injection molding plate (3) is slidably connected to the middle section of the guide rod (2), and one end of the injection molding plate (3) facing the bottom mold (5) is fixedly connected to the upper mold (4).

2. An injection mold for an injection molded product with an insert as claimed in claim 1, characterized in that: A fixed die groove (502) is provided at one end of the bottom die (5) close to the upper die (4); a semiconductor heat sink (7) is fixedly provided at one end of the bottom die (5); an insert groove (503) is provided on one side of the fixed die groove (502) of the bottom die (5) close to the semiconductor heat sink (7); a blocking groove (501) is provided on the periphery of the fixed die groove (502); and the blocking groove (501) is located on the inner side of the four guide rods (2); The middle section of one end of the blocking groove (501) facing the semiconductor heat dissipation plate (7) is blocked by the insert groove (503).

3. An injection mold for an injection molded product with an insert as claimed in claim 2, characterized in that: A half groove (301) is provided at one end of the injection molding plate (3) coplanar with the semiconductor heat sink (7); a raw material inlet pipe (302) is fixedly connected to one end of the injection molding plate (3) away from the half groove (301); an insert fixing device (402) is fixedly connected to one end of the upper mold (4) close to the half groove (301); a plurality of discharge ports (401) are provided at one end of the upper mold (4) away from the injection molding plate (3); a baffle plate (303) is provided on the outer side of the upper mold (4); and the baffle plate (303) is fixedly connected to the injection molding plate (3); The raw material inlet pipe (302) passes through the injection molding plate (3) and the upper mold (4), and is connected to each discharge port (401).

4. An injection mold for an injection molded product with an insert as claimed in claim 3, characterized in that: The semiconductor heat dissipation plate (7) is clamped with the half groove (301), one end of the semiconductor heat dissipation plate (7) away from the bottom mold (5) is fixedly connected to a heat dissipation fan (701), and one end of the semiconductor heat dissipation plate (7) away from the heat dissipation fan (701) is in contact with the insert fixing device (402).

5. An injection mold for an injection molded product with an insert as claimed in claim 4, characterized in that: The bottom mold (5) is fixedly mounted with an electric push rod (6) at the center of the insert fixing device (402), and a cooling liquid circulation groove (801) is also provided inside the bottom mold (5). One end of the cooling liquid circulation groove (801) is connected to a liquid inlet joint (8), and the other end is connected to a liquid outlet joint (9). The liquid inlet joint (8) and the liquid outlet joint (9) are both fixedly connected to the side of the bottom mold (5); Wherein, the cooling liquid circulation groove (801) is located directly below the fixed mold groove (502) and below the electric push rod (6).

6. An injection mold for an injection molded product with an insert as claimed in claim 5, characterized in that: The upper mold (4) is located directly above the fixed mold groove (502), the insert fixing device (402) is located directly above the insert groove (503), the blocking plate (303) is located directly above the blocking groove (501), the upper mold (4) is slidably connected to the fixed mold groove (502), the blocking plate (303) is slidably connected to the blocking groove (501), and the insert fixing device (402) is slidably connected to the insert groove (503).

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