PCB warping detection vacuum platform and PCB warping detection equipment

Abstract

The utility model provides a PCB warping detection vacuum platform and PCB warping detection equipment. The PCB warping detection equipment comprises a rack, a detection module, a transfer module, a pressing plate storage bin and a PCB warping detection vacuum platform. The PCB warping detection vacuum platform comprises a base, a detection panel, a detection adsorption assembly, a detection lifting platform and a lifting driving assembly, each detection adsorption assembly comprises a positioning pipe and a movable pipe, the positioning pipes are fixed on the detection lifting platform, and the bottom ends of the positioning pipes are communicated to the vacuum module; the bottom of the movable pipe is slidably arranged in the positioning pipe; a butt joint rubber ring is arranged at the top end of the movable pipe. When acting force is applied to the PCB, the detection lifting table and the detection adsorption assembly are driven by the lifting driving assembly to be lifted to a high position, by means of sliding fit between the movable pipe and the positioning pipe and lifting of the butt joint rubber rings, the butt joint rubber rings can make contact with the PCB, gaps are reduced, adsorption force can be applied to the PCB, and the detection accuracy is improved.

Description

Technical Field

[0001] The utility model relates to the field of PCB detection, in particular to a PCB warping detection vacuum platform and PCB warping detection equipment. Background Art

[0002] The PCB is provided with a printed circuit, which is a plate material and may have warping phenomenon; especially the thinner PCB is prone to warping. If the substrate of the PCB is warped, it will be difficult to print the circuit on it later; or after the circuit is printed, the stress of the PCB substrate is changed, so that the PCB is warped. The warped PCB affects the subsequent assembly and may interfere with other components to cause the circuit. Therefore, it is necessary to detect the warping of the PCB to ensure the product quality. In the prior art, usually only the warping of the PCB in the natural state can be detected, but some warping can be repaired during the installation process, so it is necessary to apply a certain force to the PCB to detect whether the warping state of the PCB under the force is qualified. Usually, a vacuum adsorption platform can be used to apply force to the PCB, but due to the warping of the PCB, the gap between the adsorption surface of the vacuum adsorption platform of the prior art and the PCB may lead to insufficient adsorption force, affecting the detection accuracy. Utility Model Content

[0003] The utility model provides a PCB warping detection vacuum platform and PCB warping detection equipment, which can improve the detection accuracy.

[0004] The utility model provides a PCB warpage detection vacuum platform, including a base, a detection panel, a detection adsorption component, a detection lifting platform and a lifting drive component;

[0005] The detection panel is fixed to the base and is used to place the PCB; the detection panel is in the shape of a square plate, the upper surface of which is the detection surface and is provided with a plurality of adsorption holes;

[0006] There are multiple detection adsorption components, which are arranged on the detection lifting platform; each of the detection adsorption components includes a positioning tube and a movable tube, the positioning tube is fixed to the detection lifting platform, and its bottom end is connected to the vacuum module; the movable tube and the positioning tube are both arranged vertically, the bottom of the movable tube is slidably arranged in the positioning tube, and a sealing structure is arranged between the two; the top of the movable tube protrudes from the top of the movable tube, and the adsorption hole is penetrated and extends to the detection surface; a gap is arranged between the movable tube and the adsorption hole; a docking rubber ring is fixed on the top surface of the movable tube; a flange is arranged on the top circumference of the movable tube, and a limited edge is arranged at the bottom of the hole wall of the adsorption hole, and the limited edge is located below the flange;

[0007] The detection lifting platform is vertically slidably arranged on the base and is located below the detection panel; the lifting drive assembly is connected to the detection lifting platform to drive the detection lifting platform and the plurality of detection adsorption assemblies to move up and down, thereby changing the height of the docking rubber ring protruding from the detection surface; when the detection lifting platform and the detection adsorption assembly are located at a lower position, the limiting edge abuts against the flange, and the top surfaces of the plurality of docking rubber rings are located on the same plane and are flush with or lower than the detection surface.

[0008] The detection panel is fixed to the base through a plurality of guide columns, a plurality of linear bearings are arranged on the detection lifting platform, and the linear bearings are vertically penetrated by the guide columns.

[0009] Among them, the detection panel includes a top plate and a bottom plate, the top plate is located above the bottom plate; the adsorption hole includes a first hole and a second hole, the first hole is arranged on the top plate, and the second hole is arranged on the bottom plate, the aperture of the second hole is smaller than the aperture of the first hole, and the limiting edge is formed at the edge of the second hole; the bottom plate is slidably arranged on the guide column and is detachably fixedly connected to the top plate; the aperture of the second hole is equal to or larger than the outer diameter of the top end of the positioning tube.

[0010] Among them, the upper surface of the bottom plate is in contact with the lower surface of the top plate; a plurality of reinforcing ribs are arranged on the lower surface of the bottom plate, and the plurality of reinforcing ribs are connected in a grid shape.

[0011] The detection lifting platform includes a first support beam and a second support beam, the first support beams are multiple and parallel to each other; the multiple first support beams are fixed above the second support beam, and the length directions of the two are perpendicular; the first support beam and the second support beam are both strip-shaped hollow structures, and the inner cavities of the two are connected;

[0012] The positioning tube is fixed to the first support beam and communicates with the inner cavity of the first support beam;

[0013] The second support beam is provided with a docking joint, which is connected to the inner cavity of the second support beam and to the vacuum module.

[0014] Among them, the detection lifting platform also includes two sliding plates, which are strip-shaped and parallel to the second support beam. The sliding plates are arranged on the bottom surfaces of multiple first support beams. The two sliding plates are respectively located at the two ends of the first support beam in the length direction, and each sliding plate slides with the two guide columns.

[0015] Among them, the lifting drive assembly includes a lifting plate and two micro-lifting mechanisms; the lifting plate is strip-shaped and parallel to the second support beam; the lifting plate is arranged on the bottom surface of multiple first support beams and is located in the middle position in the length direction of the first support beam; the two micro-lifting mechanisms are respectively connected to the two ends of the lifting plate; the micro-lifting mechanism includes a flat plate, a vertical plate, a push rod and a micro-motor; the bottom end of the vertical plate is fixedly connected to the end of the lifting plate, and the top end of the vertical plate is fixedly connected to one end of the flat plate; the push rod is vertically arranged, and its top is abutted against the bottom surface of the flat plate, the micro-motor is fixed to the base, and is connected to the push rod through a ball screw transmission, so that the push rod can be lifted and moved; the detection lifting platform is located between the vertical plates of the two micro-lifting mechanisms.

[0016] There are two second support beams, which is less than the number of the first support beams.

[0017] On the other hand, the utility model provides a PCB warping detection device, which includes a frame, a detection module, a transfer module, a pressure plate storage bin and the aforementioned PCB warping detection vacuum platform; the detection module is arranged on the base, and is used to scan and detect the PCB on the PCB warping detection vacuum platform; the transfer module, the pressure plate storage bin and the base are all arranged on the frame, and the pressure plate storage bin is used to store the pressure plate; the base and the pressure plate storage bin are arranged in the horizontal direction; the transfer module is arranged on the frame, and is used to move the pressure plate between the PCB warping detection vacuum platform and the pressure plate storage bin.

[0018] Wherein, the detection module includes a transverse axis scanning component, a longitudinal axis scanning component and a vertical axis scanning component; the transverse axis scanning component includes a transverse axis sliding member, a transverse axis transmitter and a transverse axis receiver, the transverse axis sliding member is a bar arranged in the longitudinal direction, located above the PCB warpage detection vacuum platform, and its two ends are respectively connected to the base in the transverse sliding direction, the transverse axis transmitter and the transverse axis receiver are respectively arranged at the longitudinal ends of the transverse axis sliding member, and are respectively located at the longitudinal sides of the PCB warpage detection vacuum platform; a transverse axis driving mechanism is arranged on the base, and the transverse axis driving mechanism is transmission-connected to the transverse axis sliding member to drive the transverse axis scanning component to move in the transverse direction;

[0019] The longitudinal axis scanning assembly comprises a longitudinal axis sliding member, a longitudinal axis transmitter and a longitudinal axis receiver; the longitudinal axis sliding member is a bar arranged in the transverse direction, located above the PCB warpage detection vacuum platform and the transverse axis sliding member, and its two ends are respectively connected to the base in a longitudinal sliding manner; the longitudinal axis transmitter and the longitudinal axis receiver are respectively arranged at the transverse ends of the longitudinal axis sliding member, and are respectively located at the transverse sides of the PCB warpage detection vacuum platform; a longitudinal axis driving mechanism is arranged on the base, and the longitudinal axis driving mechanism is transmission-connected to the longitudinal axis sliding member to drive the longitudinal axis scanning assembly to move in the longitudinal direction;

[0020] A vertical axis driving mechanism is arranged above the longitudinal axis sliding member, and the vertical axis driving mechanism is connected to the vertical axis scanning assembly to drive the vertical axis scanning assembly to slide in the transverse direction.

[0021] The utility model provides a PCB warpage detection vacuum platform and a PCB warpage detection device. When the PCB warpage detection vacuum platform needs to be used to apply a force to the PCB, the detection lifting platform and the detection adsorption component thereon are lifted to a higher position under the drive of the lifting drive component, and a plurality of docking rubber rings move upward and contact the bottom surface of the PCB. Then, the vacuum module is turned on to generate negative pressure to generate an adsorption force on the PCB. By utilizing the sliding cooperation between the movable tube and the positioning tube and the lifting of the docking rubber ring, each docking rubber ring can be in contact with the PCB, thereby reducing the gap between the PCB and the docking rubber ring, which is beneficial to applying an adsorption force to the PCB, thereby improving the detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of the structure of a PCB warpage detection device provided in a preferred embodiment of the utility model;

[0023] Figure 2 yes Figure 1 Schematic diagram of the structure of the base of the PCB warpage detection equipment, the PCB warpage detection vacuum platform and the detection module;

[0024] Figure 3 yes Figure 1 A schematic diagram of the structure of the PCB warpage detection vacuum platform of the PCB warpage detection equipment;

[0025] Figure 4 yes Figure 3 Schematic diagram of the structure of the vacuum platform for PCB warpage detection from another angle;

[0026] Figure 5 yes Figure 3 Schematic diagram of the exploded view of the vacuum platform for PCB warpage detection;

[0027] Figure 6 yes Figure 5Schematic diagram of another angle of the PCB warpage detection vacuum platform;

[0028] Figure 7 yes Figure 3 A cross-sectional diagram of the vacuum platform for PCB warpage detection;

[0029] Figure 8 yes Figure 7 A in the enlarged view;

[0030] Fig. 9 yes Figure 8 A cross-sectional diagram of the detection lifting platform of the PCB warpage detection vacuum platform in the raised state. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0032] Please refer to Figure 1 A PCB warpage detection device provided by an embodiment of the utility model includes a frame 900, a PCB warpage detection vacuum platform 1, a detection module 2, a transfer module 3 and a pressure plate storage bin 4.

[0033] The rack 900 is used to provide support for the entire device. The PCB can be placed on the PCB warpage detection vacuum platform 1. The detection module 2 is used to scan and detect the PCB on the PCB warpage detection vacuum platform 1 to detect qualified and unqualified products. Figure 1 As shown, the PCB warping detection vacuum platform 1, the transfer module 3 and the pressure plate storage bin 4 are arranged on the frame 900. The transfer module 3 is located above the PCB warping detection vacuum platform 1, and is used to place or remove the pressure plate on the PCB. The transfer module 3 can also be used to move the PCB, so as to place the PCB on the PCB warping detection vacuum platform 1, and can remove the PCB from the PCB warping detection vacuum platform 1, and at the same time, the pressure plate can be moved between the PCB warping detection vacuum platform 1 and the pressure plate storage bin 4.

[0034] like Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6As shown, the PCB warpage detection vacuum platform 1 includes a base 800, a detection panel 11, a detection adsorption component 12, a detection lifting platform 13 and a lifting drive component 14. The base 800 is arranged on the frame 900, and the PCB warpage detection vacuum platform 1 and the detection module 2 are both arranged on the base 800. The detection panel 11 is a square plate, and its upper surface is a detection surface 119. The detection panel 11 is fixed to the base 800, that is, the position of the detection panel 11 remains fixed, and the detection surface 119 is in a horizontal state. A plurality of adsorption holes 110 are arranged on the detection lifting platform 13, which are used to adsorb the PCB and provide adsorption force to the PCB. A plurality of detection adsorption components 12 are arranged on the detection lifting platform 13, and the lifting drive component 14 drives the detection adsorption component 12 to rise and fall through the detection lifting platform 13, so that it protrudes from the detection surface 119, thereby facilitating its contact with the PCB and providing adsorption force.

[0035] Multiple detection adsorption components 12 are arranged in a matrix on the detection lifting platform 13, and their arrangement rules can also be set as needed. Each detection adsorption component 12 includes a positioning tube 121 and a movable tube 122. The positioning tube 121 is fixed to the detection lifting platform 13, and its bottom end is connected to the vacuum module (not shown in the figure). Figure 7 , Figure 8 As shown, the movable tube 122 and the positioning tube 121 are both arranged vertically, the bottom of the movable tube 122 is slidably arranged in the positioning tube 121, and a sealing structure 123 is arranged between the two. The top of the movable tube 122 protrudes from the top of the movable tube 122, and penetrates the adsorption hole 110 and extends to the detection surface 119; the movable tube 122 and the adsorption hole 110 are arranged with a gap, that is, the outer wall of the movable tube 122 is isolated from the inner wall of the adsorption hole 110. A docking rubber ring 124 is fixed on the top surface of the movable tube 122, and the docking rubber ring 124 can be a rubber ring or a silicone ring. The docking rubber ring 124 can be used to contact the PCB to avoid damage to the PCB. A flange 1221 is provided on the top circumferential surface of the movable tube 122, and a limiting edge 1121 is provided at the bottom of the hole wall of the adsorption hole 110. The limiting edge 1121 is located below the flange 1221. The blocking effect of the limiting edge 1121 can limit the downward movement of the movable tube 122.

[0036] The detection lifting platform 13 is vertically slidably arranged on the base 800 and is located below the detection panel 11; the lifting drive component 14 is connected to the detection lifting platform 13 to drive the detection lifting platform 13 and multiple detection adsorption components 12 to move up and down, thereby changing the height of the docking rubber ring 124 of the movable tube 122 protruding from the detection surface 119.

[0037] When detecting the warping state of the PCB in a natural state, the detection lifting platform 13 and the detection adsorption component 12 thereon are located at a lower position of the fall back. At this time, the limiting edge 1121 abuts against the flange 1221, and the top surfaces of the docking rubber rings 124 of the multiple detection adsorption components 12 are located on the same plane and are flush with or lower than the detection surface 119, so that the PCB can be placed on the detection surface 119.

[0038] When it is necessary to use the PCB warpage detection vacuum platform 1 to apply force to the PCB, such as Fig. 9 As shown, the detection lifting platform 13 and the detection adsorption component 12 thereon are lifted to a higher position under the drive of the lifting drive component 14, and multiple docking rubber rings 124 move upward and contact the bottom surface of the PCB, and then the vacuum module is turned on to generate negative pressure to generate adsorption force on the PCB. By utilizing the sliding fit between the movable tube 122 and the positioning tube 121 and the lifting of the docking rubber ring 124, each docking rubber ring 124 can contact the PCB, reducing the gap between the PCB and the PCB, which is conducive to applying adsorption force to the PCB; thereby improving the detection accuracy.

[0039] Since a sealing structure 123 is provided between the movable tube 122 and the positioning tube 121, under the action of the sealing structure 123, the upward movement of the positioning tube 121 will drive the movable tube 122 to move upward together; when the docking rubber ring 124 contacts the PCB, the action of the PCB on the docking rubber ring 124 and the movable tube 122 is greater than the action of the sealing structure 123 on the movable tube 122, and the positioning tube 121 continues to move upward, while the docking rubber ring 124 and the movable tube 122 remain stationary under the action of the PCB. In this way, after the detection lifting platform 13 moves upward by a preset distance, the preset distance is equal to or greater than the second height, so that all the docking rubber rings 124 can contact the PCB.

[0040] After the detection adsorption component 12 is lifted to a higher position and each docking rubber ring 124 contacts the PCB, the vacuum module is started again to form a negative pressure in the movable tube 122 and the positioning tube 121. Since the top of the movable tube 122 contacts the PCB through the docking rubber ring 124, under the action of negative pressure, the internal space of the movable tube 122 and the positioning tube 121 is compressed to make the movable tube 122 move downward, and the movable tube 122 drives the PCB to move downward, thereby applying a force to the PCB. At this time, the PCB can be warped again to detect whether the PCB can be restored to a qualified state under the predetermined force.

[0041] When the detection lifting platform 13 moves downward, or the movable tube 122 moves downward to a lower position under the action of negative pressure, the flange 1221 abuts against the limiting edge 1121. Through the cooperation between the limiting edge 1121 and the flange 1221, the lowest position of the movable tube 122 moving downward can be limited. At the same time, it can be ensured that when the detection lifting platform 13 is at a lower position, the top surface of the docking rubber ring 124 is on the same plane.

[0042] In this embodiment, the detection panel 11 is fixed to the base 800 by a plurality of guide columns 15, and a plurality of linear bearings (not marked in the figure) are arranged on the detection lifting platform 13. The linear bearings are vertically penetrated through the guide columns 15. The guide columns 15 can be used to support the detection panel 11 and realize the vertical sliding of the detection lifting platform 13. The structure is simple and the cost is reduced.

[0043] In this embodiment, Figure 5 , Figure 6 and Figure 8 As shown, the detection panel 11 includes a top plate 111 and a bottom plate 112, and the top plate 111 is located above the bottom plate 112. The adsorption hole 110 includes a first hole 1101 and a second hole 1102, the first hole 1101 is arranged on the top plate 111, and the second hole 1102 is arranged on the bottom plate 112, the aperture of the second hole 1102 is smaller than the aperture of the first hole 1101, and a limiting edge 1121 is formed at the edge of the second hole 1102. The bottom plate 112 is slidably arranged on the guide column 15, and is detachably fixedly connected to the top plate 111. The aperture of the second hole 1102 is equal to or greater than the outer diameter of the top end of the positioning tube 121. When the positioning tube 121 is inserted into the second hole 1102, the two are clearance-fitted.

[0044] During assembly, the detection lifting platform 13 is first connected to the guide column 15, and then the positioning tube 121 is fixedly connected to the detection lifting platform 13, and the two can be threadedly connected; then the bottom plate 112 is assembled to the guide column 15, so that the top end of the positioning tube 121 protrudes from the second hole 1102; then the movable tube 122 is assembled into the positioning tube 121, and the top plate 111 is fixed to the top end of the guide column 15, and finally the bottom plate 112 is lifted and fixedly connected to the top plate 111, thereby completing the assembly of the PCB warpage detection vacuum platform 1, and the cooperation of the top plate 111 and the bottom plate 112 can facilitate the assembly and connection.

[0045] The upper surface of the bottom plate 112 is fitted with the lower surface of the top plate 111, and a plurality of reinforcing ribs 1129 are provided on the lower surface of the bottom plate 112, and the plurality of reinforcing ribs 1129 are connected in a grid shape. The reinforcing ribs 1129 can improve the structural strength of the bottom plate 112 and keep its surface flat; the bottom plate 112 and the top plate 111 are fitted and connected, and the bottom plate 112 can be used to keep the top plate 111 flat, thereby improving the accuracy of the test.

[0046] like Figure 7 As shown, a vacuum adsorption channel 130 is provided inside the detection lifting platform 13, and the bottom of the positioning tube 121 is connected to the vacuum module through the vacuum adsorption channel 130, so as to facilitate assembly connection and pipeline setting.

[0047] In this embodiment, the detection lifting platform 13 includes a first support beam 131 and a second support beam 132. There are multiple first support beams 131, which are parallel to each other. Multiple first support beams 131 are fixed above the second support beam 132, and the length directions of the two are perpendicular. The first support beam 131 and the second support beam 132 are both hollow strip structures, and the inner cavities of the two are connected. The positioning tube 121 is fixed to the first support beam 131 and is connected to the inner cavity of the first support beam 131 to form a vacuum adsorption channel 130. The first support beam 131 and the second support beam 132 are fixed and connected to form an integral structure to move up and down as a whole.

[0048] The second support beam 132 is provided with a butt joint 133, and the butt joint 133 is connected to the inner cavity of the second support beam 132 and to the vacuum module. The hollow structure of the first support beam 131 and the second support beam 132 facilitates the connection between the positioning tube 121 and the vacuum module, reduces the number of pipelines, facilitates assembly, and makes the overall structure more concise and compact.

[0049] There are two second support beams 132, which are less than the first support beams 131, so as to realize the function of integrating the inner cavity channels of the first support beams 131 and reduce the pipeline connection between the vacuum module. The vacuum module can be fixed on the base 800 and connected to the two docking joints 133 through a hose.

[0050] like Figure 5 , Figure 6 As shown, the lifting drive assembly 14 includes a lifting plate 141 and two micro-lifting mechanisms 140. The lifting plate 141 is strip-shaped and parallel to the second support beam 132. The lifting plate 141 is arranged on the bottom surface of the plurality of first support beams 131 and is located in the middle position in the length direction of the first support beam 131. The two micro-lifting mechanisms 140 are connected to both ends of the lifting plate 141, respectively.

[0051] The micro-lifting mechanism 140 includes a flat plate 142, a vertical plate 143, a push rod 144 and a micro-motor 145. The bottom end of the vertical plate 143 is fixedly connected to the end of the lifting plate 141, and the top end of the vertical plate 143 is fixedly connected to one end of the flat plate 142. The push rod 144 is vertically arranged, and its top is in contact with the bottom surface of the flat plate 142. The micro-motor 145 is fixed to the base 800 and is connected to the push rod 144 through a ball screw transmission, so that the push rod 144 can be lifted and moved, and then the lifting plate 141 is moved through the flat plate 142 and the vertical plate 143, and the lifting plate 141 drives the detection lifting platform to move. The detection lifting platform 13 is located between the vertical plates 143 of the two micro-lifting mechanisms 140. The flat plate 142 can be supported to a higher position by using the vertical plate 143 to reduce the vertical size of the entire PCB warpage detection vacuum platform 1, making the structure more compact.

[0052] Since the top rod 144 is in contact with the bottom surface of the flat plate 142, when the top rod 144 is lifted, the flat plate 142 can be driven to rise by the top rod 144; when the top rod 144 is lowered, the detection lifting platform can lower itself by its own power, and the structure is simple and easy to assemble. The use of two micro-lifting mechanisms 140 can improve the lifting stability and balance.

[0053] The detection lifting platform 13 also includes two sliding plates 134, which are strip-shaped and parallel to the second support beam 132. The sliding plates 134 are arranged on the bottom surface of the plurality of first support beams 131. The two sliding plates 134 are respectively located at the two ends of the length direction of the first support beam 131. Each sliding plate 134 is slidably matched with two guide columns to facilitate the assembly between the detection lifting platform 13 and the guide columns 15, and to ensure the stability of the lifting of the detection lifting platform 13. The guide columns 15 are also arranged at the lifting plate 141, and the two are slidably connected to further ensure the lifting stability.

[0054] The detection module 2 includes a transverse scanning component 21, a longitudinal scanning component 22 and a vertical scanning component 23; the transverse scanning component 21 is slidably arranged on the base 800 along the transverse direction, and is used to scan the PCB along the transverse direction; the longitudinal scanning component 22 is slidably arranged on the base 800 along the longitudinal direction Y, and is used to scan the PCB along the longitudinal direction; the vertical scanning component 23 is located above the PCB warpage detection vacuum platform 1, and is slidably arranged on the base 800 along the transverse direction and the longitudinal direction, and is used to locate the warpage position of the PCB.

[0055] The warping degree of the PCB and the position where the warping will occur can be detected by the transverse axis scanning component 21, the longitudinal axis scanning component 22 and the vertical axis scanning component 23, so as to determine whether the PCB is qualified.

[0056] The transverse axis scanning assembly 21 includes a transverse axis sliding member 211, a transverse axis transmitter 212 and a transverse axis receiver 213. The transverse axis sliding member 211 is a bar arranged in the longitudinal direction and is located above the PCB warpage detection vacuum platform 1. Its two ends are respectively connected to the base 800 in a transverse sliding manner to ensure the stability of the transverse movement of the transverse axis sliding member 211. The transverse axis transmitter 212 and the transverse axis receiver 213 are respectively arranged at the longitudinal ends of the transverse axis sliding member 211 and at the longitudinal sides of the PCB warpage detection vacuum platform 1 to scan the PCB on the PCB warpage detection vacuum platform 1.

[0057] The base 800 is provided with a transverse drive mechanism 24, which is connected to the transverse slide 211 to drive the transverse scanning assembly 21 to move transversely. In this embodiment, the transverse drive mechanism 24 is a combination of a motor and a conveyor belt mechanism, which has a simple structure and stable operation.

[0058] The longitudinal scanning assembly 22 includes a longitudinal sliding member 221, a longitudinal transmitter 222 and a longitudinal receiver 223. The longitudinal sliding member 221 is a bar arranged along the horizontal direction X, and is located above the PCB warpage detection vacuum platform 1 and the transverse sliding member 211. Its two ends are respectively connected to the base 800 by sliding along the longitudinal direction Y to ensure the stability of the longitudinal sliding member 221 in the longitudinal movement. The longitudinal transmitter 222 and the longitudinal receiver 223 are respectively arranged at the two transverse ends of the longitudinal sliding member 221 and at the two transverse sides of the PCB warpage detection vacuum platform 1 to scan the PCB on the PCB warpage detection vacuum platform 1.

[0059] The base 800 is provided with a longitudinal drive mechanism 25, which is connected to the longitudinal slide 221 to drive the longitudinal scanning assembly 22 to move longitudinally. In this embodiment, the longitudinal drive mechanism 25 is a combination of a motor and a conveyor belt mechanism, which has a simple structure and stable operation.

[0060] A vertical axis driving mechanism 26 is disposed above the longitudinal axis sliding member 221, and the vertical axis driving mechanism 26 is connected to the vertical axis scanning assembly 23 to drive the vertical axis scanning assembly 23 to slide in the horizontal direction. When the longitudinal axis driving mechanism 25 drives the longitudinal axis sliding member 221 to move in the longitudinal direction, the vertical axis driving mechanism 26 and the vertical axis scanning assembly 23 can be driven to move in the longitudinal direction, thereby enabling the vertical axis scanning assembly 23 to move in the horizontal and longitudinal directions, so as to perform a height scan on a certain position of the PCB, thereby accurately measuring the height of the PCB warpage.

[0061] The entire detection module 2 has a reasonable structure and can accurately detect the warping of the PCB.

[0062] The pressing plate storage bin 4 is provided on the frame 900 for storing the pressing plate. The frame 900 is also provided with an upper bin 51 and a lower bin 52. The upper bin 51 is used to store the PCB to be tested, and the lower bin 52 is used to store the PCB after the test. In the horizontal direction, the upper bin 51, the PCB warpage detection vacuum platform 1, the pressing plate storage bin 4 and the lower bin 52 are arranged in sequence, and are all located below the transfer module 3. The lower bin 52 may include a qualified bin and a discarded bin. The qualified bin is used to place the PCB that has passed the test, and the discarded bin is used to place the unqualified PCB. The two are also arranged in the horizontal direction.

[0063] The base 800 and the platen storage bin 4 are arranged in the transverse direction, so that the platen can be moved in the transverse direction by using the transfer module 3 . The transfer module 3 can move the platen between the PCB warpage detection vacuum platform 1 and the platen storage bin 4 .

[0064] The transfer module 3 is used to transfer the pressing plate and the PCB, and is located above the upper bin 51, the PCB warpage detection vacuum platform 1, the pressing plate storage bin 4, and the lower bin 52. The transfer module 3 is used to move the pressing plate between the PCB warpage detection vacuum platform 1 and the pressing plate storage bin 4, and can also move the PCB from the upper bin 51 to the PCB warpage detection vacuum platform 1, and move the PCB from the PCB warpage detection vacuum platform 1 to the lower bin 52.

[0065] The transfer module 3 includes a manipulator 31, a vertical drive assembly 32 and a horizontal drive assembly 33. The manipulator 31 is used to grab the PCB or the pressing plate, and the vertical drive assembly 32 is connected to the manipulator 31 to drive the manipulator 31 to move vertically to lift or lower the PCB or the pressing plate; the horizontal drive assembly 33 is arranged on the frame and connected to the vertical drive assembly 32 to drive the vertical drive assembly 32 and the manipulator 31 to move horizontally X, so that the pressing plate moves between the PCB warpage detection vacuum platform 1 and the pressing plate storage bin 4, or realizes the loading and unloading of PCB.

[0066] The manipulator 31 may be a vacuum adsorption mechanism to adsorb and grab the PCB, or may be a clamping mechanism to clamp the PCB for pick-up and placement.

[0067] When performing warpage detection on a PCB under a predetermined force, the pressure plate can be first placed on the PCB located on the PCB warpage detection vacuum platform 1 through the transfer module 3, and the degree of warpage of the PCB can be reduced by the pressure plate, so that the PCB is as close as possible to the detection surface of the PCB warpage detection vacuum platform 1. At the same time, the PCB can be in closer contact with the docking rubber ring, so as to facilitate the application of force to the PCB through the detection adsorption component, thereby improving the test accuracy.

[0068] The transfer module 3 includes two manipulators 31 and two vertical drive components 32, wherein one manipulator 31 and one vertical drive component 32 move above both the upper material bin 51 and the PCB warpage detection vacuum platform 1, and are used to move the PCB in the upper material bin 51 to the PCB warpage detection vacuum platform 1. A code reading component is also provided on one side of the manipulator 31, and is used to read the identification code of the PCB currently being detected; the other manipulator 31 and another vertical drive component 32 move above both the PCB warpage detection vacuum platform 1 and the lower material bin 52, and are used to move the PCB that has been detected to the lower material bin 52. With the two manipulators 31, loading and unloading can be carried out simultaneously to improve the detection efficiency. The lateral drive component 33 is a linear motor, which is connected to the two manipulators 31 at the same time to simplify the structure and reduce costs.

[0069] The PCB warpage detection device provided by the utility model performs the following detection process on the PCB.

[0070] In the first step, the PCB is placed on the PCB warpage detection vacuum platform 1, and the PCB warpage detection vacuum platform 1 is in a non-suction state.

[0071] In this embodiment, the PCB can be moved from the loading bin 51 to the PCB warpage detection vacuum platform 1 by the transfer module 3. Of course, in other embodiments, the PCB can also be placed on the PCB warpage detection vacuum platform 1 manually.

[0072] More specifically, the manipulator 31 is moved to the top of the loading bin 51 by the lateral drive assembly 33, and the manipulator 31 is driven downward by the vertical drive assembly 32 to grab the PCB in the loading bin 51 by the manipulator 31; then the vertical drive assembly 32 drives the manipulator 31 and the PCB to be lifted, and the lateral drive assembly 33 moves the manipulator 31 and the PCB to the top of the PCB warping detection vacuum platform 1; the vertical drive assembly 32 drives the manipulator 31 to move downward to place the PCB on the PCB warping detection vacuum platform 1; the manipulator 31 is moved away from the top of the PCB warping detection vacuum platform 1.

[0073] In the second step, the warping state of the PCB in its natural state is detected by the detection module 2 to determine whether the PCB is qualified in its natural state.

[0074] First, it is possible to detect whether the PCB is warped. Specifically, the longitudinal scanning component 22 and the transverse scanning component 21 of the detection module 2 are used to scan the PCB in the length and width directions respectively. If the upper surface of the PCB in both directions is straight, and the lower surface of the PCB is parallel to the detection surface 119, the PCB is not warped, and the detection is qualified, and the transfer module 3 moves the PCB to the qualified bin; otherwise, the PCB is warped. Usually, the PCB has a certain degree of warping, so this step can be omitted, or the upper surface shape is directly used to determine the position of the highest point of the warping.

[0075] Then, the warped PCB is inspected to see whether the highest point of the warping is within a preset height.

[0076] Here, the high point position of the upper surface can be determined based on the PCB upper surface curve scanned by the longitudinal scanning component 22 and the transverse scanning component 21, and then the position of the highest point and the height corresponding to the position can be determined in combination with the vertical scanning component 23.

[0077] In this step, the PCB warpage detection vacuum platform 1 is in a closed state without suction. After the PCB is placed on the PCB warpage detection vacuum platform 1, no other external force acts on the PCB, so as to detect whether the PCB is warped in a natural state and the highest point of the warpage. The specific method for detecting and judging the warpage state of the PCB is not limited to this, and various mature scanning methods in the prior art can be used to measure the warpage state of the PCB in a natural state.

[0078] Then, the vertical axis scanning component 23 is used to detect the highest point of the warping of the PCB in the length and width directions, and the height of the highest point of the warping is determined to be the first height. The first height is compared with the preset height. In this embodiment, the preset height includes a first preset height and a second preset height, and the first preset height is less than the second preset height. If the first height is less than or equal to the first preset height, the PCB is qualified in the inspection, and the transfer module 3 moves the PCB to the qualified bin; if the first height is greater than the second preset height, the PCB is unqualified in the inspection; if the first height is greater than the first preset height and less than or equal to the second preset height, the next step of inspection is performed.

[0079] In the third step, the detection lifting platform 13 and the plurality of detection adsorption components 12 are driven upward by the lifting driving component 14 , so that the docking rubber ring 124 of each detection adsorption component 12 abuts against the PCB.

[0080] The fourth step is to start the vacuum module of the PCB warpage detection vacuum platform 1 to provide a preset adsorption force to the PCB to simulate the force during PCB installation.

[0081] Step 5: Use the detection module 2 again to detect whether the warping state of the PCB is qualified.

[0082] If the PCB is qualified, the warping of the PCB can be restored to a normal range under the action of a preset adsorption force; if the PCB is unqualified, after the force of the manipulator 31 is removed, the warping of the PCB can be restored to a warped state only under the adsorption force of the PCB warping detection vacuum platform 1, that is, its deformation stress is large and it is not convenient for installation.

[0083] In this step, the height of the highest point of the warping is determined as the second height by the detection module 2. The second height is compared with the first preset height. If the second height is less than the first preset height, it indicates that the PCB can change the warping state value within the normal range under the force of the screw during assembly, that is, the PCB is qualified in the detection; otherwise, it indicates that the PCB cannot change the warping state under the force of the screw, or the change of the warping state needs to exceed the force of the screw, and forced installation may cause problems such as screw damage and PCB damage. The PCB is unqualified in the detection, and the transfer module 3 moves the PCB to the elimination bin.

[0084] In this embodiment, the PCB warpage detection vacuum platform 1 applies adsorption force to the PCB, which can preliminarily simulate the stress of PCB installation, so as to detect whether the PCB can be assembled on the product, and further detect whether the PCB is qualified.

[0085] After step S300 and before step S400, the method further includes the following steps: placing a pressure plate on the PCB on the PCB warpage detection vacuum platform 1, the pressure plate being in the shape of a flat plate 142, and applying a force to the PCB on the PCB warpage detection vacuum platform 1 by using the pressure plate to reduce the warpage of the PCB, so that the PCB can tend to fit the detection surface, and then the lower surface of the PCB can fit the docking rubber ring more closely. Different numbers of pressure plates can be selected according to the material and toughness of the PCB.

[0086] In this step, the pressing plate can be moved from the pressing plate storage bin 4 to the PCB on the PCB warpage detection vacuum platform 1 through the transfer module 3 .

[0087] After placing the pressing plate, turn on the adsorption force of the PCB warpage detection vacuum platform 1, and then remove the pressing plate from the PCB, that is, after step S400 and before step S500, remove the pressing plate from the PCB of the PCB warpage detection vacuum platform 1. At this time, the pressing plate can also be moved from the PCB of the PCB warpage detection vacuum platform 1 to the pressing plate storage bin 4 through the transfer module 3.

[0088] The force applied to the PCB by the pressing plate is greater than the preset adsorption force of the PCB warpage detection vacuum platform 1, so that the PCB is as close to the detection surface 119 as possible, thereby improving the detection accuracy.

[0089] After the inspection is completed, the vacuum module is closed to remove the adsorption force, and the inspection lifting platform 13 moves to a lower position, and the limiting edge 1121 blocks below the flange 1221, so that the top surfaces of the multiple docking rubber rings are in a flush state again.

[0090] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A PCB warpage detection vacuum platform, characterized in that: It includes a base, a detection panel, a detection adsorption component, a detection lifting platform and a lifting drive component; The detection panel is fixed to the base and is used to place the PCB; the detection panel is in the shape of a square plate, the upper surface of which is the detection surface and is provided with a plurality of adsorption holes; There are multiple detection adsorption components, which are arranged on the detection lifting platform; each of the detection adsorption components includes a positioning tube and a movable tube, the positioning tube is fixed to the detection lifting platform, and its bottom end is connected to the vacuum module; the movable tube and the positioning tube are both arranged vertically, the bottom of the movable tube is slidably arranged in the positioning tube, and a sealing structure is arranged between the two; the top of the movable tube protrudes from the top of the movable tube, and the adsorption hole is penetrated and extends to the detection surface; a gap is arranged between the movable tube and the adsorption hole; a docking rubber ring is fixed on the top surface of the movable tube; a flange is arranged on the top circumference of the movable tube, and a limited edge is arranged at the bottom of the hole wall of the adsorption hole, and the limited edge is located below the flange; The detection lifting platform is vertically slidably arranged on the base and is located below the detection panel; the lifting drive assembly is connected to the detection lifting platform to drive the detection lifting platform and the plurality of detection adsorption assemblies to move up and down, thereby changing the height of the docking rubber ring protruding from the detection surface; when the detection lifting platform and the detection adsorption assembly are located at a lower position, the limiting edge abuts against the flange, and the top surfaces of the plurality of docking rubber rings are located on the same plane and are flush with or lower than the detection surface.

2. The PCB warpage detection vacuum platform according to claim 1, characterized in that: The detection panel is fixed to the base through a plurality of guide columns, a plurality of linear bearings are arranged on the detection lifting platform, and the linear bearings are vertically penetrated by the guide columns.

3. The PCB warpage detection vacuum platform according to claim 2, characterized in that: The detection panel includes a top plate and a bottom plate, the top plate is located above the bottom plate; the adsorption holes include a first hole and a second hole, the first hole is arranged on the top plate, and the second hole is arranged on the bottom plate, the aperture of the second hole is smaller than the aperture of the first hole, and the limiting edge is formed at the edge of the second hole; the bottom plate is slidably arranged on the guide column and is detachably fixedly connected to the top plate; the aperture of the second hole is equal to or larger than the outer diameter of the top end of the positioning tube.

4. The PCB warpage detection vacuum platform according to claim 3, characterized in that: The upper surface of the bottom plate is in contact with the lower surface of the top plate; a plurality of reinforcing ribs are arranged on the lower surface of the bottom plate, and the plurality of reinforcing ribs are connected in a grid shape.

5. The PCB warpage detection vacuum platform according to claim 2, characterized in that: The detection lifting platform includes a first support beam and a second support beam, wherein the first support beams are multiple and parallel to each other; the multiple first support beams are fixed above the second support beam, and the length directions of the two are perpendicular; the first support beam and the second support beam are both strip-shaped hollow structures, and the inner cavities of the two are connected; The positioning tube is fixed to the first support beam and communicates with the inner cavity of the first support beam; The second support beam is provided with a docking joint, which is connected to the inner cavity of the second support beam and to the vacuum module.

6. The PCB warpage detection vacuum platform according to claim 5, characterized in that: The detection lifting platform also includes two sliding plates, which are strip-shaped and parallel to the second support beams. The sliding plates are arranged on the bottom surfaces of multiple first support beams. The two sliding plates are respectively located at the two ends of the first support beams in the length direction, and each sliding plate is slidably matched with the two guide columns.

7. The PCB warpage detection vacuum platform according to claim 5, characterized in that: The lifting drive assembly includes a lifting plate and two micro-lifting mechanisms; the lifting plate is strip-shaped and parallel to the second support beam; the lifting plate is arranged on the bottom surface of multiple first support beams and is located in the middle position in the length direction of the first support beam; the two micro-lifting mechanisms are respectively connected to the two ends of the lifting plate; the micro-lifting mechanism includes a flat plate, a vertical plate, a push rod and a micro-motor; the bottom end of the vertical plate is fixedly connected to the end of the lifting plate, and the top end of the vertical plate is fixedly connected to one end of the flat plate; the push rod is vertically arranged, and its top is in contact with the bottom surface of the flat plate, the micro-motor is fixed to the base, and is connected to the push rod through a ball screw transmission, so that the push rod can be lifted and moved; the detection lifting platform is located between the vertical plates of the two micro-lifting mechanisms.

8. The PCB warpage detection vacuum platform according to claim 5, characterized in that: There are two second support beams, which is less than the number of the first support beams.

9. A PCB warpage detection device, characterized in that: The PCB warping detection equipment includes a frame, a detection module, a transfer module, a pressure plate storage bin and the PCB warping detection vacuum platform according to any one of claims 1 to 8; the detection module is arranged on the base, and is used to scan and detect the PCB on the PCB warping detection vacuum platform; the transfer module, the pressure plate storage bin and the base are all arranged on the frame, and the pressure plate storage bin is used to store the pressure plate; the base and the pressure plate storage bin are arranged in the horizontal direction; the transfer module is arranged on the frame, and is used to move the pressure plate between the PCB warping detection vacuum platform and the pressure plate storage bin.

10. The PCB warpage detection device according to claim 9, characterized in that: The detection module includes a transverse axis scanning component, a longitudinal axis scanning component and a vertical axis scanning component; the transverse axis scanning component includes a transverse axis sliding member, a transverse axis transmitter and a transverse axis receiver; the transverse axis sliding member is a bar arranged in the longitudinal direction, located above the PCB warpage detection vacuum platform, and its two ends are respectively connected to the base in a transverse sliding manner; the transverse axis transmitter and the transverse axis receiver are respectively arranged at the longitudinal ends of the transverse axis sliding member and are respectively located at the longitudinal sides of the PCB warpage detection vacuum platform; a transverse axis driving mechanism is arranged on the base, and the transverse axis driving mechanism is transmission-connected to the transverse axis sliding member to drive the transverse axis scanning component to move in the transverse direction; The longitudinal axis scanning assembly comprises a longitudinal axis sliding member, a longitudinal axis transmitter and a longitudinal axis receiver; the longitudinal axis sliding member is a bar arranged in the transverse direction, located above the PCB warpage detection vacuum platform and the transverse axis sliding member, and its two ends are respectively connected to the base in a longitudinal sliding manner; the longitudinal axis transmitter and the longitudinal axis receiver are respectively arranged at the transverse ends of the longitudinal axis sliding member, and are respectively located at the transverse sides of the PCB warpage detection vacuum platform; a longitudinal axis driving mechanism is arranged on the base, and the longitudinal axis driving mechanism is transmission-connected to the longitudinal axis sliding member to drive the longitudinal axis scanning assembly to move in the longitudinal direction; A vertical axis driving mechanism is arranged above the longitudinal axis sliding member, and the vertical axis driving mechanism is connected to the vertical axis scanning assembly to drive the vertical axis scanning assembly to slide in the transverse direction.

Images