A system for automatically detecting the temperature of a copper plate

Abstract

The utility model relates to the technical field of wafer testing, and discloses a system for automatically detecting the temperature of a copper disk. By designing a temperature detection device with a similar structure to a probe card, not only can the temperature detection device be directly placed on a placement port of a probe station and fixed by a chuck to restore the sealed environmental conditions for wafer testing, but also because the copper disk can move by itself, the temperature of different positions of the copper disk can be detected without repeatedly manually changing the detection points, and the system has the advantages of convenient data collection, convenient operation, high accuracy and efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing, in particular to a system for automatically detecting the temperature of a copper disk. Background Art

[0002] Under the current technical background, there are two main methods for measuring the temperature of the copper plate of the probe station: multi-probe technology and single-probe technology. Although these two methods have their own characteristics, they both show certain limitations and shortcomings in practical applications.

[0003] First of all, multi-probe digital thermometers show high efficiency when detecting the temperature of multiple locations at the same time. However, due to the process differences and inconsistency of calibration accuracy between multiple sensors, the measurement accuracy between the probes may deviate, which is undoubtedly a problem that needs to be solved for occasions that require high-precision temperature data. In addition, the multi-probe digital thermometer has limited and fixed settings for the detection position points, which limits its application in data collection and analysis at more points and cannot meet a wider range of measurement needs.

[0004] In contrast, a single-probe digital thermometer only detects one position at each measurement, which to a certain extent ensures the focus and accuracy of the measurement. However, this measurement method relies on manual operation, the workload of measurement and calibration is large, and there is a lack of automation support, making the entire measurement process cumbersome and time-consuming. What is more serious is that in a low-temperature environment, due to the formation of ice and the requirement to maintain an ice-free environment, personnel face greater operational challenges when changing positions, which undoubtedly increases the difficulty and uncertainty of the measurement.

[0005] In general, both multi-probe and single-probe digital thermometers have the problems of cumbersome operation and difficult to ensure measurement accuracy. These problems not only affect the efficiency and accuracy of measurement, but also increase the complexity and risk of measurement work. Therefore, it is necessary to seek more advanced and efficient temperature measurement methods to meet the increasingly stringent measurement needs.

[0006] The above information is presented as background information only to assist with understanding the present disclosure and no determination or admission is made as to whether any of the above may be used as prior art with respect to the present disclosure. Utility Model Content

[0007] The utility model provides a system for automatically detecting the temperature of a copper plate to solve the problems existing in the prior art.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A system for automatically detecting the temperature of a copper plate comprises a probe station and a temperature detection device; wherein:

[0010] The probe station is provided with a copper plate for carrying the wafer and driving the wafer to move; a placement opening for placing the temperature detection device is provided on the probe station at a position corresponding to the copper plate, and a chuck for fixing the temperature detection device is provided at the placement opening;

[0011] The temperature detection device is used to detect the temperature of different positions of the copper disk during the movement of the copper disk, and includes a PCB and a temperature sensor. The temperature sensor is arranged on the PCB and is arranged toward the copper disk when the temperature detection device is placed in the placement port.

[0012] Furthermore, in the system for automatically detecting the temperature of the copper pan, a motion mechanism for driving the copper pan to move in a horizontal direction or a vertical direction is disposed at the bottom of the copper pan.

[0013] Furthermore, in the system for automatically detecting the temperature of the copper pan, the temperature sensor is a non-contact temperature sensor.

[0014] Furthermore, in the system for automatically detecting the temperature of the copper pan, the temperature sensor is a single probe.

[0015] Further, in the system for automatically detecting the temperature of the copper pan, the temperature detection device further comprises a reader;

[0016] The reader is connected to the PCB.

[0017] Compared with the prior art, the utility model has the following beneficial effects:

[0018] The utility model provides a system for automatically detecting the temperature of a copper disk. By designing a temperature detection device with a similar structure to a probe card, not only can the temperature detection device be directly placed on the placement port of the probe station and fixed by a chuck to restore the sealed environmental conditions of wafer testing, but the copper disk can also move by itself to detect the temperature of different positions of the copper disk, without the need to repeatedly manually change the detection points, and has the advantages of convenient data collection, convenient operation, high accuracy and efficiency.

[0019] The present invention has other characteristics and advantages, which will be apparent from the accompanying drawings and subsequent specific embodiments incorporated herein, or will be described in detail in the accompanying drawings and subsequent specific embodiments incorporated herein, which together are used to explain the specific principles of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 It is a structural schematic diagram of a system for automatically detecting the temperature of a copper plate provided by an embodiment of the utility model;

[0022] Figure 2 It is a structural schematic diagram of a temperature detection device provided in an embodiment of the utility model.

[0023] Reference numerals:

[0024] Probe station 1, copper plate 2, placement port 3, chuck 4, PCB 5, temperature sensor 6, motion mechanism 7, reader 8. DETAILED DESCRIPTION

[0025] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0026] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0027] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0028] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.

[0029] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0030] Without further limitations, in this application, the words "include", "comprises", "has" or other similar expressions used in the sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0031] Similar to the understanding in the Examination Guidelines, in this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0032] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0033] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0034] Embodiment 1

[0035] In view of the above-mentioned defects in the prior art, the applicant, based on many years of rich practical experience and professional knowledge in design and manufacturing in this field, and in conjunction with the application of theory, actively conducts research and innovation in the hope of creating a technology that can solve the defects in the prior art. After continuous research and design, and after repeated trial production and improvement, the present utility model with real practical value was finally created.

[0036] Please refer to Figure 1-2 , an embodiment of the utility model provides a system for automatically detecting the temperature of a copper disk. Specifically, the system is mainly composed of a probe station 1 and a carefully configured temperature detection device. A copper disk 2 is provided inside the probe station 1, and the copper disk 2 is not only used to carry the wafer, but also has the function of driving the wafer to run. In order to achieve accurate temperature measurement, a placement port 3 is opened at a position corresponding to the copper disk 2 on the probe station 1. This placement port 3 was originally used for placing a probe card during wafer testing, but is now also used for placing a temperature detection device to ensure that the device can be placed accurately and stably. In addition, in order to fix the probe card or the temperature detection device, a chuck 4 is provided at the placement port 3, which has a compact structure and can effectively fix the device to prevent displacement during the test process.

[0037] As the core part of the system, the temperature detection device is designed with full consideration of practicality and efficiency. The device consists of a PCB 5 and a temperature sensor 6, and its structure is similar to that of a probe card, wherein the temperature sensor 6 is precisely mounted on the PCB 5, which is equivalent to the needle tip position of the probe card. When the temperature detection device is placed in the placement port 3, the temperature sensor 6 will face the copper plate 2, ensuring that the temperature of the copper plate 2 at different positions can be detected in real time and accurately.

[0038] It is worth mentioning that, through a unique design, the structure of the temperature detection device in this embodiment is similar to that of the probe card, which enables the temperature detection device to be directly placed in the placement port 3 of the probe station 1 and fixed by the chuck 4. This design not only restores the sealed environment conditions of the wafer test, but also makes full use of the self-motion characteristics of the copper disk 2 to realize the automatic detection of the temperature at different positions of the copper disk 2. Compared with the traditional method of manually changing the detection point, this system does not require repeated operations, which greatly improves the convenience, accuracy and efficiency of data collection.

[0039] In summary, the utility model provides a system for automatically detecting the temperature of a copper pan, which is not only sophisticated in structure and reasonable in design, but also exhibits excellent performance and efficiency in practical applications, providing strong support for technological progress in related fields.

[0040] Please refer again Figure 1In this embodiment, it is particularly worth noting the movement mechanism of the copper plate 2. A movement mechanism 7 is provided at the bottom of the copper plate 2, which is specifically used to drive the copper plate 2 to move in a horizontal direction or a vertical direction.

[0041] This design greatly enhances the flexibility and functionality of the system. Through the precise control of the motion mechanism 7, the copper plate 2 can move smoothly in different directions, so that the temperature sensor 6 can detect the temperature at different positions on the surface of the copper plate 2. This automated motion mode not only greatly improves the measurement efficiency, but also ensures the comprehensiveness and accuracy of the temperature data.

[0042] In addition, due to the existence of the motion mechanism 7, the user does not need to manually adjust the position of the copper disk 2, thereby greatly reducing the difficulty and workload of operation. At the same time, this also avoids the measurement error that may be caused by improper human operation, further improving the reliability and stability of the system.

[0043] In this embodiment, the temperature sensor 6 is a non-contact temperature sensor. This non-contact design gives the temperature sensor 6 a unique working mode and significant advantages.

[0044] The non-contact temperature sensor 6 detects the surface temperature of an object by measuring the infrared radiation emitted by the object without direct contact with the object. This measurement method not only avoids the heat conduction error that may be caused by contact, but also ensures that the sensor will not be affected by the surface conditions of the object being measured (such as roughness, humidity, etc.) during the measurement process. Therefore, the non-contact temperature sensor 6 can provide more accurate and reliable measurement results.

[0045] In this embodiment, since the copper plate 2 may vibrate or displace during movement, the use of the non-contact temperature sensor 6 can ensure that the temperature of the copper plate 2 is measured without affecting the normal movement of the copper plate 2. This measurement method not only improves the accuracy of the measurement, but also ensures the real-time and continuity of the measurement.

[0046] In addition, the non-contact temperature sensor 6 also has the advantages of fast response speed, wide measurement range, long service life, etc. These advantages make it an ideal choice for the temperature detection system in this embodiment, further improving the performance and reliability of the entire system.

[0047] In this embodiment, the temperature sensor 6 is a single probe.

[0048] It should be noted that the single probe design simplifies the structure of the temperature detection device, making it easier to be placed in the placement port 3 of the probe station 1 and fixed by the chuck 4. In addition, since there is only one probe, there is no need to worry about calibration and coordination between multiple probes, thereby improving the convenience of operation.

[0049] Please refer again Figure 1 In this embodiment, in order to enhance the functionality and user-friendliness of the system, the temperature detection device is further improved. Specifically, in addition to the PCB 5 and the temperature sensor 6 mentioned above, the temperature detection device also adds a key component, namely, the reader 8.

[0050] As an important component of the temperature detection device, the reader 8 is closely connected to the PCB 5. This design enables the temperature data detected by the temperature sensor 6 to be transmitted to the reader 8 in real time and accurately for display and processing. Through the reader 8, the user can intuitively see the temperature values ​​at different positions on the copper plate 2, thereby realizing real-time monitoring and data analysis of the copper plate temperature.

[0051] The introduction of the reader 8 not only improves the automation of temperature detection, but also greatly simplifies the operation process. The user does not need to manually record or calculate temperature data, but only needs to observe the display of the reader 8. This not only improves work efficiency, but also reduces the possibility of human error.

[0052] In addition, the reader 8 usually also has data storage and transmission functions. The user can save the temperature data in the reader 8 for subsequent analysis and processing. At the same time, the reader 8 can also be connected to a computer or other device to achieve remote transmission and sharing of data. This makes the temperature detection system more flexible and convenient, and can meet the needs of different users.

[0053] Although the terms such as probe station, copper plate, placement port, chuck, etc. are used more frequently in this application, the possibility of using other terms is not excluded. These terms are used only to more conveniently describe and explain the essence of the utility model; interpreting them as any additional restrictions is contrary to the spirit of the utility model.

[0054] The utility model provides a system for automatically detecting the temperature of a copper disk. By designing a temperature detection device with a similar structure to a probe card, not only can the temperature detection device be directly placed on the placement port of the probe station and fixed by a chuck to restore the sealed environmental conditions of wafer testing, but the copper disk can also move by itself to detect the temperature of different positions of the copper disk, without the need to repeatedly manually change the detection points, and has the advantages of convenient data collection, convenient operation, high accuracy and efficiency.

[0055] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A system for automatically detecting the temperature of a copper plate, characterized in that: It comprises a probe station (1) and a temperature detection device; wherein: The probe station (1) is provided with a copper plate (2) for carrying a wafer and driving the wafer to move; a placement opening (3) for placing the temperature detection device is provided at a position corresponding to the copper plate (2) on the probe station (1); a chuck (4) for fixing the temperature detection device is provided at the placement opening (3); The temperature detection device is used to detect the temperature of different positions of the copper disk (2) during the movement of the copper disk (2), and comprises a PCB (5) and a temperature sensor (6); the temperature sensor (6) is arranged on the PCB (5) and is arranged toward the copper disk (2) when the temperature detection device is placed in the placement opening (3).

2. The system for automatically detecting the temperature of a copper pan according to claim 1, characterized in that: A moving mechanism (7) for driving the copper plate (2) to move in a horizontal direction or a vertical direction is provided at the bottom of the copper plate (2).

3. The system for automatically detecting the temperature of a copper pan according to claim 1, characterized in that: The temperature sensor (6) is a non-contact temperature sensor.

4. The system for automatically detecting the temperature of a copper pan according to claim 1, characterized in that: The temperature sensor (6) is a single probe.

5. The system for automatically detecting the temperature of a copper pan according to claim 1, characterized in that: The temperature detection device also includes a reader (8); The reader (8) is connected to the PCB (5).

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