Device for measuring magnetic field intensity and temperature of electrified coil

Abstract

The utility model discloses a device for measuring the magnetic field intensity and temperature of an electrified coil. And the temperature sensor is tightly attached to the metal elastic sheet, and is tightly attached to the inner wall of the electromagnetic coil under the stress of the metal elastic sheet when the temperature sensor is sleeved in the hollow part in the electromagnetic coil. The magnetic field sensor is placed in the magnetic conductive sleeve to form a magnetic conductive structure, the whole magnetic conductive structure is placed in the hollow position in the electromagnetic coil, and pins of the temperature sensor and the magnetic field sensor are connected to a peripheral interface module of the signal acquisition board. According to the utility model, the temperature sensor and the magnetic field sensor are used for collecting the magnetic force and the temperature rise condition inside the electrified coil in real time when the electrified coil works, the sensors output analog voltage signals, the analog voltage signals are processed by the MCU and sent to monitoring equipment through the CAN bus, and the service life of the product coil can be prolonged.

Description

Technical Field

[0001] The utility model relates to the field of electromagnetic coil control, in particular to a device for measuring the magnetic field strength and temperature of an energized coil. Background Art

[0002] The ABS system is an anti-lock braking system. When the car brakes, it automatically controls the braking force of the brakes to prevent the wheels from locking, ensure that the adhesion between the wheels and the ground is at the maximum value, and achieve the best braking effect. Oil inlet solenoid valve: a normally open solenoid valve, that is, when the power is off, the solenoid valve is open. During normal braking, the oil inlet solenoid valve is in a power-off open state, and the pressure oil from the master pump enters the slave pump. The oil inlet solenoid valve closes the oil channel when it is powered on. Oil return solenoid valve: a normally closed solenoid valve, that is, when the power is off, the solenoid valve is closed. During normal braking, the oil return solenoid valve is in a power-off closed state to ensure the oil pressure of the slave pump. The oil return solenoid valve opens when the power is on. The opening and closing of the above solenoid valves are controlled by the magnetic force generated by the operation of the energized coil to control the state of the solenoid valve.

[0003] Therefore, the coil magnetic force is one of the important parameters for adjusting the anti-lock braking system ABS.

[0004] In order to make the vehicle's ABS adjustment meet the corresponding regulatory requirements, vehicle calibration usually directly changes the coil current to adjust the performance. This method of parameter setting mainly has the following two problems:

[0005] 1. The actual magnetic force and temperature rise generated by the energized coil are unclear, which makes the vehicle parameter matching somewhat blind.

[0006] 2. There is a lack of specific environment such as low temperature and high temperature tests in the early stage of matching. The lack of environmental factors may cause the coil performance to decline, resulting in the problem that the matching performance is good at room temperature, but the performance matching is poor at low temperature and high temperature.

[0007] 3. Due to unreasonable matching parameter settings, the service life of the coil is reduced and does not meet the requirements of the life cycle. Utility Model Content

[0008] In order to solve the problems existing in the background technology, the utility model provides a device for measuring the magnetic field strength and temperature of an energized coil.

[0009] The technical solution of the utility model is achieved in this way:

[0010] The device includes a magnetic sleeve, an electromagnetic coil, a metal spring, a temperature sensor, a magnetic field sensor, and a signal acquisition board. The temperature sensor is tightly attached to the metal spring, and when inserted into the hollow part of the electromagnetic coil, the temperature sensor is tightly attached to the inner wall of the electromagnetic coil by the stress of the metal spring. The magnetic field sensor is placed in the magnetic sleeve to form a magnetic structure, and the entire magnetic structure is placed in the hollow part of the electromagnetic coil. The temperature sensor and the magnetic field sensor pins are connected to the peripheral interface module of the signal acquisition board.

[0011] The signal acquisition board comprises three parts, namely a microcontroller chip unit, a power management module and a peripheral interface module; the microcontroller chip unit is electrically connected to the power management module and the peripheral interface module respectively, and the power management module and the peripheral interface module are connected to each other.

[0012] The microcontrol chip unit includes a crystal oscillator module Y2 and a microcontroller chip MCU2. The pins and pins of the crystal oscillator module Y2 are grounded via capacitors C12 and C13 respectively. The pins and pins of the crystal oscillator module Y2 are grounded. The pins and pins of the crystal oscillator module Y2 are connected to the EXTAL pin and XTAL pin of the microcontroller chip MCU2 respectively. The VDD1 pin, VDDX pin, VRH pin, VDDA pin, VSSPLL pin, and VDDR pin of the microcontroller chip MCU2 are connected to the power supply VCC. The VSS1 pin, VSSX pin, VREGEN pin, VSSA pin, VRL pin, VSSPLL pin, XFC pin, and VSSR pin of the microcontroller chip MCU2 are connected to the ground.

[0013] The power management module includes a power management chip U12, the VSUP1 pin and the VSUP2 pin of the power management chip U12 are both connected to the IGN pin of the socket U7 in the peripheral interface module, and the CAN pin is grounded via a capacitor C16; the CANH pin is connected to the CANH pin of the socket U7 in the peripheral interface module, the CANL pin is connected to the CANL pin of the socket U7 in the peripheral interface module, the GND-CAN pin, the DBG pin, and the GND pin are all connected to the ground, the VDD pin outputs the power supply voltage VCC, and the RST pin is connected to the power supply voltage VCC via a resistor R2; the CS pin, the SCLK pin, the MOSI pin, the MISO pin, the TXD pin, and the RXD pin are respectively connected to the CS pin, the SCLK pin, the MOSI pin, the MISO pin, the TXD pin, and the RXD pin of the microcontroller chip MCU2 in the microcontroller chip unit.

[0014] It comprises two metal springs, which are respectively located on both sides of the electromagnetic coil; the temperature sensor comprises two temperature sensors, which are respectively arranged on the two metal springs.

[0015] The peripheral interface module includes a magnetic field sensor U9, a temperature sensor U10, a temperature sensor U11 and a socket U7. The VO1 pin of the magnetic field sensor U9 is connected to the power supply voltage VCC, the VS1 pin is simultaneously connected to the PAD05 pin of the microcontrol chip MCU2 in the microcontrol chip unit and the pin VS1 of the socket U7, and the pin GND of the magnetic field sensor U9 is grounded; the VO pin of the temperature sensor U10 is connected to its own GND pin via a capacitor C14, the capacitor C14 is connected in parallel with a constant current source I1, and the VO pin of the temperature sensor U10 is connected to the pin PAD07 of the microcontrol chip MCU2 in the microcontrol chip unit; the VO pin of the temperature sensor U11 is connected to the pin PAD07 of the microcontrol chip MCU2 in the microcontrol chip unit via a capacitor C15 and Its own GND pin is connected, capacitor C15 is connected in parallel with a constant current source I2, the VO pin of the temperature sensor U11 is connected to the pin PAD06 of the microcontrol chip MCU2 in the microcontrol chip unit; the IGN pin of the connector U7 is connected to the VSUP1 pin and the VSUP2 pin of the power management chip U12 in the power management module, the GND pin of the connector U7 is grounded, the pin VO1 is connected to the VO1 pin of the magnetic field sensor U9, the VS1 pin is connected to the VS1 pin of the magnetic field sensor U9, the GND1 pin, the GND2 pin and the pin GND3 are grounded, the PTC1 pin is connected to the VO pin of the temperature sensor U10, and the PTC2 pin is connected to the VO pin of the temperature sensor U11.

[0016] Beneficial effects of the utility model:

[0017] The utility model uses a temperature sensor and a magnetic field sensor to collect the magnetic force and temperature rise inside the energized coil in real time. The sensor outputs an analog voltage signal which is processed by a microcontroller MCU and sent to a monitoring device via a CAN bus.

[0018] Furthermore, the utility model can be used to analyze the relationship between temperature and field strength, thereby matching the parameters provided by the test for setting the coil working control, thereby extending the service life of the coil. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a measured explosion diagram of the device of the utility model;

[0020] Figure 2 It is a measurement and installation diagram of the device of the utility model;

[0021] Figure 3 The utility model is a circuit diagram of the device.

[0022] In the figure: a magnetic sleeve (1), an electromagnetic coil (2), a metal spring (3), a temperature sensor (4), a magnetic field sensor (5), a signal acquisition board (6), a microcontroller chip unit (7), a power management module (8), and a peripheral interface module (9). DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0024] The device comprises a magnetic sleeve 1, an electromagnetic coil 2, a metal spring 3, a temperature sensor 4, a magnetic field sensor 5 and a signal acquisition board 6. Figure 1 and Figure 2 As shown, the temperature sensor 4 in the measuring device is closely attached to the metal spring 3, and is inserted into the surrounding edge of the hollow part of the electromagnetic coil 2. The temperature sensor 4 is closely attached to the annular inner wall of the electromagnetic coil 2 by the stress of the metal spring 3. The magnetic field sensor 5 is placed in the magnetic conductive sleeve 1 to form a magnetic conductive structure, and the entire magnetic conductive structure is placed in the middle of the hollow part of the electromagnetic coil 2. The pins of the temperature sensor 4 and the magnetic field sensor 5 are connected to the peripheral interface module of the signal acquisition board 6.

[0025] The signal acquisition board 6 includes three parts, namely a microcontroller chip unit 7, a power management module 8 and a peripheral interface module 9; the microcontroller chip unit 7 is electrically connected to the power management module 8 and the peripheral interface module 9 respectively, and the power management module 8 and the peripheral interface module 9 are interconnected.

[0026] like Figure 3 As shown, the microcontroller chip unit 7 includes a crystal oscillator module Y2 and a microcontroller chip MCU2, the No. 1 pin and the No. 3 pin of the crystal oscillator module Y2 are grounded via capacitors C12 and C13 respectively, the No. 2 pin and the No. 4 pin of the crystal oscillator module Y2 are both grounded, and the No. 1 pin and the No. 3 pin of the crystal oscillator module Y2 are connected to the No. 34 EXTAL pin and the No. 35 XTAL pin of the microcontroller chip MCU2 respectively;

[0027] The VDD1 pin No. 9, VDDX pin No. 77, VRH pin No. 60, VDDA pin No. 59, VSSPLL pin No. 31, and VDDR pin No. 29 of the microcontrol chip MCU2 are all connected to the power supply VCC, and the VSS1 pin No. 10, VSSX pin No. 76, VREGEN pin No. 67, VSSA pin No. 62, VRL pin No. 61, VSSPLL pin No. 33, XFC pin No. 32, and VSSR pin No. 28 of the microcontrol chip MCU2 are all connected to ground.

[0028] like Figure 3As shown, the power management module 8 includes a power management chip U12, and the No. 1 VSUP1 pin and the No. 2 VSUP2 pin of the power management chip U12 are connected to the No. 1 IGN pin of the socket U7 in the peripheral interface module 9, and the No. 6 5V-CAN pin is grounded via a capacitor C16; the No. 7 CANH pin is connected to the No. 11 CANH pin of the socket U7 in the peripheral interface module 9, the No. 8 CANL pin is connected to the No. 10 CANL pin of the socket U7 in the peripheral interface module 9, the No. 9 GND-CAN pin, the No. 16 DBG pin, and the No. 3 No. 8 GND pins are all connected to the ground, No. 28 VDD pin outputs the power supply voltage VCC, and No. 22 RST pin is connected to the power supply voltage VCC via resistor R2; No. 24 CS pin, No. 25 SCLK pin, No. 26 MOSI pin, No. 27 MISO pin, No. 29 TXD pin, and No. 30 RXD pin are respectively connected to No. 69 CS pin, No. 70 SCLK pin, No. 71 MOSI pin, No. 73 MISO pin, No. 74 TXD pin, and No. 75 RXD pin of the microcontroller chip MCU2 in the microcontroller chip unit 7.

[0029] Specifically, RXD pin No. 30 is connected to RXD pin No. 75 of the micro-control chip MCU2 in the micro-control chip unit 7, TXD pin No. 29 is connected to TXD pin No. 74 of the micro-control chip MCU2 in the micro-control chip unit 7, MISO pin No. 27 is connected to MISO pin No. 73 of the micro-control chip MCU2 in the micro-control chip unit 7, MOSI pin No. 26 is connected to MOSI pin No. 71 of the micro-control chip MCU2 in the micro-control chip unit 7, SCLK pin No. 25 is connected to SCLK pin No. 70 of the micro-control chip MCU2 in the micro-control chip unit 7, and CS pin No. 24 is connected to CS pin No. 69 of the micro-control chip MCU2 in the micro-control chip unit 7.

[0030] It includes two metal springs 3 , and the two metal springs 4 are respectively located on both sides of the electromagnetic coil 3 . The temperature sensor 4 includes two temperature sensors, and the two temperature sensors are respectively arranged on the two metal springs 4 .

[0031] like Figure 3 As shown, the peripheral interface module 9 includes a magnetic field sensor U9, a temperature sensor U10, a temperature sensor U11 and a socket U7. Pin No. 1 VO1 of the magnetic field sensor U9 is connected to the power supply voltage VCC, pin No. 2 VS1 is simultaneously connected to pin No. 56 PAD05 of the microcontroller chip MCU2 in the microcontroller chip unit 7 and pin No. 4 VS1 of the socket U7, and pin No. 3 GND of the magnetic field sensor U9 is grounded; the magnetic field sensor U9 is the magnetic field sensor 5, and the temperature sensor U10 and the temperature sensor U11 are two temperature sensors 4.

[0032] The VO pin No. 1 of the temperature sensor U10 is connected to its own GND pin via capacitor C14, and a constant current source I1 is connected in parallel to the capacitor C14. The VO pin No. 1 of the temperature sensor U10 is connected to the 58th pin PAD07 of the microcontroller chip MCU2 in the microcontroller chip unit 7. The VO pin No. 1 of the temperature sensor U11 is connected to its own GND pin via capacitor C15, and a constant current source I2 is connected in parallel to the capacitor C15. The VO pin No. 1 of the temperature sensor U11 is connected to the 57th pin PAD06 of the microcontroller chip MCU2 in the microcontroller chip unit 7. The connector U7 IGN pin No. 1 is connected to VSUP1 pin No. 1 and VSUP2 pin No. 2 of the power management chip U12 in the power management module 8, GND pin No. 2 of the connector U7 is grounded, pin No. 3 VO1 is connected to VO1 pin No. 1 of the magnetic field sensor U9, VS1 pin No. 4 is connected to VS1 pin No. 2 of the magnetic field sensor U9, GND1 pin No. 5, GND2 pin No. 7 and GND3 pin No. 9 are grounded, PTC1 pin No. 6 is connected to VO pin No. 1 of the temperature sensor U10, and PTC2 pin No. 8 is connected to VO pin No. 1 of the temperature sensor U11.

[0033] In the specific implementation, the model of MCU2 is S9S12P128JOMQK, the model of power management chip U12 is MCZ33904A5EK, the model of magnetic field sensor U9 is A1319, the models of IC3 and IC4 are TLE4250-2G, and the models of temperature sensors U10 and U11 are PT100.

[0034] In the utility model, the temperature sensor 4 is closely attached to the metal spring sheet 3, and when inserted into the hollow of the electromagnetic coil 2, the stress of the spring sheet 3 makes the temperature sensor 4 closely attached to the inner wall of the electromagnetic coil 2. Two temperature sensors are arranged at two metal spring sheets respectively, so that the temperature at the two places can be verified to ensure the accuracy of the measurement.

[0035] The magnetic field sensor 5 is placed in the magnetic conductive sleeve 1 to form the entire magnetic conductive structure, and the entire magnetic conductive structure is placed in the hollow of the electromagnetic coil 2, so that the magnetic force is concentrated on the magnetic conductive metal, thereby ensuring the consistency of each magnetic field sensor measurement.

[0036] The sensor pins are connected to the peripheral interface module 9 of the signal acquisition board 6. The vehicle ignition wire and the ground wire are respectively connected to the peripheral interface module 9 to power the device. The monitoring device interacts with the device through the CAN line on the peripheral interface module 9.

[0037] The function of power management chip U12:

[0038] 1. Step down the IGN voltage +12V to VCC (+5V). VCC powers MCU2. At the same time, VCC powers the No. 1 V01 pin of the magnetic field sensor chip U9.

[0039] 2. The power management chip U12 has an integrated CAN interface. 5V-CAN is the power supply port of the internal CAN module, which interacts with MCU2 through the receiving data line RXD and the sending data line TXD.

[0040] 3. The parameter configuration and fault diagnosis information of the power management chip U12 interact with MCU2 through SPI communication, which includes four data lines, namely MISO, MOSI, SCLK, and CS.

[0041] The value of constant current source I1 and I2 is 1mA, and its function is:

[0042] 1. PT100 is a resistor whose resistance changes linearly with temperature. When the current is constant, the voltage change at both ends of the sensor can represent the resistance change, and then the current temperature can be calculated.

[0043] The use and measurement process of the utility model device is:

[0044] Step 1: If Figure 2 As shown, the temperature sensor 4 is closely attached to the metal spring 3, and when inserted into the hollow of the electromagnetic coil 2, the temperature sensor 4 will be closely attached to the inner wall of the electromagnetic coil 2 due to the stress of the spring. The magnetic field sensor 5 is placed in the magnetic sleeve 1 of the magnetic metal, and the entire magnetic structure is placed in the hollow of the electromagnetic coil 2.

[0045] Step 2: The vehicle ignition wire and the ground wire are connected to the peripheral interface module 9 of the signal acquisition board 6 to power the device. The monitoring device interacts with the device through the CAN line on the peripheral interface module 9 of the signal acquisition board 6. The pin signals and power supply pins of the temperature sensor 4 and the magnetic field sensor 5 are connected to the peripheral interface module 9 of the signal acquisition board 6. The pins of the electromagnetic coil 2 are connected to the coil driver board of the actual product.

[0046] Step 3: The measuring device is placed in a high and low temperature box, the signal acquisition board 6 is connected to the power supply, and the product driver board controls the electromagnetic coil 2, changes the current size, and observes the magnetic field size and coil temperature rise in the coil at high temperature, normal temperature, and low temperature in real time through the monitoring equipment, and records the parameters.

[0047] The above specific implementation modes are used to explain the present invention rather than to limit the present invention. Any modification and change made to the present invention within the spirit of the present invention and the protection scope of the claims shall fall within the protection scope of the present invention.

Claims

1. A device for measuring the magnetic field strength and temperature of an energized coil, characterized in that: The device comprises a plurality of parts, namely, a magnetic sleeve (1), an electromagnetic coil (2), a metal spring (3), a temperature sensor (4), a magnetic field sensor (5) and a signal acquisition board (6): the temperature sensor (4) is tightly attached to the metal spring (3) and inserted into the hollow part of the electromagnetic coil (2); the temperature sensor (4) is tightly attached to the inner wall of the electromagnetic coil (2) by the stress of the metal spring (3); the magnetic field sensor (5) is placed in the magnetic sleeve (1) to form a magnetic structure; the entire magnetic structure is placed in the hollow part of the electromagnetic coil (2); the pins of the temperature sensor (4) and the magnetic field sensor (5) are connected to the peripheral interface module of the signal acquisition board (6).

2. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 1, characterized in that: The signal acquisition board (6) comprises three parts, namely a microcontroller chip unit (7), a power management module (8) and a peripheral interface module (9); the microcontroller chip unit (7) is electrically connected to the power management module (8) and the peripheral interface module (9), respectively, and the power management module (8) and the peripheral interface module (9) are interconnected.

3. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 2, characterized in that: The microcontroller chip unit (7) comprises a crystal oscillator module Y2 and a microcontroller chip MCU2. The pins and pins of the crystal oscillator module Y2 are grounded via capacitors C12 and C13 respectively. The pins and pins of the crystal oscillator module Y2 are grounded. The pins and pins of the crystal oscillator module Y2 are connected to the EXTAL pin and XTAL pin of the microcontroller chip MCU2 respectively. The VDD1 pin, VDDX pin, VRH pin, VDDA pin, VSSPLL pin and VDDR pin of the microcontroller chip MCU2 are connected to the power supply VCC. The VSS1 pin, VSSX pin, VREGEN pin, VSSA pin, VRL pin, VSSPLL pin, XFC pin and VSSR pin of the microcontroller chip MCU2 are connected to the ground.

4. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 2, characterized in that: The power management module (8) includes a power management chip U12, wherein the VSUP1 pin and the VSUP2 pin of the power management chip U12 are both connected to the IGN pin of the connector U7 in the peripheral interface module (9), and the CAN pin is grounded via a capacitor C16; the CANH pin is connected to the CANH pin of the connector U7 in the peripheral interface module (9), the CANL pin is connected to the CANL pin of the connector U7 in the peripheral interface module (9), the GND-CAN pin, the DBG pin, and the GND pin are all connected to ground, the VDD pin outputs a power supply voltage VCC, and the RST pin is connected to the power supply voltage VCC via a resistor R2; the CS pin, the SCLK pin, the MOSI pin, the MISO pin, the TXD pin, and the RXD pin are respectively connected to the CS pin, the SCLK pin, the MOSI pin, the MISO pin, the TXD pin, and the RXD pin of the microcontroller chip MCU2 in the microcontroller chip unit (7).

5. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 1, characterized in that: It comprises two metal springs (3), the two metal springs (3) are respectively located on both sides of the electromagnetic coil (2), and the temperature sensor (4) comprises two temperature sensors, the two temperature sensors are respectively arranged on the two metal springs (3).

6. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 4, characterized in that: The peripheral interface module (9) comprises a magnetic field sensor U9, a temperature sensor U10, a temperature sensor U11 and a socket U7, the VO1 pin of the magnetic field sensor U9 is connected to a power supply voltage VCC, the VS1 pin is simultaneously connected to the PAD05 pin of the microcontroller chip MCU2 in the microcontroller chip unit (7) and the pin VS1 of the socket U7, and the GND pin of the magnetic field sensor U9 is grounded; The VO pin of the temperature sensor U10 is connected to its own GND pin via a capacitor C14, a constant current source I1 is connected in parallel to the capacitor C14, and the VO pin of the temperature sensor U10 is connected to the pin PAD07 of the microcontroller chip MCU2 in the microcontroller chip unit (7); the VO pin of the temperature sensor U11 is connected to its own GND pin via a capacitor C15, a constant current source I2 is connected in parallel to the capacitor C15, and the VO pin of the temperature sensor U11 is connected to the pin PAD06 of the microcontroller chip MCU2 in the microcontroller chip unit (7).

7. The device for measuring the magnetic field strength and temperature of a powered coil according to claim 6, characterized in that: The IGN pin of the connector U7 is connected to the VSUP1 pin and the VSUP2 pin of the power management chip U12 in the power management module (8), the GND pin of the connector U7 is grounded, the VO1 pin is connected to the VO1 pin of the magnetic field sensor U9, the VS1 pin is connected to the VS1 pin of the magnetic field sensor U9, the GND1 pin, the GND2 pin and the GND3 pin are grounded, the PTC1 pin is connected to the VO pin of the temperature sensor U10, and the PTC2 pin is connected to the VO pin of the temperature sensor U11.

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