A semiconductor manufacturing execution system and a digital factory
By designing a semiconductor manufacturing execution system including MES execution system, AMHS material management and control system, warehousing and logistics management system, compound production equipment and AGV robots, the problem of how to upgrade and transform office buildings and build semiconductor production and management bridges is solved, and the effect of improving the operation and management efficiency of semiconductor factories is achieved.
Patent Information
- Application Number
- CN202420461313.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-11
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-03-11
AI Technical Summary
How to design a semiconductor manufacturing execution system can achieve the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, improve semiconductor factory operations and improve management efficiency.
A semiconductor manufacturing execution system is proposed, including a MES execution system, an AMHS material management system, a warehousing and logistics management system, a compound production equipment and an AGV robot. Through the connection and collaborative work of these systems, the information connection between the first and second spaces of the office building is realized, and the robot is used to schedule within the two spaces to build a bridge between production and management.
It realizes information-based connectivity within the office building, improves the operational efficiency and management efficiency of semiconductor factories, and ensures timely response to changes in production conditions.
Smart Images
Figure CN222748881U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor manufacturing digitization, in particular to a semiconductor manufacturing execution system and a digital factory. Background Art
[0002] With the expansion of urban radius, my country's first- and second-tier cities have gradually established emerging industries in new urban areas to provide high-end employment opportunities. Among them, the model of semiconductor industry settling in new urban areas has gradually evolved from traditional factories dominated by industrial plants to new semiconductor factories dominated by office buildings in high-tech parks.
[0003] This new semiconductor industry development model requires a matching semiconductor manufacturing execution system to achieve the upgrade and renovation of office buildings, build a bridge between semiconductor production and management, accurately transmit real-time data from the production end to the management end, ensure timely response to changes in production conditions, improve semiconductor factory operations and enhance management efficiency. Utility Model Content
[0004] The technical problem to be solved by the utility model is: how to design a semiconductor manufacturing execution system that can achieve the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, improve the operation of semiconductor factories and enhance management efficiency.
[0005] Therefore, in order to solve the above problems, the embodiments of the utility model propose a semiconductor manufacturing execution system and a digital factory. The semiconductor manufacturing execution system proposed by the inventor of the present application can realize the information connection between the first space and the second space inside the office building, and the robot is dispatched within the scope of the first space and the second space, thereby building a bridge between semiconductor production and management, improving the operation of semiconductor factories and enhancing management efficiency.
[0006] In the first aspect, an embodiment of the utility model proposes a semiconductor manufacturing execution system, including: an MES execution system, an AMHS material control system, a warehouse logistics management system, compound production equipment, and an AGV robot, wherein the number of the compound production equipment is multiple, and the number of the AGV robots is also multiple; the MES execution system is connected to the AMHS material control system, the AMHS material control system is connected to the warehouse logistics management system, the warehouse logistics management system is connected to the compound production equipment, the compound production equipment is connected to the MES execution system, and the AMHS material control system is wirelessly connected to the multiple AGV robots; the MES execution system, the AMHS material control system, the warehouse logistics management system, and the multiple compound production equipment are all located in the same space, and the MES execution system includes a total control module, a factory integration module, and a product integration module, and the total control module is respectively connected to the factory integration module and the product integration module.
[0007] Its further technical solution is that the semiconductor manufacturing execution system cooperates with the smart landmarks on the ground, multiple smart landmarks are arranged between the multiple compound production equipment and the AMHS material control system, at least one smart landmark is arranged on one side of the multiple compound production equipment, and the multiple AGV robots correspond to the multiple smart landmarks.
[0008] Its further technical solution is that the first kanban of the semiconductor manufacturing execution system is arranged in the first space, and the second kanban of the semiconductor manufacturing execution system is arranged in the second space, and the first space and the second space are connected by a vertical elevator; the MES execution system, the first kanban and the second kanban of the semiconductor manufacturing execution system are all connected to the computer equipment, and the semiconductor manufacturing execution system also includes: an AMR instruction system and a robot task kanban, the AMR instruction system is connected to the MES execution system, the AMR instruction system is connected to the computer equipment, the AMR instruction system is connected to the robot task kanban, the robot task kanban and the computer equipment are arranged in the first space, the MES execution system, the AMHS material control system, the warehouse logistics management system, and a plurality of the compound production equipment are arranged in the second space; the robot task kanban is used to display the robot scheduling status of the first space and the second space, and the first kanban and the second kanban are both used to display the enterprise information system and the reporting system.
[0009] A further technical solution is that the semiconductor manufacturing execution system also includes multiple data acquisition devices, and the multiple data acquisition devices are connected to the multiple compound production equipment and correspond one to one; the compound production equipment includes any one or more of crystal growth equipment, epitaxial growth reaction equipment, cutting equipment, grinding equipment, polishing equipment, and measuring equipment.
[0010] A further technical solution is that the semiconductor manufacturing execution system also includes multiple AMR robots, and the multiple AMR robots are wirelessly connected to the AMR command system. The activity range of the multiple AMR robots includes the first space, the elevator, and the second space. The multiple AMR robots can remotely control the operating buttons of the elevator.
[0011] In a second aspect, an embodiment of the utility model further proposes a digital factory, which includes a first space and a second space, wherein the first space and the second space are connected by a vertical elevator, and the digital factory includes the semiconductor manufacturing execution system as described in the first aspect.
[0012] With the expansion of urban radius, my country's first- and second-tier cities have gradually established emerging industries in new urban areas to provide high-end employment opportunities. Among them, the model of semiconductor industry settling in new urban areas has gradually evolved from traditional factories dominated by industrial plants to new semiconductor factories dominated by office buildings in high-tech parks.
[0013] In view of this new development model of the semiconductor industry, a matching semiconductor manufacturing execution system is needed to achieve the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, accurately transmit real-time data from the production end to the management end, ensure timely response to changes in production conditions, improve semiconductor factory operations and enhance management efficiency. In response to the above problems, the semiconductor manufacturing execution system proposed by the inventor of this application can realize the information connection between the first space and the second space inside the office building, and the robot is dispatched within the scope of the first space and the second space, thereby building a bridge between semiconductor production and management, improving semiconductor factory operations and enhancing management efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0015] Figure 1 A control block diagram of a semiconductor manufacturing execution system proposed in an embodiment of the utility model.
[0016] Figure 2 This is another control block diagram of the semiconductor manufacturing execution system proposed in an embodiment of the present utility model.
[0017] Figure 3 This is another control block diagram of the semiconductor manufacturing execution system proposed in an embodiment of the present utility model.
[0018] Figure 4 A partial diagram of a semiconductor manufacturing execution system proposed in an embodiment of the present utility model.
[0019] Figure 5 Another partial diagram of the semiconductor manufacturing execution system provided in an embodiment of the present utility model.
[0020] Figure 6 This is another partial diagram of the semiconductor manufacturing execution system provided in an embodiment of the present utility model.
[0021] Figure 7 This is a spatial schematic diagram of a digital factory proposed in an embodiment of the utility model.
[0022] Reference numerals
[0023] MES execution system 10, AMHS material control system 20, warehouse logistics management system 30, compound production equipment 40, data acquisition device 40a, AGV robot 50, AMR instruction system 60, robot task board 70, AMR robot 80, computer equipment 100, first space 1, first board 1a, second space 2, second board 2a, helicopter 3. DETAILED DESCRIPTION
[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments. Similar component numbers in the drawings represent similar components. Obviously, the embodiments to be described below are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0025] It should be understood that the terms used in this utility model embodiment specification are only for the purpose of describing specific embodiments and are not intended to limit the utility model embodiments. As used in the utility model embodiment specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.
[0026] Example
[0027] See also Figure 1-Figure 7 , is a semiconductor manufacturing execution system proposed in an embodiment of the utility model. The dotted line in the figure represents control achieved by wireless communication. The semiconductor manufacturing execution system includes: an MES execution system 10, an AMHS material control system 20, a warehouse logistics management system 30, a compound production equipment 40, and an AGV robot 50. The number of the compound production equipment 40 is multiple, and the number of the AGV robots 50 is also multiple; the MES execution system 10 is connected to the AMHS material control system 20, and the AMHS material control system 20 is connected to the warehouse logistics management system 30. The management system 30 is connected to the compound production equipment 40, the compound production equipment 40 is connected to the MES execution system 10, and the AMHS material control system 20 is wirelessly connected to the multiple AGV robots 50; the MES execution system 10, the AMHS material control system 20, the warehouse logistics management system 30, and the multiple compound production equipment 40 are all arranged in the same space, and the MES execution system 10 includes a total control module 11, a factory integration module 12, and a product integration module 13, and the total control module 11 is connected to the factory integration module 12 and the product integration module 13 respectively. The technical effect of the above scheme is that the semiconductor manufacturing execution system can realize the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, improve the operation of semiconductor factories and enhance management efficiency.
[0028] Furthermore, the semiconductor manufacturing execution system cooperates with the intelligent landmarks on the ground. Multiple intelligent landmarks are arranged between the multiple compound production equipment 40 and the AMHS material control system 20. At least one intelligent landmark is arranged on one side of the multiple compound production equipment 40. Multiple AGV robots 50 correspond to multiple intelligent landmarks. In the semiconductor manufacturing industry, it is necessary to upgrade the factory to be lean, intelligent and digital, and gradually build a smart factory with few or no people. The AGV robot described in this embodiment can realize functions such as autonomous operation, automatic navigation, automatic obstacle avoidance and automatic charging. Its navigation methods currently include vision, laser radar, magnetic guide strips, etc., which can complete the fully automated distribution of materials and effectively solve the problems of insufficient human resources and high costs of enterprises. Furthermore, engineers can program the scheduling rules of the AGV robot in the simulation model to determine the type of materials required for each workstation. When the material reaches the safety inventory, the system calls the idle and available AGV robot to perform the task, otherwise the AGV robot is in a waiting state.
[0029] Furthermore, the first kanban 1a of the semiconductor manufacturing execution system is arranged in the first space 1, and the second kanban 2a of the semiconductor manufacturing execution system is arranged in the second space 2, and the first space 1 and the second space 2 are connected by a vertical elevator 3; the MES execution system 10, the first kanban 1a, and the second kanban 2a of the semiconductor manufacturing execution system are all connected to the computer device 100, and the semiconductor manufacturing execution system further includes: an AMR instruction system 60 and a robot task kanban 70, the AMR instruction system 60 is connected to the MES execution system 10, and the AMR instruction system 60 is connected to the MES execution system 10. 0 is connected to the computer device 100, the AMR instruction system 60 is connected to the robot task board 70, the robot task board 70 and the computer device 100 are arranged in the first space 1, the MES execution system 10, the AMHS material control system 20, the warehouse logistics management system 30, and the plurality of compound production equipment 40 are all arranged in the second space 2; the robot task board 70 is used to display the robot scheduling status of the first space 1 and the second space 2, and the first board 1a and the second board 2a are both used to display the enterprise information system and the reporting system.
[0030] Furthermore, the semiconductor manufacturing execution system of the semiconductor manufacturing execution system further includes a plurality of AMR robots 80, and the plurality of AMR robots 80 are wirelessly connected to the AMR instruction system 60, and the activity range of the plurality of AMR robots 80 includes the first space 1, the elevator 3, and the second space 2, and the plurality of AMR robots 80 can remotely control the operation button of the elevator 3. In the above scheme, the AGV robot and the AMR robot can cooperate with each other, for example, the AGV robot is mainly responsible for the transportation in the second space, and the AMR robot is mainly responsible for the transfer between the first space and the second space.
[0031] Furthermore, the embodiment of the utility model also proposes a digital factory, the digital factory comprising a first space 1 and a second space 2, the first space 1 and the second space 2 being connected by a vertical elevator 3, and the digital factory further comprising a semiconductor manufacturing execution system as described in any of the above embodiments. Compared with the existing digital factories, the digital factory described in the present application can realize the information connection between the first space 1 and the second space 2 inside the office building, and the robot can be dispatched within the scope of the first space 1 and the second space 2, thereby building a bridge between semiconductor production and management.
[0032] With the expansion of urban radius, my country's first- and second-tier cities have gradually established emerging industries in new urban areas to provide high-end employment opportunities. Among them, the model of semiconductor industry settling in new urban areas has gradually evolved from traditional factories dominated by industrial plants to new semiconductor factories dominated by office buildings in high-tech parks.
[0033] In view of this new development model of the semiconductor industry, a matching semiconductor manufacturing execution system is needed to achieve the upgrading and transformation of office buildings, build a bridge between semiconductor production and management, accurately transmit real-time data from the production end to the management end, ensure timely response to changes in production conditions, improve semiconductor factory operations and enhance management efficiency. In response to the above problems, the semiconductor manufacturing execution system proposed by the inventor of this application can realize the information connection between the first space and the second space inside the office building, and the robot is dispatched within the scope of the first space and the second space, thereby building a bridge between semiconductor production and management, improving semiconductor factory operations and enhancing management efficiency.
[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0036] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0037] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0038] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms should not be understood as necessarily being directed to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification.
[0039] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is intended to include these modifications and variations.
[0040] The above is a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the utility model, and these modifications or replacements should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A semiconductor manufacturing execution system, characterized in that: The semiconductor manufacturing execution system comprises: MES execution system, AMHS material control system, warehouse logistics management system, compound production equipment, AGV robot, wherein the number of the compound production equipment is multiple, and the number of the AGV robots is also multiple; The MES execution system is connected to the AMHS material control system, the AMHS material control system is connected to the warehouse logistics management system, the warehouse logistics management system is connected to the compound production equipment, the compound production equipment is connected to the MES execution system, and the AMHS material control system is wirelessly connected to the plurality of AGV robots; The MES execution system, the AMHS material control system, the warehouse logistics management system, and the plurality of compound production equipment are all arranged in the same space. The MES execution system includes a total control module, a factory integration module, and a product integration module. The total control module is connected to the factory integration module and the product integration module respectively. The semiconductor manufacturing execution system cooperates with the smart landmarks on the ground. Multiple smart landmarks are arranged between the multiple compound production equipment and the AMHS material control system. At least one smart landmark is arranged on one side of the multiple compound production equipment. The multiple AGV robots correspond to the multiple smart landmarks.
2. The semiconductor manufacturing execution system according to claim 1, characterized in that: The first façade of the semiconductor manufacturing execution system is arranged in the first space, and the second façade of the semiconductor manufacturing execution system is arranged in the second space, and the first space and the second space are connected by a vertical elevator; The MES execution system, the first kanban, and the second kanban of the semiconductor manufacturing execution system are all connected to the computer device, and the semiconductor manufacturing execution system further includes: AMR instruction system and a robot task board, the AMR instruction system is connected to the MES execution system, the AMR instruction system is connected to the computer device, the AMR instruction system is connected to the robot task board, the robot task board and the computer device are arranged in the first space, the MES execution system, the AMHS material control system, the warehouse logistics management system, and the plurality of compound production equipment are arranged in the second space; the robot task board is used to display the robot scheduling status of the first space and the second space, and the first board and the second board are both used to display the enterprise information system and the reporting system.
3. The semiconductor manufacturing execution system according to claim 2, wherein: The semiconductor manufacturing execution system further includes a plurality of data acquisition devices, and the plurality of data acquisition devices are connected to the plurality of compound production equipments and correspond one to one.
4. The semiconductor manufacturing execution system according to claim 3, characterized in that: The compound production equipment includes any one or more of crystal growth equipment, epitaxial growth reaction equipment, cutting equipment, grinding equipment, polishing equipment, and measurement equipment.
5. The semiconductor manufacturing execution system according to claim 4, characterized in that: The semiconductor manufacturing execution system also includes multiple AMR robots, and the multiple AMR robots are wirelessly connected to the AMR command system. The activity range of the multiple AMR robots includes the first space, the elevator, and the second space. The multiple AMR robots can remotely control the operating buttons of the elevator.
6. A digital factory, characterized in that: The digital factory includes a first space and a second space, the first space and the second space are connected by a vertical elevator, and the digital factory also includes a semiconductor manufacturing execution system as described in any one of claims 1-5.