A DDR5 desktop motherboard with a heat spreader installed

Abstract

The utility model belongs to the technical field of desktop motherboards, and discloses a DDR5 desktop motherboard equipped with a heat spreader, comprising: a printed substrate, used as a circuit substrate for various electronic components of the desktop motherboard; a CPU module, located in the middle of the printed substrate, used as a computing and control module of the desktop; a slot, used for inserting a memory card, located on one side of the CPU module; an IO control chip, located on one side of the slot adjacent to the CPU module, used for executing instructions of the CPU module to control IO devices of the desktop; a BIOS storage chip, used as the most basic input / output system of the desktop motherboard, located on one side of the IO control chip; a heat spreader assembly, comprising a mounting seat and a heat spreader respectively abutting against an external radiator and the CPU module, the heat spreader being arranged on the printed substrate through the mounting seat; the utility model can quickly conduct the heat generated by the CPU module during operation to the external radiator, and finally quickly dissipate the heat to the outside through the external radiator.

Description

Technical Field

[0001] The utility model relates to the technical field of desktop motherboards, and in particular to a DDR5 desktop motherboard equipped with a heat spreader. Background Art

[0002] The motherboard, also called mainboard, systemboard, or motherboard, is one of the most basic and important components of a computer. The main circuit system and heat dissipation components (devices) that make up the computer are installed on the motherboard. The main circuit system generally includes BIOS chip, I / O control chip, keyboard and panel control switch interface, indicator light connector, expansion slot, DC power supply connector of the motherboard and plug-in card, etc.

[0003] At present, the prior art does not have a corresponding heat dissipation structure designed for the BGA packaged CPU module on the desktop motherboard, and the traditional external heat sink cannot directly contact the BGA packaged CPU silicon chip, which often leads to poor heat dissipation effect. Utility Model Content

[0004] In view of this, the purpose of the utility model is to provide a DDR5 desktop motherboard equipped with a heat spreader, which is intended to abut against the CPU module and the external radiator respectively through the heat spreader, so as to quickly conduct the heat generated by the CPU module during operation to the external radiator, and finally dissipate it quickly to the outside through the external radiator.

[0005] To achieve the above objectives, the utility model discloses a DDR5 desktop motherboard equipped with a heat spreader, comprising:

[0006] A printed substrate, used as a circuit substrate for each electronic component of the desktop motherboard;

[0007] A CPU module, located in the middle of the printed circuit board, is used as a computing and control module of the desktop computer;

[0008] A slot, used for inserting a memory card, located on one side of the CPU module;

[0009] An IO control chip, located on a side of the CPU module adjacent to the slot, for executing instructions of the CPU module to control the IO devices of the desktop computer;

[0010] BIOS storage chip, used as the most basic input / output system of the desktop motherboard, located on one side of the IO control chip;

[0011] The heat spreader assembly comprises a mounting seat and a heat spreader respectively abutting against an external heat sink and the CPU module, wherein the heat spreader is arranged on the printed circuit board through the mounting seat.

[0012] Preferably, the DDR5 desktop motherboard also includes a heat sink group and a bracket fastener, the bracket fasteners are symmetrically distributed on both sides of the CPU module, the external radiator is snap-connected to the bracket fastener, and the heat sink group abuts against the external radiator.

[0013] Preferably, the bracket fastener is fixed on the printed circuit board by threaded connection.

[0014] Preferably, it also includes a power port, a PCIE interface and a data transmission interface.

[0015] Preferably, the CPU module is a BGA CPU module.

[0016] Preferably, the slots are dual DDR5 UDIMM slots.

[0017] Preferably, the DDR5 desktop motherboard also includes an audio interface.

[0018] Preferably, the DDR5 desktop motherboard also includes a hard disk interface.

[0019] Preferably, the hard disk interface is an M.2 hard disk interface, and the printed circuit board is arranged in a rectangular structure.

[0020] Preferably, the DDR5 desktop motherboard also includes a tantalum capacitor group, which is evenly distributed in a linear manner at intervals on a side of the CPU module away from the slot.

[0021] To sum up, compared with the prior art, the utility model provides a DDR5 desktop motherboard equipped with a heat spreader, which is respectively connected to the CPU module and the external radiator. The heat generated by the CPU module during operation can be quickly conducted to the external radiator, and finally dissipated to the outside through the external radiator, thereby enhancing the heat dissipation performance of the motherboard and improving the stability and reliability of the CPU module. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1is a schematic diagram of the three-dimensional structure of the vapor chamber assembly provided in this embodiment;

[0024] Figure 2 This is a schematic diagram of the three-dimensional structure of a DDR5 desktop motherboard with a heat spreader installed in this embodiment. Figure 1 ;

[0025] Figure 3 This is a schematic diagram of the three-dimensional structure of a DDR5 desktop motherboard with a heat spreader installed in this embodiment. Figure 2 ;

[0026] Figure 4 It is a rear view schematic diagram of a DDR5 desktop motherboard with a heat spreader installed provided in this embodiment.

[0027] Figure numerals: 1. printed circuit board; 2. CPU module; 3. slot; 4. IO control chip; 5. BIOS storage chip; 6. tantalum capacitor group; 7. heat sink group; 8. bracket fastener; 9. power port; 10. PCIE interface; 11. data transmission interface; 12. audio interface; 13. hard disk interface; 14. mounting seat; 15. heat spreader. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solutions and advantages of the utility model more clearly understood, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0029] In the description of the present invention, it should be noted that the terms "front", "rear", "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0031] In addition, the technical features involved in the different embodiments of the present invention described above can be combined with each other as long as they do not conflict with each other.

[0032] A DDR5 desktop motherboard with a heat spreader installed, such as Figures 1 to 4 As shown, including:

[0033] A printed substrate 1 is used as a circuit substrate for various electronic components of a desktop motherboard;

[0034] The CPU module 2 is located in the middle of the printed substrate 1 and is used as a computing and control module of the desktop computer;

[0035] In this embodiment, the CPU module 2 is a BGA CPU module.

[0036] Slot 3, used for inserting a memory card, is located on one side of the CPU module 2;

[0037] In this embodiment, slot 3 is a dual DDR5 UDIMM slot.

[0038] It should be noted that UDIMM, the full name of which is Unbuffered DIMM, means that the address and control signals directly reach the DRAM chip on the DIMM without passing through a buffer or making any timing adjustments. Since UDIMM does not have any cache between the CPU and the memory, the latency is smaller at the same frequency.

[0039] It should be further explained that, in some embodiments, the size specifications and the limiting method of the slot 3 can be selectively set according to actual conditions and are not specifically limited here.

[0040] The IO control chip 4 is located on one side of the CPU module 2 adjacent to the slot 3 and is used to execute instructions of the CPU module 2 to control the IO devices of the desktop computer;

[0041] BIOS storage chip 5, used as the most basic input / output system of the desktop motherboard, is located on one side of the IO control chip 4;

[0042] In this embodiment, the BIOS storage chip 5 is a QFN packaged BIOS storage chip.

[0043] It should be noted that compared with the SOP packaged chip used in the traditional motherboard structure, the QFN packaged BIOS storage chip used in this motherboard structure has the physical advantages of small size, light weight and large storage capacity, and has the quality advantages of strong heat dissipation, good electrical performance and high reliability, which can make the data transmission between the BGA CPU module and the dual DDR5 UDIMM slots more efficient and stable.

[0044] The heat spreader assembly includes a mounting seat 14 and a heat spreader 15 abutting against the CPU module 2 . The heat spreader 15 is disposed on the printed substrate 1 through the mounting seat 14 . The mounting seat 14 is snap-connected to the printed substrate 1 .

[0045] It should be noted that, compared with the setting mode in which the external heat sink (not shown) on the traditional motherboard cannot directly contact the CPU module 2, this embodiment uses a heat spreader to respectively contact the CPU module 2 and the external heat sink, so that the heat generated by the CPU module 2 during operation can be quickly transferred to the external heat sink, and finally quickly dissipated to the outside through the external heat sink, thereby enhancing the heat dissipation performance of the motherboard and improving the stability and reliability of the CPU module.

[0046] It should be noted that, in some embodiments, in order to further enhance the heat dissipation effect, the mainboard may further include a heat sink group 7 and a bracket fastener 8, the bracket fastener 8 is symmetrically distributed on both sides of the CPU module 2, the external radiator is snap-connected to the bracket fastener 8, and the heat sink group 7 is abutted against the external radiator; the heat sink group 7 efficiently concentrates most of the heat generated by other electronic components on the mainboard during operation, and then quickly dissipates the heat to the outside through the external radiator.

[0047] It should be noted that compared with the traditional motherboard structure that directly fixes the external radiator on the printed circuit board 1 with screws, the present motherboard structure, through the setting of a pair of bracket fasteners 8 on both sides of the CPU module 2, and then by snap-connecting the external radiator to the bracket fasteners 8, can achieve rapid installation or removal of the external radiator, which is beneficial for the staff to efficiently assemble or repair the motherboard. At the same time, since the bracket fastener 8 can support a larger external radiator, the overall heat dissipation effect of the motherboard can be effectively improved.

[0048] In this embodiment, the bracket fastener 8 is fixedly disposed on the printed substrate 1 by threaded connection.

[0049] It should be noted that, in some embodiments, the connection and fixing method between the bracket fastener 8 and the printed circuit board 1 can also be selectively set according to actual needs, and is not limited to the threaded connection method, and is not specifically limited here.

[0050] Furthermore, this embodiment also includes a power port 9 , a PCIE interface 10 , a data transmission interface 11 , an audio interface 12 and a hard disk interface 13 .

[0051] It should be noted that, in the specific implementation process, the power port 9 is used to electrically connect to an external power source, the data transmission interface 11 is used to transmit data to an external electronic device, the audio interface 12 is used to connect to an audio device, and the hard disk interface 13 is used to connect to a hard disk; wherein, the full name of PCIE is Peripheral Component Interconnect Express, which is a high-speed serial computer expansion bus standard. PCIE belongs to high-speed serial point-to-point dual-channel high-bandwidth transmission, and the connected devices are allocated exclusive channel bandwidth and do not share bus bandwidth. It mainly supports active power management, error reporting, end-to-end reliability transmission, hot plugging, and quality of service functions.

[0052] In this embodiment, the hard disk interface 13 is an M.2 hard disk interface.

[0053] It should be noted that, in some embodiments, the model of the hard disk interface 13 can also be selectively set according to actual needs, and is not specifically limited here.

[0054] In this embodiment, the printed substrate 1 is arranged in a rectangular structure.

[0055] It should be noted that, in some embodiments, the structural shape of the printed substrate 1 can also be set according to actual needs, such as a circle, an irregular polygon, etc., which is not specifically limited here.

[0056] In a specific implementation process, this embodiment further includes a tantalum capacitor group 6 which is evenly distributed in a linear manner at intervals on a side of the CPU module 2 away from the slot 3 .

[0057] It should be noted that compared with the aluminum electrolytic capacitors used on traditional motherboards, the tantalum capacitors on this motherboard structure have the advantages of high energy density, high reliability, high stability of electrical properties, and a wider operating temperature range, which can make the data transmission and line current between the BGA CPU module and the dual DDR5 UDIMM slots more stable.

[0058] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A DDR5 desktop motherboard with a heat spreader installed, characterized in that: include: A printed substrate (1) used as a circuit substrate for each electronic component of the desktop motherboard; A CPU module (2), located in the middle of the printed substrate (1), and used as a computing and control module of the desktop computer; A slot (3), used for inserting a memory card, located on one side of the CPU module (2); An IO control chip (4), located on a side of the CPU module (2) adjacent to the slot (3), and used for executing instructions of the CPU module (2) to control the IO device of the desktop computer; A BIOS storage chip (5), used as the most basic input / output system of the desktop motherboard, located on one side of the IO control chip (4); The heat spreader assembly comprises a mounting seat (14) and a heat spreader (15) respectively abutting against an external heat sink and the CPU module (2); the heat spreader (15) is arranged on the printed substrate (1) via the mounting seat (14).

2. The DDR5 desktop motherboard with a vapor chamber as claimed in claim 1, wherein: It also comprises a heat sink group (7) and a bracket fastener (8), wherein the bracket fastener (8) is symmetrically distributed on both sides of the CPU module (2), the external heat sink is buckled and connected to the bracket fastener (8), and the heat sink group (7) is in abutment with the external heat sink.

3. The DDR5 desktop motherboard with a vapor chamber as claimed in claim 2, wherein: The bracket fastener (8) is fixedly arranged on the printed substrate (1) by means of a threaded connection.

4. The DDR5 desktop motherboard with a vapor chamber as claimed in claim 1, wherein: It also includes a power port (9), a PCIE interface (10) and a data transmission interface (11).

5. The DDR5 desktop motherboard with a vapor chamber installed as claimed in any one of claims 1 to 3, characterized in that: The CPU module (2) is a BGA CPU module.

6. The DDR5 desktop motherboard with a vapor chamber installed as claimed in any one of claims 1 to 4, characterized in that: The slot (3) is a dual DDR5 UDIMM slot.

7. The DDR5 desktop motherboard with a vapor chamber installed as claimed in claim 1 or 3, characterized in that: An audio interface (12) is also included.

8. The DDR5 desktop motherboard with a vapor chamber installed as claimed in claim 1 or 4, characterized in that: It also includes a hard disk interface (13).

9. The DDR5 desktop motherboard with a vapor chamber as claimed in claim 8, wherein: The hard disk interface (13) is an M.2 hard disk interface, and the printed substrate (1) is arranged in a rectangular structure.

10. The DDR5 desktop motherboard with a vapor chamber installed as claimed in claim 1 or 9, characterized in that: Also includes: The tantalum capacitor group (6) is evenly distributed in a linear manner at intervals on a side of the CPU module (2) away from the slot (3).

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