Ultrasonic fingerprint recognition device and electronic device for fingerprint recognition

Abstract

The present application relates to the field of electronics, and in particular to the field of fingerprint recognition, and in particular to an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. The ultrasonic fingerprint recognition device is installed in an electronic device, and includes an ultrasonic sensor and a circuit board; the circuit board is electrically connected to a processing unit of the electronic device; the ultrasonic sensor is attached to the inside of a groove formed by a raised structure through an adhesive layer; at least a portion of the ultrasonic sensor is disposed inside the groove formed by the raised structure, the raised structure is a part of the outer frame of the electronic device and the raised structure protrudes from the outer frame of the electronic device, and by disposing the ultrasonic fingerprint recognition device in the groove formed by the raised structure of the outer frame of the electronic device, the raised structure can guide the user to find the position of the pressed finger more quickly while improving the space utilization.

Description

Technical Field

[0001] The present application relates to the field of fingerprint recognition, and in particular to an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. Background Art

[0002] With the development of smart devices, fingerprint recognition has become one of the functions of most smart devices. The side fingerprint solution is installed in a different location from the traditional front and back fingerprint solutions. Currently, the mainstream front fingerprint recognition terminals use optical or ultrasonic fingerprint solutions, while the back fingerprint recognition terminals use capacitive fingerprint solutions. For terminals with side fingerprint recognition function, the fingerprint recognition device is set on the side of the middle frame of the smart device.

[0003] At present, the side fingerprint solution mainly adopts the capacitive fingerprint solution. However, when the cover above the capacitive fingerprint module is thicker, the penetration performance of the capacitive fingerprint solution is poor, resulting in weak signal strength and reduced recognition accuracy. Utility Model Content

[0004] In view of the problem of low recognition accuracy of side fingerprints in the prior art, the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition.

[0005] A first aspect of an embodiment of the present application provides an ultrasonic fingerprint recognition device, which is installed in an electronic device, and the ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board;

[0006] The circuit board is electrically connected to a processing unit of the electronic device;

[0007] The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the outer frame of the electronic device, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board;

[0008] The ultrasonic sensor is attached to the groove formed on the back side of the raised structure;

[0009] At least a portion of the ultrasonic sensor is disposed inside the groove, and an outer frame of the electronic device protrudes to form a front side of the protruding structure;

[0010] The raised structure is a part of the outer frame of the electronic device.

[0011] In addition, in combination with the first aspect, in an implementation of the first aspect, the depth of the groove is equal to or less than the thickness of the ultrasonic sensor; the bottom area of ​​the groove is larger than the area of ​​the ultrasonic sensor; the long side of the raised structure is parallel to the long side of the display screen of the electronic device, and the short side of the raised structure is parallel to the short side of the display screen of the electronic device.

[0012] In addition, in combination with the first aspect, in an implementation of the first aspect, the height of the protruding structure is not less than 0.5 mm and not more than 3 mm;

[0013] The height of the raised structure is equal to the height of the volume button or the power button of the electronic device;

[0014] The raised structure is a rectangular parallelepiped raised structure.

[0015] In addition, in combination with the first aspect, in an implementation of the first aspect, the ultrasonic sensor includes an acoustic layer and a silicon wafer layer, and the silicon wafer layer is connected to the acoustic layer;

[0016] The groove formed by attaching the ultrasonic sensor to the back of the raised structure includes:

[0017] The acoustic layer is attached to the groove, and the acoustic layer is arranged between the protruding structure and the silicon wafer layer; or

[0018] The silicon sheet layer is attached to the groove, and the silicon sheet layer is arranged between the protruding structure and the acoustic layer.

[0019] In addition, in combination with the first aspect, in an implementation of the first aspect, the ultrasonic sensor further includes an adhesive layer, the acoustic layer or the silicon wafer layer is attached to the groove formed on the back side of the protruding structure through the adhesive layer, and the adhesive layer is copper foil adhesive;

[0020] The ultrasonic fingerprint recognition device further includes a reinforcing member, which is used to fix the ultrasonic sensor, and the acoustic layer or the silicon wafer layer is fixed to the reinforcing member through a fixing layer;

[0021] The ultrasonic fingerprint recognition device also includes a first fixing component, through which the circuit board is fixed to the outer frame, and the first fixing component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer;

[0022] One end of the silicon wafer layer is connected to the circuit board through a binding wire, and the first fixing component is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or

[0023] One end of the silicon layer is connected to the circuit board through ACF glue.

[0024] In addition, in combination with the first aspect, in an implementation of the first aspect, the front side of the protruding structure provides a pressing surface for contacting with a user's finger.

[0025] In addition, in combination with the first aspect, in an implementation of the first aspect, the outer frame and the raised structure are made of the same material, the outer frame is plastic or metal, the raised structure and the outer frame to which it is connected are integrally formed, and there is no air gap between the raised structure and the outer frame.

[0026] In addition, in combination with the first aspect, in an implementation of the first aspect, the outer frame and the protruding structure are made of different materials, and the outer frame is plastic or metal.

[0027] In addition, in combination with the first aspect, in an implementation of the first aspect, a silk screen is provided on the top of the front surface of the protruding structure, and the silk screen is a fingerprint pattern;

[0028] The protruding structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and a side close to the back of the electronic device;

[0029] The raised structure is vertical or has a second chamfer on both sides along the outer frame;

[0030] The top of the front side of the raised structure is flat; or,

[0031] The top of the front side of the raised structure is an arc surface, the curvature of the arc surface is smaller than the curvature of the first chamfer, the curvature of the arc surface is smaller than the curvature of the second chamfer, and the curvature of the arc surface is equal to the curvature of the outer frame of the electronic device.

[0032] A second aspect of the embodiments of the present application provides an electronic device for fingerprint recognition, comprising the ultrasonic fingerprint recognition device of any one of the first aspects and an outer frame.

[0033] Compared with the prior art, the beneficial effect of the embodiments of the present application is that the embodiments of the present application provide an ultrasonic fingerprint recognition device and an electronic device for fingerprint recognition. On the one hand, since ultrasonic waves have strong penetrating power and can easily penetrate the outer frame of the electronic device, the ultrasonic signal intensity received by the ultrasonic sensor is high and the fingerprint recognition accuracy is high. In addition, by arranging the ultrasonic fingerprint recognition device in the groove formed by the raised structure of the outer frame of the electronic device, the space utilization rate can be improved. At the same time, the raised structure can guide the user to find the position of the pressed finger more quickly. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0035] Figure 1 A schematic cross-sectional view of an ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0036] Figure 2 A cross-sectional schematic diagram of another ultrasonic fingerprint recognition device according to an embodiment of the present application;

[0037] Figure 3 A schematic diagram of a cross section from any outer frame to another outer frame of an ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device;

[0038] Figure 4 A schematic diagram of a cross section from any one outer frame to another outer frame of an electronic device installed on an outer frame of another embodiment of the present application;

[0039] Figure 5 A schematic cross-sectional view of an ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, from a display screen of the electronic device to a bottom surface of the electronic device;

[0040] Figure 6 A schematic cross-sectional view of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from a display screen of the electronic device to a bottom surface of the electronic device;

[0041] Figure 7 A schematic cross-sectional view of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from a display screen of the electronic device to a bottom surface of the electronic device;

[0042] Figure 8 A schematic cross-sectional view of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device, extending from a display screen of the electronic device to a bottom surface of the electronic device;

[0043] Fig. 9 A schematic diagram of a cross section from any one outer frame to another outer frame of an electronic device installed in an outer frame of the present application;

[0044] Fig.10 This is a schematic diagram of a cross section from any outer frame to another outer frame of another ultrasonic fingerprint recognition device according to an embodiment of the present application installed on an outer frame of an electronic device. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical scheme and advantages of the present application clearer, some embodiments of the present application will be described in detail in the following by way of example in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in each example, many technical details are provided in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can be implemented.

[0046] The basic principle of ultrasonic under-screen fingerprint recognition is: the ultrasonic sensor is installed under the screen, and the ultrasonic waves it emits pass through the screen and reach the surface of the finger, and the fingerprint reflects the ultrasonic waves. Since the valleys and ridges of the fingerprint reflect the ultrasonic waves differently, the reflected echoes pass through the screen and are received by the ultrasonic sensor, and the fingerprint image can be obtained based on the echo differences.

[0047] The present application embodiment provides an ultrasonic fingerprint recognition device, Figure 1 It is a cross-sectional schematic diagram of an ultrasonic fingerprint recognition device provided in an embodiment of the present application. The ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The circuit board 102 is electrically connected to a processing unit of an electronic device. The ultrasonic sensor 101 is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and pass through the outer frame of the electronic device. It is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit of the electronic device through the circuit board 102. In this embodiment, the ultrasonic sensor 101 is connected to the circuit board 102 through a binding wire 103. In the above embodiment, the circuit board is electrically connected to the processing unit in the electronic device. The circuit board 102 can be a flexible circuit board. The circuit board is used to transmit electrical signals to the processing unit of the electronic device. The processing unit performs fingerprint recognition and fingerprint anti-counterfeiting according to the electrical signals.

[0048] Compared to Figure 1 In the ultrasonic sensor shown in the figure, in this embodiment, it is also possible not to use a binding wire to connect the circuit board and the ultrasonic sensor. Figure 2 As shown, the ultrasonic fingerprint recognition device 100 includes an ultrasonic sensor 101 and a circuit board 102. The pad portion 12 of the ultrasonic sensor 101 is electrically connected to the flexible circuit board 102. The flexible circuit board 102 is used to connect to an external circuit, and the external circuit is, for example, a processing unit of an electronic device. In this embodiment, the electrical connection area of ​​the flexible circuit board 102 may also include a pad (not shown). The pad portion 12 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible circuit board 102 may be electrically connected through a conductive adhesive 1031. Optionally, the pad portion 12 of the ultrasonic sensor 101 and the electrical connection area of ​​the flexible circuit board 102 are electrically connected through ACF (Anisotropic Conductive Film) adhesive 1031 using an ACF lamination process. The ultrasonic sensor 101 and the flexible circuit board 102 are bound by the ACF adhesive 1031 to achieve electrical conduction. At the same time, the ACF adhesive 1031 itself has adhesiveness, which can make the ultrasonic sensor 101 and the flexible circuit board 102 better bonded together. Adopting Figure 1 The solution of binding wire is easy to process and has good structural stability, while the solution using ACF glue does not need to consider the problem of binding wire fixation.

[0049] Figures 3 to 8 The ultrasonic fingerprint recognition device provided in the embodiment of the present application is installed in the outer frame of an electronic device at different angles. The ultrasonic fingerprint recognition device is applied to an electronic device. The ultrasonic fingerprint recognition device is installed in the electronic device. The electronic device is, for example, a mobile phone, an electronic watch, etc. The embodiment of the present application takes the ultrasonic fingerprint recognition device installed in a mobile phone as an example for explanation. In the following embodiments, Figure 3 , Figure 4 , Fig. 9 and Fig.10 What is shown is a cross-sectional view from any outer frame to another outer frame of an electronic device, Figures 5 to 8 Shown is a cross-sectional view from a display screen of an electronic device to an outer frame of a bottom surface of the electronic device.

[0050] Figure 3 The long frame 300 of the entire electronic device is shown. The ultrasonic fingerprint recognition device includes an ultrasonic sensor 301 and a circuit board 302. The ultrasonic sensor 301 is attached to a groove 306 formed on the back side 3051 of the raised structure 305. When viewed from the side of the mobile phone, the outer frame 300 of the mobile phone is raised outward to form a raised structure 305. The outer frames 3000 and 3001 of the mobile phone are two short outer frames of the mobile phone. The outer frame 300 of the mobile phone is one of the long frames of the mobile phone (the other long frame opposite to the long frame 300 is not shown). The long outer frame 300 of the mobile phone can also be provided with a power button and a volume adjustment button. A groove 306 is formed inside the raised structure 305 to accommodate the ultrasonic sensor 301. Specifically, the back side 3051 of the raised structure 305 is concave toward its front side 3052 to form a groove 306 to accommodate the ultrasonic sensor 301. On the one hand, the raised structure 305 is helpful for the user to quickly find the fingerprint collection area. On the other hand, the groove 306 inside the raised structure is used to accommodate at least a part of the ultrasonic sensor 301, which can improve the space utilization rate. In addition, since the groove 306 formed on the back of the raised structure 305 is used to accommodate part of the ultrasonic sensor 301, the distance between the ultrasonic sensor and the fingerprint collection surface is reduced, and the strength of the ultrasonic signal can be significantly improved, thereby improving the accuracy of fingerprint collection. At least a part of the ultrasonic sensor 301 is arranged inside the raised structure 305. Specifically, at least a part of the ultrasonic sensor 301 is arranged inside the groove 306. The raised structure 305 is a part of the outer frame 300 of the electronic device. The outer frame 300 of the electronic device protrudes to form the front side 3052 of the raised structure. The raised structure 305 protrudes from the outer frame 300 of the electronic device. Since the raised structure protrudes from the outer frame of the electronic device, it can remind the user of the position where the finger is pressed, and the user can find the fingerprint collection position by touch.

[0051] Design and position of the raised structure 305 : Part of the outer frame of the electronic device is designed to be raised. This raised structure is not only a part of the outer frame, but is also specially designed to accommodate the ultrasonic sensor 301 .

[0052] Formation and function of groove 306: A groove 306 is designed on the back side 3051 of the raised structure 305 (i.e., the side facing the inside of the electronic device). The groove 306 is specially formed for installing the ultrasonic sensor 301, and its shape and size are suitable for accommodating the ultrasonic sensor. Specifically, the bottom area of ​​the groove 306 is larger than the area of ​​the ultrasonic sensor 301, and the depth of the groove 306 can be equal to the thickness of the ultrasonic sensor so as to just accommodate the ultrasonic sensor, or the depth of the groove 306 can be less than the thickness of the ultrasonic sensor so as to accommodate part of the ultrasonic sensor. Since the depth of the groove is small, the raised structure 305 has a certain thickness, and thus the strength of the outer frame is higher. In some embodiments, the depth of the groove 306 can be greater than the thickness of the ultrasonic sensor so that the ultrasonic sensor can be completely disposed inside the groove. In addition, there is space in the groove to accommodate other related components.

[0053] Installation of ultrasonic sensor: Figure 3 As shown, the ultrasonic sensor may include an adhesive layer 304, and the acoustic layer or silicon wafer layer may be attached to the groove 306 through the adhesive layer 304, and the adhesive layer 304 may be glue or other viscous materials. The ultrasonic sensor may be bonded to the groove by a front-mounted or back-mounted solution. In this solution, the adhesive layer is not limited to adhesive materials such as copper foil adhesive, double-sided adhesive, and thermosetting adhesive. Since copper foil adhesive can achieve better acoustic impedance matching, the adhesive layer may preferably be copper foil adhesive, and the copper foil adhesive includes a copper foil layer and an adhesive layer arranged on the upper and lower surfaces of the copper foil layer. At least part (may be most or all) of the ultrasonic sensor 301 is arranged in the groove 306, which can better fix the ultrasonic sensor and may also provide a certain degree of protection for the ultrasonic sensor.

[0054] The above structure can protect the ultrasonic sensor, which not only can effectively utilize the space of the device, but also can help improve the receiving or transmitting efficiency of the ultrasonic sensor. Due to the presence of the groove 306, the propagation path of the ultrasonic wave will be shorter, thereby improving the fingerprint recognition performance of the entire electronic device.

[0055] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 3As shown, the front side 3052 of the raised structure 305 provides a pressing surface for contacting the user's finger, so that the ultrasonic sensor 301 can collect the user's fingerprint. In order to improve the waterproof level of the device and to prevent water vapor from entering the ultrasonic sensor 301 and thus affecting fingerprint recognition, there is no air gap between the raised structure 305 and the outer frame 300.

[0056] In this embodiment, the circuit board 302 can be attached to the outer frame 300 to facilitate fixing the circuit board 302 . Figure 3 A positive bonding solution is adopted, that is, the acoustic layer 3012 is bonded to the groove 306 formed by the protruding structure 305 through the adhesive layer 304, and the acoustic layer 3012 is arranged between the silicon wafer layer 3011 and the protruding structure 305.

[0057] Based on the contents disclosed in the above embodiments, this embodiment also provides Figure 4 A schematic diagram of the outer frame of an electronic device shown. Figure 4 It is also a positive paste solution adopted. In this embodiment Figure 3 and Figure 4 Taking the positive posting solution as an example, it should be noted that: Figure 3 and Figure 4 It is also applicable to the back-sticking solution, in which the silicon wafer layer is attached to the groove formed by the protruding structure 305 through an adhesive layer, and the silicon wafer layer 3011 is arranged between the acoustic layer 3012 and the protruding structure 305. The back-sticking solution will not be described in detail here.

[0058] In this scheme, if Figure 4 As shown, the ultrasonic fingerprint recognition device may also include a reinforcement 308, which is used to fix the ultrasonic sensor 301. The ultrasonic sensor 301 is fixed to the reinforcement 308 through a fixing layer 309, wherein the fixing layer may be glue or foam glue. In this embodiment, the foam glue has a protective effect. When the back-sticking solution is used, the foam glue is used to fix the acoustic layer to the reinforcement, and the foam glue has a certain protective effect on the acoustic layer. In this embodiment, one end of the circuit board 302 may also be fixed to the reinforcement 308 through the fixing layer 309, and the reinforcement 308 may be a steel plate.

[0059] like Figure 4As shown, the outer frame 300 of the electronic device protrudes toward the outside of the electronic device to form a protruding structure 305, the mobile phone frames 3000 and 3001 are the short frames of the mobile phone, and the outer frame 300 of the mobile phone is the long outer frame of the mobile phone. A groove is formed inside the protruding structure 305 to accommodate the ultrasonic sensor 301. In this embodiment, the ultrasonic fingerprint recognition device also includes a first fixing component 307, and the first fixing component 307 is attached to the back of the outer frame 300 to fix the circuit board 302 to the outer frame 300. In addition, the first fixing component 307 can also have a certain height, and the first fixing component is used to support the circuit board so as to facilitate the electrical connection between the circuit board and the silicon wafer layer. As shown Figure 4 As shown, one end of the silicon wafer layer 3011 is connected to the circuit board 302 via a binding wire 310, and the first fixing component 307 is used to support the circuit board 302 so that the second electrical connection area 3061 of the circuit board 302 and the first electrical connection area 3062 of the silicon wafer layer 3011 are at the same height, so as to facilitate connecting the two through the binding wire 310 and fixing the two to the reinforcement member 308 at the same time. Figure 4 In the embodiment, a first electrical connection area 3062 is provided at one end of the silicon wafer layer 3011, a second electrical connection area 3061 is provided at one end of the circuit board 302, and a binding wire 310 is used to connect the first electrical connection area and the second electrical connection area. For the front-mounting solution, if the groove depth is not enough to accommodate the entire acoustic layer 3012, the introduction of the first fixing component 307 is more conducive to making the electrical connection areas of the circuit board 302 and the silicon wafer layer 3011 at the same height, so as to facilitate the connection of the two through the binding wire.

[0060] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 4 As shown, the height h1 of the raised structure 305 is not less than 0.5 mm and not more than 3 mm. The height of the raised structure is set between 0.5 mm and 3 mm, which not only avoids the raised structure being too thin to protect the ultrasonic fingerprint recognition device, but also avoids the raised structure being too thick to affect the intensity of the received ultrasonic signal. In this embodiment, when the height of the raised structure is equal to the height of the volume button or the power button of the electronic device, the appearance of the electronic device has good consistency and is convenient for users to use. In this embodiment, the raised structure can be a rectangular raised structure, the long side of the raised structure is parallel to the long side of the display screen of the electronic device, and the short side of the raised structure is parallel to the short side of the display screen of the electronic device, so that the sensing area of ​​the ultrasonic sensor is long enough to collect more fingerprint data. Figure 3 , Figure 4 , Fig. 9 as well as Fig.10 The long side of the raised structure can be observed, from Figures 5 to 8 The short sides of the raised structures can be observed.

[0061] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 3 As shown, the outer frame 300 is made of the same material as the raised structure 305, and the outer frame may be made of plastic or metal. The raised structure 305 and the outer frame 300 to which it is connected are integrally formed. Since the raised structure and the outer frame are integrally formed, process steps are saved and processing is facilitated. In addition, it can further prevent water vapor from entering the ultrasonic sensor, thereby affecting fingerprint recognition, and can also improve the waterproof level of electronic equipment.

[0062] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 3 As shown, the materials of the outer frame 300 and the raised structure 305 can be different. When the outer frame is plastic, the raised structure is metal, or when the raised structure is metal, the outer frame is plastic. Since the material of the raised structure 305 is different from that of the outer frame 300, the user can easily distinguish the position of the raised structure with the naked eye, so as to remind the user of the pressing position. In this embodiment, the outer frame can be made of plastic, hardware, glass, ceramic, etc., and the surface of the outer frame can be processed by vacuum plating, vacuum matte, oil spraying, material polishing and other processes.

[0063] Based on the contents disclosed in the above embodiments, this embodiment also provides Figure 5 A schematic diagram of an outer frame of an electronic device shown in FIG. Figure 5 It is a schematic cross-sectional view from the display screen of the electronic device to the bottom surface of the electronic device, and the stacked structure of the ultrasonic sensor 501 can be seen in the cross section.

[0064] like Figure 5 As shown, the ultrasonic fingerprint recognition device includes an ultrasonic sensor 501 and a circuit board (not shown), the ultrasonic sensor 501 includes an adhesive layer 504, and the acoustic layer 5012 is attached to the inside of the protruding structure 505 through the adhesive layer 504. Specifically, the ultrasonic sensor 501 is attached to the groove 506 formed on the back side 5051 of the protruding structure 505. Figure 5 The outer frame 500 of the electronic device is vertically arranged on the upper surface 5000 of the display screen and the back 5001 of the electronic device. The height of the portion of the outer frame close to the upper surface 5000 of the display screen is lower than the height of the front of the raised structure 505. Specifically, the middle frame portion close to the display screen 5000 is 5003, and its height is lower than the height of the front 5052 of the raised structure. The middle frame portion 5003 close to the display screen 5000 and the front 5052 of the raised structure form a first step structure, that is, the raised structure is vertical on the side close to the display screen of the electronic device and the side close to the back of the electronic device. The height of the first step structure is h2. In this embodiment, h2 can be equal to h1. Figure 5In the figure, the height of the middle frame portion close to the display screen 5000 and close to the back side 5001 of the electronic device is lower than the height of the front side of the raised structure 505. Specifically, the middle frame portion on the back side 5001 of the electronic device and the front side 5052 of the raised structure form another step structure, and the raised structure 505 is vertical on one side 5053 close to the display screen of the electronic device and on one side 5054 close to the back side of the electronic device.

[0065] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 5 The raised structure 505 protrudes a certain height relative to the outer frame 500 close to the display screen, and the top of the front side 5052 of the raised structure 505 is a plane. When the top of the front side 5052 of the raised structure 505 is a plane, it is more conducive to the collection of fingerprint recognition signals.

[0066] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 5 The difference is that the protruding structure forms a first chamfer on the side close to the display screen of the electronic device and the side close to the back of the electronic device. Figure 6 As shown, the raised structure 505 forms a first chamfer 5041 on a side close to the display screen 5000 of the electronic device. At the same time, the raised structure 505 forms a first chamfer 5042 on a side close to the back side 5001 of the electronic device. In this solution, the design of the first chamfer makes the electronic device easier to grasp and is more suitable for electronic devices with chamfered outer frames.

[0067] Based on the contents disclosed in the above embodiments, in this embodiment, the top of the front surface of the protruding structure may be a curved surface, the curvature of the curved surface is smaller than the curvature of the first chamfer, and the curvature of the curved surface may be equal to the curvature of the outer frame of the electronic device. Figure 7 As shown, the top of the front side 5052 of the raised structure 505 can be a curved surface, and the curvature of the curved surface is less than the curvature of the first chamfer 5041, which is more conducive to the collection of fingerprint recognition signals. In addition, when the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device, the appearance of the electronic device has better consistency and is easier to grasp. When the top of the front side 5052 of the raised structure 505 is a curved surface, it is more suitable for mobile phones with curved sides. In this embodiment, when the top of the front side 5052 of the raised structure is a curved surface, the raised structure forms a first chamfer 5041 on the side close to the display screen 5000 of the electronic device, and at the same time, the raised structure forms a first chamfer 5042 on the side close to the back side 5001 of the electronic device. In this embodiment, the curvature of the curved surface at the top of the front side 5052 of the raised structure 505 is less than the curvature of the first chamfer 5041, and the curvatures of the first chamfers 5041 and 5042 are the same. The larger the curvature, the greater the curvature of the curve, and the smaller the curvature of the arc surface at the top of the front side of the raised structure, which facilitates the collection of fingerprint path information and improves the consistency of the propagation path of the ultrasonic sensor.

[0068] Based on the contents disclosed in the above embodiments, in this embodiment, a silk screen is provided on the top of the protrusion, and the silk screen is a fingerprint pattern. The design of the silk screen facilitates the user to quickly locate the fingerprint collection area, further improving the user experience.

[0069] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 5 As shown, the ultrasonic sensor includes a copper foil adhesive 504, which is adhered to the inside of a groove 506 formed on the back side 5051 of the raised structure 505. The back side 5051 of the raised structure 505 forms a groove 506 for accommodating the ultrasonic sensor 501. Since the groove 506 is provided inside the raised structure to accommodate the ultrasonic sensor, space can be saved and equipment utilization can be improved.

[0070] Based on the contents disclosed in the above embodiments, in this embodiment, Figure 5 As shown, the ultrasonic sensor 501 includes an acoustic layer 5012 and a silicon wafer layer 5011 , the silicon wafer layer 5011 is connected to the acoustic layer 5012 , and one end of the silicon wafer layer is connected to the circuit board through a binding wire.

[0071] The groove formed by attaching the ultrasonic sensor to the back of the raised structure has the following two structures:

[0072] Positive sticker solution: Figure 5 As shown, the acoustic layer 5012 is attached to the inside of the groove 506 formed on the back side of the protruding structure 505 through the adhesive layer 504, and the acoustic layer 5012 is arranged between the protruding structure 505 and the silicon wafer layer 5011;

[0073] Back sticker solution: Figure 8 As shown, the ultrasonic sensor 501 is attached to the groove 506 formed on the back side 5051 of the protruding structure 505. The silicon wafer layer 5011 is attached to the inside of the groove 506 formed on the back side of the protruding structure 505 through the adhesive layer 504, and the silicon wafer layer 5011 is electrically connected to the circuit board through the binding wire, and the silicon wafer layer 5011 is arranged between the protruding structure 505 and the acoustic layer 5012. In this embodiment, compared with the back-sticking solution, the distance between the acoustic layer and the object to be measured in the front-sticking solution is closer, so the ultrasonic fingerprint signal strength collected by the electronic device using the front-sticking solution is higher.

[0074] Figure 3 In the embodiment, the protrusion structure 305 is vertical along the two sides 3055 and 3056 of the outer frame 300. Based on the contents disclosed in the above embodiment, another outer frame schematic diagram of an electronic device is also provided in this embodiment. Fig. 9 The cross-sectional view from any outer frame of the electronic device to another outer frame is shown. Figure 3 as well as Figure 4 The difference is, Fig. 9 The raised structure forms second chamfers 3053 and 3054 along the direction of the outer frame. The rounded edge design of the raised structure is convenient for users to touch and easy to wipe off stains. Fig. 9 In the figure, the top of the front side 3052 of the raised structure is flat.

[0075] Based on the contents disclosed in the above embodiments, another schematic diagram of an outer frame of an electronic device is also provided in this embodiment. Fig.10 The cross-sectional view from any outer frame of the electronic device to another outer frame is shown. Fig. 9 The difference is, Fig.10 In the embodiment, the top of the front side 3052 of the raised structure can be a curved surface, and the curvature of the curved surface is smaller than the curvature of the second chamfer 3053. The larger the curvature, the greater the curvature of the curve. The curved surface of the top of the front side of the raised structure has a smaller curvature, which is convenient for collecting fingerprint information, and the consistency of the propagation path of the ultrasonic sensor is better, which is more conducive to the collection of fingerprint recognition signals. In addition, when the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device, the appearance of the electronic device has better consistency. When the top of the front side 3052 of the raised structure 305 is a curved surface, it is more suitable for mobile phones with curved sides.

[0076] Based on the contents disclosed in the above embodiments, this embodiment further provides an electronic device for fingerprint recognition, for example, Figures 5 to 8 The electronic device shown includes the ultrasonic fingerprint recognition device and the outer frame in the above embodiment, which will not be described in detail here.

[0077] It should be understood that in the embodiment of the present application, "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0078] In addition, the term "and / or" in this article is only a description of the association relationship between the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0079] Those of ordinary skill in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0080] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0081] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0082] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0083] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0084] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage media include: various media that can store program codes, such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks or optical disks.

[0085] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. An ultrasonic fingerprint recognition device installed in an electronic device, characterized in that: The ultrasonic fingerprint recognition device includes an ultrasonic sensor and a circuit board; The circuit board is electrically connected to the processing unit of the electronic device; The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the outer frame of the electronic device, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board; The ultrasonic sensor is attached to the groove formed on the back side of the protruding structure; At least a portion of the ultrasonic sensor is disposed inside the groove, and an outer frame of the electronic device protrudes to form a front side of the protruding structure; The protruding structure is a part of the outer frame of the electronic device.

2. The ultrasonic fingerprint recognition device according to claim 1, characterized in that: The depth of the groove is equal to or less than the thickness of the ultrasonic sensor; the bottom area of ​​the groove is larger than the area of ​​the ultrasonic sensor; the long side of the raised structure is parallel to the long side of the display screen of the electronic device, and the short side of the raised structure is parallel to the short side of the display screen of the electronic device.

3. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The height of the protruding structure is not less than 0.5 mm and not more than 3 mm; The height of the protruding structure is equal to the height of the volume button or the power button of the electronic device; The protruding structure is a rectangular parallelepiped protruding structure.

4. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The ultrasonic sensor comprises an acoustic layer and a silicon wafer layer, wherein the silicon wafer layer is connected to the acoustic layer; The groove formed by the ultrasonic sensor being attached to the back side of the protruding structure includes: The acoustic layer is attached to the groove, and the acoustic layer is arranged between the protruding structure and the silicon wafer layer; or The silicon sheet layer is attached to the groove, and the silicon sheet layer is arranged between the protruding structure and the acoustic layer.

5. The ultrasonic fingerprint recognition device according to claim 4, characterized in that: The ultrasonic sensor further comprises an adhesive layer, the acoustic layer or the silicon wafer layer is attached to the groove formed on the back side of the protruding structure through the adhesive layer, and the adhesive layer is copper foil adhesive; The ultrasonic fingerprint recognition device further includes a reinforcing member, the reinforcing member is used to fix the ultrasonic sensor, and the acoustic layer or the silicon wafer layer is fixed to the reinforcing member through a fixing layer; The ultrasonic fingerprint recognition device further includes a first fixing component, through which the circuit board is fixed to the outer frame, and the first fixing component is used to support the circuit board so that the circuit board is electrically connected to the silicon wafer layer; One end of the silicon wafer layer is connected to the circuit board through a binding wire, and the first fixing component is used to support the circuit board so that the electrical connection area of ​​the circuit board and the electrical connection area of ​​the silicon wafer layer are at the same height; or, One end of the silicon wafer layer is connected to the circuit board through ACF glue.

6. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The front side of the raised structure provides a pressing surface for contacting with a user's finger.

7. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The outer frame is made of the same material as the protruding structure. The outer frame is made of plastic or metal. The protruding structure and the outer frame connected thereto are formed in one piece. There is no air gap between the protruding structure and the outer frame.

8. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: The outer frame is made of a different material from that of the protruding structure, and the outer frame is made of plastic or metal.

9. The ultrasonic fingerprint recognition device according to claim 1 or 2, characterized in that: A silk screen is provided on the top of the front side of the raised structure, and the silk screen is a fingerprint pattern; The protruding structure is vertical or has a first chamfer on a side close to the display screen of the electronic device and a side close to the back of the electronic device; The protruding structure is vertical or has a second chamfer on both sides along the outer frame; The top of the front side of the protruding structure is a plane; or, The top of the front side of the raised structure is a curved surface, the curvature of the curved surface is smaller than the curvature of the first chamfer, the curvature of the curved surface is smaller than the curvature of the second chamfer, and the curvature of the curved surface is equal to the curvature of the outer frame of the electronic device.

10. An electronic device for fingerprint recognition, characterized in that: It comprises the ultrasonic fingerprint recognition device according to any one of claims 1 to 9 and the outer frame.

Images