Capacitors

Abstract

The utility model discloses a capacitor, including a capacitor forming mold, a capacitor core group and a plurality of centering positioning blocks; the capacitor forming mold is provided with a mold cavity for encapsulating packaging materials; the lead-out terminal of the capacitor core group is fixed at the bottom of the mold cavity; the centering positioning block is fixedly matched on the surface of the capacitor core group and abuts against the inner wall of the mold cavity. The utility model installs a plurality of centering positioning blocks on the surface of the capacitor core group, and the centering positioning blocks abut against the inner wall of the mold cavity, so that the gap between the capacitor core group and the mold cavity is fixed and unchanged, so that the shaking of the capacitor core group can be avoided, and the capacitor core group no longer shakes during the process of pouring the packaging material, so that the thickness of the packaging material can be guaranteed to be uniform, the production defect rate of the shell-less capacitor can be reduced, the minimum material thickness can be guaranteed, and the moisture-proof performance of the shell-less capacitor can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a capacitor without a casing. Background Art

[0002] Capacitors are one of the electronic components used in large quantities in electronic devices. Ordinary capacitors are mainly composed of capacitor core groups, shells and packaging materials, wherein the capacitor core group is placed in the shell, and a gap is left between the shell and the packaging material is filled in the above gap for packaging, wherein the shell generally includes plastic shell and metal shell.

[0003] The caseless capacitor is mainly formed by a mold, and the capacitor core group is directly wrapped with packaging materials to form the capacitor shape without the need for a shell. In the prior art, when the capacitor core group is placed in the capacitor forming mold, there is a gap between the capacitor core group and the capacitor forming mold for filling the packaging material, and the capacitor core group will shake and cause position displacement, resulting in uneven thickness of the packaging material of the caseless capacitor, and the minimum material thickness required by the design cannot be guaranteed, and the capacitor core group may even be exposed. Utility Model Content

[0004] The utility model aims to provide a capacitor, which effectively solves the problems of capacitor core group deviation, uneven thickness of packaging materials, etc. that occur during the potting process of caseless capacitors, and improves the yield rate of products.

[0005] In order to achieve the above purpose, the solution of the utility model is:

[0006] A capacitor comprises a capacitor forming die, a capacitor core group and a plurality of centering positioning blocks; the capacitor forming die is provided with a die cavity for encapsulating packaging materials; the lead terminals of the capacitor core group are fixed at the bottom of the die cavity; the centering positioning blocks are fixedly fitted on the surface of the capacitor core group and abut against the inner wall of the die cavity.

[0007] The capacitor forming mold is composed of a bottom plate, two large side plates and two small side plates spliced ​​together to form the mold cavity; the bottom plate, the large side plates and the small side plates are locked by bolts.

[0008] The bottom of the mold cavity is provided with an escape groove for evading the lead-out terminal; the lead-out terminal of the capacitor core group is downwardly placed in the escape groove and is connected and fixed by a fastener penetrating the capacitor forming mold.

[0009] The material of the centering positioning block is epoxy resin, polyurethane, PC, PBT, PS, ABS, PA, PA66, PE, PP, POM or PPS.

[0010] The lower surface of the centering positioning block is a plane, the upper surface of the centering positioning block is a plane with an area smaller than that of the lower surface, or the upper surface of the centering positioning block is an arc surface or a point.

[0011] After adopting the above technical solution, the utility model has the following technical effects:

[0012] The utility model installs a plurality of centering positioning blocks on the surface of the capacitor core group, and the centering positioning blocks abut against the inner wall of the mold cavity, so that the gap between the capacitor core group and the mold cavity is fixed and unchanged, and the shaking of the capacitor core group can be avoided. In the process of pouring the packaging material, the capacitor core group no longer shakes, and the thickness of the packaging material can be guaranteed to be uniform, the production defect rate of the shell-free capacitor is reduced, the minimum material thickness is guaranteed, and the moisture-proof performance of the shell-free capacitor is improved; because the centering positioning block is fixedly connected to the surface of the capacitor core group and is integrated with the packaging material after pouring the packaging material, the bonding degree between the capacitor core group and the packaging material can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional diagram of a specific embodiment of the utility model (with packaging materials);

[0014] Figure 2 It is a three-dimensional diagram of a specific embodiment of the utility model (without packaging material);

[0015] Figure 3 It is an exploded view of a specific embodiment of the utility model;

[0016] Figure 4 It is a vertical cross-sectional view of a specific embodiment of the utility model;

[0017] Figure 5 A cross-sectional view of a specific embodiment of the utility model ( Figure 4 Middle AA direction);

[0018] Figure 6 This is a schematic diagram of a first implementation of a centering positioning block in a specific embodiment of the utility model;

[0019] Figure 7 This is a schematic diagram of a second implementation of a centering positioning block in a specific embodiment of the utility model;

[0020] Figure 8 This is a schematic diagram of a third implementation of the centering positioning block in a specific embodiment of the utility model;

[0021] Fig. 9 This is a schematic diagram of a fourth implementation of the centering positioning block in a specific embodiment of the utility model;

[0022] Description of Figure Numbers:

[0023] 1-capacitor forming mold; 10-mold cavity; 11-bottom plate; 111-avoidance groove; 12-large side plate; 13-small side plate; 14-bolt;

[0024] 2-capacitor core group; 21-lead terminal;

[0025] 3-Center positioning block;

[0026] 4- Packaging materials;

[0027] 5- Fasteners. DETAILED DESCRIPTION

[0028] In order to further explain the technical solution of the present invention, the present invention is described in detail below through specific embodiments.

[0029] refer to Figures 1 to 7 As shown, the utility model discloses a capacitor, including a capacitor forming die 1, a capacitor core group 2 and a plurality of center positioning blocks 3;

[0030] The capacitor forming mold 1 is provided with a mold cavity 10 for encapsulating the packaging material 4;

[0031] The lead-out terminal 21 of the capacitor core group 2 is fixed to the bottom of the mold cavity 10;

[0032] The center positioning block 3 is fixedly fitted on the surface of the capacitor core group 2 and abuts against the inner wall of the mold cavity 10 .

[0033] Through the above scheme, the utility model installs a plurality of centering positioning blocks 3 on the surface of the capacitor core group 2, and the centering positioning blocks 3 abut against the inner wall of the mold cavity 10, so that the gap between the capacitor core group 2 and the mold cavity 10 is fixed, which can avoid the shaking of the capacitor core group 2. During the process of pouring the packaging material 4, the capacitor core group 2 no longer shakes, which can ensure the uniform thickness of the packaging material 4, reduce the production defect rate of the shell-less capacitor, ensure the minimum material thickness, and improve the moisture-proof performance of the shell-less capacitor; because the centering positioning block 3 is fixedly connected to the surface of the capacitor core group 2, and at the same time, it is integrated with the packaging material 4 after the packaging material 4 is poured, it can play a role in improving the bonding between the capacitor core group 2 and the packaging material 4.

[0034] Specific embodiments of the present utility model are shown below.

[0035] The capacitor forming mold 1 is composed of a bottom plate 11 , two large side plates 12 and two small side plates 13 , which are spliced ​​together to form the mold cavity 10 . The bottom plate 11 , the large side plates 12 and the small side plates 13 are locked with bolts 14 .

[0036] The bottom of the mold cavity 10 (i.e., the bottom plate 11) is provided with an escape groove 111 for escaping the lead-out terminal 21; the lead-out terminal 21 of the capacitor core group 2 is downwardly placed in the escape groove 111 and connected and fixed by a fastener 5 penetrating the capacitor molding mold 1. In this embodiment, the fastener 5 is a bolt.

[0037] The material of the centering positioning block 3 may be a filling resin such as epoxy resin, polyurethane, or an engineering plastic such as PC, PBT, PPS, PS, ABS, PA, PA66, PE, PP, POM, etc.

[0038] The height of the above-mentioned centering positioning block 3 is the minimum material thickness designed for the shellless capacitor. It is fixed on the capacitor core group 2 placed on the capacitor molding module 1, which limits the position deviation of the capacitor core group 2 caused by shaking. After the packaging material 4 is poured into the opening surface of the capacitor molding mold 1, the centering positioning block 3 can be integrated with the packaging material 4, wherein the lower surface of the centering positioning block 3 can be set to a plane of any shape, which is in contact with and fixed to the capacitor core group 2, and the upper surface of the centering positioning block 3 can be set to a plane, arc surface or point with a smaller area, so as to minimize the area of ​​the centering positioning block 3 exposed to the packaging material 4, so that the surface of the shellless capacitor has no obvious appearance defects after demolding, and a shellless capacitor with a more uniform thickness of the packaging material 4 can be obtained, thereby ensuring the minimum packaging material thickness.

[0039] See also Figures 6 to 9 , are some implementation methods of the above-mentioned centering positioning block 3:

[0040] See also Figure 6 The above-mentioned center positioning block 3 is a cone, and its upper and lower surfaces are both circular.

[0041] See also Figure 7 The center positioning block 3 is a cone, and its upper surface is an arc surface and its lower surface is a circle.

[0042] See also Figure 8 The above-mentioned center positioning block 3 is a cone, and its upper and lower surfaces are both square.

[0043] See also Fig. 9 The centering positioning block 3 comprises a cone and a column connected in one piece, and the upper surface of the cone and the lower surface of the column are both square.

[0044] The above embodiments and drawings do not limit the product form and style of the present utility model. Any appropriate changes or modifications made by ordinary technicians in the relevant technical field should be deemed to be within the patent scope of the present utility model.

Claims

1. A capacitor, characterized in that: It includes a capacitor forming die, a capacitor core group and a plurality of center positioning blocks; The capacitor forming mold is provided with a mold cavity for potting packaging materials; The lead-out terminals of the capacitor core group are fixed at the bottom of the mold cavity; The centering positioning block is fixedly fitted on the surface of the capacitor core group and abuts against the inner wall of the mold cavity.

2. The capacitor according to claim 1, wherein: The capacitor forming mold is composed of a bottom plate, two large side plates and two small side plates spliced ​​together to form the mold cavity; the bottom plate, the large side plates and the small side plates are locked by bolts.

3. The capacitor according to claim 1, wherein: The bottom of the mold cavity is provided with an escape groove for evading the lead-out terminal; the lead-out terminal of the capacitor core group is downwardly placed in the escape groove and is connected and fixed by a fastener penetrating the capacitor forming mold.

4. The capacitor according to claim 1, wherein: The material of the centering positioning block is epoxy resin, polyurethane, PC, PBT, PS, ABS, PA, PA66, PE, PP, POM or PPS.

5. The capacitor according to claim 1, wherein: The lower surface of the centering positioning block is a plane, and the upper surface of the centering positioning block is a plane with an area smaller than that of the lower surface.

6. The capacitor according to claim 1, wherein: The lower surface of the centering positioning block is a plane, and the upper surface of the centering positioning block is an arc surface or a point.

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