High-sensitivity flow chip packaging structure
By setting up a multi-layer heat dissipation plate and a thermally conductive copper plate in the chip packaging structure, the problem of difficulty in heat dissipation in the chip packaging structure is solved, a more efficient heat dissipation effect is achieved, and the service life of the chip is extended.
Patent Information
- Application Number
- CN202421552494.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-07-03
AI Technical Summary
The existing chip packaging structure has difficulties in heat dissipation, especially the heat dissipation at the bottom of the chip, which leads to long-term high-heat operation of the chip and causes damage.
A high-sensitive flow chip packaging structure is designed, and a first inner heat dissipation plate and a first outer heat dissipation plate are arranged in the outer shell, and a combination of the second thermally conductive copper plate and the packaging cover plate is used to realize multi-faceted heat dissipation of the chip.
Through this structure, the heat dissipation efficiency of the chip is improved, and heat at the bottom of the chip is avoided directly transmitted to the circuit board, thereby extending the service life of the chip.
Smart Images
Figure CN222749485U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip packaging, in particular to a high-sensitivity flow chip packaging structure. Background Art
[0002] Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to place the high-sensitivity flow chip produced by the foundry in a protective shell, lead out the pins, and then fix the package into a whole. The packaging assembly technology is to protect the high-sensitivity flow chip with the integrated circuit formed therein from the influence of the external environment, and to facilitate the installation of the high-sensitivity flow chip in the shell, thereby ensuring the operational reliability of the high-sensitivity flow chip.
[0003] When the existing high-sensitivity flow chip is packaged, since there are many semiconductor resistors inside the high-sensitivity flow chip, a large amount of heat will be generated when the high-sensitivity flow chip is working. Generally, the chip packaging structure will set heat sinks at the upper and lower ends to ensure the normal operation of the semiconductor chip. However, the chip package is usually installed on a circuit board, so that the heat conducted by the heat sink at the bottom of the chip package is directly conducted to the circuit board. The circuit board has poor heat absorption efficiency, making it difficult to dissipate heat from the bottom of the chip package. In addition, heat sinks are generally not set on both sides of the conventional chip package, so that when the chip in the chip package is working, the heat at both ends of the chip is difficult to conduct out for heat dissipation, and long-term high-temperature operation will cause great damage to the chip.
[0004] In view of the above technical defects, a solution is now proposed. Utility Model Content
[0005] The purpose of the utility model is to provide a high-sensitivity flow chip packaging structure to solve the above-mentioned technical defects.
[0006] The purpose of the utility model can be achieved through the following technical solutions:
[0007] A highly sensitive flow chip packaging structure comprises an outer shell, wherein a chip mounting slot is provided inside the outer shell, and four second mounting slots distributed in an array are further provided at the bottom of the chip mounting slot, wherein a first heat-conducting copper plate is provided inside each of the second mounting slots, and a first internal heat dissipation plate is fixedly connected above the first heat-conducting copper plate;
[0008] A high-sensitivity flow chip is placed above the first inner heat sink, eight pins are fixed on both sides of the high-sensitivity flow chip, PC connecting plates are sleeved on the outside of the pins on both sides of the high-sensitivity flow chip, and a packaging cover is also provided above the outer shell.
[0009] Preferably, eight first mounting grooves distributed in an array are provided on both sides of the chip mounting groove, and a groove is further provided on the bottom of the outer shell.
[0010] Preferably, a first external heat sink fixedly connected to the lower portion of the first thermally conductive copper plate is provided, the first external heat sink is located inside the slot, third mounting slots are provided at both ends of the first external heat sink, and the lowest point of the first external heat sink is higher than the lowest point of the outer shell.
[0011] Preferably, the high-sensitivity flow chip is located in the chip mounting groove, and heat dissipation silicone grease is coated between the high-sensitivity flow chip and the first inner heat dissipation plate.
[0012] Preferably, the PC connecting plate is made of insulating material, and a second inner heat dissipation plate is placed between both sides of the high-sensitivity flow chip and the inner wall of the outer shell, and eight slide grooves are provided at the bottom of the second inner heat dissipation plate.
[0013] Preferably, an array-distributed fixing groove is provided at the upper end of the second inner heat dissipation plate, and the outer shell is slidably connected between the fixing groove and the first mounting groove. A second outer heat dissipation plate is also fixedly provided on one side of the second inner heat dissipation plate, and the second outer heat dissipation plate is located on the outside of the outer shell.
[0014] Preferably, a third inner heat sink is fixedly provided below the packaging cover plate, and the third inner heat sink is extended into the chip mounting groove and pressed on the top of the high-sensitivity flow chip, and heat dissipation silicone grease is coated between the third inner heat sink and the high-sensitivity flow chip, and an array-distributed first mounting groove root heat dissipation fins are provided above the packaging cover plate, and fourth mounting grooves are provided at both ends of the packaging cover plate, and a fixing hole is provided above the fourth mounting groove.
[0015] Preferably, symmetrically distributed second thermally conductive copper plates are provided at both ends of the outer shell, a threaded hole is provided above the second thermally conductive copper plate, one side of the lower end of the second thermally conductive copper plate is inserted into the third mounting groove, one side of the upper end of the second thermally conductive copper plate is inserted into the fourth mounting groove, and a threaded fixing screw is also provided inside the threaded hole, and the fixing screw is also located in the fixing hole.
[0016] The beneficial effects of the utility model are as follows:
[0017] The utility model applies heat dissipation silicone grease on the top of the first inner heat dissipation plate in the outer shell, and then places the high-sensitivity flow chip with the PC connection plate on the top of the first inner heat dissipation plate, compacts it, and then sets two second inner heat dissipation plates between the high-sensitivity flow chip and the inner wall of the outer shell, so as to fix the high-sensitivity flow chip, and then applies heat dissipation silicone grease on the top of the high-sensitivity flow chip, and covers the third inner heat dissipation plate with the high-sensitivity flow chip, and then inserts one side of the lower end of the second heat-conducting copper plate into the third installation groove, and inserts one side of the upper end of the second heat-conducting copper plate into the fourth installation groove;
[0018] Then, a fixing screw is inserted into the fixing hole, and the bottom end of the fixing screw is screwed into the threaded hole to fix the second thermally conductive copper plate and the packaging cover plate, thereby completing the packaging process. In this device, the second inner heat sink and the second outer heat sink dissipate heat on the side of the chip, and in this device, the bottom of the first outer heat sink at the bottom of the outer shell does not contact the circuit board, so that the heat conducted by the chip is not directly conducted to the circuit board, but is conducted to the packaging cover plate through the second thermally conductive copper plate, and then dissipated through the heat dissipation fins, so that the heat dissipation efficiency of the device is better. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The utility model is further described below in conjunction with the accompanying drawings;
[0020] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0021] Figure 2 It is a schematic cross-sectional view of the overall structure of the utility model;
[0022] Figure 3 It is a schematic diagram of the overall structure of the outer shell in the utility model;
[0023] Figure 4 It is a schematic diagram of the connection structure between the first inner heat sink and the first outer heat sink in the utility model;
[0024] Figure 5 This is a schematic diagram of the installation structure of the high-sensitivity flow chip in the outer shell of the utility model;
[0025] Figure 6 It is a schematic diagram of the connection structure between the outer shell and the second inner heat sink in the utility model;
[0026] Figure 7 It is a schematic diagram of the connection structure between the third external heat sink and the heat sink fins in the utility model;
[0027] Figure 8 It is a schematic diagram of the overall structure of the second heat-conducting copper plate and the fixing screws of the utility model.
[0028] Legend: 1. Outer shell; 11. Chip mounting slot; 12. First mounting slot; 13. Second mounting slot; 14. Slot; 15. First inner heat sink; 16. First thermal copper plate; 17. First outer heat sink; 18. Third mounting slot; 19. High-sensitivity flow chip; 20. Pin; 21. PC connecting board; 22. Second inner heat sink; 23. Slide slot; 24. Fixing slot; 25. Second outer heat sink; 26. Package cover; 27. Fourth mounting slot; 28. Fixing hole; 29. Heat sink fin; 30. Third inner heat sink; 31. Second thermal copper plate; 32. Threaded hole; 33. Fixing screw. DETAILED DESCRIPTION
[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0030] See also Figure 1 - Figure 8 As shown, the utility model is a high-sensitivity flow chip packaging structure, including an outer shell 1, a chip mounting groove 11 is provided inside the outer shell 1, eight first mounting grooves 12 distributed in an array are provided on both sides of the chip mounting groove 11, four second mounting grooves 13 distributed in an array are also provided at the bottom of the chip mounting groove 11, a groove 14 is also provided at the bottom of the outer shell 1, a first heat-conducting copper plate 16 is provided inside the second mounting groove 13, and a first inner heat dissipation plate 15 fixedly connected is provided above the first heat-conducting copper plate 16.
[0031] A first external heat sink 17 is fixedly connected below the first heat-conducting copper plate 16. The first external heat sink 17 is located inside the slot 14. Third mounting slots 18 are provided at both ends of the first external heat sink 17. The lowest point of the first external heat sink 17 is higher than the lowest point of the outer shell 1, so that after the chip in the device is packaged, the heat will not be directly conducted to the circuit board on which it is installed when the bottom of the chip dissipates heat.
[0032] A high-sensitivity flow chip 19 is placed above the first inner heat sink 15. The high-sensitivity flow chip 19 is located in the chip mounting groove 11. Heat dissipation silicone grease is coated between the high-sensitivity flow chip 19 and the first inner heat sink 15. Eight pins 20 are fixed on both sides of the high-sensitivity flow chip 19. When the high-sensitivity flow chip 19 is installed, the pins 20 are slidably matched with the first mounting groove 12.
[0033] The outside of the pins 20 on both sides of the high-sensitivity flow chip 19 are sleeved with PC connecting boards 21, and the PC connecting boards 21 connect the eight pins 20 on one side into a whole, and the PC connecting boards 21 are made of insulating material, so that any pin 20 on the outside of the high-sensitivity flow chip 19 is not easily broken when the device is installed. A second inner heat sink 22 is also placed between the two sides of the high-sensitivity flow chip 19 and the inner wall of the outer shell 1, and eight slide grooves 23 are opened at the bottom of the second inner heat sink 22, and the slide grooves 23 are slidably connected with the pins 20 during installation.
[0034] When the second inner heat sink 22 is installed, the bottom of the second inner heat sink 22 contacts the top of the first inner heat sink 15. The upper end of the second inner heat sink 22 is also provided with an array of fixing grooves 24. The outer shell 1 between the fixing grooves 24 and the first installation grooves 12 is slidably connected. A second outer heat sink 25 is also fixedly provided on one side of the second inner heat sink 22. The second outer heat sink 25 is located on the outside of the outer shell 1. When in use, the heat emitted from the side of the high-sensitivity flow chip 19 is absorbed by the second inner heat sink 22, and then the heat is conducted to the second outer heat sink 25 for dissipation.
[0035] A packaging cover plate 26 is also provided above the outer shell 1, and a third inner heat sink 30 is fixedly provided below the packaging cover plate 26. The third inner heat sink 30 extends into the chip mounting groove 11 and is pressed above the high-sensitivity flow chip 19. Heat dissipation silicone grease is coated between the third inner heat sink 30 and the high-sensitivity flow chip 19. Twelve heat dissipation fins 29 distributed in an array in the first mounting groove 11 are provided above the packaging cover plate 26. Fourth mounting grooves 27 are also provided at both ends of the packaging cover plate 26, and fixing holes 28 are provided above the fourth mounting groove 27.
[0036] A symmetrically distributed second thermally conductive copper plate 31 is provided at both ends of the outer shell 1, a threaded hole 32 is provided above the second thermally conductive copper plate 31, one side of the lower end of the second thermally conductive copper plate 31 is inserted into the third mounting groove 18, and one side of the upper end of the second thermally conductive copper plate 31 is inserted into the fourth mounting groove 27, and a threaded fixing screw 33 is also provided inside the threaded hole 32, and the fixing screw 33 is also located in the fixing hole 28.
[0037] The working process and principle of the utility model are as follows:
[0038] During packaging, the outer shell 1 is first placed on a fixed processing table. At this time, the outer shell 1 is connected to the first inner heat sink 15, the first heat-conducting copper plate 16, the first outer heat sink 17, and the third mounting groove 18. Then, heat dissipation silicone grease is applied on the first inner heat sink 15. Then, the high-sensitivity flow chip 19 with the PC connecting plate 21 is placed on the first inner heat sink 15 for compaction. Then, two second inner heat sinks 22 are set between the high-sensitivity flow chip 19 and the inner wall of the outer shell 1, so as to fix the high-sensitivity flow chip 19.
[0039] Then apply heat dissipation silicone grease on the top of the high-sensitivity flow chip 19, align the third inner heat dissipation plate 30 with the high-sensitivity flow chip 19 and cover it, then insert the lower end of the second thermally conductive copper plate 31 into the third mounting groove 18, and insert the upper end of the second thermally conductive copper plate 31 into the fourth mounting groove 27, and then insert the fixing screw 33 through the fixing hole 28, and screw the bottom end of the fixing screw 33 into the threaded hole 32 to fix the second thermally conductive copper plate 31 to the packaging cover plate 26, thereby completing the packaging process.
[0040] In the description of this specification, the description with reference to the terms "one embodiment", "example", "specific example", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0041] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is only limited by the claims and their full scope and equivalents.
Claims
1. A high-sensitivity flow chip packaging structure, comprising an outer shell (1), characterized in that: A chip mounting groove (11) is provided inside the outer shell (1), and four second mounting grooves (13) distributed in an array are provided at the bottom of the chip mounting groove (11), and a first heat-conducting copper plate (16) is provided inside each of the second mounting grooves (13), and a first internal heat dissipation plate (15) is fixedly connected above the first heat-conducting copper plate (16); A high-sensitivity flow chip (19) is placed above the first inner heat sink (15), eight pins (20) are fixedly provided on both sides of the high-sensitivity flow chip (19), PC connecting plates (21) are sleeved on the outside of the pins (20) on both sides of the high-sensitivity flow chip (19), and a packaging cover plate (26) is also provided above the outer shell (1).
2. A high-sensitivity flow chip packaging structure according to claim 1, characterized in that: Eight first mounting grooves (12) distributed in an array are provided on both sides of the chip mounting groove (11), and a groove (14) is also provided on the bottom of the outer shell (1).
3. A high-sensitivity flow chip packaging structure according to claim 1, characterized in that: A first external heat dissipation plate (17) is fixedly connected below the first heat-conducting copper plate (16), the first external heat dissipation plate (17) is located inside the slot (14), third mounting slots (18) are provided at both ends of the first external heat dissipation plate (17), and the lowest point of the first external heat dissipation plate (17) is higher than the lowest point of the outer shell (1).
4. A high-sensitivity flow chip packaging structure according to claim 1, characterized in that: The high-sensitivity flow chip (19) is located in the chip mounting groove (11), and heat dissipation silicone grease is coated between the high-sensitivity flow chip (19) and the first inner heat dissipation plate (15).
5. The high-sensitivity flow chip packaging structure according to claim 1, characterized in that: The PC connecting plate (21) is made of insulating material. A second inner heat sink (22) is placed between the two sides of the high-sensitivity flow chip (19) and the inner wall of the outer shell (1). The bottom of the second inner heat sink (22) is provided with eight slide grooves (23).
6. A high-sensitivity flow chip packaging structure according to claim 5, characterized in that: The upper end of the second inner heat dissipation plate (22) is also provided with an array of fixed grooves (24), the outer shell (1) is slidably connected between the fixed groove (24) and the first mounting groove (12), and a second outer heat dissipation plate (25) is also fixedly provided on one side of the second inner heat dissipation plate (22), the second outer heat dissipation plate (25) being located on the outer side of the outer shell (1).
7. The high-sensitivity flow chip packaging structure according to claim 1, characterized in that: A third inner heat sink (30) is fixedly provided below the packaging cover plate (26); the third inner heat sink (30) extends into the chip mounting groove (11) and is pressed against the top of the high-sensitivity flow chip (19); heat dissipation silicone grease is coated between the third inner heat sink (30) and the high-sensitivity flow chip (19); a first mounting groove (12) and heat dissipation fins (29) distributed in an array are provided above the packaging cover plate (26); fourth mounting grooves (27) are provided at both ends of the packaging cover plate (26); and a fixing hole (28) is provided above the fourth mounting groove (27).
8. The high-sensitivity flow chip packaging structure according to claim 1, characterized in that: The two ends of the outer shell (1) are provided with symmetrically distributed second heat-conducting copper plates (31), a threaded hole (32) is provided above the second heat-conducting copper plate (31), one side of the lower end of the second heat-conducting copper plate (31) is inserted into the third mounting groove (18), and one side of the upper end of the second heat-conducting copper plate (31) is inserted into the fourth mounting groove (27), and a threaded fixing screw (33) is also provided inside the threaded hole (32), and the fixing screw (33) is also located in the fixing hole (28).