An ultra-small horizontal surface mount connector

Abstract

The utility model relates to an ultra-small horizontal surface-mount connector, including: an inner conductor, an insulating medium and an outer conductor, a through hole is provided at the center of the outer conductor, the insulating medium is installed in the right end of the through hole, the inner conductor is fixed in the insulating medium, the right end of the inner conductor is provided with an inner conductor microstrip, the left end of the inner conductor extends from the left end of the insulating medium and is located in the outer conductor; a soldering piece is provided at the right end of the outer conductor, two soldering pieces are provided, the two soldering pieces are symmetrically arranged on both sides of the inner conductor microstrip, and the soldering piece and the inner conductor microstrip are arranged flush; positioning surfaces are provided on both sides of the outer conductor, the positioning surfaces are L-shaped, and the lower surface of the soldering piece is flush with the upper surface of the positioning surface. After adopting such a scheme, the volume and weight can be effectively reduced, and at the same time, the effect of a bent connector is achieved by using a straight connector, avoiding the defect of right-angle transition in transmission, and greatly improving the electrical performance.

Description

Technical Field

[0001] The utility model relates to an ultra-small horizontal surface-mount connector. Background Art

[0002] In the electronics manufacturing industry, reflow soldering, as an automated production process, has greatly improved soldering efficiency and soldering quality stability. Reflow soldering technology is widely used in large-scale, high-density electronic component assembly and connection.

[0003] With the miniaturization of electronic components, the coaxial surface mount connectors used in reflow soldering are getting smaller and smaller. At present, the ultra-small horizontal surface mount connectors on the market are mostly vertical surface mount connectors between connectors and printed circuit boards. The horizontal surface mount connection between connectors and printed circuit boards is mostly achieved by right-angle surface mount connectors. On the one hand, right-angle surface mount connectors are limited by their "L"-shaped structure, and their volume and weight are often much larger than straight connectors; on the other hand, due to the right-angle transition defect of transmission, the RF electrical performance indicators are poor. In this context, it is urgent to solve the problem of ultra-small horizontal surface mount connectors. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide an ultra-small horizontal surface-mount connector, which can effectively reduce the volume and weight, and at the same time achieve the effect of a bent connector by using a straight connector, avoiding the defect of right-angle transition in transmission, and greatly improving the electrical performance.

[0005] In order to solve the above technical problems, the technical solutions provided by the utility model are as follows:

[0006] A subminiature horizontal surface mount connector, comprising: an inner conductor, an insulating medium and an outer conductor, wherein a through hole is provided at the center of the outer conductor, the insulating medium is installed in the right end of the through hole, the inner conductor is fixed in the insulating medium, the right end of the outer conductor is a plane, the right end of the inner conductor is provided with an inner conductor microstrip, the left end of the inner conductor extends from the left end of the insulating medium and is located in the outer conductor; a soldering piece is provided at the right end of the outer conductor, two soldering pieces are provided, and the two soldering pieces are symmetrically arranged on both sides of the inner conductor microstrip, the thickness of the soldering piece is the same as the diameter of the inner conductor microstrip, the soldering piece and the inner conductor microstrip are arranged flush, and the length of the soldering piece is the same as the length of the inner conductor microstrip; positioning surfaces are provided on both sides of the outer conductor, the positioning surface is L-shaped, and the lower surface of the soldering piece is flush with the upper surface of the positioning surface.

[0007] Preferably: the left end of the through hole is an SMP pin-type interface hole.

[0008] Preferably: a limiting protrusion is provided in the through hole, the limiting protrusion extends circumferentially along the inner wall of the through hole, and the left end step surface of the insulating medium abuts against the limiting protrusion; a groove is provided on the inner wall of the through hole, the groove is located on the right side of the limiting protrusion, the groove extends circumferentially along the inner wall of the through hole, and a protrusion is provided on the outer side of the insulating medium, and the protrusion fits in the groove.

[0009] Preferably, the upper surface of the outer conductor is a plane.

[0010] The beneficial effect of the utility model is that when the connector is used, a hole is first processed on the printed circuit board, and then a layer of solder paste is evenly applied to the grounding part and microstrip of the hole on the printed circuit board, and then the lower end of the outer conductor is clamped in the hole of the printed circuit board. Due to the existence of the positioning surface, the outer conductor can be installed in a precise position; then the welding piece is in contact with the grounding part of the printed circuit board, and the microstrip of the inner conductor is in contact with the microstrip of the printed circuit board, and then the contact parts are welded together by using the reflow soldering technology to complete the connection between the connector and the printed circuit board, so that the effect of the bent connector is achieved by using the straight connector, the defect of the right-angle transition of the transmission is avoided, the electrical performance is greatly improved, and the volume and weight of the connector are effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments:

[0012] Figure 1 It is a cross-sectional view of an embodiment of the ultra-small horizontal surface mount connector of the utility model;

[0013] Figure 2 A top view of an embodiment of the ultra-small horizontal surface mount connector of the utility model;

[0014] Figure 3 The three-dimensional embodiment of the ultra-small horizontal surface mount connector of the utility model Figure 1 ;

[0015] Figure 4 The three-dimensional embodiment of the ultra-small horizontal surface mount connector of the utility model Figure 2 ;

[0016] Figure 5 The three-dimensional embodiment of the ultra-small horizontal surface mount connector of the utility model Figure 3 .

[0017] in:

[0018] 1. Inner conductor; 11. Inner conductor microstrip;

[0019] 2. Insulating medium; 21. Protrusion;

[0020] 3. outer conductor; 31. through hole; 311. limiting protrusion; 312. groove; 32. welding piece; 33. positioning surface. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0022] In the description of the present invention, it is necessary to understand that the directions and positional relationships indicated by “up”, “down”, “left”, “right”, “front”, “back”, “vertical”, “bottom”, “inside” and “outside” are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0023] like Figure 1 and Figure 5 As shown,

[0024] A subminiature horizontal surface mount connector comprises: an inner conductor 1, an insulating medium 2 and an outer conductor 3, wherein a through hole 31 is arranged at the center of the outer conductor 3, the left end of the through hole 31 is an SMP pin-type interface hole, the insulating medium 2 is installed in the right end of the through hole 31, the inner conductor 1 is fixed in the insulating medium 2, the right end of the outer conductor 3 is a plane, the right end of the inner conductor 1 is arranged with an inner conductor microstrip 11, the left end of the inner conductor 1 extends from the left end of the insulating medium 2 and is located in the outer conductor 3; a soldering piece 32 is arranged at the right end of the outer conductor 3, two soldering pieces 32 are arranged, the two soldering pieces 32 are symmetrically arranged on both sides of the inner conductor microstrip 11, the thickness of the soldering piece 32 is the same as the diameter of the inner conductor microstrip 11, the soldering piece 31 and the inner conductor microstrip 11 are arranged flush, and the length of the soldering piece 32 is the same as the length of the inner conductor microstrip 11; positioning surfaces 33 are arranged on both sides of the outer conductor 3, the positioning surface 33 is L-shaped, and the lower surface of the soldering piece 32 is flush with the upper surface of the positioning surface 33.

[0025] In this way, when the connector is in use, a hole is first processed on the printed circuit board, and then a layer of solder paste is evenly applied to the grounding part of the hole and the microstrip on the printed circuit board, and then the lower end of the outer conductor 3 is clamped in the hole of the printed circuit board. Due to the presence of the positioning surface 33, the outer conductor 3 can be installed in a precise position; then the welding piece 31 contacts the ground of the printed circuit board, and the inner conductor microstrip 11 contacts the microstrip of the printed circuit board, and then the reflow soldering technology is used to weld the contact parts together to complete the connection between the connector and the printed circuit board, thereby achieving the effect of a bent connector by using a straight connector, avoiding the right-angle transition defect of the transmission, greatly improving the electrical performance, and effectively reducing the size and weight of the connector.

[0026] In addition, a limiting protrusion 311 is provided in the through hole 31, and the limiting protrusion 311 extends circumferentially along the inner wall of the through hole 31, and the left end step surface of the insulating medium 2 abuts against the limiting protrusion 311; a groove 312 is provided on the inner wall of the through hole 31, and the groove 312 is located on the right side of the limiting protrusion 311. The groove 312 extends circumferentially along the inner wall of the through hole 31, and a protrusion 21 is provided on the outer side of the insulating medium 2, and the protrusion 21 fits in the groove 312.

[0027] In this way, due to the existence of the limiting protrusion 311, the insulating medium 2 is easy to position during installation; at the same time, because the protrusion 21 is matched in the groove 312, the insulating medium 2 can be better positioned and fixed.

[0028] In addition, the upper surface of the outer conductor 3 is a plane.

[0029] In this way, processing the upper surface of the outer conductor 3 into a flat surface can reduce the volume and weight of the outer conductor 3 .

[0030] In short, the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An ultra-small horizontal surface mount connector, characterized in that: include: An inner conductor, an insulating medium and an outer conductor, wherein a through hole is provided at the center of the outer conductor, the insulating medium is installed in the right end of the through hole, the inner conductor is fixed in the insulating medium, the right end of the outer conductor is a plane, the right end of the inner conductor is provided with an inner conductor microstrip, the left end of the inner conductor extends from the left end of the insulating medium and is located in the outer conductor; a welding piece is provided at the right end of the outer conductor, two welding pieces are provided, and the two welding pieces are symmetrically arranged on both sides of the inner conductor microstrip, the thickness of the welding piece is the same as the diameter of the inner conductor microstrip, and the welding piece and the inner conductor microstrip are arranged flush, and the length of the welding piece is the same as the length of the inner conductor microstrip; positioning surfaces are provided on both sides of the outer conductor, the positioning surface is L-shaped, and the lower surface of the welding piece is flush with the upper surface of the positioning surface.

2. The ultra-small horizontal surface mount connector according to claim 1, characterized in that: The left end of the through hole is an SMP pin-type interface hole.

3. The ultra-small horizontal surface mount connector according to claim 1, characterized in that: A limiting protrusion is arranged in the through hole, and the limiting protrusion extends circumferentially along the inner wall of the through hole, and the left end step surface of the insulating medium abuts against the limiting protrusion; a groove is arranged on the inner wall of the through hole, and the groove is located on the right side of the limiting protrusion, and the groove extends circumferentially along the inner wall of the through hole, and a protrusion is arranged on the outer side of the insulating medium, and the protrusion fits in the groove.

4. The ultra-small horizontal surface mount connector according to claim 1, characterized in that: The upper surface of the outer conductor is a plane.

Images