A heat dissipation type motor driver
By setting a sheet, water pipe and semiconductor refrigeration sheet on the top of the stepping drive of the motor driver, and equipped with a cooling fan and a mini water pump, a more efficient heat dissipation effect is achieved, solving the problem of poor heat dissipation effect in the prior art.
Patent Information
- Application Number
- CN202421258047.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-06-04
AI Technical Summary
The heat dissipation effect of existing motor drivers is poor, mainly because only heat sinks are installed on the top of the driver, the heat exchange area is small and the heat dissipation efficiency is low.
A heat-dissipation motor driver is designed, and a thin sheet is provided on the top of the stepper driver. A water pipe and a semiconductor refrigeration sheet are installed on the sheet. The top of the refrigeration sheet is equipped with fins and a cooling fan. It is fixed together by connecting frames and fixing bolts. The semiconductor refrigeration sheet and water pipe are supplied with power through a wiring tube. When the temperature reaches a certain level, the temperature sensor triggers the work of the refrigeration sheet, the cooling fan and the micro water pump, and uses the cooling water and the cooling effect to cool down.
This design significantly improves the heat dissipation effect of the motor driver, effectively reduces the temperature of the stepper driver, and solves the problem of poor heat dissipation effect in the prior art.
Smart Images
Figure CN222750344U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of drivers, in particular to a heat dissipation type motor driver. Background Art
[0002] A motor driver is an actuator that converts electrical pulses into angular displacement. When the driver receives a pulse signal, it drives the motor to rotate in the set direction. When ordinary switches or electronic components cannot be used as switches to control the motor, a driver must be added to control the motor. The driver can also be used to adjust the speed of the motor and control the forward and reverse rotation of the motor by controlling the pulse frequency. During use, the motor driver often generates a lot of heat.
[0003] In the prior art, generally only a heat sink is provided on the top of the motor driver, which has a small heat dissipation range and only exchanges heat with the air, resulting in poor heat dissipation effect. Utility Model Content
[0004] The utility model aims to solve the disadvantage of poor heat dissipation effect in the prior art and proposes a heat dissipation type motor driver.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a heat dissipation type motor driver, including a stepper driver, a thin sheet is provided on the top of the stepper driver, a water pipe is provided on the top of the thin sheet, a cold source box is provided on one side of the stepper driver, and fixing frames are provided on both sides of the cold source box, a semiconductor refrigeration sheet is provided on the top of the thin sheet, three wire grooves are provided on the surface of the water pipe, a wiring tube is provided on the surface of the stepper driver, a temperature sensor is provided on the bottom of the wiring tube, a fin is provided on the top of the semiconductor refrigeration sheet, a cooling fan is provided on the top of the fin, a micro water pump is provided on one side of the cold source box, two connecting frames are provided on both sides of the stepper driver and the cooling fan, and fixing bolts are provided on one side of the four connecting frames.
[0006] Preferably, the four connecting frames are symmetrically arranged in pairs at both ends of the surface of the stepper driver, and the position of the connecting frame of the cooling fan is consistent with the position of the connecting frame on the surface of the stepper driver.
[0007] Preferably, the connecting frames are welded to the surfaces of the stepper driver and the cooling fan, and the stepper driver and the cooling fan are connected together by fixing bolts.
[0008] Preferably, the thin sheet, water pipe and semiconductor cooling sheet are all set up between the stepping driver and the cooling fan.
[0009] Preferably, the thin sheet is installed on the surface of the stepper driver, the water pipe and the semiconductor refrigeration sheet are installed on the top surface of the thin sheet, and the three wire troughs are all set up on a side close to the wiring pipe.
[0010] Preferably, the cold source box is mounted on the stepping driver through the cooperation of fixing bolts and a fixing frame, and the micro water pump is mounted on the cold source box.
[0011] Preferably, one end of the water pipe is mounted on the micro water pump, and the other end of the water pipe is mounted on the cold source box, and the wiring pipe is set up on the surface of the stepper driver away from the cold source box.
[0012] Beneficial Effects
[0013] In the utility model, a thin sheet is provided on the top of a stepper driver, a water pipe and a semiconductor refrigeration sheet are installed on the top surface of the thin sheet, fins are installed on the top of the water pipe and the semiconductor refrigeration sheet, a cooling fan is installed on the top of the fin, the stepper driver and the cooling fan are connected together by a connecting frame and fixed with fixing bolts, when the stepper driver and the cooling fan are fixed together, the thin sheet, water pipe, semiconductor refrigeration sheet and fin between the stepper driver and the cooling fan are squeezed and fixed together, the route of the semiconductor refrigeration sheet is connected together through a wiring pipe for unified power supply, when in use, a temperature sensor on the surface of the stepper driver will detect the temperature of the stepper driver, when the temperature reaches a certain level, the temperature sensor will transmit the collected information to the controller through an electrical signal, the controller receives the information and processes the information and transmits the processed signal to the semiconductor refrigeration sheet, the cooling fan and the micro water pump through an electrical signal, the semiconductor refrigeration sheet is powered on to start cooling, and the micro water pump will also transport the cooling water inside the cold source box to the water pipe, the cooling water circulating inside the semiconductor refrigeration sheet and the water pipe is used to cool the stepper driver, and the disadvantage of poor heat dissipation effect is solved. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is an isometric view of the utility model;
[0015] Figure 2 It is a left and right isometric view of the utility model;
[0016] Figure 3 It is a front view of the utility model;
[0017] Figure 4 For the utility model Figure 3 A cross-sectional view of
[0018] Figure 5 It is a partial isometric drawing of the utility model;
[0019] Figure 6 It is a partial stereogram of the utility model.
[0020] Legend:
[0021] 1. Stepper driver; 2. Fins; 3. Cooling fan; 4. Fixing frame; 5. Cold source box; 6. Connecting frame; 7. Fixing bolts; 8. Wiring pipe; 9. Semiconductor cooling sheet; 10. Thin sheet; 11. Water pipe; 12. Wire trough; 13. Temperature sensor; 14. Micro water pump. DETAILED DESCRIPTION
[0022] In order to make the technical means, creative features, objectives and effects of the present invention easy to understand, the present invention is further described below in conjunction with specific embodiments and drawings, but the following embodiments are only preferred embodiments of the present invention, not all. Based on the embodiments in the implementation mode, other embodiments obtained by those skilled in the art without creative work are all within the protection scope of the present invention.
[0023] The specific embodiments of the present utility model are described below in conjunction with the accompanying drawings. Specific embodiment one:
[0025] Reference Figure 1-6 A heat dissipation motor driver comprises a stepper driver 1, a thin sheet 10 is provided on the top of the stepper driver 1, a water pipe 11 is provided on the top of the thin sheet 10, a cold source box 5 is provided on one side of the stepper driver 1, a fixing frame 4 is provided on both sides of the cold source box 5, a semiconductor cooling sheet 9 is provided on the top of the thin sheet 10, three wire grooves 12 are provided on the surface of the water pipe 11, a wiring tube 8 is provided on the surface of the stepper driver 1, a temperature sensor 13 is provided at the bottom of the wiring tube 8, a fin 2 is provided on the top of the semiconductor cooling sheet 9, a cooling fan 3 is provided on the top of the fin 2, a micro water pump 14 is provided on one side of the cold source box 5, two connecting frames 6 are provided on both sides of the stepper driver 1 and the cooling fan 3, a fixing bolt 7 is provided on one side of the four connecting frames 6, the four connecting frames 6 are symmetrically arranged at both ends of the surface of the stepper driver 1, and the connecting frames 6 of the cooling fan 3 are arranged The position is consistent with the position of the connecting frame 6 on the surface of the stepper driver 1. The connecting frame 6 is welded to the surface of the stepper driver 1 and the cooling fan 3, and the stepper driver 1 and the cooling fan 3 are connected together by fixing bolts 7. The thin film 10, the water pipe 11 and the semiconductor refrigeration sheet 9 are all set up in the middle of the stepper driver 1 and the cooling fan 3. The thin film 10 is installed on the surface of the stepper driver 1, the water pipe 11 and the semiconductor refrigeration sheet 9 are installed on the top surface of the thin film 10, and the three wire grooves 12 are all set up on the side close to the wiring pipe 8. The cold source box 5 is installed on the stepper driver 1 by the cooperation of the fixing bolts 7 and the fixing frame 4. The micro water pump 14 is installed on the cold source box 5, one end of the water pipe 11 is installed on the micro water pump 14, and the other end of the water pipe 11 is installed on the cold source box 5, and the wiring pipe 8 is set on the surface of the stepper driver 1 away from the side of the cold source box 5.
[0026] A thin sheet 10 is provided on the top of the stepper driver 1. The thin sheet 10 is usually a thin iron sheet. When condensed water is generated when the semiconductor refrigeration sheet 9 is working, the thin sheet 10 will isolate the condensed water and the stepper driver 1 to prevent the condensed water from damaging the stepper driver 1. A water pipe 11 and five semiconductor refrigeration sheets 9 are installed on the top surface of the thin sheet 10. Fins 10 are installed on the top of the water pipe 11 and the semiconductor refrigeration sheet 9. A cooling fan 3 is installed on the top of the fin 10. The stepper driver 1 and the cooling fan 3 are connected together by a connecting frame 6 and fixed with fixing bolts 7. When the stepper driver 1 and the cooling fan 3 are fixed together, the thin sheet 10, the water pipe 11, the semiconductor refrigeration sheet 9 and the fins 2 between the stepper driver 1 and the cooling fan 3 are squeezed and fixed. Together, the routes of the semiconductor refrigeration sheets 9 are connected together through the wiring tube 8 for unified power supply, and the lines of the temperature sensor 13 will also be connected to the wiring tube 8. The wiring tube 8 is equipped with power lines and cables. The lines of the three semiconductor refrigeration sheets 9 separated by the water pipe 11 are connected to the wiring tube 8 through the wire groove 12 on the top surface of the water pipe 11. When in use, the temperature sensor 13 on the surface of the stepper driver 1 will detect the temperature of the stepper driver 1. The temperature sensor 13 is installed on the stepper driver 1 by screws. When the temperature reaches a certain level, the temperature sensor 13 will transmit the collected information to the controller through electrical signals. The controller receives the information and processes the information and transmits the processed signal to the semiconductor refrigeration sheet 9, the cooling fan 3 and The micro water pump 14 and the semiconductor refrigeration sheet 9 are powered on to start cooling. By creating an electric heat connection between the semiconductor chips and utilizing the thermoelectric effect generated when current passes through the electric heat connection, the effect of cooling one end and heating the other end is achieved. The cold side contacts the thin sheet 10 to dissipate heat to the stepper driver 1, and the hot side contacts the fin 2 and transfers the heat to the fin 2. The fin 2 dissipates heat by heat exchange with the air, thereby dissipating heat to the semiconductor refrigeration sheet 9. The cooling fan 3 on top of the fin 2 will also start working after receiving the electrical signal and is powered by connecting to a power source. There is an electric coil and a rotating magnet inside the cooling fan 3 motor. When current passes through the electric coil, a rotating magnetic field is generated. This rotating magnetic field drives the blades to rotate, thereby The plate 2 is blown to dissipate heat to further dissipate heat for the semiconductor refrigeration plate 9, and the micro water pump 14 is also started by the received electrical signal. The micro water pump 14 is usually driven by an electromagnetic drive, and the magnetic field generated by the electromagnetic coil drives the piston or diaphragm to move. The micro water pump 14 is usually composed of a plurality of one-way valves for controlling the direction of the fluid entering and exiting the pump. When the piston or diaphragm moves, the one-way delivery of the fluid is achieved through the coordinated work of the valves, so that the cooling water inside the cold source box 5 is delivered to the water pipe 11 and circulated in the water pipe 11. The micro water pump 14 is installed on the cold source box 5 by fixing bolts 7. When the cooling water inside the water pipe 11 circulates, the fins 2 on the top of the water pipe 11 will also dissipate heat for the water pipe 11, thereby dissipating the cooling water inside the water pipe 11.The cooling water that has been circulated further dissipates the heat of the stepper driver 1. The cooling water that has been circulated finally enters the cold source box 5 again through the water pipe 11 for recycling. The cooling water that circulates inside the semiconductor refrigeration sheet 9 and the water pipe 11 cools the stepper driver 1. Specific embodiment 2:
[0028] Reference Figure 1-6 Four blocks can be provided on the top surface of the thin film 10, and the blocks are set up at each corner of the thin film 10. The four blocks are connected together. The thin film 10 is installed on the stepper driver 1 by screws, and the bottom ends of the water pipe 11, the semiconductor cooling sheet 9 and the fin 2 are all installed in the middle of the blocks to prevent the thin film 10, the water pipe 11, the semiconductor cooling sheet 9 and the fin 2 from falling through the front and rear gaps when the stepper driver 1 moves.
[0029] In summary:
[0030] 1. A thin sheet 10 is provided on the top of the stepper driver 1, a water pipe 11 and a semiconductor cooling sheet 9 are installed on the top surface of the thin sheet 10, a fin 10 is installed on the top of the water pipe 11 and the semiconductor cooling sheet 9, and a cooling fan 3 is installed on the top of the fin 10. The stepper driver 1 and the cooling fan 3 are connected together through a connecting frame 6 and fixed with fixing bolts 7. When the stepper driver 1 and the cooling fan 3 are fixed together, the thin sheet 10, the water pipe 11, the semiconductor cooling sheet 9 and the fin 2 between the stepper driver 1 and the cooling fan 3 are squeezed and fixed together, and the route of the semiconductor cooling sheet 9 is connected together through a wiring pipe 8 for unified power supply. When in use, the temperature sensor 13 on the surface of the stepper driver 1 will detect the temperature of the stepper driver 1. When the temperature reaches a certain level, the temperature sensor 13 will transmit the collected information to the controller through an electrical signal. The controller receives the information and processes the information and transmits the processed signal to the semiconductor refrigeration chip 9, the cooling fan 3 and the micro water pump 14 through an electrical signal. The semiconductor refrigeration chip 9 is powered on to start cooling, and the micro water pump 14 will also transport the cooling water inside the cold source box 5 to the water pipe 11. The cooling water circulating inside the semiconductor refrigeration chip 9 and the water pipe 11 cools the stepper driver 1, thereby solving the disadvantage of poor heat dissipation effect.
[0031] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.
[0032] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. A heat dissipation motor driver, comprising a stepper driver (1), characterized in that: A thin sheet (10) is provided on the top of the stepper driver (1), a water pipe (11) is provided on the top of the thin sheet (10), a cold source box (5) is provided on one side of the stepper driver (1), and fixing frames (4) are provided on both sides of the cold source box (5), a semiconductor cooling sheet (9) is provided on the top of the thin sheet (10), three wire grooves (12) are provided on the surface of the water pipe (11), a wiring tube (8) is provided on the surface of the stepper driver (1), a temperature sensor (13) is provided at the bottom of the wiring tube (8), a fin (2) is provided on the top of the semiconductor cooling sheet (9), a cooling fan (3) is provided on the top of the fin (2), a micro water pump (14) is provided on one side of the cold source box (5), two connecting frames (6) are provided on both sides of the stepper driver (1) and the cooling fan (3), and fixing bolts (7) are provided on one side of the four connecting frames (6).
2. A heat dissipation type motor driver according to claim 1, characterized in that: The four connecting frames (6) are symmetrically arranged in pairs at the two ends of the surface of the stepper driver (1), and the position of the connecting frame (6) of the cooling fan (3) is consistent with the position of the connecting frame (6) on the surface of the stepper driver (1).
3. The heat dissipation motor driver according to claim 1, characterized in that: The connecting frames (6) are welded to the surfaces of the stepping driver (1) and the cooling fan (3), and the stepping driver (1) and the cooling fan (3) are connected together via fixing bolts (7).
4. The heat dissipation motor driver according to claim 1, characterized in that: The thin sheet (10), the water pipe (11) and the semiconductor cooling sheet (9) are all arranged between the stepping driver (1) and the cooling fan (3).
5. The heat dissipation type motor driver according to claim 1, characterized in that: The thin sheet (10) is mounted on the surface of the stepper driver (1), the water pipe (11) and the semiconductor cooling sheet (9) are mounted on the top surface of the thin sheet (10), and the three wire grooves (12) are all set on a side close to the wiring pipe (8).
6. The heat dissipation motor driver according to claim 1, characterized in that: The cold source box (5) is mounted on the stepping driver (1) through the cooperation of fixing bolts (7) and a fixing frame (4), and the micro water pump (14) is mounted on the cold source box (5).
7. The heat dissipation motor driver according to claim 1, characterized in that: One end of the water pipe (11) is mounted on the micro water pump (14), and the other end of the water pipe (11) is mounted on the cold source box (5), and the wiring pipe (8) is set on the surface of the stepping driver (1) on the side away from the cold source box (5).