A Bluetooth headset capable of dissipating heat
By introducing heat dissipation fins, telescopic devices and barrier devices into Bluetooth headphones, the existing Bluetooth headphones have been solved, the heat dissipation efficiency, unsuitable for different head types, and the problems of bare hair and frozen scalp are achieved, achieving more efficient heat dissipation and a more comfortable wearing experience.
Patent Information
- Application Number
- CN202421164474.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-27
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-05-27
AI Technical Summary
The existing Bluetooth headsets have low heat dissipation efficiency and no telescopic devices and barrier devices are installed, which leads to unsuitable for wearers of different head types and problems such as bare hair and freezing scalp.
A Bluetooth headset consisting of two headphone bodies, heat dissipation fins, telescopic device and barrier device are designed. The heat dissipation fins increase the heat dissipation area, the telescopic device allows the wearer to adjust the way the headset is worn, and the barrier device blocks the connecting rod from direct contact with the head through the adhesive cloth plate and adhesive cloth strip.
It improves the cooling efficiency of the headphones, adapts to the needs of different head wearers, and avoids the problems of hair skewing and scalp frozen.
Smart Images

Figure CN222750540U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of Bluetooth earphones, in particular to a Bluetooth earphone capable of dissipating heat. Background Art
[0002] Bluetooth headsets are hands-free headsets that apply Bluetooth technology, allowing users to avoid the entanglement of annoying wires and make calls easily in various ways. Since the advent of Bluetooth headsets, they have been a good tool for mobile business people to improve efficiency. The existing heat dissipation method of Bluetooth headsets is to open multiple heat dissipation holes on the outer surface of the headset and rely on the natural flow of air to achieve heat dissipation, but the heat dissipation efficiency is low.
[0003] At present, there is an existing Bluetooth headset capable of heat dissipation (such as patent number: CN212211352U), which discloses a Bluetooth headset capable of heat dissipation, including a first headset and a second headset, wherein a first connection block is fixedly installed on the top of the first headset, a second connection block is fixedly connected to the top of the second headset, a first connection rod is movably sleeved on one end of the top of the first connection block, and a second connection rod is movably sleeved on the other end of the top of the first connection block. In this Bluetooth headset capable of heat dissipation, the connection block has a width value not higher than three millimeters to reduce the contact area with the head, and the material is aluminum alloy, a material with good heat dissipation. The first heat dissipation hole dissipates heat at the contact between the first headset and the second headset and the ear, and the internal components are isolated by the groove made of extruded polystyrene foam board, so that the temperature will not be transmitted to the ear, and the heat can be dissipated to the outside of the headset through the second heat dissipation hole to achieve a high heat dissipation effect, and the high heat dissipation and strong heat insulation increase the comfort of using the headset in summer.
[0004] However, during the implementation of the above technical solution, it was found that there were at least the following technical problems:
[0005] 1. The existing device only dissipates heat by providing heat dissipation holes on the earphone, and the heat dissipation mostly relies on air flow to take away the heat in the earphone, which has the problem of low efficiency.
[0006] 2. The existing device is not provided with a telescopic device. Different wearers have different head shapes. The fixed-length connecting rod is not suitable for the wearer to adjust a comfortable wearing method.
[0007] 3. The existing device is not provided with a blocking device. When in use, the first connecting rod and the second connecting rod directly contact the head, which may cause the problem of hair sticking. In addition, when the weather is cold in autumn and winter, the first connecting rod and the second connecting rod directly contact the head, which may cause the problem of frozen scalp. Utility Model Content
[0008] 1. Technical issues to be resolved
[0009] In view of the deficiencies in the prior art, the utility model provides a Bluetooth headset capable of heat dissipation, which solves the technical problems of the prior art devices, such as low heat dissipation efficiency, difficulty in adjusting the wearer to a comfortable wearing position, and hair damage and scalp freezing.
[0010] (II) Technical solution
[0011] In order to achieve the above objectives, the present invention is implemented through the following technical solutions:
[0012] A heat-dissipating Bluetooth headset comprises two headset bodies, wherein the two headset bodies are provided with ear slots on opposite sides thereof, a baffle is fixedly installed on the inner side of one end of the headset body provided with the ear slot, a first heat dissipation system is arranged on the end of the headset body away from the ear slot, the two headset bodies are fixedly connected with a telescopic device, the telescopic device is slidably connected with a connecting device, the first heat dissipation system comprises heat dissipation fins, the heat dissipation fins are fixedly installed on one side of the headset body away from the ear slot, the heat dissipation fins pass through the headset body and directly contact with electronic components installed in the headset body, the telescopic device comprises a telescopic block, the telescopic block is fixedly connected to the top of the headset body, the connecting device comprises a first bow rod and a second bow rod, and both ends of the first bow rod and the second bow rod are fixedly connected to the two telescopic devices.
[0013] Preferably: a plurality of first heat dissipation holes are provided on the side of one end of the earphone body close to the heat dissipation fins, the first heat dissipation holes are connected to the electronic components inside the earphone body, and a reinforced heat dissipation hole is also provided on the end of the earphone body close to the heat dissipation fins, and the reinforced heat dissipation holes are disposed at the upper and lower ends of the heat dissipation fins.
[0014] Preferably, five damping grooves are provided on a side of the telescopic block away from the ear placement groove, and one end of the telescopic block away from the earphone body is slidably connected to two limit rods.
[0015] Preferably: the telescopic device also includes a connecting plate, which is fixedly connected to the two ends of the first bow rod and the second bow rod. There are two connecting plates. A sliding groove is provided at one end of the connecting plate close to the telescopic block. The top surface of the sliding groove is fixedly connected to the limit rod, and a damping block is fixedly arranged at one end of the inner side of the sliding groove close to the damping groove.
[0016] Preferably: the inner sides of the two connecting plates are fixedly connected with a cloth sticking plate, the cloth sticking plate is adhered with a wool sticking strip, the two wool sticking strips are fixedly connected with a cotton sleeve, and the cotton sleeve is in contact with the first bow rod and the second bow rod.
[0017] Preferably: a heat dissipation copper wire is arranged between the first bow-shaped rod and the second bow-shaped rod, the number of the heat dissipation copper wires is several, and the heat dissipation copper wire is fixedly connected to the gap between the first bow-shaped rod and the second bow-shaped rod.
[0018] (III) Beneficial effects
[0019] 1. The heat emitted by the electronic components inside the earphone body is first dissipated into the air by the first heat dissipation hole. The contact between the heat dissipation fins and the earphone body further increases the heat dissipation area. The heat dissipation fins conduct the heat inside the earphone body and dissipate it into the air. The heat dissipation fins conduct the heat inside the earphone body to assist the heat dissipation fins. The excess heat is conducted to the connecting plate through the telescopic block, and then to the heat dissipation copper wire through the first bow rod and the second bow rod fixedly connected to the connecting plate. A large range of gaps are provided between the heat dissipation copper wires, which greatly increases the heat dissipation capacity and dissipates the heat of the earphone body to a large extent. This solves the problem that the existing device only dissipates heat by providing heat dissipation holes on the earphone, and most of the heat dissipation relies on air flow to take away the heat in the earphone, which is inefficient.
[0020] Second, the telescopic block is driven out of the slide groove by pulling the earphone body, and the damping groove and the damping block are squeezed to increase the damping. The limit rod is used to maintain the connection between the telescopic block and the connecting plate and limit the stretching length of the telescopic block, thereby solving the problem that the existing device is not provided with a telescopic device and it is not easy for the wearer to adjust to the most comfortable wearing method.
[0021] 3. The wearer can adhere the sticky cloth plate fixed by the connecting plate to the sticky wool strip, and fix the cotton cover to the inner side of the first bow rod and the second bow rod to prevent the first bow rod and the second bow rod from directly contacting the head, thus solving the problem of existing devices that cause hair damage and frozen scalp. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings.
[0023] Figure 1 This is the overall structure diagram of the device of the utility model;
[0024] Figure 2 This is a semi-disassembled structural diagram of the entire device of the utility model;
[0025] Figure 3 This is a structural diagram of the connection device of the utility model;
[0026] Figure 4 This is a structural diagram of the earphone body of the utility model;
[0027] Figure 5 For the utility model Figure 3 Enlarged structural diagram at point A.
[0028] Legend: 1. Earphone body; 2. First bow-shaped rod; 3. Second bow-shaped rod; 4. Heat dissipation copper wire; 5. Connecting plate; 6. Telescopic block; 7. Sticky cloth strip; 8. Cotton cloth cover; 101. Ear placement slot; 102. First heat dissipation hole; 103. Heat dissipation fin; 104. Strengthened heat dissipation hole; 501. Sticky cloth plate; 502. Slide groove; 503. Damping block; 601. Damping groove; 602. Limit rod. DETAILED DESCRIPTION
[0029] The embodiment of the present application provides a Bluetooth headset capable of dissipating heat, thereby effectively solving the problems of existing devices such as low heat dissipation efficiency, difficulty for the wearer to adjust to a comfortable wearing position, and hair damage and scalp freezing.
[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the technical solution in the embodiment of the present application effectively solves the technical problems of the existing device, such as low heat dissipation efficiency, difficulty for the wearer to adjust to a comfortable wearing mode, and hair damage and scalp freezing. The overall idea is as follows:
[0031] In view of the problems existing in the prior art, the utility model provides a heat-dissipating Bluetooth headset, comprising two earphone bodies 1, wherein the two earphone bodies 1 have opposite sides each provided with an ear-receiving groove 101, a baffle is fixedly installed on the inner side of one end of the earphone body 1 having the ear-receiving groove 101, a first heat dissipation system is arranged on the end of the earphone body 1 away from the ear-receiving groove 101, the two earphone bodies 1 are fixedly connected with a telescopic device, the telescopic device is slidably connected with a connecting device, the first heat dissipation system comprises heat dissipation fins 103, the heat dissipation fins 103 are fixedly installed on one side of the earphone body 1 away from the ear-receiving groove 101, the heat dissipation fins 103 pass through the earphone body 1 and directly contact with electronic components installed in the earphone body 1, the telescopic device comprises a telescopic block 6, the telescopic block 6 is fixedly connected to the top of the earphone body 1, the connecting device comprises a first bow rod 2 and a second bow rod 3, and both ends of the first bow rod 2 and the second bow rod 3 are fixedly connected to the two telescopic devices.
[0032] A plurality of first heat dissipation holes 102 are provided on the side of one end of the earphone body 1 close to the heat dissipation fins 103. The first heat dissipation holes 102 are connected to the electronic components inside the earphone body 1. A reinforced heat dissipation hole 104 is also provided on the end of the earphone body 1 close to the heat dissipation fins 103. The reinforced heat dissipation holes 104 are disposed at the upper and lower ends of the heat dissipation fins 103.
[0033] Five damping grooves 601 are formed on a side of the telescopic block 6 away from the ear placement groove 101 , and two limit rods 602 are slidably connected to one end of the telescopic block 6 away from the earphone body 1 .
[0034] The telescopic device also includes a connecting plate 5, which is fixedly connected to the two ends of the first bow rod 2 and the second bow rod 3. There are two connecting plates 5. A sliding groove 502 is provided at one end of the connecting plate 5 close to the telescopic block 6. The top surface of the sliding groove 502 is fixedly connected to the limiting rod 602. A damping block 503 is fixedly arranged at one end of the inner side of the sliding groove 502 close to the damping groove 601.
[0035] The inner sides of the two connecting plates 5 are fixedly connected with a cloth sticking plate 501, and the cloth sticking plate 501 is adhered with a wool sticking strip 7. The two wool sticking strips 7 are fixedly connected with a cotton sleeve 8, and the cotton sleeve 8 is in contact with the first bow rod 2 and the second bow rod 3.
[0036] A heat dissipation copper wire 4 is arranged between the first bow rod 2 and the second bow rod 3 . The number of the heat dissipation copper wires 4 is several and the heat dissipation copper wires 4 are fixedly connected to the gap between the first bow rod 2 and the second bow rod 3 .
[0037] The heat emitted by the electronic components inside the earphone body 1 is first dissipated into the air by the first heat dissipation hole 102. The heat dissipation fins 103 are in contact with the earphone body 1 to further increase the heat dissipation area. The heat dissipation fins 103 conduct the heat inside the earphone body 1 and dissipate it into the air. The heat dissipation fins 103 conduct the heat inside the earphone body 1 to assist the heat dissipation fins 103 in dissipating heat. The excess heat is conducted to the connecting plate 5 through the telescopic block 6, and then to the heat dissipation copper wire 4 through the first bow rod 2 and the second bow rod 3 fixedly connected to the connecting plate 5. A large range of gaps are provided between each heat dissipation copper wire 4, which greatly increases the heat dissipation capacity and dissipates a large amount of heat from the earphone body 1. This solves the problem that the existing device only dissipates heat by providing heat dissipation holes on the earphone, and most of the heat dissipation relies on air flow to take away the heat in the earphone, which is inefficient.
[0038] Working principle:
[0039] In the first step, the heat emitted by the electronic components inside the earphone body 1 is first dissipated into the air by the first heat dissipation hole 102. The heat dissipation fins 103 are in contact with the earphone body 1 to further increase the heat dissipation area. The heat dissipation fins 103 conduct the heat inside the earphone body 1 and dissipate it into the air. The heat dissipation fins 103 conduct the heat inside the earphone body 1 to assist the heat dissipation fins 103 in heat dissipation. The excess heat is conducted to the connecting plate 5 through the telescopic block 6, and then conducted to the heat dissipation copper wire 4 through the first bow rod 2 and the second bow rod 3 fixedly connected to the connecting plate 5. A large range of gaps are provided between each heat dissipation copper wire 4, which greatly increases the heat dissipation capacity and dissipates a large amount of heat from the earphone body 1.
[0040] In the second step, the telescopic block 6 is driven out of the slide groove 502 by pulling the earphone body 1. The damping groove 601 and the damping block 503 are squeezed to increase the damping. The limiting rod 602 is used to maintain the connection between the telescopic block 6 and the connecting plate 5 and limit the stretching length of the telescopic block 6. The wearer can adhere the adhesive plate 501 fixed by the connecting plate 5 to the adhesive cloth strip 7 and fix the cotton cover 8 to the inner side of the first bow rod 2 and the second bow rod 3 to prevent the first bow rod 2 and the second bow rod 3 from directly contacting the head.
[0041] Finally, it should be noted that: Obviously, the above embodiments are only examples for clearly explaining the present invention, and are not intended to limit the implementation methods. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from this are still within the scope of protection of the present invention.
Claims
1. A Bluetooth headset capable of dissipating heat, comprising two headset bodies (1), characterized in that: The two earphone bodies (1) are each provided with an ear-receiving groove (101) on one side opposite to the other, a blocking plate is fixedly mounted on the inner side of one end of the earphone body (1) provided with the ear-receiving groove (101), a first heat dissipation system is provided on one end of the earphone body (1) away from the ear-receiving groove (101), the two earphone bodies (1) are fixedly connected with a telescopic device, and the telescopic device is slidably connected with a connecting device; The first heat dissipation system comprises a heat dissipation fin (103), the heat dissipation fin (103) being fixedly mounted on a side of the earphone body (1) away from the ear placement slot (101), and the heat dissipation fin (103) passing through the earphone body (1) and directly contacting the electronic components installed in the earphone body (1); The telescopic device comprises a telescopic block (6), and the telescopic block (6) is fixedly connected to the top of the earphone body (1); Wherein, the connecting device comprises a first bow-shaped rod (2) and a second bow-shaped rod (3), and both ends of the first bow-shaped rod (2) and the second bow-shaped rod (3) are fixedly connected to two telescopic devices.
2. A Bluetooth headset capable of dissipating heat as claimed in claim 1, characterized in that: A plurality of first heat dissipation holes (102) are provided on the side surface of one end of the earphone body (1) close to the heat dissipation fins (103), and the first heat dissipation holes (102) are connected to the electronic components inside the earphone body (1). A reinforced heat dissipation hole (104) is also provided on the end of the earphone body (1) close to the heat dissipation fins (103), and the reinforced heat dissipation holes (104) are respectively arranged at the upper and lower ends of the heat dissipation fins (103).
3. A Bluetooth headset capable of dissipating heat as claimed in claim 2, characterized in that: The telescopic block (6) is provided with five damping grooves (601) on a side away from the ear placement groove (101), and the end of the telescopic block (6) away from the earphone body (1) is slidably connected to two limit rods (602).
4. A Bluetooth headset capable of dissipating heat as claimed in claim 3, characterized in that: The telescopic device also includes a connecting plate (5), the connecting plate (5) is fixedly connected to the two ends of the first bow rod (2) and the second bow rod (3), the number of the connecting plates (5) is two, a sliding groove (502) is provided at one end of the connecting plate (5) close to the telescopic block (6), the inner top surface of the sliding groove (502) is fixedly connected to the limit rod (602), and a damping block (503) is fixedly provided at one end of the inner side of the sliding groove (502) close to the damping groove (601).
5. A Bluetooth headset capable of dissipating heat as claimed in claim 4, characterized in that: The inner sides of the two connecting plates (5) are fixedly connected with a cloth-adhesive plate (501), the cloth-adhesive plate (501) is adhered with a wool-adhesive cloth strip (7), the two wool-adhesive cloth strips (7) are fixedly connected with a cotton sleeve (8), and the cotton sleeve (8) is in contact with the first bow-shaped rod (2) and the second bow-shaped rod (3).
6. A Bluetooth headset capable of dissipating heat as claimed in claim 5, characterized in that: A heat dissipation copper wire (4) is arranged between the first bow-shaped rod (2) and the second bow-shaped rod (3), the number of the heat dissipation copper wires (4) is several, and the heat dissipation copper wires (4) are fixedly connected in the gap between the first bow-shaped rod (2) and the second bow-shaped rod (3).
Citation Information
Patent Citations
Bluetooth earphone capable of dissipating heat
CN212211352U