Heat dissipation structure and energy storage power supply

Abstract

The present application relates to the technical field of energy storage equipment, and in particular to a heat dissipation structure and an energy storage power supply. The heat dissipation structure includes a shell, a fan and a first air guide. The shell has a heat dissipation channel, and the heat dissipation channel is configured to accommodate a circuit board. The shell has an air inlet and an air outlet arranged relatively to each other, and the air inlet and the air outlet are respectively connected to the heat dissipation channel. The fan is located in the heat dissipation channel, and the fan is configured to introduce external airflow from the air inlet into the heat dissipation channel. The first air guide is arranged in the heat dissipation channel and is located on the side of the fan facing the air outlet. The first air guide is spaced from the circuit board to form a first guide channel. The first guide channel is configured to connect the air inlet and the air outlet, and guide the airflow generated by the fan to flow through the surface of the circuit board. In the heat dissipation structure of the present application, under the action of the first air guide, the low-height heating device on the circuit board has sufficient airflow for heat dissipation, thereby improving the uniformity of heat dissipation of the circuit board and improving the heat dissipation efficiency.

Description

Technical Field

[0001] The present application relates to the field of energy storage devices, and in particular to a heat dissipation structure and an energy storage power supply. Background Art

[0002] The heating components on the circuit board in the energy storage power supply will generate heat when working, which needs to be dissipated by air cooling. There are many heating components on the circuit board, and the heights are different. The airflow will escape when it flows from the air inlet to the air outlet, resulting in less and less airflow flowing through the surface of the circuit board, making the airflow flowing through the low-height heating components insufficient, and the heat dissipation effect is poor, which leads to uneven heat dissipation of the entire circuit board and low heat dissipation efficiency. Utility Model Content

[0003] In view of this, the present application provides a heat dissipation structure and an energy storage power supply, which can improve the heat dissipation uniformity inside the energy storage power supply and improve the heat dissipation efficiency.

[0004] An embodiment of the present application provides a heat dissipation structure, which is applied to an energy storage power supply, the energy storage power supply includes a circuit board, and the heat dissipation structure includes a shell, a fan and a first air guide. The shell has a heat dissipation channel, and the heat dissipation channel is configured to accommodate the circuit board. The shell has an air inlet and an air outlet arranged relatively to each other, and the air inlet and the air outlet are respectively connected to the heat dissipation channel. The fan is located in the heat dissipation channel, and the fan is configured to introduce external airflow from the air inlet into the heat dissipation channel. The first air guide is arranged in the heat dissipation channel and is located on the side of the fan facing the air outlet. The first air guide is spaced apart from the circuit board to form a first guide channel. The first guide channel is configured to connect the air inlet and the air outlet, and guide the airflow generated by the fan to flow through the surface of the circuit board.

[0005] In the above-mentioned heat dissipation structure, the airflow enters the heat dissipation channel in the shell from the air inlet, and in the process of flowing toward the air outlet, when the airflow flows to the first air guide member, it can flow along the first air guide member to the first guide channel, thereby contacting the surface of the circuit board, and then the low-height heat-generating components on the circuit board have sufficient airflow for heat dissipation, thereby achieving uniform heat dissipation of the circuit board and improving heat dissipation efficiency.

[0006] In at least one embodiment, one side of the first air guide is connected to the side of the shell facing the circuit board, and the other side of the first air guide extends toward the circuit board to form a first guide channel between the first air guide and the circuit board.

[0007] In the above-mentioned embodiment, the first air guide can guide the wind flow that escapes to a position far away from the circuit board to flow towards the circuit board. When the wind flow flows along the first air guide to the first guide channel, the wind flow can contact the heat generating device on the circuit board, thereby dissipating the heat for the heat generating device.

[0008] In at least one embodiment, the heat dissipation structure includes a fixing column, and the fixing column is supported between the circuit board and the first air guide member, so that the first air guide member and the circuit board are spaced apart to form a first guide channel.

[0009] In the above embodiment, the fixing column can support the first air guide member so that there is a gap between the circuit board and the first air guide member to form the first flow guide channel. The fixing column can also connect the first air guide member to the circuit board to improve the stability of the installation of the first air guide member.

[0010] In at least one embodiment, at least two first air guides are provided and arranged in a direction perpendicular to the air inlet toward the air outlet, and an air passage is formed between two adjacent first air guides, connecting the air inlet and the air outlet.

[0011] In the above-mentioned embodiments, a part of the airflow entering the heat dissipation channel from the air inlet will be dispersed to different positions in a direction perpendicular to the air inlet toward the air outlet during the process of flowing toward the air outlet. At least two first air guides can increase the contact area with the dispersed airflow and guide the dispersed airflow to flow toward the first guide channel, so that this part of the airflow contacts the heating components on the circuit board to achieve heat dissipation; after a part of the airflow dissipates the heat of the heating components in the heat dissipation channel, it flows through the air port to the air outlet and finally flows out from the air outlet.

[0012] In at least one embodiment, the first air guide member has an air guide surface on a side facing the air inlet, the air guide surface is biased toward the direction where the air outlet is located, and the angle between the air guide surface and the surface of the circuit board is an acute angle.

[0013] In the above-mentioned embodiment, when the wind flows to the first wind guide member, the wind guide surface can guide the wind to flow in the direction of the first guide channel, so that the wind flows through the surface of the circuit board and improves the heat dissipation efficiency.

[0014] In at least one embodiment, two first air guides are provided and are arranged at intervals along the direction from the vertical air inlet to the air outlet; the heat dissipation structure includes two second air guides, the two second air guides are connected to the two first air guides one by one, and are respectively located on the opposite sides of the two first air guides, and the second air guides are configured to guide the airflow through the corresponding first air guides.

[0015] In the above-mentioned embodiment, the second air guide member can guide the wind flowing to both sides of the vertical air inlet toward the air outlet to flow toward the first air guide member, thereby facilitating the wind flow through the first air guide member and the first guide channel, and further facilitating the wind flow to dissipate heat for the heat generating device in the first guide channel.

[0016] In at least one embodiment, the angle between the surface of the second air guide member facing the air inlet and the first air guide member is an obtuse angle.

[0017] In the above-mentioned embodiment, the inclination direction of the first air guide has a component in the direction from the air inlet to the air outlet, which is beneficial for the airflow flowing to the first air guide to flow along the first air guide toward the air outlet to facilitate the discharge of the airflow; it is also convenient to gather the airflow in the heat dissipation channel to the first air guide, thereby improving the heat dissipation efficiency of the heat-generating device at the first guide channel.

[0018] In at least one embodiment, the heat dissipation structure also includes a diverter, which is located in the heat dissipation channel and is arranged on the side of the fan facing the air outlet. The side of the diverter facing the fan is provided with an intersecting first diverter surface and a second diverter surface, and the angle between the first diverter surface and the second diverter surface is an apparent angle.

[0019] In the above-mentioned embodiment, the flow divider can divide the wind flow entering the air outlet into two parts, one part flows along the first flow divider surface, and the other part flows along the second flow divider surface, thereby improving the fluidity of the wind flow in the heat dissipation channel and facilitating the wind flow to contact and dissipate heat from heating devices at different positions. In addition, the arrangement method in which the angle between the first flow divider surface and the second flow divider surface is a superior angle is also conducive to the first flow divider surface and the second flow divider surface guiding the wind flow to flow in the direction of the air outlet, facilitating the wind flow to quickly discharge from the heat dissipation channel to improve the heat dissipation efficiency.

[0020] In at least one embodiment, a direction from the air inlet to the air outlet is defined as a first direction, and a second direction is a direction perpendicular to the first direction;

[0021] The heat dissipation structure also includes a heat sink arranged on the surface of the circuit board, the heat sink is located between the air inlet and the first air guide channel, the heat sink includes a heat dissipation body and an air guide portion, the air guide portion is connected to the side of the heat dissipation body away from the fan in the second direction, the air guide portion forms a first air guide channel extending along the first direction, connecting the air inlet and the air outlet, and the air guide portion is configured to block the airflow in the first air guide channel from leaving the first air guide channel from the second direction.

[0022] In the above-mentioned embodiment, the heat sink is used to dissipate the heat from the wind flow and the heating device in the heat dissipation channel, which is beneficial to improving the heat dissipation effect. After the wind flow enters the heat dissipation channel from the air inlet, it can enter the first air guide duct and flow in the first direction in the first air guide duct, thereby achieving heat dissipation and cooling of the wind flow. The wind guide portion can also block the wind flow from flowing out of the first air guide duct, thereby improving the adequacy of the contact between the wind flow and the heat sink.

[0023] In at least one embodiment, two radiators are provided, the two radiators are spaced apart along the second direction, and the air guide parts of the two radiators are arranged back to back.

[0024] In the above embodiment, the arrangement of the two radiators makes it easy for the wind entering the air inlet to contact the radiator, and the wind guiding parts of the two radiators can block the wind from flowing toward the edge of the heat dissipation channel in the second direction, thereby facilitating the radiator to cool and dissipate the wind.

[0025] An embodiment of the present application also provides an energy storage power supply, including a battery pack, an electronic control component and the heat dissipation structure in any of the above embodiments, the battery pack and the electronic control component are arranged in a shell, the electronic control component includes a circuit board and multiple heating devices, the heating devices are arranged on the circuit board, and some of the heating devices are arranged in the first guide channel.

[0026] In the above-mentioned energy storage power supply, the wind flow in the heat dissipation channel can flow toward the circuit board under the guidance of the first air guide member, and the wind flow can be easily gathered in the first guide channel, so as to contact the surface of the circuit board. The low-height heating device in the first guide channel has sufficient wind flow for heat dissipation, thereby achieving uniform heat dissipation of the circuit board and improving heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope.

[0028] Figure 1 A three-dimensional diagram of an energy storage power supply provided in one embodiment of the present application.

[0029] Figure 2 This is an exploded view of an energy storage power supply in one embodiment of the present application.

[0030] Figure 3 It is an exploded view of the heat dissipation structure and the electronic control components in one embodiment of the present application.

[0031] Figure 4 It is a cross-sectional view of a heat dissipation structure and a heat generating device in one embodiment of the present application.

[0032] Figure 5 It is a cross-sectional view of a heat dissipation structure and an electronic control component at a first angle in one embodiment of the present application.

[0033] Figure 6 This is a three-dimensional diagram showing the internal structure of a housing according to an embodiment of the present application.

[0034] Figure 7 It is a cross-sectional view of the heat dissipation structure and the electronic control component at a second angle in one embodiment of the present application.

[0035] Figure 8 It is a three-dimensional diagram of a heat sink in one embodiment of the present application.

[0036] Fig. 9It is a side view of a heat sink in one embodiment of the present application.

[0037] Main component symbols

[0038]

[0039]

[0040] The following specific implementation methods will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0043] The heating components on the circuit board in the energy storage power supply will generate heat when working, which needs to be dissipated by air cooling. There are many heating components on the circuit board, and the heights are different. The airflow will escape when it flows from the air inlet to the air outlet, resulting in less and less airflow flowing through the surface of the circuit board, making the airflow flowing through the low-height heating components insufficient, and the heat dissipation effect is poor, which leads to uneven heat dissipation of the entire circuit board and low heat dissipation efficiency.

[0044] An embodiment of the present application provides a heat dissipation structure, which is applied to an energy storage power supply, the energy storage power supply includes a circuit board, and the heat dissipation structure includes a shell, a fan and a first air guide. The shell has a heat dissipation channel, and the heat dissipation channel is configured to accommodate the circuit board. The shell has an air inlet and an air outlet that are relatively arranged, and the air inlet and the air outlet are respectively connected to the heat dissipation channel. The fan is located in the heat dissipation channel, and the fan is configured to introduce external airflow from the air inlet into the heat dissipation channel. The first air guide is arranged in the heat dissipation channel and is located on the side of the fan facing the air outlet. The first air guide is spaced apart from the circuit board to form a first guide channel. The first guide channel is configured to connect the air inlet and the air outlet, and guide the airflow generated by the fan to flow through the surface of the circuit board.

[0045] In the above-mentioned heat dissipation structure, the wind flows into the heat dissipation channel in the shell from the air inlet, and in the process of flowing toward the air outlet, when the wind flows to the first air guide member, it can flow along the first air guide member to the first guide channel, thereby contacting the surface of the circuit board, and then the low-height heating components on the circuit board have sufficient wind flow for heat dissipation, thereby improving the uniformity of heat dissipation of the circuit board and improving the heat dissipation efficiency.

[0046] Some embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0047] See also Figures 1 to 4 An embodiment of the present application provides a heat dissipation structure 100 and an energy storage power supply 1000. The energy storage power supply 1000 includes the heat dissipation structure 100, a battery pack 200, and an electric control component 300. The battery pack 200 is electrically connected to the electric control component 300. The heat dissipation structure 100 dissipates heat from the electric control component 300 to improve the heat dissipation efficiency of the energy storage power supply 1000.

[0048] In some embodiments, the energy storage power supply 1000 may be a household or commercial energy storage power supply, or a portable mobile power supply, etc.

[0049] See also Figure 1 and Figure 2 In some embodiments, the energy storage power supply 1000 further includes a bottom shell 400 , the battery pack 200 is disposed in the bottom shell 400 , and the electronic control component 300 is disposed on the battery pack 200 .

[0050] See also Figure 3 and Figure 4 In some embodiments, the electronic control component 300 includes a circuit board 301 and a plurality of heating devices 302 . The surface of the circuit board 301 includes a front side 3011 and a back side 3012 . The heating devices 302 are arranged on the front side 3011 of the circuit board 301 , and the back side 3012 of the circuit board 301 is arranged toward the battery pack 200 .

[0051] It is understandable that the heating device 302 can be arranged on both the front side 3011 and the back side 3012 of the circuit board 301. For ease of understanding, the embodiment of the present application only exemplifies the arrangement of the heating device 302 on the front side 3011 of the circuit board 301.

[0052] The plurality of heating devices 302 include a low-height heating device 302 , where “low height” refers to a heating device 302 that is relatively closer to the circuit board 301 in the height direction, and the height direction may be the direction of the Z axis in the figure.

[0053] In some embodiments, the plurality of heating devices 302 include MOS tubes (Metal Oxide Semiconductor Field Effect Transistor), inductors, transformers, and capacitors.

[0054] In some embodiments, the circuit board 301 is a power board, and the power board is fixed on the bottom shell 400 of the energy storage power supply 1000. When the power board is working, it will generate heat, and the heat dissipation structure 100 can dissipate heat from the power board.

[0055] See also Figure 1 , Figure 3 and Figure 4 In some embodiments, the heat dissipation structure 100 includes a housing 10, and the electric control component 300 is disposed in the housing 10. The housing 10 of the heat dissipation structure 100 is connected to the bottom case 400, and they are together covered on the outside of the energy storage power supply 1000 to protect the energy storage power supply 1000.

[0056] See also Figure 1 , Figure 5 and Figure 6 In some embodiments, the housing 10 has a heat dissipation channel 11, which is configured to accommodate the circuit board 301. The housing 10 has an air inlet 12 and an air outlet 13 that are arranged opposite to each other, and the air inlet 12 and the air outlet 13 are respectively connected to the heat dissipation channel 11. The direction in which the wind flows from the air inlet 12 through the air outlet 13 is the direction indicated by the X-axis shown in the figure. Specifically, after the wind flows into the heat dissipation channel 11 from the air inlet 12, the heat dissipation of the heating device 302 and the circuit board 301 in the heat dissipation channel 11 is performed, and finally the wind is discharged from the energy storage power supply 1000 from the air outlet 13 to achieve heat dissipation of the energy storage power supply 1000.

[0057] See also Figure 3 , Figure 5 and Figure 6 In some embodiments, the heat dissipation structure 100 further includes a fan 20 and a first heat conducting member 30. The fan 20 is located in the heat dissipation channel 11, and the fan 20 is configured to introduce external wind flow from the air inlet 12 and blow it into the heat dissipation channel 11. The first air guide member 30 is disposed in the heat dissipation channel 11 and is located on the side of the fan 20 facing the air outlet 13. The first air guide member 30 and the circuit board 301 are spaced apart to form a first guide channel 31. The first guide channel 31 is configured to connect the air inlet 12 and the air outlet 13, and guide the wind flow generated by the fan 20 to flow through the surface of the circuit board 301.

[0058] It can be understood that the height of the first guide channel 31 is smaller than the height of other positions of the heat dissipation channel 11, some low-height heating devices 302 are arranged in the first guide channel 31, and other heating devices 302 are arranged between the first guide channel 31 and the air inlet 12 or between the first guide channel 31 and the air outlet 13. Figure 5 The height direction shown is the direction shown by the Z axis, which is perpendicular to the direction shown by the X axis and perpendicular to the front side 3011 of the circuit board 301 .

[0059] The airflow enters the heat dissipation channel 11 in the shell 10 from the air inlet 12, and in the process of flowing toward the air outlet 13, when the airflow flows to the first air guide 30, it can flow along the first air guide 30 to the first guide channel 31, thereby contacting the surface of the circuit board 301, and then the low-height heating device 302 on the circuit board 301 has sufficient airflow for heat dissipation, thereby improving the uniformity of heat dissipation of the circuit board 301 and improving the heat dissipation efficiency.

[0060] See also Figure 1 , Figure 3 and Figure 7 In some embodiments, the housing 10 includes a housing body 14, which accommodates the first air guide 30 and covers the electronic control component 300. The housing body 14 is buckled with the bottom housing 400 of the energy storage power supply 1000 to cover the electronic control component 300 and the battery pack 200.

[0061] One side of the first air guide 30 is connected to the side of the shell body 14 of the shell 10 toward the front side 3011 of the circuit board 301, and the other side of the first air guide 30 extends toward the direction close to the circuit board 301 to form a first guide channel 31 between the first air guide 30 and the front side 3011 of the circuit board 301.

[0062] Exemplarily, the shell body 14 has a first side 141 and a second side 142 extending in the direction indicated by the X-axis, and the first side 141 and the second side 142 are arranged opposite to each other in the direction indicated by the Y-axis, wherein the direction indicated by the Y-axis is perpendicular to the direction indicated by the X-axis and is also perpendicular to the Z-axis direction. The shell body 14 also has a third side 143 and a fourth side 144 extending in the direction indicated by the Y-axis, and the third side 143 and the fourth side 144 are arranged opposite to each other in the direction indicated by the X-axis. The first side 141, the fourth side 144, the second side 142 and the third side 143 are connected in sequence. The shell body 14 also includes a top cover 145, which is arranged toward the front side 3011 of the circuit board 301, and the top cover 145 is connected to the first side 141, the second side 142, the third side 143 and the fourth side 144 to form a heat dissipation channel 11.

[0063] The first air guide 30 can guide the wind flow that escapes to a position far away from the circuit board 301. For example, the first air guide 30 guides the wind flow near the top cover 145 to flow toward the circuit board 301. When the wind flow flows along the first air guide 30 to the first flow guide channel 31, the wind flow can conduct heat with the heating device 302 on the circuit board 301, take away the heat of the heating device 302, and thus dissipate heat for the heating device 302.

[0064] See also Figure 3 and Figure 7In some embodiments, the heat dissipation structure 100 includes a fixing column 40 , and the fixing column 40 is supported between the circuit board 301 and the first air guide member 30 , so that the first air guide member 30 and the circuit board 301 are spaced apart to form a first guide channel 31 .

[0065] The fixing post 40 is connected between the first air guide 30 and the circuit board 301, and can support the first air guide 30, so that there is a gap between the circuit board 301 and the first air guide 30, so as to form the first flow guide 31. The fixing post 40 can also connect the first air guide 30 to the circuit board 301, thereby improving the stability of the installation of the first air guide 30.

[0066] Exemplarily, the fixing column 40 can also be set on some heating devices 302 and connected to the first air guide 30, so that a gap is formed between the first air guide 30 and the heating device 302, and the air flow can flow through the gap, thereby taking away the heat of the heating device 302 and achieving the purpose of heat dissipation.

[0067] In some embodiments, a plurality of fixing posts 40 are provided, for example, two or three fixing posts 40 . The specific number of fixing posts 40 is set according to the connection requirements between the first air guide 30 and the circuit board 301 and the space size of the heat dissipation channel 11 .

[0068] See also Figure 5 and Figure 6 In some embodiments, the first air guide member 30 has an air guide surface 32 on the side facing the air inlet 12, the air guide surface 32 is biased toward the direction of the air outlet 13, and forms an angle with the front side 3011 of the circuit board 301, which is the first angle a shown in the figure, and the first angle a is an acute angle.

[0069] It can be understood that when the first angle a is an acute angle, in the process of the windflow flowing from the air inlet 12 to the air outlet 13, the windflow changes its direction under the action of the guide surface 32, and the angle between the changed direction of the windflow (the flow direction along the guide surface 32) and the original direction (the direction from the air inlet 12 to the air outlet 13) is an obtuse angle, so that the windflow slowly transitions to change its direction, thereby reducing the wind resistance caused by the sudden change of the windflow direction to a certain extent.

[0070] When the wind flows to the first wind guide member 30 , the wind guide surface 32 can guide the wind to flow in the direction of the first guide channel 31 , so that the wind flows through the surface of the circuit board 301 , thereby improving the heat dissipation efficiency.

[0071] See also Figure 4 , Figure 6 and Figure 7In some embodiments, at least two first air guides 30 are provided and arranged at intervals in a direction perpendicular to the air inlet 12 toward the air outlet 13, that is, arranged at intervals in a direction indicated by the Y axis in the figure. An air passage 33 is formed between two adjacent first air guides 30, and the air passage 33 connects the air inlet 12 and the air outlet 13.

[0072] Part of the wind flow entering the heat dissipation channel 11 from the air inlet 12 will also be dispersed to different positions along the second direction Y in the process of flowing toward the air outlet 13. At least two first air guides 30 can increase the contact area with the dispersed wind flow and guide the dispersed wind flow to the first guide channel 31, so that the part of the wind flow contacts the heating device 302 on the circuit board 301 to achieve heat dissipation; after part of the wind flow dissipates the heat of the heating device 302 in the heat dissipation channel 11, it flows to the air outlet 13 through the air outlet 33 and finally flows out from the air outlet 13. The provision of the air outlet 33 can reduce the wind resistance of the wind flow, thereby improving the heat dissipation efficiency.

[0073] See also Figure 4 , Figure 6 and Figure 7 In some embodiments, two first air guides 30 are provided and are arranged at intervals along the direction perpendicular to the air inlet 12 toward the air outlet 13, that is, the two first air guides 30 are arranged at intervals along the direction indicated by the Y-axis; the heat dissipation structure 100 also includes two second air guides 50, the two second air guides 50 are connected to the two first air guides 30 in a one-to-one correspondence, and are respectively located on the opposite sides of the two first air guides 30, and the second air guides 50 are configured to guide the airflow to flow through the corresponding first air guides 30.

[0074] The second air guide member 50 can guide the wind flowing through the two inner walls of the shell 10 along the direction indicated by the Y-axis to flow toward the first air guide member 30, thereby increasing the wind flowing through the first air guide member 30 and the first guide channel 31, and then facilitating the wind flow to dissipate heat for the heating device 302 in the first guide channel 31, so that the heating device 302 in the first guide channel 31 has sufficient wind flow for heat dissipation.

[0075] See also Figure 6 and Figure 7 In some embodiments, an angle is formed between the surface of the second air guide 50 facing the air inlet 12 and the first air guide 30, and the angle is the second angle b shown in the figure, and the second angle b is an obtuse angle.

[0076] Exemplarily, one side of one second air guide member 50 is connected to the first side 141, and the other side is connected to the side of the corresponding first air guide member 30 facing the first side 141; one side of another second air guide member 50 is connected to the second side 142, and the other side is connected to the side of the corresponding first air guide member 30 facing the second side 142.

[0077] The second angle b is set as an obtuse angle, so that the two second air guides 50 gradually approach each other along the direction indicated by the X-axis, forming a trumpet-like structure, thereby achieving the effect of converging wind flow, and converging the wind flow of the heat dissipation channel 11 to the first air guide 30, thereby improving the heat dissipation efficiency of the heating device 302 at the first guide channel 31.

[0078] See also Figure 3 , Figure 4 , Figure 5 and Figure 8 , the direction from the air inlet 12 to the air outlet 13 is defined as the first direction, that is, the first direction is the direction pointed by the X-axis in the figure, the second direction is perpendicular to the first direction, and the second direction is the direction indicated by the Y-axis in the figure. For the convenience of referring to the figure later, the first direction is represented by "first direction X", and the second direction is represented by "second direction Y". In some embodiments, the heat dissipation structure 100 also includes a heat sink 60 disposed on the front side 3011 of the circuit board 301, and the heat sink 60 is located between the air inlet 12 and the first guide channel 31. The heat sink 60 includes a heat dissipation body 61 and an air guide portion 62, the air guide portion 62 is connected to the side of the heat dissipation body 61 away from the fan 20 in the second direction Y, and the air guide portion 62 is formed with a first air guide channel 621 extending along the first direction X, the first air guide channel 621 connects the air inlet 12 and the air outlet 13, and the air guide portion 62 is configured to block the wind flow entering the first air guide channel 621 from the second direction Y and leaving the first air guide channel 621.

[0079] The heat sink 60 dissipates heat from the wind flow and the heating device 302 in the heat dissipation channel 11, which is beneficial to improving the heat dissipation effect. After the wind flow enters the heat dissipation channel 11 from the air inlet 12, it can enter the first wind guide duct 621 and flow in the first wind guide duct 621 in the first direction X, thereby achieving heat dissipation and cooling of the wind flow. The wind guide portion 62 can also block the wind flow from flowing out of the first wind guide duct 621, thereby improving the adequacy of the wind flow in contact with the heat sink 60.

[0080] See also Figure 3 , Figure 4 , Figure 8 and Fig. 9In some embodiments, the heat dissipation body 61 includes a plurality of mutually parallel first fins 611, and the air guide portion 62 includes a plurality of mutually parallel second fins 622, and the second fins 622 are perpendicular to the first fins 611. A first air guide duct 621 is formed between two adjacent second fins 622. A second air guide duct 612 is formed between two adjacent first fins 611, and the second air guide duct 612 extends along the first direction X and connects the air inlet 12 and the air outlet 13. The arrangement of the plurality of first fins 611 and the plurality of second fins 622 is conducive to increasing the contact area between the radiator 60 and the wind flow, thereby facilitating the improvement of the heat dissipation efficiency of the radiator 60 to the electronic control component 300.

[0081] See also Figure 3 and Figure 4 In some embodiments, two radiators 60 are provided, the two radiators 60 are arranged at intervals along the second direction Y, and the air guide parts 62 of the two radiators 60 are arranged back to back.

[0082] The two heat sinks 60 are provided so that the wind flow entering the air inlet 12 can easily contact the heat sink 60, and the wind guides 62 of the two heat sinks 60 can block the wind flow from flowing toward the edge of the heat dissipation channel 11 in the second direction Y, so that the heat sink 60 can cool and dissipate the wind flow. A part of the wind flow can also flow between the two heat sinks 60 to dissipate the heat of the heating components 302 distributed between the two heat sinks 60.

[0083] In other embodiments, more than two heat sinks 60 are provided, for example, three, four, five, etc. The provision of multiple heat sinks 60 simultaneously dissipates heat from the heat generating device 302 in the heat dissipation channel 11 to improve the heat dissipation efficiency.

[0084] See also Figure 4 , Figure 6 and Figure 7 In some embodiments, the heat dissipation structure 100 further includes a flow divider 70, which is located in the heat dissipation channel 11 and is disposed on the side of the fan 20 facing the air outlet 13. The flow divider 70 is provided with a first flow divider surface 71 and a second flow divider surface 72 intersecting each other on the side facing the fan 20, and the angle between the first flow divider surface 71 and the second flow divider surface 72 is the third angle c in the figure, and the third angle c is the reflex angle. It can be understood that the reflex angle is an angle greater than 180° and less than 360°.

[0085] One end of the first diverter surface 71 away from the air inlet 12 and one end of the second diverter surface 72 away from the air inlet 12 extend away from each other and extend in a direction away from the fan 20 .

[0086] The flow divider 70 can divide the wind flow entering the air outlet 13 into two parts, one part flows along the first flow divider surface 71, and the other part flows along the second flow divider surface 72, thereby improving the fluidity of the wind flow in the heat dissipation channel 11, and facilitating the wind flow to contact and dissipate heat with the heating components 302 at different positions. In addition, the arrangement in which the angle between the first flow divider surface 71 and the second flow divider surface 72 is a superior angle is also conducive to the first flow divider surface 71 and the second flow divider surface 72 guiding the wind flow to flow in the direction of the air outlet 13, facilitating the wind flow to quickly discharge from the heat dissipation channel 11, thereby improving the heat dissipation efficiency.

[0087] See also Figure 4 , Figure 6 and Figure 7 In some embodiments, the diverter 70 is disposed between two radiators 60, with the first diverter surface 71 facing one of the radiators 60 and the second diverter surface 72 facing the other radiator 60, so that the wind flows to the two radiators 60 and the heat dissipation efficiency is improved.

[0088] See also Figure 4 , Figure 6 and Figure 7 In some embodiments, the shunt member 70 is connected to the shell body 14 , for example, the shunt member 70 is connected to the side of the top cover 145 facing the front side 3011 of the circuit board 301 , so that the shunt member 70 and the shell 10 can be assembled together on the bottom shell 400 of the energy storage power supply 1000 .

[0089] In other embodiments, the diverter 70 may also be disposed on the front side 3011 of the circuit board 301 , so as to divert the wind flow close to the front side 3011 of the circuit board 301 .

[0090] See also Figure 6 and Figure 7 In some embodiments, the heat dissipation structure 100 further includes two third air guides 80, and the third air guides 80 are arranged at a position of the heat dissipation channel 11 near the air inlet 12. One of the third air guides 80 extends toward the first side plate on a side away from the air inlet 12, and the other third air guide 80 extends toward the second side plate on a side away from the air inlet 12. The two third air guide plates are arranged at intervals along the second direction Y. The fan 20 has an air outlet side, and the air outlet side of the fan 20 is located between the two third air guides 80. After the airflow introduced into the air inlet 12 by the fan 20 is discharged from the air outlet side of the fan 20, it can flow to different positions of the heat dissipation channel 11 under the guiding action of the third air guide 80, thereby reducing the escape of the airflow drawn out by the fan 20 and improving the utilization rate of the airflow.

[0091] See also Figure 6 and Figure 7In some embodiments, the third air guide 80 is connected to the side of the top cover 145 facing the front side 3011 of the circuit board 301, so as to facilitate the overall assembly of the housing 10 and the third air guide 80. In other embodiments, the third air guide 80 can also be connected to the front side 3011 of the circuit board 301.

[0092] See also Figure 3 and Figure 5 In some embodiments, the fan 20 is tilted toward the front side 3011 of the circuit board 301 , so that the fan 20 can blow air toward the circuit board 301 to dissipate heat from the circuit board 301 .

[0093] In addition, those skilled in the art should recognize that the above embodiments are only used to illustrate the present application and are not intended to be limiting of the present application. As long as they are within the spirit and scope of the present application, appropriate changes and modifications to the above embodiments are within the scope of the present application.

Claims

1. A heat dissipation structure, applied to an energy storage power supply, wherein the energy storage power supply includes a circuit board, characterized in that: The heat dissipation structure comprises: A housing having a heat dissipation channel, wherein the heat dissipation channel is configured to accommodate the circuit board, and the housing has an air inlet and an air outlet arranged opposite to each other, wherein the air inlet and the air outlet are respectively connected to the heat dissipation channel; A fan is located in the heat dissipation channel, and the fan is configured to introduce external wind flow from the air inlet and blow it into the heat dissipation channel; The first air guide is arranged in the heat dissipation channel and is located on the side of the fan facing the air outlet. The first air guide is spaced apart from the circuit board to form a first guide channel. The first guide channel is configured to connect the air inlet and the air outlet and guide the airflow generated by the fan to flow through the surface of the circuit board.

2. The heat dissipation structure according to claim 1, characterized in that: One side of the first air guide is connected to the side of the shell facing the circuit board, and the other side of the first air guide extends toward the circuit board to form the first flow guide channel between the first air guide and the circuit board.

3. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure includes a fixing column, and the fixing column is supported between the circuit board and the first air guide member, so that the first air guide member and the circuit board are spaced apart to form the first flow guide channel.

4. The heat dissipation structure according to claim 1, characterized in that: At least two first air guides are provided and arranged in a direction perpendicular to the air inlet toward the air outlet. An air passage is formed between two adjacent first air guides, and the air passage connects the air inlet and the air outlet.

5. The heat dissipation structure according to claim 1, characterized in that: The first air guide member has an air guide surface on a side facing the air inlet, the air guide surface is biased toward the direction where the air outlet is located, and an angle between the air guide surface and the surface of the circuit board is an acute angle.

6. The heat dissipation structure according to claim 1, characterized in that: There are two first air guides, which are arranged at intervals along a direction perpendicular to the air inlet toward the air outlet; the heat dissipation structure includes two second air guides, which are connected to the two first air guides one by one and are respectively located on the opposite sides of the two first air guides, and the second air guides are configured to guide the wind flow through the corresponding first air guides.

7. The heat dissipation structure according to claim 6, characterized in that: An angle between a surface of the second air guide member facing the air inlet and the first air guide member is an obtuse angle.

8. The heat dissipation structure according to claim 1, characterized in that: The heat dissipation structure also includes a diverter, which is located in the heat dissipation channel and is arranged on the side of the fan facing the air outlet. The diverter is provided with a first diverter surface and a second diverter surface that intersect each other on the side facing the fan, and the angle between the first diverter surface and the second diverter surface is an advantageous angle.

9. The heat dissipation structure according to any one of claims 1 to 8, characterized in that: Define the direction from the air inlet to the air outlet as a first direction, and the second direction as a direction perpendicular to the first direction; The heat dissipation structure also includes a heat sink arranged on the surface of the circuit board, the heat sink is located between the air inlet and the first air guide channel, the heat sink includes a heat dissipation body and an air guide portion, the air guide portion is connected to the side of the heat dissipation body away from the fan in the second direction, the air guide portion forms a first air guide channel extending along the first direction, the first air guide channel connects the air inlet and the air outlet, and the air guide portion is configured to block the airflow in the first air guide channel from escaping from the first air guide channel from the second direction.

10. The heat dissipation structure according to claim 9, characterized in that: Two radiators are provided, the two radiators are arranged at intervals along the second direction, and the air guide parts of the two radiators are arranged opposite to each other.

11. An energy storage power supply, characterized in that: It includes a battery pack, an electronic control component and a heat dissipation structure as described in any one of claims 1 to 10, wherein the battery pack and the electronic control component are arranged in the shell, and the electronic control component includes the circuit board and a plurality of heating devices, the heating devices are arranged on the circuit board, and some of the heating devices are arranged in the first guide channel.

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